TWI778277B - 承載帶、覆蓋帶及靜電屏蔽袋中之碳奈米管 - Google Patents
承載帶、覆蓋帶及靜電屏蔽袋中之碳奈米管 Download PDFInfo
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- TWI778277B TWI778277B TW108124424A TW108124424A TWI778277B TW I778277 B TWI778277 B TW I778277B TW 108124424 A TW108124424 A TW 108124424A TW 108124424 A TW108124424 A TW 108124424A TW I778277 B TWI778277 B TW I778277B
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- carbon nanotubes
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Abstract
本發明係關於一種用於運輸電子組件之承載帶、覆蓋帶或靜電屏蔽袋,其由聚合物及在0.01重量%與3重量%之間的碳奈米管構成。碳奈米管可具有任意數目之壁及直徑尺寸小於約100 nm之任何所期望的大小。包括碳奈米管之承載帶、覆蓋帶或袋所量測的靜電耗散範圍在1×105
與1×1012
Ω/sq之間及透光率值在60%與90%之間。包括碳奈米管之承載帶、覆蓋帶或袋減少表面缺陷、高密度扭結物及聚結物。包括碳奈米管之靜電屏蔽袋可形成為片材,其製成所期望尺寸之袋。
Description
本發明大體上係關於一種在承載帶中運輸由覆蓋帶及抗靜電袋所封閉之電子組件的抗靜電封裝,其中該抗靜電封裝至少部分地由碳奈米管形成。在抗靜電封裝中包括碳奈米管改良封裝產物之靜電耗散及傳導。
目前,碳黑在承載帶中用作全均勻厚度的添加劑,或作為單獨頂蓋層及底蓋層之一部分,以便增加用於形成承載帶之普通絕緣材料的電導率。使用碳黑材料有助於在運輸電子組件期間減少沿承載帶之靜電積聚。靜電積聚可能會放電,導致損壞或毀壞置放於承載帶囊袋及/或抗靜電袋內並在其內運輸的敏感電子組件。
承載帶可由擠出原料產生,該等原料又可在連續製程中再加熱及形成,或可在擠出之後立即形成承載帶、覆蓋帶或抗靜電袋。
目前,靜電屏蔽袋由多個層形成,該等層與在外層之間的至少一個箔片或金屬化膜層層壓在一起。該至少一個箔片或金屬化膜層提供導電路徑,其用於使電或靜電遠離袋之內含物轉移或耗散,以便保護在袋內部運輸之電敏感產品。靜電耗散減少可能損壞或毀壞在靜電屏蔽袋中運輸之敏感電子組件之靜電荷。
靜電屏蔽袋中之層數通常為三至五層。該等層中之一或多者可由具有不同特性之材料組成,諸如靜電屏蔽、防潮或抗穿刺性。靜電屏蔽袋內之各個層之厚度一般在0.0005吋至0.003吋範圍內且總袋厚度為0.002吋至0.008吋。典型的3層袋可利用外部靜電耗散聚酯層、中間箔屏蔽層及內部靜電耗散聚乙烯層。額外層可包括耐綸或其他聚合物以增加強度、防潮品質或額外靜電屏蔽。5層袋可包括由中心之聚酯層隔開之兩個鋁箔屏蔽層而非單一箔屏蔽層。
當各種材料層壓在一起以形成袋材料時,可在靜電屏蔽袋內提供防潮保護。
如圖1中所示,覆蓋帶之常見組態包括三(3)層。第一層通常由雙軸定向膜構成,雙軸定向膜提供覆蓋帶之剛性。第一層可由聚酯,諸如聚對苯二甲酸乙二酯(PET/BO-PET)形成。第二層或中間材料將經由使用密封層來黏結第一層,該密封層可由聚乙烯(PE)、聚丙烯(PP)及乙烯-乙酸乙烯酯共聚物(EVA)形成。應注意,可使用其他聚合物/化合物。作為第3材料之密封劑可視用於中間材料中之材料而不同。第3材料通常由兩種或更多種常用的密封劑聚合物組分形成,該等組分包括(但不限於)乙烯-乙酸乙烯酯共聚物(EVA)、基於聚胺基甲酸酯之樹脂(PU)、聚乙烯樹脂(PE)、聚氯乙烯(PVC)等。
當前覆蓋帶一般使用π-電共軛導電聚合物,包括(但不限於)聚(3,4-伸乙二氧基噻吩/聚苯乙烯磺酸(PEDOT/PSS)、聚(3-丙基-噻吩)、聚(3-乙基吡咯);具有電導能力之細粉,諸如氧化鈦、氧化鋅、氧化錫、碳黑或其組合,共軛導電聚合物可為基礎膜層之添加劑以增加膜層之電導率。在使用覆蓋帶時,此層塗覆有熱活化黏著劑,其阻擋膜層且防止對覆蓋帶之裝置側的靜電控制。
上文所提及及/或描述之技術並不意欲承認本文中所提及之任何專利、公開案或其他資訊為關於本發明之「先前技術」。另外,此部分不應理解為意謂已進行搜尋或不存在如37 C.F.R.§1.56(a)中所限定之其他相關資訊。
本申請案中任何地方提及之所有美國專利及申請案及所有其他公開文獻均以全文引用之方式併入本文中。
在不限制本發明之範疇的情況下,下文闡述本發明所主張之一些實施例中的簡要說明。本發明之概述實施例及/或本發明之其他實施例的額外細節可見於下文之實施方式中。
出於遵守37 C.F.R. § 1.72之目的,提供本說明書中技術揭示內容之簡要摘要。
在一個實施例中,承載帶包括複數個對準囊袋,其中帶及囊袋運輸電子組件,且承載帶由重量百分比在0.99%與99%之間的聚合物及重量百分比在0.01%與3%之間的碳奈米管形成。
在另一實施例中,碳奈米管係選自由以下組成之群:單壁碳奈米管、雙壁碳奈米管及三壁或更多壁碳奈米管及其組合。
