TWI744956B - Substrate carrier apparatus, and method for correcting position of hand of substrate carrier apparatus - Google Patents

Substrate carrier apparatus, and method for correcting position of hand of substrate carrier apparatus Download PDF

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TWI744956B
TWI744956B TW109120689A TW109120689A TWI744956B TW I744956 B TWI744956 B TW I744956B TW 109120689 A TW109120689 A TW 109120689A TW 109120689 A TW109120689 A TW 109120689A TW I744956 B TWI744956 B TW I744956B
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hand
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橋本光治
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日商斯庫林集團股份有限公司
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    • G05B19/19Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path
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    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/18Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/4155Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by programme execution, i.e. part programme or machine function execution, e.g. selection of a programme
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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Abstract

本發明的課題在於提供一種能以更高的位置精度使手部移動之技術。用以搬運基板之基板搬運裝置CR2係具備手部46、旋轉機構42、旋轉檢測部47、第一直動機構43、第一檢測部48、第二直動機構44以及第二檢測部49。於手部46載置基板。旋轉機構42係包含與手部46連動之旋轉體421,並使旋轉體421繞著旋轉軸線CA1旋轉。旋轉檢測部47係檢測旋轉體421的旋轉位置。第一直動機構43係包含與手部46連動之第一移動體431,並使第一移動體431沿著第一移動方向D1移動。第一檢測部48係檢測第一移動體431的位置。第二直動機構44係包含與手部46連動之第二移動體441,並使第二移動體441朝第二移動方向移動。第二檢測部49係檢測第二移動體441的位置。 The subject of the present invention is to provide a technique capable of moving the hand with higher position accuracy. The substrate conveying device CR2 for conveying substrates includes a hand 46, a rotating mechanism 42, a rotation detecting section 47, a first linear motion mechanism 43, a first detecting section 48, a second linear motion mechanism 44, and a second detecting section 49. The substrate is placed on the hand 46. The rotating mechanism 42 includes a rotating body 421 that is linked to the hand 46 and rotates the rotating body 421 around the rotation axis CA1. The rotation detection unit 47 detects the rotation position of the rotating body 421. The first linear motion mechanism 43 includes a first moving body 431 linked with the hand 46, and moves the first moving body 431 along the first moving direction D1. The first detection unit 48 detects the position of the first moving body 431. The second linear motion mechanism 44 includes a second moving body 441 linked with the hand 46 and moves the second moving body 441 in the second moving direction. The second detection unit 49 detects the position of the second moving body 441.

Description

基板搬運裝置以及基板搬運裝置的手部的位置修正方法 Substrate conveying device and method for correcting the hand position of the substrate conveying device

本發明係有關於一種基板搬運裝置以及基板搬運裝置的手部的位置修正方法。 The present invention relates to a substrate conveying device and a method for correcting the position of the hands of the substrate conveying device.

以往已提案有一種用以搬運基板之直動式的基板搬運裝置(專利文獻1至專利文獻3)。在專利文獻1中揭示有一種包含直動式手臂之基板搬運機器人。該基板搬運機器人係包含本體以及設置於本體上的直動式手臂。於直動式手臂的前端設置有叉部(fork)。於叉部上載置基板。直動式手臂係被帶子(belt)以及馬達驅動。直動式手臂進行伸縮,藉此將載置於叉部上的基板搬運至目的的位置。 In the past, a direct-acting substrate transfer device for transferring substrates has been proposed (Patent Document 1 to Patent Document 3). Patent Document 1 discloses a substrate transfer robot including a direct-acting arm. The substrate transfer robot includes a main body and a direct-acting arm provided on the main body. A fork is provided at the front end of the direct-acting arm. Place the substrate on the fork. The direct-acting arm is driven by a belt and a motor. The direct-acting arm expands and contracts to transport the substrate placed on the fork to the desired position.

此外,在專利文獻2中,基板搬運裝置係包含手部(hand)、升降軸驅動部、線性軸驅動部以及迴旋軸驅動部。於手部上載置基板。線性軸驅動部係使手部朝水平的一個方向往復移動。迴旋軸驅動部係使線性軸驅動部繞著鉛直的旋轉軸線迴旋,藉此使手部迴旋。升降軸驅動部係使迴旋軸驅動部升降,藉此使線性軸驅動部以及手部升降。此種基板搬運裝置係能三維地調整手部的位置。 In addition, in Patent Document 2, the substrate conveying device includes a hand, a lift shaft drive section, a linear shaft drive section, and a swing shaft drive section. Place the substrate on the hand. The linear axis driving part makes the hand move back and forth in one horizontal direction. The swivel axis drive unit makes the linear axis drive unit swivel around a vertical axis of rotation, thereby making the hand swivel. The lifting shaft drive unit raises and lowers the swing shaft drive unit, thereby lifting the linear shaft drive unit and the hand. Such a substrate transport device can adjust the position of the hand three-dimensionally.

[先前技術文獻] [Prior Technical Literature]

[專利文獻] [Patent Literature]

[專利文獻1]日本特開2009-23021號公報。 [Patent Document 1] JP 2009-23021 A.

[專利文獻2]日本特開2011-159884號公報。 [Patent Document 2] JP 2011-159884 A.

[專利文獻3]日本特許第4980978號公報。 [Patent Document 3] Japanese Patent No. 4980978.

在基板搬運裝置將基板搬入至基板處理裝置之情形中,會有基板處理裝置內的基板的位置成為問題之情形。例如,會有於基板處理裝置設置有用以保持基板之自轉夾具(spin chuck)之情形。在此情形中,期望基板搬運裝置以基板的中心與自轉夾具的旋轉中心一致之方式將基板搬入至基板處理裝置。 In the case where the substrate conveying device carries the substrate into the substrate processing device, the position of the substrate in the substrate processing device may become a problem. For example, there may be cases where a spin chuck is provided in the substrate processing apparatus to hold the substrate. In this case, it is desirable that the substrate transport device transports the substrate to the substrate processing device in such a manner that the center of the substrate coincides with the rotation center of the rotation jig.

在專利文獻1中,在從馬達至直動式手臂為止之驅動力傳達系統中設置有帶子。當該帶子為彈性體時,直動式手臂的位置精度係降低。 In Patent Document 1, a belt is provided in the driving force transmission system from the motor to the direct-acting arm. When the belt is an elastic body, the position accuracy of the direct-acting arm is lowered.

此外,在專利文獻2中,基板搬運裝置係藉由線性軸驅動部以及迴旋驅動部的兩個軸調整基板的水平面中的位置。在此種兩個軸所為之調整中,手部的位置精度的提升存在界限。 In addition, in Patent Document 2, the substrate conveying device adjusts the position of the substrate in the horizontal plane by the two shafts of the linear axis drive unit and the gyration drive unit. In the adjustment of the two axes, there is a limit to the improvement of the accuracy of the hand position.

因此,本發明的目的係提供一種能以更高的位置精度使手部移動之技術。 Therefore, the object of the present invention is to provide a technology capable of moving the hand with higher position accuracy.

