JP7446181B2 - 基板処理方法および基板処理装置 - Google Patents

基板処理方法および基板処理装置 Download PDF

Info

Publication number
JP7446181B2
JP7446181B2 JP2020139221A JP2020139221A JP7446181B2 JP 7446181 B2 JP7446181 B2 JP 7446181B2 JP 2020139221 A JP2020139221 A JP 2020139221A JP 2020139221 A JP2020139221 A JP 2020139221A JP 7446181 B2 JP7446181 B2 JP 7446181B2
Authority
JP
Japan
Prior art keywords
substrate
gas
flow rate
substrate processing
processing method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020139221A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022035121A (ja
Inventor
正幸 尾辻
雅彦 加藤
佑 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2020139221A priority Critical patent/JP7446181B2/ja
Priority to TW110116724A priority patent/TWI781609B/zh
Priority to CN202110651722.3A priority patent/CN114076504B/zh
Priority to KR1020210084674A priority patent/KR102585601B1/ko
Publication of JP2022035121A publication Critical patent/JP2022035121A/ja
Application granted granted Critical
Publication of JP7446181B2 publication Critical patent/JP7446181B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/06—Controlling, e.g. regulating, parameters of gas supply
    • F26B21/12—Velocity of flow; Quantity of flow, e.g. by varying fan speed, by modifying cross flow area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molecular Biology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2020139221A 2020-08-20 2020-08-20 基板処理方法および基板処理装置 Active JP7446181B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020139221A JP7446181B2 (ja) 2020-08-20 2020-08-20 基板処理方法および基板処理装置
TW110116724A TWI781609B (zh) 2020-08-20 2021-05-10 基板處理方法及基板處理裝置
CN202110651722.3A CN114076504B (zh) 2020-08-20 2021-06-11 衬底处理方法及衬底处理装置
KR1020210084674A KR102585601B1 (ko) 2020-08-20 2021-06-29 기판 처리 방법 및 기판 처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020139221A JP7446181B2 (ja) 2020-08-20 2020-08-20 基板処理方法および基板処理装置

Publications (2)

Publication Number Publication Date
JP2022035121A JP2022035121A (ja) 2022-03-04
JP7446181B2 true JP7446181B2 (ja) 2024-03-08

Family

ID=80283006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020139221A Active JP7446181B2 (ja) 2020-08-20 2020-08-20 基板処理方法および基板処理装置

Country Status (4)

Country Link
JP (1) JP7446181B2 (ko)
KR (1) KR102585601B1 (ko)
CN (1) CN114076504B (ko)
TW (1) TWI781609B (ko)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012243869A (ja) 2011-05-17 2012-12-10 Tokyo Electron Ltd 基板乾燥方法及び基板処理装置
JP2015185713A (ja) 2014-03-25 2015-10-22 株式会社東芝 基板処理装置及び基板処理方法
US20160133456A1 (en) 2014-11-07 2016-05-12 Semes Co., Ltd. Apparatus and method for treating a substrate
JP2020004948A (ja) 2018-06-22 2020-01-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理装置、および乾燥前処理液
JP2020035986A (ja) 2018-08-31 2020-03-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2020077826A (ja) 2018-11-09 2020-05-21 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥方法および基板処理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000021869A (ja) * 1998-06-30 2000-01-21 Tokyo Electron Ltd 真空処理装置
JP3905784B2 (ja) * 2002-03-26 2007-04-18 大日本スクリーン製造株式会社 基板処理装置
JP4853536B2 (ja) * 2009-03-13 2012-01-11 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5486708B2 (ja) 2013-02-28 2014-05-07 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP6709555B2 (ja) * 2015-03-05 2020-06-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2019054112A (ja) * 2017-09-15 2019-04-04 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥方法および基板乾燥装置
JP7107754B2 (ja) * 2017-09-22 2022-07-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7198618B2 (ja) 2018-09-21 2023-01-04 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012243869A (ja) 2011-05-17 2012-12-10 Tokyo Electron Ltd 基板乾燥方法及び基板処理装置
JP2015185713A (ja) 2014-03-25 2015-10-22 株式会社東芝 基板処理装置及び基板処理方法
US20160133456A1 (en) 2014-11-07 2016-05-12 Semes Co., Ltd. Apparatus and method for treating a substrate
JP2020004948A (ja) 2018-06-22 2020-01-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理装置、および乾燥前処理液
JP2020035986A (ja) 2018-08-31 2020-03-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2020077826A (ja) 2018-11-09 2020-05-21 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥方法および基板処理装置

Also Published As

Publication number Publication date
JP2022035121A (ja) 2022-03-04
CN114076504B (zh) 2022-11-22
CN114076504A (zh) 2022-02-22
KR102585601B1 (ko) 2023-10-10
TWI781609B (zh) 2022-10-21
TW202209419A (zh) 2022-03-01
KR20220023287A (ko) 2022-03-02

Similar Documents

Publication Publication Date Title
KR102011570B1 (ko) 기판 처리 방법 및 기판 처리 장치
KR100970060B1 (ko) 기판처리장치 및 기판처리방법
JP6770886B2 (ja) 基板処理装置及び基板処理方法
US20190011734A1 (en) Substrate processing method
US20210057235A1 (en) Substrate treatment method and substrate treatment device
US11152204B2 (en) Substrate processing method and substrate processing apparatus
JP2012084931A (ja) 基板処理方法
JP6945314B2 (ja) 基板処理装置
US10615026B2 (en) Substrate processing method and substrate processing apparatus
CN110047776B (zh) 基板处理方法和基板处理装置
KR102301798B1 (ko) 기판 처리 방법 및 기판 처리 장치
JP2010109087A (ja) 基板処理装置
US20120131815A1 (en) Method and apparatus for wafer wet processing
US11145516B2 (en) Substrate processing method and substrate processing apparatus
JP7446181B2 (ja) 基板処理方法および基板処理装置
JP5308211B2 (ja) 基板処理装置
JP7437154B2 (ja) 基板処理装置、および、基板処理方法
JP6640630B2 (ja) 基板処理装置および基板処理方法
WO2024084850A1 (ja) 基板処理方法および基板処理装置
JP2022035122A (ja) 基板処理装置および基板処理方法
WO2023106012A1 (ja) 基板処理装置および基板処理方法
KR20230032954A (ko) 기판 처리 방법, 및, 기판 처리 장치

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230620

TRDD Decision of grant or rejection written
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20240215

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240220

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240227

R150 Certificate of patent or registration of utility model

Ref document number: 7446181

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150