在另一替代實施例中,雙壁碳奈米管及三壁或更多壁碳奈米管的相鄰壁之間的壁間隔距離在0.20 nm與0.34 nm之間。
在至少一個實施例中,碳奈米管各自的直徑尺寸在1 nm與100 nm之間。
在一些實施例中,碳奈米管各自的表面積在600 m2
/g至1000 m2
/g之間。
在至少一個替代實施例中,用於承載帶、覆蓋帶或靜電耗散袋中之碳奈米管的縱橫比為3000:1至6000:1長度與直徑比。
在一些替代實施例中,在擠出承載帶之前或在用於製造靜電耗散袋之片材形成期間,將碳奈米管作為原料碳奈米管材料添加至聚合物中。
在至少一個替代實施例中,聚合物係選自由以下組成之群:聚碳酸酯(PC)、丙烯腈丁二烯苯乙烯(ABS)、聚丙烯(PP)、聚苯乙烯(PS)、聚對苯二甲酸乙二酯(PET)、高密度聚乙烯(HDPE)、低密度聚乙烯(LDPE)、線性低密度聚乙烯(LLDPE)、苯乙烯-丙烯腈(SAN)、聚乙烯(PE)、聚酯(PETE)及其組合。
在至少一個替代實施例中,包括碳奈米管之承載帶、覆蓋帶或靜電耗散袋所量測的靜電耗散範圍在1×105
與1×1012
Ω/sq之間。
在一些實施例中,具有碳奈米管之承載帶、覆蓋帶或靜電耗散袋的透光率值在60%與90%之間、霧度值在60%與70%之間及/或透明度值在25%與45%之間。
在一些實施例中,包括碳奈米管之承載帶、覆蓋帶及/或靜電耗散袋在製造製程期間減少表面缺陷、減少高密度扭結物及/或減少聚結物。
在至少一個實施例中,包括碳奈米管之承載帶、覆蓋帶及/或靜電耗散袋減少碳材料轉移。
在至少一個替代實施例中,承載帶包括覆蓋帶,覆蓋帶具有熱活化黏著劑或壓敏黏著劑,覆蓋帶由至少一個層形成,該至少一個層包括聚合物及碳奈米管。
在熱活化黏著層中利用碳奈米管將可改良承載帶囊袋內部之靜電控制。此有助於減少靜電積聚,靜電積聚可能會損壞或毀壞置放於承載帶囊袋內並在其內運輸之敏感電子組件。碳奈米管亦可用於控制基礎膜層之表面電阻率且維持材料透明。
覆蓋帶包括分散於整個熱活化黏著劑塗層中或基礎聚合物膜中之碳奈米管(carbon nanotube,CNT)。在兩種情況下,可控制基礎膜及黏著劑塗層之表面電阻率且防止靜電放電及損壞藉由覆蓋帶密封於承載帶囊袋中之靜電敏感裝置。碳奈米管提供一致且可重複的表面電阻率(surface resistivity,SR)讀數,且受加熱及形成循環的影響較少。將少量CNT添加至基礎材料中,使成品透明。半透明至透明材料具有能夠在裝載、運輸及選取&置放操作期間看見囊袋中之裝置的優點。
CNT具有較高縱橫比,需要最小負載且允許一致水準之表面電阻率控制。碳奈米管包括單壁及多壁碳奈米管兩者,其可用作覆蓋帶黏著劑及襯底膜帶之導電添加劑。
CNT可併入於(但不限於)各種聚合物(諸如聚酯及聚烯烴)內,該等聚合物為覆蓋帶常用的。
使用CNT產生經塗覆之產物可藉由將碳奈米管以原料形式添加至塗覆混合物中來實現,且經由混合及施用來分散。碳奈米管可以各種比率混合,視母料中CNT之百分比而定,其係基於針對覆蓋帶熱活化黏著劑之最終表面電阻率水準。
對於膜,亦可將CNT預混至可直接饋送至擠出機中之最終樹脂中,或可使用與基礎膜相容且在擠出之前與基礎樹脂混合在一起之載體材料添加碳奈米管。
表徵本發明之此等及其他實施例於隨附申請專利範圍中特別指出且形成其一部分。然而,為了進一步理解本發明、藉由其使用獲得之其優點及目標,應參考形成其另一部分之圖式及隨附描述內容,其中說明及描述本發明之實施例。
相關申請案之交叉引用
本申請案主張2018年7月12日申請之美國臨時專利申請案序號62/697075之權益,該臨時專利申請案以全文引用之方式併入本文中。本申請案亦主張2018年9月20日申請之美國臨時專利申請案序號62/733746之權益,該臨時專利申請案以全文引用之方式併入本文中。
在一些實施例中,包括於本文所揭示之承載帶發明中的碳奈米管利用以均勻的擠出材料分散於整個承載帶中或作為多層擠出材料上之蓋層的碳奈米管(CNT)。碳奈米管提供更一致且可重複的表面電阻率(SR)讀數。利用碳奈米管之靜電耗散材料的表面電阻率讀數在1×105
至1×1012
Ω/sq範圍內。此表面電阻率水準降低靜電放電對組件損壞的可能性。相較於具有較高SR讀數之碳黑(十的6次方),使用與聚合物組合之碳奈米管允許將SR讀數靶向及控制至較小範圍(十的三次方或10^3)。由碳奈米管製得之產物受在承載帶形成期間使用之加熱及形成之循環影響較小,因為與碳奈米管相關之較小粒度允許較佳材料分散性及拉伸時更一致之密度變化。
在某些實施例中,常用碳奈米管以單壁、雙壁及多壁變體之形式存在,其中在多壁變體中各壁之相鄰間距為約0.34 nm。碳奈米管之直徑在約1 nm至約100 nm之直徑範圍內。
在其他實施例中,使用較少量(通常小於或等於約3%)的碳奈米管來獲得可接受的靜電耗散範圍,碳奈米管之尺寸在1 nm至100 nm範圍內。
相比於向基礎材料添加約10-15%碳黑,將具有如所揭示之尺寸範圍的碳奈米管添加至基礎材料以向所製造產物提供類似的表面電阻率。
在至少一個實施例中,碳奈米管可併入於由各種聚合物形成之基礎材料內,該等聚合物諸如聚碳酸酯(PC)、丙烯腈丁二烯苯乙烯(ABS)、聚丙烯(PP)及聚苯乙烯(PS)、聚對苯二甲酸乙二酯(PET)、高密度聚乙烯(HDPE)、低密度聚乙烯(LDPE)及線性低密度聚乙烯(LLDPE)、苯乙烯-丙烯腈(SAN)、聚乙烯(PE)或聚酯(PETE)以及其他熱塑性材料。應注意,碳奈米管之使用不限於與以上所確定之聚合物一起使用,且可與其他聚合物或包括複合材料之其他材料一起使用。
