TWI776960B - 聚醯亞胺樹脂、聚醯亞胺清漆及聚醯亞胺薄膜 - Google Patents

聚醯亞胺樹脂、聚醯亞胺清漆及聚醯亞胺薄膜 Download PDF

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Publication number
TWI776960B
TWI776960B TW107133712A TW107133712A TWI776960B TW I776960 B TWI776960 B TW I776960B TW 107133712 A TW107133712 A TW 107133712A TW 107133712 A TW107133712 A TW 107133712A TW I776960 B TWI776960 B TW I776960B
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Taiwan
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structural unit
mol
polyimide
compound represented
polyimide resin
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TW107133712A
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English (en)
Chinese (zh)
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TW201922848A (zh
Inventor
安孫子洋平
村山智壽
岡田佳奈
關口慎司
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日商三菱瓦斯化學股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Wire Bonding (AREA)
TW107133712A 2017-10-04 2018-09-26 聚醯亞胺樹脂、聚醯亞胺清漆及聚醯亞胺薄膜 TWI776960B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-194284 2017-10-04
JP2017194284 2017-10-04

Publications (2)

Publication Number Publication Date
TW201922848A TW201922848A (zh) 2019-06-16
TWI776960B true TWI776960B (zh) 2022-09-11

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TW107133712A TWI776960B (zh) 2017-10-04 2018-09-26 聚醯亞胺樹脂、聚醯亞胺清漆及聚醯亞胺薄膜

Country Status (5)

Country Link
JP (1) JP7215428B2 (ja)
KR (1) KR102647164B1 (ja)
CN (1) CN111164131B (ja)
TW (1) TWI776960B (ja)
WO (1) WO2019069723A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112437786A (zh) * 2019-06-20 2021-03-02 杰富意化学株式会社 聚酰亚胺溶液及聚酰亚胺
TW202120634A (zh) * 2019-10-11 2021-06-01 日商三菱瓦斯化學股份有限公司 聚醯亞胺樹脂組成物、聚醯亞胺清漆、以及聚醯亞胺薄膜
JP2022022728A (ja) * 2020-07-02 2022-02-07 住友化学株式会社 ポリイミド系樹脂を含む光学フィルムの製造方法
KR20230038474A (ko) * 2020-07-16 2023-03-20 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 적층체
KR20230041689A (ko) * 2020-07-21 2023-03-24 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 폴리이미드 수지, 폴리이미드 바니시 및 폴리이미드 필름
WO2023199718A1 (ja) * 2022-04-15 2023-10-19 三菱瓦斯化学株式会社 共重合ポリイミド

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201522421A (zh) * 2013-09-27 2015-06-16 Toray Industries 聚醯亞胺前驅物、由其得到的聚醯亞胺樹脂膜以及含有其的顯示元件、光學元件、光接收元件、觸控面板、電路基板、有機ｅｌ顯示器以及有機ｅｌ元件及彩色濾光片的製造方法

Family Cites Families (7)

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Publication number Priority date Publication date Assignee Title
JPS6010533U (ja) 1983-07-02 1985-01-24 鐘ケ江　一広 ブラシ矯正用キヤツプ
JP2005289034A (ja) * 2004-01-21 2005-10-20 Kaneka Corp 版材用樹脂組成物及びそれを用いた高分子印刷版
JP2006206825A (ja) * 2005-01-31 2006-08-10 Jfe Chemical Corp 芳香族ポリイミド樹脂前駆体及び芳香族ポリイミド樹脂
JP2013137334A (ja) * 2010-04-21 2013-07-11 Nissan Chem Ind Ltd ポリイミド構造を含有する樹脂を含むリソグラフィー用レジスト下層膜形成組成物
JP5727885B2 (ja) * 2010-09-07 2015-06-03 Ｊｆｅケミカル株式会社 ポリイミドおよびポリイミドフィルム
US9777137B2 (en) * 2011-06-13 2017-10-03 Kaneka Corporation Polyamic acid, polyimide, polyamic acid solution, polyimide solution, polyimide films obtained from these solutions, and use of polyimide films
KR102656566B1 (ko) * 2015-03-26 2024-04-12 도레이 카부시키가이샤 수지 적층막, 그것을 포함하는 적층체, tft 기판, 유기 el 소자 컬러 필터 및 그들의 제조 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201522421A (zh) * 2013-09-27 2015-06-16 Toray Industries 聚醯亞胺前驅物、由其得到的聚醯亞胺樹脂膜以及含有其的顯示元件、光學元件、光接收元件、觸控面板、電路基板、有機ｅｌ顯示器以及有機ｅｌ元件及彩色濾光片的製造方法

Also Published As

Publication number Publication date
TW201922848A (zh) 2019-06-16
WO2019069723A1 (ja) 2019-04-11
JP7215428B2 (ja) 2023-01-31
KR20200052317A (ko) 2020-05-14
CN111164131B (zh) 2022-08-02
CN111164131A (zh) 2020-05-15
JPWO2019069723A1 (ja) 2020-09-10
KR102647164B1 (ko) 2024-03-14

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