TWI752878B - 接合材用合金錠 - Google Patents

接合材用合金錠 Download PDF

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Publication number
TWI752878B
TWI752878B TW110116698A TW110116698A TWI752878B TW I752878 B TWI752878 B TW I752878B TW 110116698 A TW110116698 A TW 110116698A TW 110116698 A TW110116698 A TW 110116698A TW I752878 B TWI752878 B TW I752878B
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TW
Taiwan
Prior art keywords
mass
alloy
intermetallic compound
alloy ingot
present
Prior art date
Application number
TW110116698A
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English (en)
Chinese (zh)
Other versions
TW202208644A (zh
Inventor
關根重信
Original Assignee
日商納普拉有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商納普拉有限公司 filed Critical 日商納普拉有限公司
Application granted granted Critical
Publication of TWI752878B publication Critical patent/TWI752878B/zh
Publication of TW202208644A publication Critical patent/TW202208644A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/282—Zn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
TW110116698A 2020-08-27 2021-05-10 接合材用合金錠 TWI752878B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020143554A JP6890201B1 (ja) 2020-08-27 2020-08-27 接合材用合金インゴット
JP2020-143554 2020-08-27

Publications (2)

Publication Number Publication Date
TWI752878B true TWI752878B (zh) 2022-01-11
TW202208644A TW202208644A (zh) 2022-03-01

Family

ID=76429581

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110116698A TWI752878B (zh) 2020-08-27 2021-05-10 接合材用合金錠

Country Status (3)

Country Link
JP (1) JP6890201B1 (ja)
CN (1) CN114101967B (ja)
TW (1) TWI752878B (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004181485A (ja) * 2002-12-03 2004-07-02 Senju Metal Ind Co Ltd 鉛フリーはんだ合金
JP2018135574A (ja) * 2017-02-23 2018-08-30 有限会社 ナプラ 金属粒子
JP2019025540A (ja) * 2017-07-25 2019-02-21 有限会社 ナプラ 金属粒子および接合構造部
TW201929994A (zh) * 2017-12-31 2019-08-01 日商千住金屬工業股份有限公司 焊料合金

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5250582B2 (ja) * 2010-04-22 2013-07-31 有限会社 ナプラ 充填用基材及びそれを用いた充填方法
CN102974954B (zh) * 2012-12-17 2015-03-11 南京航空航天大学 含Fe和Pr的Sn-Cu-Ni无铅钎料
JP6111952B2 (ja) * 2013-09-25 2017-04-12 日立金属株式会社 無鉛はんだ合金、接合材及び接合体
JP2015131340A (ja) * 2013-12-10 2015-07-23 住友金属鉱山株式会社 Ａｕ−Ｓｎ−Ａｇ系はんだ合金並びにこのＡｕ−Ｓｎ−Ａｇ系はんだ合金を用いて封止された電子部品及び電子部品搭載装置
EP3095885B9 (en) * 2014-01-16 2019-12-25 UACJ Corporation Aluminum alloy material, method for producing same, aluminum alloy clad material, and method for producing same
JP6144440B1 (ja) * 2017-01-27 2017-06-07 有限会社 ナプラ 半導体封止用プリフォーム
JP6355092B1 (ja) * 2017-05-11 2018-07-11 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた接合構造体
JP6799701B1 (ja) * 2020-03-12 2020-12-16 有限会社 ナプラ 金属粒子

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004181485A (ja) * 2002-12-03 2004-07-02 Senju Metal Ind Co Ltd 鉛フリーはんだ合金
JP2018135574A (ja) * 2017-02-23 2018-08-30 有限会社 ナプラ 金属粒子
JP2019025540A (ja) * 2017-07-25 2019-02-21 有限会社 ナプラ 金属粒子および接合構造部
TW201929994A (zh) * 2017-12-31 2019-08-01 日商千住金屬工業股份有限公司 焊料合金

Also Published As

Publication number Publication date
CN114101967B (zh) 2022-12-20
JP2022038859A (ja) 2022-03-10
CN114101967A (zh) 2022-03-01
TW202208644A (zh) 2022-03-01
JP6890201B1 (ja) 2021-06-18

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