TWI760564B - 電鍍用電極及電解金屬箔之製造裝置 - Google Patents
電鍍用電極及電解金屬箔之製造裝置 Download PDFInfo
- Publication number
- TWI760564B TWI760564B TW107133097A TW107133097A TWI760564B TW I760564 B TWI760564 B TW I760564B TW 107133097 A TW107133097 A TW 107133097A TW 107133097 A TW107133097 A TW 107133097A TW I760564 B TWI760564 B TW I760564B
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- Prior art keywords
- electrode
- substrate
- screw
- electroplating
- electrode member
- Prior art date
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 88
- 239000002184 metal Substances 0.000 title claims abstract description 88
- 239000011888 foil Substances 0.000 title claims abstract description 71
- 238000004519 manufacturing process Methods 0.000 title abstract description 35
- 238000007747 plating Methods 0.000 title abstract description 5
- 239000000758 substrate Substances 0.000 claims description 109
- 238000009713 electroplating Methods 0.000 claims description 95
- 239000007787 solid Substances 0.000 claims description 22
- 230000000295 complement effect Effects 0.000 claims description 8
- 238000005323 electroforming Methods 0.000 abstract description 23
- 238000000034 method Methods 0.000 abstract description 9
- 230000010485 coping Effects 0.000 abstract 1
- 125000006850 spacer group Chemical group 0.000 description 17
- 210000004027 cell Anatomy 0.000 description 14
- 238000009826 distribution Methods 0.000 description 11
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 9
- 239000003054 catalyst Substances 0.000 description 9
- 239000003792 electrolyte Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 229910052719 titanium Inorganic materials 0.000 description 9
- 239000010936 titanium Substances 0.000 description 9
- 239000002585 base Substances 0.000 description 7
- 230000007547 defect Effects 0.000 description 7
- 239000008151 electrolyte solution Substances 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000000926 separation method Methods 0.000 description 6
- 229910052715 tantalum Inorganic materials 0.000 description 5
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 5
- 229910001069 Ti alloy Inorganic materials 0.000 description 4
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 210000002421 cell wall Anatomy 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 229910052758 niobium Inorganic materials 0.000 description 4
- 239000010955 niobium Substances 0.000 description 4
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 230000008719 thickening Effects 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- 229910052726 zirconium Inorganic materials 0.000 description 4
- 229910052787 antimony Inorganic materials 0.000 description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 3
- 229910052797 bismuth Inorganic materials 0.000 description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 3
- 238000001354 calcination Methods 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007772 electrode material Substances 0.000 description 3
- 229910052735 hafnium Inorganic materials 0.000 description 3
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- -1 platinum group metals Chemical class 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- VONLASUMRVUZLY-UHFFFAOYSA-N [Ir].[Ti].[Ta] Chemical compound [Ir].[Ti].[Ta] VONLASUMRVUZLY-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- ULFQGKXWKFZMLH-UHFFFAOYSA-N iridium tantalum Chemical compound [Ta].[Ir] ULFQGKXWKFZMLH-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0657—Conducting rolls