基板搬運裝置的第一態樣為:用以搬運基板,並具備:手部,係用以載置前述基板;旋轉機構,係包含與前述手部連動之旋轉體,並使前述旋轉體繞著沿著鉛直方向的旋轉軸線旋轉;旋轉檢測部,係檢測前述旋轉體的旋轉位置;第一直動機構,係包含與前述手部連動之第一移動體,並使前述第一移動體沿著與鉛直方向交叉之第一移動方向移動;第一檢測部,係檢測前述第一移動體的位置;第二直動機構,係包含與前述手部連動之第二移動體,並使前述第二移動體朝與前述第一移動方向以及鉛直方向交叉之第二移動方向移動;以及第二檢測部,係檢測前述第二移動體的位置。 The first aspect of the substrate conveying device is: for conveying substrates, and equipped with: a hand for placing the substrate; a rotating mechanism including a rotating body linked with the hand and allowing the rotating body to go around Rotates along the axis of rotation in the vertical direction; the rotation detection unit detects the rotation position of the aforementioned rotating body; the first linear motion mechanism includes a first moving body linked with the aforementioned hand, and makes the aforementioned first moving body follow The first moving direction that crosses the vertical direction moves; the first detecting part detects the position of the first moving body; the second linear moving mechanism includes the second moving body linked with the hand, and makes the second moving body The moving body moves in a second moving direction that intersects the first moving direction and the vertical direction; and a second detection unit that detects the position of the second moving body.

基板搬運裝置的第二態樣為:在基板搬運裝置的第一態樣中,前述旋轉機構係包含直接連結於前述旋轉體之馬達。 The second aspect of the substrate conveying device is that in the first aspect of the substrate conveying device, the rotating mechanism includes a motor directly connected to the rotating body.

基板搬運裝置的手部的位置修正方法的第一態樣為:用以修正第一態樣的基板搬運裝置或者第二態樣的基板搬運裝置將基板傳遞至基板保持部時之手部的位置之方法,並具備:第一步驟,係前述基板搬運裝置依循教學資料(teaching data)使用以載置前述基板之前述手部移動,並使前述手部移動至比前述基板保持部還上方的規定位置;第二步驟,係藉由攝影機(camera)拍攝在前述規定位置停止之前述手部所載置的前述基板並取得影像資料;第三步驟,係依據前述影像資料檢測前述基板的中心的位置;以及第四步驟,係以前述基板的中心的位置接近至前述基板保持部的中心軸之方式修正前述規定位置並修正前述教學資料。 The first aspect of the method of correcting the hand position of the substrate conveying device is: to correct the position of the hand when the substrate conveying device of the first aspect or the substrate conveying device of the second aspect transfers the substrate to the substrate holder The method also includes: a first step of using the substrate transport device according to the teaching data to move the hand for placing the substrate, and move the hand to be higher than the substrate holding portion Position; The second step is to capture the substrate placed on the hand stopped at the predetermined position by a camera and obtain image data; the third step is to detect the center of the substrate based on the image data ; And the fourth step is to correct the predetermined position and correct the teaching material in such a way that the position of the center of the substrate is close to the central axis of the substrate holding portion.

基板搬運裝置的手部的位置修正方法的第二態樣為:用以修正第一態樣的基板搬運裝置或者第二樣態的基板搬運裝置將基板傳遞至基板保持部時之手部的位置之方法,並具備:第一步驟,係前述基板搬運裝置使用以載置 前述基板之前述手部移動至比前述基板保持部還上方的規定位置;第二步驟,係藉由前述基板搬運裝置所含有的鉛直驅動機構使前述手部下降並將前述基板載置於前述基板保持部;第三步驟,係前述基板保持部保持前述基板;第四步驟,係藉由攝影機拍攝被前述基板保持部保持的前述基板並取得影像資料;第五步驟,係依據前述影像資料求出以下述方式所獲得的前述基板的載置位置:將前述基板的中心相對於前述基板保持部的中心軸錯開至與前述基板保持部保持前述基板時所產生之前述基板的偏移方向為相反側所獲得;第六步驟,係前述基板搬運裝置將前述基板重新載置於前述載置位置;以及第七步驟,係前述基板保持部保持前述基板。 The second aspect of the method for correcting the hand position of the substrate conveying device is to correct the position of the hand when the substrate conveying device of the first aspect or the substrate conveying device of the second aspect transfers the substrate to the substrate holder The method includes: the first step, which is used by the aforementioned substrate conveying device for placement The hand of the substrate is moved to a predetermined position above the substrate holding portion; the second step is to lower the hand and place the substrate on the substrate by the vertical drive mechanism included in the substrate conveying device The holding part; the third step is to hold the substrate by the substrate holding part; the fourth step is to photograph the substrate held by the substrate holding part by a camera and obtain image data; the fifth step is to obtain based on the image data The placement position of the substrate is obtained by shifting the center of the substrate relative to the central axis of the substrate holding portion to the opposite side of the offset direction of the substrate generated when the substrate holding portion holds the substrate Obtained; The sixth step is that the substrate conveying device replaces the substrate in the placement position; and the seventh step is that the substrate holding portion holds the substrate.

基板搬運裝置的手部的位置修正方法的第三態樣為:在基板搬運裝置的手部的位置修正方法的第二態樣中,前述第五步驟係包含下述步驟:依據前述影像資料檢測前述基板保持部保持時所產生的前述基板的偏移量以及前述偏移方向;依據前述偏移量以及前述偏移方向修正前述規定位置,並算出俯視觀看時的位置與前述載置位置相等之修正後位置;前述基板保持部解除前述基板的保持,且前述鉛直驅動機構使前述手部上升至前述規定位置並抬起前述基板;至少驅動設置成比前述第二直動機構還接近前述手部之前述旋轉機構以及前述第一直動機構,並使前述手部移動至前述修正後位置;以及前述鉛直驅動機構使前述手部下降並將前述基板載置於前述基板保持部。 The third aspect of the method for correcting the position of the hands of the substrate conveying device is: in the second aspect of the method of correcting the position of the hands of the substrate conveying device, the fifth step includes the following steps: detecting based on the aforementioned image data The offset amount of the substrate and the offset direction generated when the substrate holding portion is held; the predetermined position is corrected based on the offset and the offset direction, and the position when viewed from above is calculated to be equal to the placement position Corrected position; the substrate holding portion releases the holding of the substrate, and the vertical drive mechanism raises the hand to the predetermined position and lifts the substrate; at least the drive is set to be closer to the hand than the second direct motion mechanism The rotating mechanism and the first linear motion mechanism move the hand to the corrected position; and the vertical drive mechanism lowers the hand and places the substrate on the substrate holding portion.

基板搬運裝置的手部的位置修正方法的第四態樣為:在基板搬運裝置的手部的位置修正方法的第二態樣或者第三態樣中,在前述第五步驟中使用基於前述影像資料的機械學習求出前述載置位置。 The fourth aspect of the method for correcting the position of the hands of the substrate conveying device is: in the second aspect or the third aspect of the method of correcting the position of the hands of the substrate conveying device, the fifth step is based on the image The machine learning of the data finds the aforementioned placement position.

