TWI758578B - 排程器、基板處理裝置、及基板搬送方法 - Google Patents

排程器、基板處理裝置、及基板搬送方法 Download PDF

Info

Publication number
TWI758578B
TWI758578B TW108102591A TW108102591A TWI758578B TW I758578 B TWI758578 B TW I758578B TW 108102591 A TW108102591 A TW 108102591A TW 108102591 A TW108102591 A TW 108102591A TW I758578 B TWI758578 B TW I758578B
Authority
TW
Taiwan
Prior art keywords
substrate
unit
graph network
substrates
processing
Prior art date
Application number
TW108102591A
Other languages
English (en)
Chinese (zh)
Other versions
TW201937318A (zh
Inventor
野野部宏司
三谷隆
小泉竜也
大石邦夫
Original Assignee
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW201937318A publication Critical patent/TW201937318A/zh
Application granted granted Critical
Publication of TWI758578B publication Critical patent/TWI758578B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/4155—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by programme execution, i.e. part programme or machine function execution, e.g. selection of a programme
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31281—Calculate optimum path for conveying workpieces
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32252—Scheduling production, machining, job shop
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36301—Optimisation of sequence of operations
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automation & Control Theory (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Human Computer Interaction (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Multi-Process Working Machines And Systems (AREA)
TW108102591A 2018-03-01 2019-01-23 排程器、基板處理裝置、及基板搬送方法 TWI758578B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018036660 2018-03-01
JP2018-036660 2018-03-01

Publications (2)

Publication Number Publication Date
TW201937318A TW201937318A (zh) 2019-09-16
TWI758578B true TWI758578B (zh) 2022-03-21

Family

ID=67767661

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108102591A TWI758578B (zh) 2018-03-01 2019-01-23 排程器、基板處理裝置、及基板搬送方法

Country Status (5)

Country Link
US (1) US10824138B2 (enExample)
JP (1) JP6995072B2 (enExample)
KR (1) KR102363113B1 (enExample)
CN (1) CN110223934B (enExample)
TW (1) TWI758578B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6517845B2 (ja) * 2017-01-17 2019-05-22 株式会社荏原製作所 スケジューラ、基板処理装置、及び基板搬送方法
JP7572863B2 (ja) * 2021-01-12 2024-10-24 株式会社荏原製作所 複数のサブモジュールを有する基板処理モジュールを備えた半導体製造装置においてサブモジュールの最適使用数を決定する方法、および半導体製造装置
JP7311553B2 (ja) * 2021-03-29 2023-07-19 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法及びプログラム