在一些實施例中,由於使用小體積之CNT材料以獲得所期望的SR水準,因此相比於使用碳黑材料,封裝成品變得更透明。用碳黑形成之當前封裝材料為不透明的,而用CNT形成之封裝材料的透光率值在60%與90%之間,其視所使用之CNT量而定。在碳奈米管材料使用期間,封裝材料中所發現之霧度在60%至70%範圍內,且封裝材料之透明度在25%至45%範圍內。由於碳黑材料使得承載帶發黑及不透光,故對於用碳黑材料製成的承載帶,此等值一般在0%之範圍內。透光率、霧度及透明度可視用於承載帶之基礎材料類型及其起始基礎材料特性而變化。
在至少一個實施例中,用於由碳奈米管形成之承載帶的半透明至透明材料具有允許個體在電子組件裝載、運輸及選取&置放操作期間看到安置於承載帶囊袋中之電子裝置的優點。半透明承載帶亦不需要用於囊袋內裝置驗證之囊袋孔,從而減小碎屑進入囊袋中之可能性,其中碎屑可在囊袋孔打孔期間形成。
在一些實施例中,使用碳奈米管替代碳黑材料改良承載帶之表面光度,因為表面缺陷(諸如凝膠/尖端)減少。與使用碳黑材料相比,尖端減少係與使用及裝載較小體積之CNT材料作為添加劑有關。
在至少一個實施例中,用於形成承載帶或抗靜電袋之添加劑的較低百分比致使CNT更一致地分散至封裝材料且減少高密度扭結物或聚結物之積聚。聚結物為永久地牽拉在一起的奈米材料之聚集粒子,由10至1000個單獨奈米粒子組成,若存在,則顯著增加原始奈米粒子之尺寸:此情境將最終導致改變預期的特性(如電導性)。
在至少一個實施例中,添加劑材料至基礎材料之不良分散引起兩個顯著結果:表面上大量的未分散材料,其將更容易地進行靜電放電;及粒子之間的間隙,其減小靜電放電。
在一些實施例中,當與基於碳黑之材料相比時,由於添加劑之較低含量及較小粒度,用碳奈米管形成之承載帶將具有更少碳材料轉移(脫落)。碳黑將扭結且產生相對較大的表面區域,該等表面區域隨後易遭受刮擦且轉移(脫落)至與承載帶囊袋中之碳黑表面區域接觸的裝置或材料之表面上。常見碳黑不以主要單獨粒子之形式存在,相反,碳黑由多個熔融在一起的粒子組成以形成具有50 μm至500 μm之常見尺寸之聚集體,而相比之下,CNT材料在1 nm至100 nm之尺寸範圍內。
在一些實施例中,碳奈米管相比於碳黑(由於聚結而具有不規則形狀)具有更高縱橫比(3000:1至6000:1長度/直徑比),因此CNT之每一體積具有更多的暴露表面,使得CNT為更有效的導體。縱橫比為長度與直徑之比。CNT之較高縱橫比產生相比於碳黑材料之較高表面積百分比。碳黑通常亦具有重疊聚集體,進一步降低碳黑之有效表面積。與碳黑之50 m2
/g至150 m2
/g範圍相比,CNT之表面積在600 m2
/g至1000 m2
/g範圍內。相較於由碳黑材料形成的承載帶,由CNT形成的承載帶將為更有效的導體。
在許多實施例中,碳奈米管包括單壁及多壁碳奈米管兩者,該等碳奈米管可用作承載帶之導電添加劑。
在一些實施例中,由使用碳奈米管之擠出產物/聚合物製造承載帶可藉由將碳奈米管以粒化形式添加至擠出機中來實現,該擠出機使用另一種聚合物作為承載帶之材料,其中對於單壁及多壁CNT兩者,提供在0.01重量%至3重量%範圍內的CNT之量。碳奈米管及聚合物載體可以0.01%至3%之各種比率與熱塑性材料混合,該等熱塑性材料諸如LLDPE、PET、SAN、ABS及其他如本文中所提及或與本文中所提及之材料相當的材料,其視母料中所期望的目標表面電阻率而定。母料中所期望的目標表面電阻率係基於針對承載帶之最終表面電阻率水準。亦可將碳奈米管預混至最終樹脂,其可直接饋入至擠出機中。此藉由將CNT與所期望的熱塑性樹脂混合至擠出機中且粒化輸出物來進行。
在至少一個實施例中,承載帶可利用與承載帶整合之碳奈米管來獲得靜電耗散或導電特性。包括碳奈米管之承載帶可藉由將含有CNT之樹脂擠出成片材形式來形成。隨後可在熱成形操作中使用加熱方法(諸如接觸、IR或對流)對片材形式再加熱,且隨後使用成形工具及模具經由壓印、氣壓或真空成形來形成囊袋。具有CNT之片材形式亦可經擠出且直接澆鑄於模具上且隨後形成併有碳奈米管之承載帶。此等製程利用在0.015%至約3%範圍內之碳奈米管。
在一些實施例中,碳奈米管可在擠出製程期間以原料形式添加,或可作為預混之濃縮添加劑添加。或者,樹脂供應商可將碳奈米管與其他聚合物混合,以在製造製程期間直接饋入擠出機中。在擠出之後,包括CNT之樹脂可分散於整個承載帶材料中,或可整合於如在多層產物內之組合層中使用的特定層中。
包括碳奈米管之承載帶的表面電阻率目標可一般在1×105
至1×1012
Ω/sq範圍內,其稱為如藉由ANSI/ESD-S541國家標準所限定之靜電耗散範圍,其中碳奈米管之含量經調節以滿足最終產物之目標值。
在替代實施例中,靜電屏蔽袋利用碳奈米管(CNT)作為均質材料分散至整個袋中,或藉由併入至一或多個可層壓在一起之單獨層中以形成多層層壓材料。靜電屏蔽袋之總層數通常在3至5範圍內,其中靜電耗散層在內部及外部,且箔片層安置於靜電耗散層之間或內部。