基板搬運裝置的手部的位置修正方法的第五態樣為:在基板搬運裝置的手部的位置修正方法的第四態樣中,在前述第五步驟中,從與前述基板的種類以及複數個前述基板保持部的至少任一者對應之複數個機械學習部選擇已與成為搬運對象的前述基板的種類以及搬運目的地的前述基板保持部的至少任一者因應之前述機械學習部,並使用所選擇的前述機械學習部求出前述載置位置。 The fifth aspect of the method of correcting the position of the hands of the substrate conveying device is: in the fourth aspect of the method of correcting the position of the hands of the substrate conveying device, in the fifth step, it is compared with the type and plural of the aforementioned substrates. A plurality of machine learning parts corresponding to at least any one of the aforementioned substrate holding parts selects the aforementioned machine learning part corresponding to at least one of the type of the aforementioned substrate to be transported and the aforementioned substrate holding part of the transport destination, and The placement position is obtained using the selected machine learning unit.

依據基板搬運裝置的第一態樣,能藉由旋轉機構、第一直動機構以及第二直動機構調整手部的水平面的位置。亦即,能藉由三個軸調整手部的水平面的位置。因此,能提升手部的位置精度。而且,由於設置有旋轉檢測部、第一檢測部以及第二檢測部,因此能針對各個軸以高的位置精度控制手部。 According to the first aspect of the substrate conveying device, the position of the horizontal plane of the hand can be adjusted by the rotation mechanism, the first linear motion mechanism, and the second linear motion mechanism. That is, the position of the horizontal plane of the hand can be adjusted by three axes. Therefore, the position accuracy of the hand can be improved. Furthermore, since the rotation detection unit, the first detection unit, and the second detection unit are provided, it is possible to control the hand with high position accuracy for each axis.

依據基板搬運裝置的第二態樣,能高精度地控制旋轉體的旋轉位置。 According to the second aspect of the substrate conveying device, the rotation position of the rotating body can be controlled with high precision.

依據基板搬運裝置的手部的位置修正方法的第一態樣,依據攝影機所拍攝的影像資料修正規定位置。因此,能藉由後續之依循教學資料的搬運處理高精度地將基板的中心接近至基板保持部的中心軸並將基板載置於基板保持部。 According to the first aspect of the method for correcting the position of the hand of the substrate conveying device, the predetermined position is corrected based on the image data taken by the camera. Therefore, it is possible to accurately approach the center of the substrate to the central axis of the substrate holding portion and place the substrate on the substrate holding portion by the subsequent transportation process following the teaching materials.

依據基板搬運裝置的手部的位置修正方法的第二態樣,將基板重新載置於已將基板的中心相對於中心軸錯開至與偏移方向為相反側的載置位置。因此,當基板保持部再次保持基板時,基板的中心係朝偏移方向偏移,亦即基板的中心係朝基板保持部的中心軸側偏移。藉此,能將基板的中心接近至 中心軸。換言之,能吸收基板保持部的保持所造成的基板的偏移,且能高精度地將基板的中心接近至基板保持部的中心軸。 According to the second aspect of the method for correcting the position of the hand of the substrate transport device, the substrate is newly placed in a placement position where the center of the substrate is shifted from the central axis to the opposite side of the offset direction. Therefore, when the substrate holding portion again holds the substrate, the center of the substrate is shifted in the offset direction, that is, the center of the substrate is shifted toward the central axis side of the substrate holding portion. With this, the center of the substrate can be approached to The central axis. In other words, the displacement of the substrate caused by the holding of the substrate holding portion can be absorbed, and the center of the substrate can be brought close to the central axis of the substrate holding portion with high accuracy.

依據基板搬運裝置的手部的位置修正方法的第三態樣,由於優先地驅動設置於手部附近的旋轉機構以及第一驅動機構,因此能高精度地使手部移動至規定位置。 According to the third aspect of the hand position correction method of the substrate conveying device, since the rotation mechanism and the first driving mechanism provided near the hand are preferentially driven, the hand can be moved to a predetermined position with high accuracy.

依據基板搬運裝置的手部的位置修正方法的第四態樣,由於利用機械學習,因此能高精度地求出偏移量以及偏移方向。 According to the fourth aspect of the hand position correction method of the substrate conveying device, since machine learning is used, the offset amount and the offset direction can be obtained with high accuracy.

依據基板搬運裝置的手部的位置修正方法的第五態樣,由於選擇已與基板的種類或者基板保持部因應的機械學習部,因此能高精度地求出載置位置。 According to the fifth aspect of the hand position correction method of the substrate conveying device, since the machine learning part corresponding to the type of the substrate or the substrate holding part is selected, the placement position can be obtained with high accuracy.

1,1A:基板處理裝置 1,1A: Substrate processing equipment

2,2a:索引區 2, 2a: Index area

3,3a:處理區 3,3a: Processing area

3A:第一處理模組 3A: The first processing module

3B:第二處理模組 3B: The second processing module

3C:第三處理模組 3C: The third processing module

3T:搬運模組 3T: Handling module

7:控制部 7: Control Department

20:基板收容器 20: substrate container

32:基板保持部 32: Board holding part

36:梭搬運裝置 36: Shuttle handling device

41:基台部 41: Abutment

42:旋轉機構 42: Rotating mechanism

43:第一直動機構 43: The first permanent moving mechanism

44:第二直動機構 44: The second direct-acting mechanism

45:鉛直驅動機構 45: Vertical drive mechanism

46,46A,46B:手部 46, 46A, 46B: hands

47:旋轉檢測部 47: Rotation detection section

48:第一檢測部 48: The first detection department

49:第二檢測部 49: The second detection department

51:自轉夾具 51: Rotation fixture

51a:自轉基座 51a: Rotation base

51b:夾具銷 51b: Fixture pin

51c:旋轉軸 51c: Rotation axis

51d:自轉馬達 51d: Rotation motor

52:處理罩 52: Treatment hood

53:噴嘴 53: Nozzle

54:配管 54: Piping

55:處理液供給源 55: Treatment liquid supply source

56:閥 56: Valve

57:攝影機 57: Camera

71:CPU 71: CPU

72:ROM 72: ROM

73:RAM 73: RAM

74:記憶部 74: Memory Department

75:匯流排配線 75: bus wiring

76:輸入部 76: Input section

77:顯示部 77: Display

321:支撐具 321: Support

411:支柱 411: Pillar

421:旋轉體 421: Rotating Body

422,432,442:固定體 422,432,442: fixed body

423,433,452:馬達 423,433,452: Motor

431:第一移動體 431: First Moving Body

434,444:帶子 434,444: strap

441:第二移動體 441: second moving body

445:線性導件 445: Linear guide

451:升降體 451: Elevating Body

453,ST1至ST6:台 453, ST1 to ST6: Taiwan

461:指部 461: finger

462:連結構件 462: Connection member

463:夾持突起部 463: Clamping protrusion

464:按壓部 464: pressing part

465:押入量檢測部 465: deposit amount detection department

710,710_1,710_2,710_3至710_n,710_m:機械學習部 710, 710_1, 710_2, 710_3 to 710_n, 710_m: Machine Learning Department

720:搬運控制部 720: Transport Control Department

CA1,X1:旋轉軸線 CA1, X1: axis of rotation

CR1:第一搬運機器人 CR1: The first handling robot

CR2:第二搬運機器人 CR2: Second handling robot

CRA:搬運機器人 CRA: Handling robot

D1:第一移動方向 D1: The first moving direction

D2:第二移動方向 D2: Second moving direction

IR:索引機器人 IR: Index Robot

L:接線 L: Wiring

P1至P18,P1A至P12A:處理單元 P1 to P18, P1A to P12A: processing unit

Pc1,Pc2:中心 Pc1, Pc2: Center

PS1:第一傳遞部 PS1: The first delivery part

PS2:第二傳遞部 PS2: The second transfer part

PSA:傳遞部 PSA: Transmission Department

R1:曲率半徑 R1: radius of curvature

SP1:停止位置 SP1: Stop position

TW1至TW6:處理塔 TW1 to TW6: Treatment tower

W,W1,W2:基板 W, W1, W2: substrate

△H:差 △H: Poor

△P:偏移量 △P: Offset

[圖1]係顯示基板搬運裝置的概略性的構成的一例之俯視圖。 Fig. 1 is a plan view showing an example of the schematic configuration of the substrate conveying device.