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030028282A1 (en) * 1998-12-31 2003-02-06 Hilario Oh Method and apparatus for resolving conflicts in a substrate processing system
US20030158618A1 (en) * 2000-02-28 2003-08-21 Raymond Browning Push-type scheduling for semiconductor fabrication
US20040078109A1 (en) * 1998-12-31 2004-04-22 Dikran Babikian Robot pre-positioning in a wafer processing system
US20060161286A1 (en) * 2000-01-17 2006-07-20 Yoichi Kobayashi Substrate transfer controlling apparatus and substrate transferring method
TW200735251A (en) * 2005-11-24 2007-09-16 Tokyo Electron Ltd Substrate transportation processing apparatus and method of trouble measures of substrate transportation processing apparatus and computer readable medium encoded with a program for trouble measures of substrate transportation processing apparatus
JP2016066643A (ja) * 2014-09-22 2016-04-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、制御方法、およびコンピュータプログラム
TW201802920A (zh) * 2016-03-30 2018-01-16 斯庫林集團股份有限公司 基板處理裝置及基板處理方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5442306A (en) 1977-09-09 1979-04-04 Osaka Shinku Kiki Seisakusho Strong flange joint device in vacuum melting furnace
US5444632A (en) * 1994-04-28 1995-08-22 Texas Instruments Incorporated Apparatus and method for controlling and scheduling processing machines
JP2003216598A (ja) * 2002-01-25 2003-07-31 Nippon Telegr & Teleph Corp <Ntt> 秘密分散を用いた動的計画法の実行方法、その装置、及びそのプログラム
US20060241813A1 (en) * 2005-04-22 2006-10-26 Applied Materials, Inc. Optimized cluster tool transfer process and collision avoidance design
US20080216077A1 (en) * 2007-03-02 2008-09-04 Applied Materials, Inc. Software sequencer for integrated substrate processing system
KR101012249B1 (ko) * 2007-07-10 2011-02-08 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치의 스케줄작성방법 및 그 프로그램
US9037279B2 (en) * 2009-09-09 2015-05-19 Taiwan Semiconductor Manufacturing Company, Ltd. Clustering for prediction models in process control and for optimal dispatching
JP5620680B2 (ja) 2010-01-12 2014-11-05 株式会社荏原製作所 スケジューラ、基板処理装置、及び基板処理装置の運転方法
JP5415356B2 (ja) * 2010-05-19 2014-02-12 株式会社荏原製作所 基板処理装置の基板搬送方法、スケジューラ、及び基板処理装置の運転制御装置
JP5449239B2 (ja) * 2010-05-12 2014-03-19 東京エレクトロン株式会社 基板処理装置、基板処理方法及びプログラムを記録した記憶媒体
CN201796892U (zh) * 2010-09-17 2011-04-13 四川虹视显示技术有限公司 双面发光的oled显示装置
JP5852908B2 (ja) * 2011-09-16 2016-02-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置のためのスケジュール作成方法およびスケジュール作成プログラム
US9862554B2 (en) * 2011-10-26 2018-01-09 Brooks Automation, Inc. Semiconductor wafer handling and transport
US9659799B2 (en) * 2012-08-28 2017-05-23 Asm Ip Holding B.V. Systems and methods for dynamic semiconductor process scheduling
CN104022230B (zh) * 2014-06-11 2016-09-14 上海和辉光电有限公司 一种oled结构及提升oled出光量的方法
JP6313671B2 (ja) * 2014-06-23 2018-04-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置のためのスケジュール作成方法および基板処理装置
KR20170015047A (ko) * 2015-07-31 2017-02-08 삼성전자주식회사 반도체 제조 장치의 처리량 측정 방법 및 시스템
JP6517845B2 (ja) * 2017-01-17 2019-05-22 株式会社荏原製作所 スケジューラ、基板処理装置、及び基板搬送方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030028282A1 (en) * 1998-12-31 2003-02-06 Hilario Oh Method and apparatus for resolving conflicts in a substrate processing system
US20040078109A1 (en) * 1998-12-31 2004-04-22 Dikran Babikian Robot pre-positioning in a wafer processing system
US20060161286A1 (en) * 2000-01-17 2006-07-20 Yoichi Kobayashi Substrate transfer controlling apparatus and substrate transferring method
US20030158618A1 (en) * 2000-02-28 2003-08-21 Raymond Browning Push-type scheduling for semiconductor fabrication
TW200735251A (en) * 2005-11-24 2007-09-16 Tokyo Electron Ltd Substrate transportation processing apparatus and method of trouble measures of substrate transportation processing apparatus and computer readable medium encoded with a program for trouble measures of substrate transportation processing apparatus
JP2016066643A (ja) * 2014-09-22 2016-04-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、制御方法、およびコンピュータプログラム
TW201802920A (zh) * 2016-03-30 2018-01-16 斯庫林集團股份有限公司 基板處理裝置及基板處理方法

Also Published As

Publication number Publication date
US10824138B2 (en) 2020-11-03
JP2019153787A (ja) 2019-09-12
CN110223934A (zh) 2019-09-10
KR20190104873A (ko) 2019-09-11
JP6995072B2 (ja) 2022-01-14
CN110223934B (zh) 2021-10-08
TW201937318A (zh) 2019-09-16
KR102363113B1 (ko) 2022-02-15
US20190271970A1 (en) 2019-09-05

Similar Documents

Publication Publication Date Title
JP5392190B2 (ja) 基板処理システム及び基板処理方法
TWI785171B (zh) 物料優化調度的方法和設備
KR101553417B1 (ko) 기판 처리 장치 및 기판 처리 방법
TWI758578B (zh) 排程器、基板處理裝置、及基板搬送方法
TWI718356B (zh) 排程器、基板處理裝置、以及基板搬運方法
CN111801785B (zh) 真空处理装置的运转方法
JP2018098301A (ja) 基板処理装置
JP4957426B2 (ja) 塗布、現像装置及び塗布、現像装置の運転方法並びに記憶媒体
US7032739B2 (en) Intermediate product carrying apparatus, and intermediate product carrying method
TW202121085A (zh) 基板處理裝置及基板處理方法
JP5867473B2 (ja) 塗布、現像装置、塗布、現像装置の運転方法及び記憶媒体
CN115997225A (zh) 调度基板路由与处理
JP6697107B2 (ja) スケジューラ、基板処理装置、及び基板搬送方法
JP7347658B2 (ja) 基板処理装置及び基板処理方法
KR20220017831A (ko) 기판 처리 장치 및 반송 스케줄 제작 방법
TW202137380A (zh) 基板處理裝置及基板處理方法
TWI906400B (zh) 基板處理裝置及基板處理方法
KR20250097702A (ko) 기판 처리 장치, 기판 처리 장치의 제어 방법, 프로그램을 저장한 기억 매체
WO2022102475A1 (ja) 基板処理装置及び基板処理方法
JP2011211218A (ja) 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体