碳奈米管提供更一致且可重複的表面電阻率(SR)讀數,且在形成用作靜電屏蔽袋之一部分之層壓袋材料期間受加熱及加工循環影響較小。將較少量之CNT (相比於碳黑材料之10-15%,通常為小於3%之CNT)添加至基礎材料樹脂以用於靜電屏蔽袋之外層中。基礎材料通常使用聚酯或聚乙烯,但可由與靜電耗散化合物(諸如碳奈米管)混合之其他聚合物製成以便具有靜電耗散特性。CNT裝載之內層亦可用於替換箔內層,使得靜電屏蔽袋更透明或半透明。靜電屏蔽袋中所使用之半透明至透明材料提供以下優點:能夠在使用期間目視觀察在靜電屏蔽袋之內部運輸之內含物,且允許個體讀取位於靜電屏蔽袋之內部的任何標籤。在一些實施例中,可觀察到位於使用CNT之靜電屏蔽袋之內部的內部條碼。
在一些實施例中,碳奈米管相比於碳黑(其由於聚結而具有不規則形狀)提供較高縱橫比(3000:1至6000:1長度/直徑比),因此CNT之每一體積具有更多的暴露表面,使得併入CNT之材料為更有效的導體。縱橫比為長度與直徑之比。CNT之較高縱橫比相比於碳黑產生更高表面積百分比。碳黑通常亦具有重疊聚集體,其進一步減小有效表面積。與碳黑之50-150 m2
/g相比,CNT之表面積在600-1000 m2
/g範圍內。因此,當與碳黑材料相比時,用CNT形成之用於靜電屏蔽袋中之承載帶或材料層將為更有效的導體。碳奈米管包括單壁及多壁碳奈米管兩者,該等碳奈米管可用作各個聚合物層內之導電組件,該等聚合物層壓在一起以形成靜電屏蔽袋或承載帶。
在一些實施例中,使用CNT形成擠出或吹塑靜電屏蔽袋可藉由將碳奈米管以粒化形式添加至擠出機中來實現,其使用另一種或不同聚合物作為載體。可以各種比率混合碳奈米管,其取決於母料中CNT之百分比,且基於針對靜電屏蔽袋、覆蓋帶或承載帶之最終表面電阻率水準。亦可將CNT預混至最終樹脂,該最終樹脂可在靜電屏蔽袋、覆蓋帶或承載帶形成期間直接饋入至擠出機中。
靜電屏蔽袋可在形成袋之材料層內利用碳奈米管以便提供靜電耗散或導電特性。碳奈米管可併入吹塑膜或片材擠出物中,且吹塑膜或片材擠出物可在均質或多層層壓物中用作袋材料。碳奈米管亦可在擠出期間以其原料形式或以預混之濃縮添加劑形式添加。
靜電遮蔽袋可用於保護單獨封裝之敏感組件、電子組件及裝置,或散裝容器、帶及卷軸、托盤或其他封裝中之多個組件或裝置。靜電屏蔽袋之尺寸可與經封裝之物件緊密匹配。靜電遮蔽袋可經真空密封以在熱密封及運輸袋內部的物件之前移除空氣。或者,靜電屏蔽袋可藉由機械或黏著構件封閉。或者,空氣亦可在密封靜電屏蔽袋之前用惰性氣體替換,以便減小在暴露於溫度變化期間由於冷凝而可能出現之任何腐蝕的可能性。
在一些實施例中,使用CNT之材料之表面電阻率目標通常可在1×105
至1×1010
Ω/sq範圍內,其中CNT之含量經調節以滿足最終產物之表面電阻率之目標值。
覆蓋帶可藉由將碳奈米管混合至黏著劑中且塗覆基礎膜來利用碳奈米管實現熱活化黏著劑之靜電耗散或導電特性,或在塗覆之前用作與熱活化黏著劑混合之預混合載體材料。
覆蓋帶之基礎膜可利用預混合於相容載體中之碳奈米管形成,該相容載體可與基礎材料一起饋入,或可與碳奈米管混合以用於在形成基礎膜期間直接輸入至擠出機中。
覆蓋帶之密封材料可與碳奈米管直接混合、預混合或藉由直接混合。
表面電阻率目標通常可在1×105
至1×1010
Ω/sq範圍內,其中CNT含量經調節以滿足最終產物之目標值。
實例
實例1:具有複數個對準囊袋之承載帶係經由使用以下各者形成:
具有單壁之碳奈米管,各碳奈米管之直徑尺寸為約20 nm;
碳奈米管之表面積為750 m2
/g;
碳奈米管之縱橫比為450:1;
在擠出之前,碳奈米管作為原材料添加至基礎材料中;
對於所形成之承載帶,碳奈米管占材料之約0.1重量%:
基礎材料占所形成之承載帶的以下重量百分比:
聚碳酸酯(PC) (99.90%);
所形成之承載帶的表面電阻率為1×1012
;
所形成之承載帶的透光率值為80%;
所形成之承載帶的霧度值為50.5;
所形成之承載帶的透明度值為26;及
所形成之承載帶的表面缺陷(諸如尖端)減小至0%之值;
所形成之承載帶具有減少之高密度扭結物或聚結物之積聚,量測值為0%;及
所形成之承載帶具有較少碳材料轉移(脫落),量測值為0%。
實例2:具有複數個對準囊袋之承載帶係經由使用以下各者形成:
具有雙壁或多壁之碳奈米管,各碳奈米管之壁的壁間隔尺寸為約0.3 nm;
各碳奈米管之直徑為約50 nm;
碳奈米管之表面積為600 m2
/g;
碳奈米管之縱橫比為3000:1;
在擠出之前,碳奈米管作為預混之濃縮添加劑添加至基礎材料中;
對於所形成之承載帶,具有碳奈米管之預混樹脂占材料之約2.5重量%;
對於所形成之承載帶,碳奈米管占材料之約0.25重量%;
基礎材料占所形成之承載帶的以下重量百分比:
聚碳酸酯(PC) (97.5%);
所形成之承載帶的表面電阻率為1×108
;
所形成之承載帶的透光率值為10%;
所形成之承載帶的表面缺陷(諸如尖端)減小至0%之值;
所形成之承載帶具有減少之高密度扭結物或聚結物之積聚,量測值為0%;及
所形成之承載帶具有較少碳材料轉移(脫落),量測值為0%。
實例3:具有複數個對準囊袋之承載帶係經由使用以下各者形成:
具有單壁之碳奈米管,各碳奈米管之直徑尺寸為約10 nm;
碳奈米管之表面積為850 m2
/g;
碳奈米管之縱橫比為5500:1;
在擠出之前,碳奈米管作為原材料添加至基礎材料中;
對於所形成之承載帶,碳奈米管占材料之約0.2重量%;
基礎材料占所形成之承載帶的以下重量百分比:
線性低密度聚乙烯(LLDPE) (19.8%);