[圖2]係顯示基板搬運裝置的概略性的構成的一例之側剖視圖。 [Fig. 2] A side cross-sectional view showing an example of the schematic configuration of the substrate conveying device.

[圖3]係顯示基板搬運裝置的概略性的構成的一例之側剖視圖。 Fig. 3 is a side cross-sectional view showing an example of the schematic configuration of the substrate conveying device.

[圖4]係顯示基板搬運裝置的概略性的構成的一例之側剖視圖。 Fig. 4 is a side cross-sectional view showing an example of the schematic configuration of the substrate conveying device.

[圖5]係概略性地顯示處理單元的構成的一例之圖。 [Fig. 5] A diagram schematically showing an example of the configuration of the processing unit.

[圖6]係概略性地顯示搬運機器人的構成的一例之圖。 [Fig. 6] A diagram schematically showing an example of the structure of the transport robot.

[圖7]係概略性地顯示基板處理裝置的各個要素與控制部之間的連接的一例之方塊圖。 Fig. 7 is a block diagram schematically showing an example of the connection between each element of the substrate processing apparatus and the control unit.

[圖8]係顯示手部的位置修正方法的一例之流程圖。 [Fig. 8] is a flowchart showing an example of the hand position correction method.

[圖9]係用以說明求出旋轉軸線的位置之手法的一例之圖。 [Fig. 9] A diagram for explaining an example of the method of obtaining the position of the rotation axis.

[圖10]係顯示手部的位置修正方法的一例之流程圖。 [Fig. 10] is a flowchart showing an example of the hand position correction method.

[圖11]係概略性地顯示旋轉軸線以及基板的中心的位置的一例之圖。 Fig. 11 is a diagram schematically showing an example of the position of the rotation axis and the center of the substrate.

[圖12]係概略性地顯示控制部的內部構成的一例之功能方塊圖。 [Fig. 12] A functional block diagram schematically showing an example of the internal structure of the control unit.

[圖13]係概略性地顯示手部上的基板的一例之俯視圖。 [Fig. 13] A plan view schematically showing an example of the substrate on the hand.

[圖14]係顯示教學資料的修正處理的一例之流程圖。 [Figure 14] is a flowchart showing an example of correction processing of teaching materials.

[圖15]係概略性地顯示基板處理裝置的構成的另一例之圖。 Fig. 15 is a diagram schematically showing another example of the configuration of the substrate processing apparatus.

以下,一邊參照圖式一邊說明實施形態。在圖式中於具有相同的構成以及功能之部分附上相同的元件符號並在以下的說明中省略重複的說明。此外,以下的實施形態為一例,並非是用以限定技術性範圍之事例。此外,為了容易理解,會有在圖式中誇張地或者簡略地圖示各個部分的尺寸以及數量之情形。此外,為了說明方向,在各個圖式中適當地附上XYZ正交座標軸。該XYZ正交座標軸中的Z方向係表示鉛直方向,XY平面為水平面。以下,將X方向的一側稱為+X側,將X方向的一側的相反側稱為-X側。針對Y軸以及Z軸亦同樣,+Z軸係表示鉛直上方。 Hereinafter, the embodiment will be described with reference to the drawings. In the drawings, the same reference numerals are attached to the parts having the same structure and function, and repeated descriptions are omitted in the following description. In addition, the following embodiment is an example, and is not an example for limiting the technical scope. In addition, for ease of understanding, there may be cases where the size and quantity of each part are shown exaggeratedly or briefly in the drawings. In addition, in order to illustrate the direction, XYZ orthogonal coordinate axes are appropriately attached to each drawing. The Z direction in the XYZ orthogonal coordinate axis indicates the vertical direction, and the XY plane is a horizontal plane. Hereinafter, the side in the X direction is referred to as the +X side, and the side opposite to the side in the X direction is referred to as the -X side. The same is true for the Y axis and the Z axis, and the +Z axis system indicates a vertical upward direction.

只要未特別地說明,則用以表示位置關係之表現(例如「朝一方向」、「沿著一方向」、「平行」、「正交」、「中心」、「同心」以及「同軸」等)係不僅嚴密地表示所指稱的位置關係,亦表示在公差或者能獲得相同程度的功能之範圍內角度或者距離已位移的狀態。只要未特別地說明,則用以表示相等的狀態之表現(例如「一致」、「相同」、「相等」以及「均質」等)係不 僅表示定量地且嚴密地相等的狀態,亦表示存在公差或者能獲得相同程度的功能之誤差的狀態。只要未特別地說明,則用以表示形狀之表現(例如「四角形狀」以及「圓筒形狀」等)係不僅幾何學性地且嚴密地表示所指稱的形狀,亦表示在能獲得相同程度的功效的範圍內具有例如凹凸或者導角等的形狀。「具備」、「具有」、「具備有」、「含有」或者「包含」一個構成要素之此種表現並非是將其他的構成要素的存在排除之排他式的表現。「A、B以及C的至少一者」之此種表現係包含只有A、只有B、只有C、A至C中的任兩者的組合、A至C全部。 Unless otherwise specified, it is used to express the performance of the positional relationship (for example, "toward one direction", "along one direction", "parallel", "orthogonal", "center", "concentric" and "coaxial", etc.) The system not only strictly expresses the positional relationship referred to, but also expresses the state in which the angle or distance has been displaced within the tolerance or the same degree of function can be obtained. Unless otherwise specified, the performance used to represent the state of equality (such as "identical", "identical", "equal" and "homogeneous", etc.) is not It only indicates a state that is quantitatively and strictly equal, and it also indicates a state where there is a tolerance or an error in which the same degree of function can be obtained. Unless otherwise specified, the expressions used to express the shape (such as "square shape" and "cylindrical shape", etc.) not only geometrically and rigorously express the referred shape, but also mean that the same degree can be obtained. The range of efficacy has a shape such as unevenness or chamfer. The expression of "has," "has," "has," "contains," or "includes" a constituent element is not an exclusive expression that excludes the existence of other constituent elements. The expression of "at least one of A, B, and C" includes only A, only B, only C, a combination of any two of A to C, and all A to C.

圖1係概略性地顯示基板處理裝置1的構成的一例之俯視圖。圖2係概略性地顯示圖1的Ⅱ-Ⅱ線中的基板處理裝置1的內部的一例之側剖視圖。圖3係概略性地顯示圖1的Ⅲ-Ⅲ線中的基板處理裝置1的內部的一例之側剖視圖。圖4係概略性地顯示圖1的Ⅳ-Ⅳ線中的基板處理裝置1的內部的一例之側剖視圖。 FIG. 1 is a plan view schematically showing an example of the structure of the substrate processing apparatus 1. FIG. 2 is a side cross-sectional view schematically showing an example of the inside of the substrate processing apparatus 1 on the II-II line of FIG. 1. FIG. 3 is a side cross-sectional view schematically showing an example of the inside of the substrate processing apparatus 1 on the line III-III of FIG. 1. FIG. 4 is a side cross-sectional view schematically showing an example of the inside of the substrate processing apparatus 1 on the IV-IV line in FIG. 1.

