TWI749123B - 表面處理銅箔及覆銅積層板 - Google Patents

表面處理銅箔及覆銅積層板 Download PDF

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Publication number
TWI749123B
TWI749123B TW106143933A TW106143933A TWI749123B TW I749123 B TWI749123 B TW I749123B TW 106143933 A TW106143933 A TW 106143933A TW 106143933 A TW106143933 A TW 106143933A TW I749123 B TWI749123 B TW I749123B
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TW
Taiwan
Prior art keywords
copper foil
layer
treatment layer
silane coupling
treated copper
Prior art date
Application number
TW106143933A
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English (en)
Chinese (zh)
Other versions
TW201839178A (zh
Inventor
篠崎健作
奧野裕子
宇野岳夫
Original Assignee
日商古河電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商古河電氣工業股份有限公司 filed Critical 日商古河電氣工業股份有限公司
Publication of TW201839178A publication Critical patent/TW201839178A/zh
Application granted granted Critical
Publication of TWI749123B publication Critical patent/TWI749123B/zh

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW106143933A 2016-12-14 2017-12-14 表面處理銅箔及覆銅積層板 TWI749123B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016241777 2016-12-14
JP2016-241777 2016-12-14

Publications (2)

Publication Number Publication Date
TW201839178A TW201839178A (zh) 2018-11-01
TWI749123B true TWI749123B (zh) 2021-12-11

Family

ID=62558501

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106143933A TWI749123B (zh) 2016-12-14 2017-12-14 表面處理銅箔及覆銅積層板

Country Status (5)

Country Link
JP (1) JP6462961B2 (ja)
KR (1) KR102268478B1 (ja)
CN (1) CN110088361B (ja)
TW (1) TWI749123B (ja)
WO (1) WO2018110579A1 (ja)

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KR102495166B1 (ko) * 2018-02-23 2023-02-06 후루카와 덴키 고교 가부시키가이샤 전해 동박, 그리고 당해 전해 동박을 이용한 리튬 이온 2차 전지용 부극, 리튬 이온 2차 전지, 동 클래드 적층판 및 프린트 배선판
CN112424399B (zh) * 2018-08-10 2023-07-25 三井金属矿业株式会社 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板
TWI668333B (zh) * 2018-09-17 2019-08-11 金居開發股份有限公司 微粗糙電解銅箔及銅箔基板
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
CN110029373A (zh) * 2019-05-24 2019-07-19 山东金宝电子股份有限公司 一种消除电解铜箔异常粗化结晶的复合添加剂
TWI764170B (zh) * 2019-06-19 2022-05-11 金居開發股份有限公司 微粗糙電解銅箔以及銅箔基板
US10619262B1 (en) * 2019-06-27 2020-04-14 Chang Chun Petrochemical Co., Ltd. Electrodeposited copper foil
TWI697574B (zh) * 2019-11-27 2020-07-01 長春石油化學股份有限公司 電解銅箔、電極及包含其之鋰離子電池
JP7421208B2 (ja) * 2019-12-24 2024-01-24 日本電解株式会社 表面処理銅箔及びその製造方法
WO2021157363A1 (ja) 2020-02-04 2021-08-12 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
KR20220106200A (ko) 2020-02-04 2022-07-28 미쓰이금속광업주식회사 조화 처리 동박, 캐리어를 구비하는 동박, 동장 적층판 및 프린트 배선판
JP7053976B1 (ja) * 2020-06-11 2022-04-12 三井金属鉱業株式会社 両面銅張積層板
JP7051988B1 (ja) 2020-11-27 2022-04-11 古河電気工業株式会社 粗化処理銅箔、銅張積層板、及びプリント配線板
WO2022153580A1 (ja) * 2021-01-15 2022-07-21 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
CN116997683A (zh) * 2021-03-26 2023-11-03 三井金属矿业株式会社 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板
KR20230159392A (ko) * 2021-03-26 2023-11-21 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어를 구비한 구리박, 동장 적층판 및 프린트 배선판
US12104265B2 (en) 2021-03-29 2024-10-01 Mitsui Mining & Smelting Co., Ltd. Roughened copper foil, copper-clad laminate and printed wiring board
WO2022209989A1 (ja) * 2021-03-29 2022-10-06 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
WO2022244827A1 (ja) * 2021-05-20 2022-11-24 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
JPWO2022255422A1 (ja) * 2021-06-03 2022-12-08
US11540389B1 (en) 2021-07-06 2022-12-27 Chang Chun Petrochemical Co., Ltd. Surface-treated copper foil and copper clad laminate
US12060647B2 (en) * 2021-07-06 2024-08-13 Chang Chun Petrochemical Co., Ltd. Surface-treated copper foil and copper clad laminate
WO2023281759A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
WO2023190833A1 (ja) * 2022-03-30 2023-10-05 古河電気工業株式会社 表面処理銅箔、銅張積層板、及びプリント配線板
JP2023159661A (ja) * 2022-04-20 2023-11-01 古河電気工業株式会社 複合フィルム
CN116351472B (zh) * 2023-02-22 2024-06-25 万华化学集团股份有限公司 一种催化精馏生产异氰酸酯的制备方法和系统
JP7434656B1 (ja) 2023-08-31 2024-02-20 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板、及びプリント配線板の製造方法

Citations (1)

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Publication number Priority date Publication date Assignee Title
TW201524280A (zh) * 2013-11-29 2015-06-16 Jx Nippon Mining & Metals Corp 表面處理銅箔、積層板、印刷配線板、電子機器、附載體銅箔及印刷配線板之製造方法

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KR20070074001A (ko) * 2002-03-05 2007-07-10 히다치 가세고교 가부시끼가이샤 수지 부착 금속박, 금속 피복 적층판, 그를 이용한 프린트배선판 및 그의 제조 방법
JP2006210689A (ja) 2005-01-28 2006-08-10 Fukuda Metal Foil & Powder Co Ltd 高周波プリント配線板用銅箔及びその製造方法
JP5129642B2 (ja) 2007-04-19 2013-01-30 三井金属鉱業株式会社 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板
JP5400447B2 (ja) 2009-03-31 2014-01-29 三井金属鉱業株式会社 粗化処理銅箔、粗化処理銅箔の製造方法及び銅張積層板
JP5885790B2 (ja) * 2013-08-20 2016-03-15 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、プリント配線板、電子機器、電子機器の製造方法、並びに、プリント配線板の製造方法
JP2015105440A (ja) 2014-11-21 2015-06-08 Jx日鉱日石金属株式会社 表面処理銅箔、積層板、プリント配線板、プリント回路板及び電子機器

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201524280A (zh) * 2013-11-29 2015-06-16 Jx Nippon Mining & Metals Corp 表面處理銅箔、積層板、印刷配線板、電子機器、附載體銅箔及印刷配線板之製造方法

Also Published As

Publication number Publication date
KR102268478B1 (ko) 2021-06-22
KR20190075054A (ko) 2019-06-28
JP6462961B2 (ja) 2019-01-30
CN110088361A (zh) 2019-08-02
WO2018110579A1 (ja) 2018-06-21
JPWO2018110579A1 (ja) 2018-12-20
TW201839178A (zh) 2018-11-01
CN110088361B (zh) 2021-07-16

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