丙烯腈丁二烯苯乙烯(ABS) (80%);
所形成之承載帶的表面電阻率為1×1010
;
所形成之承載帶的透光率值為84%;
所形成之承載帶的霧度值為59.5;
所形成之承載帶的透明度值為26;
所形成之承載帶的表面缺陷(諸如尖端)減小至值零(0);
所形成之承載帶具有減少之高密度扭結物或聚結物之積聚,量測值為0%;及
所形成之承載帶具有較少碳材料轉移(脫落),量測值為0%。
實例4:具有複數個對準囊袋之承載帶係經由使用以下各者形成:
具有單壁之碳奈米管,各碳奈米管之直徑尺寸為約60 nm;
碳奈米管之表面積為750 m2
/g;
碳奈米管之縱橫比為6000:1;
在擠出之前,碳奈米管作為原材料添加至基礎材料中;
對於所形成之承載帶,碳奈米管占材料之約0.25重量%;
基礎材料占所形成之承載帶的以下重量百分比:
線性低密度聚乙烯(LLDPE) (19.75%);
苯乙烯-丙烯腈(SAN) (80%);
所形成之承載帶的表面電阻率為1×1011
;
所形成之承載帶的透光率值為81%;
所形成之承載帶的霧度值為69.5;
所形成之承載帶的透明度值為34;
所形成之承載帶的表面缺陷(諸如尖端)減小至零0%之值;
所形成之承載帶具有減少之高密度扭結物或聚結物之積聚,量測值為0%;及
所形成之承載帶具有較少碳材料轉移(脫落),量測值為0%。
實例5:靜電耗散載體袋係經由使用以下各者形成:
具有單壁之碳奈米管,各碳奈米管之直徑尺寸為約23 nm;
碳奈米管之平均表面積為750 m2
/g;
碳奈米管之縱橫比為4500:1;
在擠出成片材之前,碳奈米管作為原材料添加至基礎材料中;
碳奈米管占所形成之耗散袋材料之約0.2%;
基礎材料占所形成之靜電耗散載體袋的以下百分比:
線性低密度聚乙烯(LLDPE) (99.80%);
所形成之靜電耗散載體袋的表面電阻率為1×1010
;
所形成之靜電耗散載體袋的透光率值為80;
所形成之靜電耗散載體袋的霧度值為80%;
所形成之靜電耗散載體袋的透明度值為54;
所形成之靜電耗散載體袋之表面缺陷(諸如尖端)減小至0%之值;
所形成之靜電耗散載體袋具有減少之高密度扭結物或聚結物之積聚,量測值為在0%;及
所形成之靜電耗散承載體袋具有較少碳材料轉移(脫落),量測值為0%。
實例6:靜電耗散載體袋係經由使用以下各者形成:
具有多壁的碳奈米管,其壁之間的壁間隔尺寸為約34 nm;
各碳奈米管之直徑為約45 nm;
碳奈米管之平均表面積為1000 m2
/g;
碳奈米管之縱橫比為3000:1;
在吹塑靜電耗散載體袋之前,碳奈米管作為預混之濃縮添加劑添加至基礎材料中;
碳奈米管占吹塑靜電耗散載體袋材料之約2.0%;
基礎材料占吹塑靜電耗散載體袋之以下百分比:
聚對苯二甲酸乙二酯(PET) (48.00%);
線性低密度聚乙烯(LLDPE) (50%);
吹塑靜電耗散載體袋之表面電阻率為1×1010
;
吹塑靜電耗散載體袋之透光率值為60%;
吹塑靜電耗散載體袋之霧度值為60%;
吹塑靜電耗散載體袋之透明度值為30%;
吹塑靜電耗散載體袋之表面缺陷(諸如尖端)減小至0%之值;
吹塑靜電耗散載體袋具有減少之高密度扭結物或聚結物之積聚,量測值為0%;及
吹塑靜電耗散載體袋具有較少碳材料轉移(脫落),量測值為0%。
實例7:靜電耗散載體袋係經由使用以下各者形成:
具有單壁之碳奈米管,碳奈米管之直徑尺寸為約20 nm;
碳奈米管之平均表面積為850 m2
/g;
碳奈米管之縱橫比為5500;
在擠出成片材之前,碳奈米管作為原材料添加至基礎材料中;
碳奈米管占所形成之抗靜電覆蓋帶之材料之約0.3%;
基礎材料占所形成之靜電耗散載體袋的以下百分比;
雙軸定向聚對苯二甲酸乙二酯(BOPET) (39.85%);
中間材料占所形成之靜電耗散載體袋的以下百分比;
乙烯-乙酸乙烯酯共聚物(EVA) (40.00%);
密封材料占所形成之靜電耗散載體袋的以下百分比;
乙烯-乙酸乙烯酯共聚物(EVA) +基於聚胺基甲酸酯之樹脂(PU) +聚乙烯樹脂(PE) (39.85%);
所形成之靜電耗散載體袋的表面電阻率為1×1010
;
所形成之承載帶的透光率值為74%;
所形成之承載帶的霧度值為60.5;及
所形成之承載帶的透明度值為20。
實例8:靜電耗散載體袋經由使用以下各者形成:
具有單壁之碳奈米管,碳奈米管之直徑尺寸為約25 nm;
碳奈米管之平均表面積為900 m2
/g;
碳奈米管之縱橫比為5000:1;
在擠出成片材之前,碳奈米管作為原材料添加至基礎材料中;
碳奈米管占所形成之抗靜電覆蓋帶之材料之約0.4%;
基礎材料占所形成之靜電耗散載體袋的以下百分比;
雙軸定向聚對苯二甲酸乙二酯(BO-PET) (39.80%);
中間材料占所形成之靜電耗散載體袋的以下百分比;
聚丙烯(PP) (40.00%);
密封材料占所形成之靜電耗散載體袋的以下百分比;
聚丙烯(PP) +基於聚胺基甲酸酯之樹脂(PU) +聚乙烯樹脂(PE)(39.85%);
所形成之靜電耗散載體袋的表面電阻率為1×109
;
所形成之承載帶的透光率值為84%;
所形成之承載帶的霧度值為60.5;及
所形成之承載帶的透明度值為20。
在第一替代實施例中,承載帶包括複數個對準囊袋,該等囊袋經建構及配置以運輸電子組件,該承載帶由材料形成,該等材料包含聚合物,該聚合物在材料的0.99重量%與99重量%之間,及碳奈米管,該碳奈米管在材料的0.01重量%與3重量%之間。