[基板處理裝置] [Substrate Processing Equipment]

基板處理裝置1係葉片式的裝置,用以逐片地處理半導體晶圓等圓板狀的基板W。基板處理裝置1係對基板W施予洗淨處理或者蝕刻處理等各種處理。如圖1所示,基板處理裝置1係朝+X側依序包含索引區(indexer section)2以及處理區3。 The substrate processing apparatus 1 is a blade-type apparatus for processing disk-shaped substrates W such as semiconductor wafers one by one. The substrate processing apparatus 1 applies various processing such as cleaning processing or etching processing to the substrate W. As shown in FIG. 1, the substrate processing apparatus 1 includes an indexer section 2 and a processing section 3 in sequence toward the +X side.

處理區3係朝+X側依序包含第一處理模組3A、搬運模組3T、第二處理模組3B以及第三處理模組3C。 The processing area 3 includes a first processing module 3A, a handling module 3T, a second processing module 3B, and a third processing module 3C in sequence toward the +X side.

第一處理模組3A係包含第一傳遞部PS1,索引區2係對第一傳遞部PS1供給基板W。處理區3係包含處理單元P1至處理單元P18,處理單元P1至處理單元P18係對未處理的一片基板W施予規定處理。規定處理係能包含例如使用了處理用的液體或者氣體之流體處理、使用了紫外線等電磁波之處理以及物理洗 淨處理(刷子洗淨以及噴霧噴嘴(spray nozzle)洗淨等)等各種處理。索引區2係從第一傳遞部PS1接取已完成處理區3中的處理的基板W。 The first processing module 3A includes a first transfer part PS1, and the index area 2 supplies the substrate W to the first transfer part PS1. The processing area 3 includes a processing unit P1 to a processing unit P18, and the processing unit P1 to a processing unit P18 apply predetermined processing to an unprocessed piece of substrate W. The prescribed treatment system can include, for example, fluid treatment using liquid or gas for treatment, treatment using electromagnetic waves such as ultraviolet rays, and physical washing. Various treatments such as cleaning (brush cleaning and spray nozzle cleaning, etc.). The index area 2 receives the substrate W that has been processed in the processing area 3 from the first transfer portion PS1.

此外,在圖2至圖4中雖然顯示了用以對處理單元P1至處理單元P18供給液體或者氣體之供給系統以及用以從處理單元P1至處理單元P18回收液體或者氣體之排出系統的構造,然而這些構造與本實施形態的本質不同,因此省略這些構造的說明。 In addition, although FIGS. 2 to 4 show the structure of the supply system for supplying liquid or gas to the processing unit P1 to the processing unit P18 and the discharge system for recovering the liquid or gas from the processing unit P1 to the processing unit P18, However, the essence of these structures is different from the present embodiment, so the description of these structures is omitted.

[索引區] [Index Area]

索引區2係包含索引機器人(indexer robot)IR以及複數個(在此為四個)台(stage)ST1至台ST4。台ST1至台ST4為基板收容器保持部,能分別保持基板收容器20,基板收容器20係以層疊狀態收容了複數片基板W。基板收容器20係可為以密閉的狀態收納基板W之前開式晶圓傳送盒(FOUP;Front Opening Unified Pod),亦可為標準機械化介面(SMIF;Standard Mechanical Inter Face)盒或者開放式匣(OC;Open Cassette)等。例如,在基板收容器20中,水平姿勢的複數片基板W係成為彼此隔開間隔地層疊於鉛直方向的狀態。 The index area 2 includes an indexer robot IR and a plurality of (here, four) stages ST1 to ST4. The stage ST1 to the stage ST4 are substrate storage container holding parts, which can hold the substrate storage container 20, respectively, and the substrate storage container 20 accommodates a plurality of substrates W in a stacked state. The substrate container 20 can be a front opening wafer transfer box (FOUP; Front Opening Unified Pod) that stores the substrate W in a sealed state, or a standard mechanized interface (SMIF; Standard Mechanical Inter Face) box or an open cassette ( OC; Open Cassette) and so on. For example, in the substrate storage container 20, a plurality of substrates W in a horizontal posture are stacked in a vertical direction with an interval therebetween.

索引機器人IR係包含一對手部,並以下述方式動作:以一個手部從被保持於台ST1至台ST4的某一個台的基板收容器20搬出一片未處理的基板W,並將該基板W從-X側傳遞至第一傳遞部PS1。再者,索引機器人IR係以下述方式動作:以另一個手部從第一傳遞部PS1接取一片處理完畢的基板W並收容至被保持於台ST1至台ST4的某一個台的基板收容器20。 The index robot IR includes a hand, and operates in the following manner: With one hand, it unloads a piece of unprocessed substrate W from the substrate container 20 held in one of the stages ST1 to ST4, and puts the substrate W on it. It is transmitted from the -X side to the first transmission part PS1. Furthermore, the index robot IR operates in the following manner: With the other hand, a piece of processed substrate W is received from the first transfer part PS1 and stored in a substrate container held in one of the stages ST1 to ST4. 20.

[處理區] [Processing area]

處理區3的第一處理模組3A係包含:第一傳遞部PS1,係暫時地保持從索引區2搬入的基板W;以及處理單元P1至處理單元P6,係對基板W進行規定處理。 The first processing module 3A of the processing area 3 includes: a first transfer portion PS1 that temporarily holds the substrate W carried in from the index area 2; and processing units P1 to P6 that perform predetermined processing on the substrate W.

第一傳遞部PS1係保持藉由索引機器人IR從-X側搬入的基板W。處理單元P1至處理單元P3係配置於第一傳遞部PS1的+Y側,處理單元P4至處理單元P6係配置於第一傳遞部PS1的-Y側。處理單元P1至處理單元P3以及處理單元P4至處理單元P6係分別依序地重疊於Z方向,並構成處理塔TW1、TW2。 The first transfer part PS1 holds the substrate W carried in from the -X side by the index robot IR. The processing units P1 to P3 are arranged on the +Y side of the first transfer part PS1, and the processing units P4 to P6 are arranged on the -Y side of the first transfer part PS1. The processing unit P1 to the processing unit P3 and the processing unit P4 to the processing unit P6 are sequentially overlapped in the Z direction, respectively, and constitute the processing towers TW1 and TW2.

搬運模組3T係鄰接地配置於第一處理模組3A的+X側。於搬運模組3T的內部設置有第一搬運機器人CR1(基板搬運裝置)。第一搬運機器人CR1係從第一傳遞部PS1將基板W搬出至+X側,並從+X側將該基板W搬入至處理單元P1至處理單元P6的任一個處理單元。此外,第一搬運機器人CR1係搬出已在處理單元P1至處理單元P6經過處理的基板W,並從+X側將該基板W搬入至第一傳遞部PS1。此外,第一搬運機器人CR1係從-X側將基板W搬入至第二處理模組3B的第二傳遞部PS2。 The handling module 3T is adjacently arranged on the +X side of the first processing module 3A. A first transfer robot CR1 (substrate transfer device) is installed inside the transfer module 3T. The first transfer robot CR1 unloads the substrate W from the first transfer part PS1 to the +X side, and transfers the substrate W to any one of the processing unit P1 to the processing unit P6 from the +X side. In addition, the first transfer robot CR1 unloads the substrate W that has been processed in the processing unit P1 to the processing unit P6, and carries the substrate W into the first transfer unit PS1 from the +X side. In addition, the first transfer robot CR1 carries the substrate W into the second transfer part PS2 of the second processing module 3B from the -X side.

