TWI781256B - 晶圓分割方法以及晶圓分割裝置 - Google Patents

晶圓分割方法以及晶圓分割裝置 Download PDF

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Publication number
TWI781256B
TWI781256B TW107142414A TW107142414A TWI781256B TW I781256 B TWI781256 B TW I781256B TW 107142414 A TW107142414 A TW 107142414A TW 107142414 A TW107142414 A TW 107142414A TW I781256 B TWI781256 B TW I781256B
Authority
TW
Taiwan
Prior art keywords
wafer
adhesive film
holding
dividing
holding part
Prior art date
Application number
TW107142414A
Other languages
English (en)
Chinese (zh)
Other versions
TW201926443A (zh
Inventor
中村勝
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201926443A publication Critical patent/TW201926443A/zh
Application granted granted Critical
Publication of TWI781256B publication Critical patent/TWI781256B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW107142414A 2017-11-30 2018-11-28 晶圓分割方法以及晶圓分割裝置 TWI781256B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017230321A JP7027137B2 (ja) 2017-11-30 2017-11-30 ウエーハの分割方法およびウエーハの分割装置
JP2017-230321 2017-11-30

Publications (2)

Publication Number Publication Date
TW201926443A TW201926443A (zh) 2019-07-01
TWI781256B true TWI781256B (zh) 2022-10-21

Family

ID=66848828

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107142414A TWI781256B (zh) 2017-11-30 2018-11-28 晶圓分割方法以及晶圓分割裝置

Country Status (4)

Country Link
JP (1) JP7027137B2 (ko)
KR (1) KR102606114B1 (ko)
CN (1) CN109860110B (ko)
TW (1) TWI781256B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021027236A (ja) * 2019-08-07 2021-02-22 株式会社ディスコ ウェーハの加工方法
JP2021027238A (ja) * 2019-08-07 2021-02-22 株式会社ディスコ ウェーハの加工方法
JP2021027237A (ja) * 2019-08-07 2021-02-22 株式会社ディスコ ウェーハの加工方法
JP2021027235A (ja) * 2019-08-07 2021-02-22 株式会社ディスコ ウェーハの加工方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016131187A (ja) * 2015-01-13 2016-07-21 株式会社ディスコ 加工装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10305420A (ja) 1997-03-04 1998-11-17 Ngk Insulators Ltd 酸化物単結晶からなる母材の加工方法、機能性デバイスの製造方法
JP3408805B2 (ja) 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
JP2005129607A (ja) 2003-10-22 2005-05-19 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2007123658A (ja) * 2005-10-31 2007-05-17 Disco Abrasive Syst Ltd 粘着テープの拡張装置
JP5409280B2 (ja) 2009-11-09 2014-02-05 株式会社ディスコ チップ間隔拡張方法
JP6151557B2 (ja) 2013-05-13 2017-06-21 株式会社ディスコ レーザー加工方法
JP2015204362A (ja) * 2014-04-14 2015-11-16 株式会社ディスコ チップ間隔維持方法
JP2017107921A (ja) 2015-12-07 2017-06-15 株式会社ディスコ ウエーハの加工方法
JP6618412B2 (ja) * 2016-04-01 2019-12-11 株式会社ディスコ 拡張装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016131187A (ja) * 2015-01-13 2016-07-21 株式会社ディスコ 加工装置

Also Published As

Publication number Publication date
JP2019102588A (ja) 2019-06-24
KR20190064440A (ko) 2019-06-10
CN109860110A (zh) 2019-06-07
KR102606114B1 (ko) 2023-11-23
JP7027137B2 (ja) 2022-03-01
TW201926443A (zh) 2019-07-01
CN109860110B (zh) 2024-01-02

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