在根據第一替代實施例之第二替代實施例中,碳奈米管係選自由以下組成之群:單壁碳奈米管、雙壁碳奈米管及三壁或多壁碳奈米管及其組合。
在根據第二替代實施例之第三替代實施例中,雙壁碳奈米管及三壁或多壁碳奈米管的相鄰壁之間的壁間隔距離在0.20 nm與0.34 nm之間。
在根據第二替代實施例之第四替代實施例中,碳奈米管各自的直徑尺寸在1 nm與100 nm之間。
在根據第二替代實施例之第五替代實施例中,碳奈米管各自的表面積在600 m2
/g至1000 m2
/g之間。
在根據第二替代實施例之第六替代實施例中,碳奈米管之縱橫比為3000:1至6000:1。
在根據第一替代實施例之第七替代實施例中,在擠出承載帶、覆蓋帶或靜電耗散袋之前將碳奈米管作為原料碳奈米管材料添加至聚合物中。
在根據第一替代實施例之第八替代實施例中,聚合物係選自由以下組成之群:聚碳酸酯(PC)、丙烯腈丁二烯苯乙烯(ABS)、聚丙烯(PP)、聚苯乙烯(PS)、聚對苯二甲酸乙二酯(PET)、高密度聚乙烯(HDPE)、低密度聚乙烯(LDPE)、線性低密度聚乙烯(LLDPE)、苯乙烯-丙烯腈(SAN)、聚乙烯(PE)、聚酯(PETE)及其組合。
在根據第一替代實施例之第九替代實施例中,承載帶所量測的靜電耗散範圍在1×105
與1×1012
Ω/sq之間。
在根據第二替代實施例的第十替代實施例中,承載帶的透光率值在60%與90%之間。
在根據第十替代實施例的第十一替代實施例中,承載帶的霧度值在60%與70%之間。
在根據第十一替代實施例的第十二替代實施例中,承載帶的透明度值在25%與45%之間。
在根據第二替代實施例的第十三替代實施例中,承載帶所量測的表面缺陷之值為10%或更小。
在根據第二替代實施例之第十四替代實施例中,承載帶所量測的高密度扭結物之值為5%或更小。
在根據第二替代實施例之第十五替代實施例中,承載帶所量測的聚結物之值為5%或更小。
在根據第二替代實施例的第十六替代實施例中,承載帶所量測的碳材料轉移(脫落)之值為1%或更小。
在根據第一替代實施例之第十七替代實施例中,承載帶進一步包括覆蓋帶,覆蓋帶具有熱活化黏著劑或壓敏黏著劑,覆蓋帶具有至少一個層,該至少一個層由聚合物及碳奈米管形成。
在第十八替代實施例中,覆蓋帶由細長帶部分形成,該細長帶部分由材料形成,該等材料包含聚合物,該等聚合物在該等材料的0.99重量%與99重量%之間,及碳奈米管,該等碳奈米管在該等材料的0.01重量%與3重量%之間,其中該細長帶部分經建構及配置以經由熱活化或壓力活化與承載帶接合。
在第十九替代實施例中,抗靜電袋由複數個層形成,該複數個層以堆疊關係彼此接合,該抗靜電袋經建構及配置以用於運輸電子組件,該複數個層中之至少一者由材料形成,該等材料包含聚合物,該等聚合物在該等材料的0.99重量%與99重量%之間,及碳奈米管,該等碳奈米管在該等材料的0.01重量%與3重量%之間。
美國專利公開案US20080085405A1以全文引用之方式併入本文中。以下確認之公開案亦以全文引用之方式併入本文中。
Efficient coating of transparent and conductive carbon nanotube thin films on plastic substrates M H Andrew Ng, Lysia T Hartadi, Huiwen Tan及C H Patrick Poa, 發佈於2008年4月15日 • IOP Publishing Ltd,Nanotechnology
,第 19 卷
,第 20 期
。
此完成本發明之較佳及替代實施例之描述。熟習此項技術者可認識到本文所描述之具體實施例之其他等效物,該等等效物意欲由本文所附申請專利範圍涵蓋。
以上揭示內容意欲為說明性的且並非窮盡性的。本說明書將對一般熟習此項技術者建議許多變化及替代方案。可按需要組合或修改個別圖中所展示及上文所描述之各種元件以用於組合。所有此等替代方案及變化意欲包括於申請專利範圍之範疇內,其中術語「包含」意謂「包括(但不限於)」。
表徵本發明之此等及其他實施例於隨附申請專利範圍中特別指出且形成其一部分。然而,為了進一步理解本發明、藉由其使用獲得之其優點及目標,應參考形成其另一部分之圖式及隨附描述內容,其中說明及描述本發明之實施例。
1‧‧‧雙軸定向擠出膜
2‧‧‧中間/第二層膜
3‧‧‧熱密封層
圖
1
說明覆蓋帶之常見組態
,
其包括三
(
3
)
層
:
雙軸定向擠出膜
1
、中間
/
第二層膜
2
及熱密封層
3
。
Claims (14)
- 一種電子運輸裝置,其包含:具有複數個對準囊袋之承載帶,該等囊袋經建構及配置以用於運輸電子組件,該承載帶由材料形成,該等材料包含聚合物,該等聚合物在該等材料的0.99重量%與99重量%之間,及碳奈米管,該等碳奈米管在該等材料的0.01重量%與3重量%之間,及其中該等碳奈米管的縱橫比為3000:1至6000:1,其中該等碳奈米管係選自由以下組成之群:雙壁碳奈米管及三壁或多壁碳奈米管及其組合,其中該等雙壁碳奈米管及三壁或多壁碳奈米管的相鄰壁之間的壁間隔距離在0.20nm與0.34nm之間,其中該等聚合物係選自由以下組成之群:聚碳酸酯(PC)、丙烯腈丁二烯苯乙烯(ABS)、聚苯乙烯(PS)、苯乙烯-丙烯腈(SAN)及其組合。