第一傳遞部PS1係包含基板保持部32,基板保持部32係以水平姿勢保持基板W。基板保持部32係藉由支撐具321保持基板W,支撐具321係從下方支撐例如基板W的周緣部。複數個(例如兩個)基板保持部32亦可隔著間隔設置於Z方向。藉此,第一傳遞部PS1係能保持複數個(例如兩個)基板W。 The first transfer portion PS1 includes a substrate holding portion 32, and the substrate holding portion 32 holds the substrate W in a horizontal posture. The substrate holding portion 32 holds the substrate W by the support 321, and the support 321 supports, for example, the peripheral portion of the substrate W from below. A plurality of (for example, two) substrate holding portions 32 may be provided in the Z direction at intervals. Thereby, the first transfer portion PS1 can hold a plurality of (for example, two) substrates W.

處理區3的第二處理模組3B係鄰接地配置於搬運模組3T的+X側。第二處理模組3B係包含:第二傳遞部PS2,係暫時地保持被第一搬運機器人CR1搬入的基板W;以及處理單元P7至處理單元P12,係對基板W進行規定處理。 The second processing module 3B of the processing zone 3 is adjacently arranged on the +X side of the handling module 3T. The second processing module 3B includes: a second transfer unit PS2 that temporarily holds the substrate W carried in by the first transfer robot CR1; and processing units P7 to P12 that perform predetermined processing on the substrate W.

處理單元P7至處理單元P9係配置於第二傳遞部PS2的+Y側,處理單元P10至處理單元P12係配置於第二傳遞部PS2的-Y側。處理單元P7至處理單元P9以及處理單元P10至處理單元P12係分別依序地重疊於Z方向,並構成處理塔TW3、TW4。 The processing units P7 to P9 are arranged on the +Y side of the second transfer portion PS2, and the processing units P10 to P12 are arranged on the -Y side of the second transfer portion PS2. The processing unit P7 to the processing unit P9 and the processing unit P10 to the processing unit P12 are sequentially overlapped in the Z direction, respectively, and constitute the processing towers TW3 and TW4.

第二傳遞部PS2係包含梭(shuttle)搬運裝置36。梭搬運裝置36係一邊以水平姿勢保持基板W一邊使基板W沿著X軸往復移動。在此,梭搬運裝置36係於Z方向隔著間隔且可同時保持兩片基板W並將兩片基板W朝X方向搬運。在第二傳遞部PS2中,能藉由梭搬運裝置36在-X位置與+X位置之間搬運基板W,-X側位置係接近第一搬運機器人CR1之位置,+X側位置係接近後述的第二搬運機器人CR2(基板搬運裝置)之位置。因此,即使在第一搬運機器人CR1以及第二搬運機器人CR2所為之基板W的水平方向的移動量比索引機器人IR還小之情形中,亦能在第一搬運機器人CR1以及第二搬運機器人CR2之間傳遞基板W。 The second transmission part PS2 includes a shuttle transport device 36. The shuttle transport device 36 reciprocates the substrate W along the X axis while holding the substrate W in a horizontal posture. Here, the shuttle conveying device 36 is spaced apart in the Z direction and can hold two substrates W at the same time and convey the two substrates W in the X direction. In the second transfer part PS2, the substrate W can be transported by the shuttle transport device 36 between the -X position and the +X position. The -X side position is close to the position of the first transport robot CR1, and the +X side position is close to the position described later. The position of the second transfer robot CR2 (substrate transfer device). Therefore, even in the case where the horizontal movement of the substrate W of the first transfer robot CR1 and the second transfer robot CR2 is smaller than that of the index robot IR, it can be used between the first transfer robot CR1 and the second transfer robot CR2. Transfer the substrate W between.

處理區3的第三處理模組3C係鄰接地配置於第二處理模組3B的+X側。第三處理模組3C係包含第二搬運機器人CR2以及處理單元P13至處理單元P18。 The third processing module 3C of the processing area 3 is adjacently arranged on the +X side of the second processing module 3B. The third processing module 3C includes a second transfer robot CR2 and processing units P13 to P18.

處理單元P13至處理單元P15係配置於第二搬運機器人CR2的+Y側,處理單元P16至處理單元P18係配置於第二搬運機器人CR2的-Y側。處理單元P13至處理單元P15以及處理單元P16至處理單元P18係分別依序地重疊於Z方向,並構成處理塔TW5、TW6。 The processing unit P13 to the processing unit P15 are arranged on the +Y side of the second transfer robot CR2, and the processing unit P16 to the processing unit P18 are arranged on the -Y side of the second transfer robot CR2. The processing unit P13 to the processing unit P15 and the processing unit P16 to the processing unit P18 are sequentially overlapped in the Z direction, respectively, and constitute the processing towers TW5 and TW6.

第二搬運機器人CR2係從梭搬運裝置36將基板W搬出至+X側,並將該基板W搬入至處理單元P7至處理單元P18的任一個處理單元。此外,第二搬運機器人CR2係搬出已在處理單元P7至處理單元P18經過處理的基板W,並將該基板W從+X側搬入至梭搬運裝置36。 The second transfer robot CR2 unloads the substrate W from the shuttle transfer device 36 to the +X side, and transfers the substrate W to any one of the processing unit P7 to the processing unit P18. In addition, the second transfer robot CR2 unloads the substrate W that has been processed in the processing unit P7 to the processing unit P18, and transfers the substrate W to the shuttle transfer device 36 from the +X side.

[處理單元] [Processing Unit]

接著,說明處理單元P1至處理單元P18的一個具體性的構成的一例。在此,代表性地說明處理單元P10。其他的處理單元P1至處理單元P9以及處理單元P11至處理單元P18的至少任一個處理單元亦可具有與處理單元P10相同的構成。圖5係概略性地顯示處理單元P10的構成的一例之圖。處理單元P10係包含自轉夾具51(基板保持部)、處理罩(processing cup)52以及噴嘴53。自轉夾具51係以水平姿勢保持一片基板W,並使基板W繞著通過基板W的中央部之鉛直的旋轉軸線X1旋轉。在此所謂的水平姿勢係指基板W的厚度方向沿著Z方向之狀態。旋轉軸線X1亦為自轉夾具51的中心軸。處理罩52係具有筒狀的形狀並圍繞自轉夾具51。噴嘴53係對被自轉夾具51保持的基板W供給處理液。處理液係包含例如蝕刻液等藥液以及純水等清洗(rinse)液。 Next, an example of a specific configuration of the processing unit P1 to the processing unit P18 will be described. Here, the processing unit P10 will be described representatively. At least any one of the other processing units P1 to P9 and the processing units P11 to P18 may have the same configuration as the processing unit P10. FIG. 5 is a diagram schematically showing an example of the configuration of the processing unit P10. The processing unit P10 includes a rotation jig 51 (substrate holding portion), a processing cup 52 and a nozzle 53. The rotation jig 51 holds a substrate W in a horizontal posture, and rotates the substrate W around a vertical rotation axis X1 passing through the center of the substrate W. The horizontal posture here refers to a state where the thickness direction of the substrate W is along the Z direction. The rotation axis X1 is also the central axis of the rotation jig 51. The processing cover 52 has a cylindrical shape and surrounds the rotation jig 51. The nozzle 53 supplies the processing liquid to the substrate W held by the rotation jig 51. The treatment liquid system includes, for example, a chemical liquid such as an etching liquid and a rinse liquid such as pure water.

