TWI744956B - 基板搬運裝置以及基板搬運裝置的手部的位置修正方法 - Google Patents
基板搬運裝置以及基板搬運裝置的手部的位置修正方法 Download PDFInfo
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- TWI744956B TWI744956B TW109120689A TW109120689A TWI744956B TW I744956 B TWI744956 B TW I744956B TW 109120689 A TW109120689 A TW 109120689A TW 109120689 A TW109120689 A TW 109120689A TW I744956 B TWI744956 B TW I744956B
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/19—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/4155—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by programme execution, i.e. part programme or machine function execution, e.g. selection of a programme
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Automation & Control Theory (AREA)
- Human Computer Interaction (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Numerical Control (AREA)
- Manipulator (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019170011A JP7374683B2 (ja) | 2019-09-19 | 2019-09-19 | 基板搬送装置および基板搬送装置のハンドの位置補正方法 |
JP2019-170011 | 2019-09-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202112641A TW202112641A (zh) | 2021-04-01 |
TWI744956B true TWI744956B (zh) | 2021-11-01 |
Family
ID=74878702
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109120689A TWI744956B (zh) | 2019-09-19 | 2020-06-19 | 基板搬運裝置以及基板搬運裝置的手部的位置修正方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7374683B2 (ja) |
TW (1) | TWI744956B (ja) |
WO (1) | WO2021054101A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230092298A (ko) * | 2021-12-17 | 2023-06-26 | 세메스 주식회사 | 웨이퍼 티칭 장치와 이를 이용한 웨이퍼 티칭 방법 |
JP2024054919A (ja) | 2022-10-06 | 2024-04-18 | 東京エレクトロン株式会社 | 基板搬送ユニットおよび基板搬送制御方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0259289A (ja) * | 1988-08-23 | 1990-02-28 | Sankyo Seiki Mfg Co Ltd | ダイレクトドライブ多関節ロボット |
JPH07193112A (ja) * | 1993-12-27 | 1995-07-28 | Hitachi Ltd | マルチ式ウエ−ハ処理装置 |
JP2010541200A (ja) * | 2007-09-22 | 2010-12-24 | ダイナミック マイクロシステムズ セミコンダクター イクイップメント ゲーエムベーハー | 一体化されたウェハ受渡し機構 |
JP2013162029A (ja) * | 2012-02-07 | 2013-08-19 | Tokyo Electron Ltd | 基板処理装置、基板処理方法及び記憶媒体 |
TW201624597A (zh) * | 2014-09-29 | 2016-07-01 | 思可林集團股份有限公司 | 基板收納容器、裝載埠裝置及基板處理裝置 |
CN107548518A (zh) * | 2015-07-22 | 2018-01-05 | 应用材料公司 | 用于由机器人进行晶片置放的光学校准的设备及方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07263518A (ja) * | 1994-03-18 | 1995-10-13 | Fujitsu Ltd | 半導体ウェハの搬送装置及び搬送方法並びに半導体ウェハ処理装置 |
JP4376116B2 (ja) | 2003-06-03 | 2009-12-02 | 東京エレクトロン株式会社 | 基板受け渡し位置の調整方法 |
JP4381962B2 (ja) | 2004-11-12 | 2009-12-09 | 大日本スクリーン製造株式会社 | 基板処理装置 |
TWI619145B (zh) * | 2015-04-30 | 2018-03-21 | 佳能股份有限公司 | 壓印裝置,基板運送裝置,壓印方法以及製造物件的方法 |
JP6923346B2 (ja) | 2017-04-20 | 2021-08-18 | 株式会社Screenホールディングス | 基板搬送装置、それを備える基板処理装置および基板搬送装置のティーチング方法 |
JP7153848B2 (ja) * | 2018-03-16 | 2022-10-17 | 株式会社東京精密 | プローバ |
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2019
- 2019-09-19 JP JP2019170011A patent/JP7374683B2/ja active Active
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2020
- 2020-06-19 TW TW109120689A patent/TWI744956B/zh active
- 2020-08-31 WO PCT/JP2020/032858 patent/WO2021054101A1/ja active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0259289A (ja) * | 1988-08-23 | 1990-02-28 | Sankyo Seiki Mfg Co Ltd | ダイレクトドライブ多関節ロボット |
JPH07193112A (ja) * | 1993-12-27 | 1995-07-28 | Hitachi Ltd | マルチ式ウエ−ハ処理装置 |
JP2010541200A (ja) * | 2007-09-22 | 2010-12-24 | ダイナミック マイクロシステムズ セミコンダクター イクイップメント ゲーエムベーハー | 一体化されたウェハ受渡し機構 |
JP2013162029A (ja) * | 2012-02-07 | 2013-08-19 | Tokyo Electron Ltd | 基板処理装置、基板処理方法及び記憶媒体 |
TW201624597A (zh) * | 2014-09-29 | 2016-07-01 | 思可林集團股份有限公司 | 基板收納容器、裝載埠裝置及基板處理裝置 |
CN107548518A (zh) * | 2015-07-22 | 2018-01-05 | 应用材料公司 | 用于由机器人进行晶片置放的光学校准的设备及方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2021054101A1 (ja) | 2021-03-25 |
JP7374683B2 (ja) | 2023-11-07 |
TW202112641A (zh) | 2021-04-01 |
JP2021048270A (ja) | 2021-03-25 |
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