- 如請求項1之電子運輸裝置,其中該等碳奈米管各自的直徑尺寸在1nm與100nm之間。
- 如請求項1之電子運輸裝置,其中該等碳奈米管各自的表面積在600m2/g至1000m2/g之間。
- 如請求項1之電子運輸裝置,其中在擠出該承載帶之前,該等碳奈米管作為原料碳奈米管材料添加至該等聚合物中。
- 如請求項1之電子運輸裝置,其中該承載帶所量測的靜電耗散範圍在 1×105與1×1012Ω/sq之間。
- 如請求項1之電子運輸裝置,其中該承載帶的透光率值在60%與90%之間。
- 如請求項6之電子運輸裝置,其中該承載帶的霧度值在60%與70%之間。
- 如請求項7之電子運輸裝置,其中該承載帶的透明度值在25%與45%之間。
- 如請求項1之電子運輸裝置,其中該承載帶所量測的表面缺陷之值為10%或更小。
- 如請求項1之電子運輸裝置,其中該承載帶所量測的高密度扭結物之值為5%或更小。
- 如請求項1之電子運輸裝置,其中該承載帶所量測的聚結物之值為5%或更小。
- 如請求項1之電子運輸裝置帶,其中該承載帶所量測的碳材料轉移(脫落)之值為1%或更小。
- 如請求項1之電子運輸裝置,其中該承載帶進一步包含覆蓋帶,該覆蓋帶包含熱活化黏著劑或壓敏黏著劑,該覆蓋帶包含至少一個層,該至少一個層由該等聚合物及該等碳奈米管形成。
- 一種電子運輸裝置,其包含:具有複數個層之抗靜電袋,該複數個層以堆疊關係彼此接合,該抗靜電袋經建構及配置以用於運輸電子組件,該複數個層中之至少一者由材料形成,該等材料包含聚合物,該等聚合物在該等材料的0.99重量%與99重量%之間,及碳奈米管,該等碳奈米管在該等材料的0.01重量%與3重量%之間,及其中該等碳奈米管的縱橫比為3000:1至6000:1,其中該等碳奈米管係選自由以下組成之群:雙壁碳奈米管及三壁或多壁碳奈米管及其組合,其中該等雙壁碳奈米管及三壁或多壁碳奈米管的相鄰壁之間的壁間隔距離在0.20nm與0.34nm之間,其中該等聚合物係選自由以下組成之群:聚碳酸酯(PC)、丙烯腈丁二烯苯乙烯(ABS)、聚苯乙烯(PS)、苯乙烯-丙烯腈(SAN)及其組合。
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
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US201862697075P | 2018-07-12 | 2018-07-12 | |
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US16/449,633 | 2019-06-24 | ||
US16/449,633 US20200017266A1 (en) | 2018-07-12 | 2019-06-24 | Carbon nanotubes in carrier tape, cover tape and static shielding bags |
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TW202006035A TW202006035A (zh) | 2020-02-01 |
TWI778277B true TWI778277B (zh) | 2022-09-21 |
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CN (1) | CN110712857A (zh) |
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CN115197577B (zh) * | 2022-08-04 | 2023-05-16 | 镇江高美新材料有限公司 | 一种抗静电硅橡胶复合材料、柔性静电屏蔽袋及其制备方法 |
CN115785584B (zh) * | 2022-12-29 | 2024-01-09 | 东莞市百高电子科技有限公司 | 一种电子元件包装用塑胶载带材料及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4898275A (en) * | 1989-05-25 | 1990-02-06 | Minnesota Mining And Manufacturing Company | Non nesting component carrier tape |
US20080085405A1 (en) * | 2006-10-06 | 2008-04-10 | Tesa Aktiengesellschaft | Adhesive tape having a carrier which is composed of one or more carrier films, the carrier bearing on at least one side an adhesive applied at least partially |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4001468B2 (ja) * | 2001-05-28 | 2007-10-31 | 電気化学工業株式会社 | キャリアテープ体 |