自轉夾具51係包含:圓板狀的自轉基座(spin base)51a,係呈水平的姿勢;複數個夾具銷(chuck pin)51b,係從自轉基座51a的上表面外周部朝上方突出;夾具開閉機構(未圖示),係將複數個夾具銷51b壓抵至基板W的周緣部;旋轉軸51c,係從自轉基座51a的中央部朝下方延伸;以及自轉馬達(spin motor)51d,係使旋轉軸51c旋轉,藉此使被複數個夾具銷51b保持的基板W繞著旋轉軸線X1旋轉。自轉夾具51並未限定於圖5所示的夾持式的夾具,亦可為真空式的夾具,真空式的夾具係藉由使基板W的下表面吸附至自轉基座的上表面從而以水平姿勢保持基板W。 The rotation clamp 51 includes: a circular plate-shaped spin base 51a, which is in a horizontal posture; a plurality of chuck pins 51b, which protrude upward from the outer periphery of the upper surface of the spin base 51a; A clamp opening and closing mechanism (not shown), which presses a plurality of clamp pins 51b against the peripheral edge of the substrate W; a rotating shaft 51c, which extends downward from the central part of the rotation base 51a; and a spin motor 51d , By rotating the rotation shaft 51c, the substrate W held by the plurality of clamp pins 51b is rotated about the rotation axis X1. The rotation jig 51 is not limited to the clamp-type clamp shown in FIG. 5, and may be a vacuum-type clamp. The vacuum-type clamp is horizontal by adsorbing the lower surface of the substrate W to the upper surface of the rotation base. The substrate W is maintained in the posture.

如圖5所示,噴嘴53係連接於配管54的一端,配管54的另一端係連接於處理液供給源55。處理液供給源55係經由配管54將處理液供給至噴嘴53。於配管54配置有閥56。閥56係被控制部7控制,從而切換配管54的內部流路 的開閉。閥56係使配管54的內部流路開放,藉此來自處理液供給源55的處理液係經由配管54供給至噴嘴53。噴嘴53係將處理液噴出至基板W。 As shown in FIG. 5, the nozzle 53 is connected to one end of the pipe 54, and the other end of the pipe 54 is connected to the processing liquid supply source 55. The processing liquid supply source 55 supplies the processing liquid to the nozzle 53 via the pipe 54. A valve 56 is arranged in the pipe 54. The valve 56 is controlled by the control unit 7 to switch the internal flow path of the pipe 54 The opening and closing. The valve 56 opens the internal flow path of the pipe 54 so that the processing liquid system from the processing liquid supply source 55 is supplied to the nozzle 53 via the pipe 54. The nozzle 53 ejects the processing liquid to the substrate W.

在圖5的例子中,噴嘴53係與被自轉夾具51保持的基板W的上表面的周緣部對向。噴嘴53亦可藉由未圖示的噴嘴移動機構在處理位置與待機位置之間往復移動。如圖5所示,處理位置為與基板W的上表面的周緣部對向之位置。待機位置為例如在Z方向中未與被自轉夾具51保持的基板W對向之位置。 In the example of FIG. 5, the nozzle 53 is opposed to the peripheral edge of the upper surface of the substrate W held by the rotation jig 51. The nozzle 53 may be moved back and forth between the processing position and the standby position by a nozzle moving mechanism not shown. As shown in FIG. 5, the processing position is a position facing the peripheral edge portion of the upper surface of the substrate W. The standby position is, for example, a position that does not face the substrate W held by the rotation jig 51 in the Z direction.

噴嘴53係在處理位置中對基板W的上表面的周緣部供給處理液。基板W旋轉,藉此噴嘴53係能對基板W的周緣部的全周供給處理液。在處理液為蝕刻液之情形中,能藉由處理液的供給來去除基板W的周緣部的雜質(亦即所謂的斜面蝕刻(bevel etching))。 The nozzle 53 supplies the processing liquid to the peripheral edge portion of the upper surface of the substrate W in the processing position. By rotating the substrate W, the nozzle 53 can supply the processing liquid to the entire periphery of the substrate W. In the case where the processing liquid is an etching liquid, impurities in the peripheral portion of the substrate W can be removed by the supply of the processing liquid (that is, so-called bevel etching).

處理單元P10亦可構成為可供給複數種類的處理液。例如設置有複數個噴嘴,複數個噴嘴係分別經由配管連接於處理液供給源。連接於各個噴嘴之處理液供給源係彼此不同。例如在從第一噴嘴供給蝕刻液後,從第二噴嘴供給清洗液,藉此能沖洗基板W上的蝕刻液。 The processing unit P10 may be configured to be able to supply a plurality of types of processing liquids. For example, a plurality of nozzles are provided, and the plurality of nozzles are respectively connected to a processing liquid supply source via a pipe. The processing liquid supply sources connected to the respective nozzles are different from each other. For example, after the etching liquid is supplied from the first nozzle, the cleaning liquid is supplied from the second nozzle, whereby the etching liquid on the substrate W can be rinsed.

在上面所說明的斜面蝕刻中期望基板W的中心位於自轉夾具51的旋轉軸線X1上。換言之,俯視觀看時期望基板W的中心與旋轉軸線X1一致。假設當基板W的中心位置從旋轉軸線X1偏移時,蝕刻液對於基板W的著液位置會因應基板W的旋轉位置而朝徑方向變動。此種變動是不期望的。 In the bevel etching described above, it is desirable that the center of the substrate W is located on the rotation axis X1 of the rotation jig 51. In other words, it is desirable that the center of the substrate W coincides with the rotation axis X1 when viewed from above. It is assumed that when the center position of the substrate W is shifted from the rotation axis X1, the position of the etching solution on the substrate W changes in the radial direction in accordance with the rotation position of the substrate W. Such changes are not expected.

因此,第二搬運機器人CR2對於基板W的搬運精度變得重要。亦即,期望第二搬運機器人CR2以高的搬運精度搬運基板W,並以基板W的中心與自轉夾具51的旋轉軸線X1一致之方式將基板W載置於處理單元P10的自轉夾具51上。 Therefore, the second transfer robot CR2 is important for the transfer accuracy of the substrate W. That is, it is desirable that the second transfer robot CR2 transfer the substrate W with high transfer accuracy, and place the substrate W on the rotation jig 51 of the processing unit P10 such that the center of the substrate W coincides with the rotation axis X1 of the rotation jig 51.

[搬運機器人] [Handling robot]

接著,說明第二搬運機器人CR2的構成的一例。此外,在此,第一搬運機器人CR1係具有與第二搬運機器人CR2相同的構成。 Next, an example of the configuration of the second transfer robot CR2 will be described. In addition, here, the first transfer robot CR1 has the same configuration as the second transfer robot CR2.

