TWI779702B - 晶片頂出器及包含晶片頂出器之晶片接合裝置 - Google Patents

晶片頂出器及包含晶片頂出器之晶片接合裝置 Download PDF

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Publication number
TWI779702B
TWI779702B TW110124669A TW110124669A TWI779702B TW I779702 B TWI779702 B TW I779702B TW 110124669 A TW110124669 A TW 110124669A TW 110124669 A TW110124669 A TW 110124669A TW I779702 B TWI779702 B TW I779702B
Authority
TW
Taiwan
Prior art keywords
ejector
wafer
drive shaft
unit
driving part
Prior art date
Application number
TW110124669A
Other languages
English (en)
Chinese (zh)
Other versions
TW202207342A (zh
Inventor
李喜澈
鄭炳浩
鄭然赫
Original Assignee
南韓商細美事有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商細美事有限公司 filed Critical 南韓商細美事有限公司
Publication of TW202207342A publication Critical patent/TW202207342A/zh
Application granted granted Critical
Publication of TWI779702B publication Critical patent/TWI779702B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H01L2221/6839—Separation by peeling using peeling wedge or knife or bar

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
TW110124669A 2020-07-09 2021-07-05 晶片頂出器及包含晶片頂出器之晶片接合裝置 TWI779702B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020200084728A KR102617784B1 (ko) 2020-07-09 2020-07-09 다이 이젝터 및 이를 포함하는 다이 본딩 장치
KR10-2020-0084728 2020-07-09

Publications (2)

Publication Number Publication Date
TW202207342A TW202207342A (zh) 2022-02-16
TWI779702B true TWI779702B (zh) 2022-10-01

Family

ID=79232860

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110124669A TWI779702B (zh) 2020-07-09 2021-07-05 晶片頂出器及包含晶片頂出器之晶片接合裝置

Country Status (3)

Country Link
KR (1) KR102617784B1 (ko)
CN (1) CN113921453A (ko)
TW (1) TWI779702B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230100765A (ko) * 2021-12-28 2023-07-06 세메스 주식회사 다이 이젝터, 및 이를 포함하는 다이 공급 모듈 및 다이 본딩 설비

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020069952A1 (en) * 2000-12-11 2002-06-13 Kabushiki Kaisha Toshiba Semiconductor chip pickup device and pickup method
TW200500284A (en) * 2003-04-14 2005-01-01 Texas Instruments Inc Semiconductor chip pick and place process and equipment
US20140238618A1 (en) * 2013-02-28 2014-08-28 Samsung Electronics Co., Ltd. Die ejector and die separation method
KR102009922B1 (ko) * 2018-03-19 2019-08-12 세메스 주식회사 다이 이젝팅 장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3817894B2 (ja) * 1998-04-06 2006-09-06 三菱電機株式会社 チップ突き上げ装置及びそれを用いたダイボンディング装置
TWI463580B (zh) * 2007-06-19 2014-12-01 Renesas Electronics Corp Manufacturing method of semiconductor integrated circuit device
JP5284144B2 (ja) * 2009-03-11 2013-09-11 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置及びピックアップ方法
JP2013033850A (ja) * 2011-08-02 2013-02-14 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法
JP2018182278A (ja) * 2017-04-07 2018-11-15 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置及び実装装置
JP7217605B2 (ja) * 2018-09-21 2023-02-03 ファスフォードテクノロジ株式会社 半導体製造装置、突上げ治具および半導体装置の製造方法
KR102165569B1 (ko) * 2018-10-15 2020-10-14 세메스 주식회사 다이 이젝팅 장치
KR102656718B1 (ko) * 2018-11-05 2024-04-12 세메스 주식회사 다이 이젝팅 장치
KR102220340B1 (ko) * 2019-06-11 2021-02-25 세메스 주식회사 다이 이젝팅 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020069952A1 (en) * 2000-12-11 2002-06-13 Kabushiki Kaisha Toshiba Semiconductor chip pickup device and pickup method
TW200500284A (en) * 2003-04-14 2005-01-01 Texas Instruments Inc Semiconductor chip pick and place process and equipment
US20140238618A1 (en) * 2013-02-28 2014-08-28 Samsung Electronics Co., Ltd. Die ejector and die separation method
KR102009922B1 (ko) * 2018-03-19 2019-08-12 세메스 주식회사 다이 이젝팅 장치

Also Published As

Publication number Publication date
KR102617784B1 (ko) 2023-12-26
CN113921453A (zh) 2022-01-11
TW202207342A (zh) 2022-02-16
KR20220006828A (ko) 2022-01-18

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