JP2007039567A (ja) * | 2005-08-03 | 2007-02-15 | Kri Inc | 高周波電子部品用複合成形体及び高周波電子部品用複合成形体製造用組成物 |
CN101321426B (zh) | 2007-06-06 | 2013-02-27 | 3M创新有限公司 | 抗静电膜及包含该膜的制品 |
KR101043432B1 (ko) * | 2009-05-04 | 2011-06-22 | (주)코스탯아이앤씨 | 체적 저항값을 갖는 캐리어 테이프 |
US20130209748A1 (en) | 2010-10-07 | 2013-08-15 | Denki Kagaku Kogyo Kabushiki Kaisha | Electronic component packaging sheet, and formed article thereof |
CN103260873B (zh) * | 2010-12-17 | 2015-09-23 | 3M创新有限公司 | 用于包装电子部件的热封膜及包覆带 |
JP2014513013A (ja) * | 2011-03-04 | 2014-05-29 | スリーエム イノベイティブ プロパティズ カンパニー | カバーテープ、コンポーネントパッケージ、及びこれらを作製する方法 |
CN103764513A (zh) * | 2011-09-01 | 2014-04-30 | 3M创新有限公司 | 用于包装电子元件的热密封包覆膜 |
CN103466195A (zh) * | 2013-03-19 | 2013-12-25 | 上海吉景包装制品有限公司 | 一种防静电上盖带 |
KR20140141208A (ko) * | 2013-05-31 | 2014-12-10 | 제일모직주식회사 | 전기전도성이 우수한 캐리어 테이프용 폴리카보네이트계 수지 조성물 |
CN105683060B (zh) * | 2013-11-06 | 2018-01-30 | 宝洁公司 | 柔性容器以及形成所述柔性容器的方法 |
JP5983850B1 (ja) * | 2015-11-18 | 2016-09-06 | 東洋インキScホールディングス株式会社 | 導電性樹脂組成物、成形体およびその製造方法 |
CN106479043A (zh) * | 2016-09-20 | 2017-03-08 | 吴忠市富林塑料包装制品有限公司 | 一种抗静电塑料编织袋及其制备方法 |
JP6897097B2 (ja) * | 2016-12-28 | 2021-06-30 | 日本ゼオン株式会社 | 複合積層体及び複合積層シート |
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- 2019-07-01 DE DE102019117660.3A patent/DE102019117660A1/de active Pending
- 2019-07-08 MY MYUI2019003925A patent/MY196992A/en unknown
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- 2019-07-11 CN CN201910625962.9A patent/CN110712857A/zh active Pending
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4898275A (en) * | 1989-05-25 | 1990-02-06 | Minnesota Mining And Manufacturing Company | Non nesting component carrier tape |
US20080085405A1 (en) * | 2006-10-06 | 2008-04-10 | Tesa Aktiengesellschaft | Adhesive tape having a carrier which is composed of one or more carrier films, the carrier bearing on at least one side an adhesive applied at least partially |
Also Published As
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TW202006035A (zh) | 2020-02-01 |
DE102019117660A1 (de) | 2020-01-16 |
US11878490B2 (en) | 2024-01-23 |
US20200017266A1 (en) | 2020-01-16 |
JP2020011776A (ja) | 2020-01-23 |
MY196992A (en) | 2023-05-17 |
CN110712857A (zh) | 2020-01-21 |
US20220106096A1 (en) | 2022-04-07 |
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