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-191163 | 2017-09-29 | ||
| JP2017191163A JP6946911B2 (ja) | 2017-09-29 | 2017-09-29 | めっき用電極および電解金属箔の製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201920779A TW201920779A (zh) | 2019-06-01 |
| TWI760564B true TWI760564B (zh) | 2022-04-11 |
Family
ID=65919751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107133097A TWI760564B (zh) | 2017-09-29 | 2018-09-20 | 電鍍用電極及電解金屬箔之製造裝置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6946911B2 (enrdf_load_stackoverflow) |
| KR (1) | KR102525857B1 (enrdf_load_stackoverflow) |
| CN (1) | CN109576739B (enrdf_load_stackoverflow) |
| TW (1) | TWI760564B (enrdf_load_stackoverflow) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7005558B2 (ja) * | 2019-06-10 | 2022-01-21 | 日鉄工材株式会社 | 金属箔製造装置 |
| CN112251780B (zh) * | 2020-09-07 | 2021-11-05 | 浙江大学 | 一种改进的平板电沉积铜箔制备方法 |
| CN115348717A (zh) * | 2021-05-13 | 2022-11-15 | 季华实验室 | 基于钉状结构固定金属线路的精细线路板及其制备方法 |
| KR20240057678A (ko) | 2022-10-25 | 2024-05-03 | 주식회사 웨스코일렉트로드 | 동박 제조용 양극 재생을 위한 리드물질 제거방법 |
| KR102538289B1 (ko) * | 2023-02-07 | 2023-05-31 | 주식회사 웨스코일렉트로드 | 동박 제조용 양극 어셈블리 |
| EP4495295A1 (en) * | 2023-07-17 | 2025-01-22 | Wesco Electrode Co., Ltd. | Positive electrode assembly for manufacture of copper foil |
| EP4610405A1 (en) | 2024-02-27 | 2025-09-03 | Wesco Electrode Co., Ltd. | Positive electrode assembly for manufacturing copper foil |
| EP4610406A1 (en) | 2024-02-27 | 2025-09-03 | Wesco Electrode Co., Ltd. | Positive electrode assembly for manufacturing copper foil |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW273578B (enrdf_load_stackoverflow) * | 1992-01-28 | 1996-04-01 | Berumerekku Denkyoku Kk | |
| JP2013204042A (ja) * | 2012-03-27 | 2013-10-07 | Daiso Co Ltd | 不溶性電極構造体、及び、不溶性電極構造体の補修方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2675219B2 (ja) * | 1991-12-26 | 1997-11-12 | ペルメレック電極株式会社 | 金属箔連続製造装置用陽極の再活性化方法 |
| JPH0647758A (ja) | 1992-07-31 | 1994-02-22 | Olympus Optical Co Ltd | 複合光学素子の製造方法及び装置 |
| JP3468545B2 (ja) | 1993-04-30 | 2003-11-17 | ペルメレック電極株式会社 | 電解用電極 |
| JP3207973B2 (ja) * | 1993-06-10 | 2001-09-10 | ティーディーケイ株式会社 | 電気めっき方法および電気めっき用分割型不溶性電極 |
| JP3606932B2 (ja) * | 1994-12-30 | 2005-01-05 | 石福金属興業株式会社 | 電解用複合電極 |
| JP2002038291A (ja) * | 2001-09-03 | 2002-02-06 | Daiso Co Ltd | 金属箔製造用陽極 |
| JP5414257B2 (ja) | 2008-12-08 | 2014-02-12 | 株式会社昭和 | 電解用電極 |
| JP4642120B2 (ja) * | 2009-04-01 | 2011-03-02 | 三井金属鉱業株式会社 | 電解金属箔製造装置並びに電解金属箔製造装置に用いる薄板状不溶性金属電極の製造方法及びその電解金属箔製造装置を用いて得られた電解金属箔 |
| CN202482454U (zh) * | 2012-02-07 | 2012-10-10 | 宝鸡天邦钛镍有限公司 | 一种用于电解铜箔生箔机的dsa整体钛阳极 |
| CN205088315U (zh) * | 2015-09-16 | 2016-03-16 | 沈阳中科惠友科技发展有限责任公司 | 加厚弧形钛阳极板 |
-
2017
- 2017-09-29 JP JP2017191163A patent/JP6946911B2/ja active Active
-
2018
- 2018-09-10 KR KR1020180107684A patent/KR102525857B1/ko active Active
- 2018-09-18 CN CN201811085722.6A patent/CN109576739B/zh active Active
- 2018-09-20 TW TW107133097A patent/TWI760564B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW273578B (enrdf_load_stackoverflow) * | 1992-01-28 | 1996-04-01 | Berumerekku Denkyoku Kk | |
| JP2013204042A (ja) * | 2012-03-27 | 2013-10-07 | Daiso Co Ltd | 不溶性電極構造体、及び、不溶性電極構造体の補修方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019065339A (ja) | 2019-04-25 |
| JP6946911B2 (ja) | 2021-10-13 |
| KR20190038325A (ko) | 2019-04-08 |
| CN109576739B (zh) | 2022-09-27 |
| CN109576739A (zh) | 2019-04-05 |
| KR102525857B1 (ko) | 2023-04-26 |
| TW201920779A (zh) | 2019-06-01 |
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