參照圖3,第二搬運機器人CR2係包含基台部41、旋轉機構42、第一直動機構43、第二直動機構44、鉛直驅動機構45以及兩個手部46A、46B。基台部41係設置於板狀的底部,於該板狀的底部設置有第三處理模組3C。於基台部41上設置有支柱411。於支柱411設置有鉛直驅動機構45,並於鉛直驅動機構45與手部46A、46B之間設置有旋轉機構42、第一直動機構43以及第二直動機構44。 3, the second transfer robot CR2 includes a base portion 41, a rotating mechanism 42, a first linear motion mechanism 43, a second linear motion mechanism 44, a vertical drive mechanism 45, and two hands 46A and 46B. The base portion 41 is disposed at the bottom of the plate shape, and the third processing module 3C is disposed on the bottom of the plate shape. Pillars 411 are provided on the base portion 41. A vertical drive mechanism 45 is provided on the pillar 411, and a rotation mechanism 42, a first linear motion mechanism 43, and a second linear motion mechanism 44 are provided between the vertical drive mechanism 45 and the hands 46A and 46B.

於手部46A、46B上分別載置有基板W。手部46A、46B係具有保持機構(後述),並分別以水平姿勢保持基板W。手部46A、46B係藉由旋轉機構42、第一直動機構43、第二直動機構44以及鉛直驅動機構45三維地移動。 A substrate W is placed on the hands 46A and 46B, respectively. The hands 46A and 46B have holding mechanisms (described later), and hold the substrate W in a horizontal posture, respectively. The hands 46A and 46B are moved three-dimensionally by the rotation mechanism 42, the first linear motion mechanism 43, the second linear motion mechanism 44, and the vertical drive mechanism 45.

圖6係概略性地顯示第二搬運機器人CR2的構成的一例之圖。第一直動機構43係包含第一移動體431,並使第一移動體431朝第一移動方向D1往復移動。第一移動方向D1為與Z方向交叉之方向,更具體而言第一移動方向D1係與Z方向正交。第一移動體431係例如由包含鐵等金屬之剛性體(rigid body)所構成。在圖6的例子中,第一移動體431係連結於手部46A、46B的基端部並與手部46A、46B連動。亦即,第一移動體431係朝第一移動方向D1往復移動,藉此手部46A、46B係與第一移動體431一體性地朝第一移動方向D1往復移動。此外,第一直動機構43亦可使手部46A、46B彼此獨立地朝第一移動方向D1移動。亦即,亦可設置有手部46A用的第一直動機構43以及手部46B用的第一直動機構43。 FIG. 6 is a diagram schematically showing an example of the configuration of the second transfer robot CR2. The first linear motion mechanism 43 includes a first moving body 431 and reciprocates the first moving body 431 in the first moving direction D1. The first movement direction D1 is a direction crossing the Z direction, and more specifically, the first movement direction D1 is orthogonal to the Z direction. The first moving body 431 is composed of, for example, a rigid body including metal such as iron. In the example of FIG. 6, the first moving body 431 is connected to the proximal end portions of the hands 46A and 46B and is linked with the hands 46A and 46B. That is, the first moving body 431 reciprocates in the first moving direction D1, whereby the hands 46A, 46B and the first moving body 431 reciprocate in the first moving direction D1 integrally. In addition, the first linear motion mechanism 43 may also move the hands 46A and 46B in the first moving direction D1 independently of each other. That is, the first linear motion mechanism 43 for the hand 46A and the first linear motion mechanism 43 for the hand 46B may be provided.

旋轉機構42係包含旋轉體421,並使旋轉體421繞著鉛直的旋轉軸線CA1轉動。旋轉體421亦可由包含鐵等金屬之剛性體所構成。在圖6的例子中,旋轉體421係連結於第一直動機構43(具體而言為後述的固定體432)。由於第一直動機構43連結於手部46A、46B,因此旋轉體421係與手部46A、46B連動。具體而言,旋轉體421轉動,藉此第一直動機構43以及手部46A、46B係與旋轉體421一體性地繞著旋轉軸線CA1轉動。藉由此種轉動,能變更手部46A、46B的朝向。 The rotating mechanism 42 includes a rotating body 421, and rotates the rotating body 421 around a vertical rotation axis CA1. The rotating body 421 may also be formed of a rigid body including metal such as iron. In the example of FIG. 6, the rotating body 421 is connected to the 1st linear motion mechanism 43 (specifically, the fixed body 432 mentioned later). Since the first linear motion mechanism 43 is connected to the hands 46A and 46B, the rotating body 421 is linked to the hands 46A and 46B. Specifically, the rotating body 421 rotates, whereby the first linear motion mechanism 43 and the hands 46A and 46B are integrally rotated with the rotating body 421 around the rotation axis CA1. With this rotation, the orientation of the hands 46A and 46B can be changed.

第一直動機構43使手部46A、46B移動之第一移動方向D1係例如為針對旋轉軸線CA1之徑方向。 The first movement direction D1 in which the first linear motion mechanism 43 moves the hands 46A and 46B is, for example, a radial direction with respect to the rotation axis CA1.

第二直動機構44係包含第二移動體441,並使第二移動體441朝第二移動方向D2往復移動。第二移動方向D2為與第一移動方向D1以及Z方向交叉之方向,具體而言第二移動方向D2係與Z方向正交。第二移動體441亦由例如包含鐵等金屬之剛性體所構成。在圖6的例子中,第二移動體441係連結於旋轉機構42(具體而言為後述的固定體422)。由於旋轉機構42經由第一直動機構43而與手部46A、46B連結,因此第二移動體441係與手部46A、46B連動。具體而言,第二移動體441係朝第二移動方向D2往復移動,藉此旋轉機構42、第一直動機構43以及手部46A、46B係與第二移動體441一體性地朝第二移動方向D2往復移動。 The second linear motion mechanism 44 includes a second moving body 441 and reciprocates the second moving body 441 in the second moving direction D2. The second movement direction D2 is a direction crossing the first movement direction D1 and the Z direction. Specifically, the second movement direction D2 is orthogonal to the Z direction. The second moving body 441 is also composed of a rigid body including metal such as iron. In the example of FIG. 6, the second moving body 441 is connected to the rotation mechanism 42 (specifically, a fixed body 422 described later). Since the rotation mechanism 42 is connected to the hands 46A and 46B via the first linear motion mechanism 43, the second moving body 441 is linked to the hands 46A and 46B. Specifically, the second moving body 441 reciprocates in the second moving direction D2, whereby the rotation mechanism 42, the first linear mechanism 43, and the hands 46A and 46B are integrally moved toward the second moving body 441. The moving direction D2 reciprocates.

此外,在圖6的例子中,由於第二直動機構44並未藉由旋轉機構42轉動,因此第二移動方向D2不會取決於旋轉機構42的轉動。另一方面,第一直動機構43係藉由旋轉機構42而轉動。因此,第一移動方向D1係因應旋轉機構42的旋轉而旋轉。因此,第一移動方向D1與第二移動方向D2之間的交叉角度係因應旋轉機構42的旋轉位置而變動。 In addition, in the example of FIG. 6, since the second linear motion mechanism 44 is not rotated by the rotation mechanism 42, the second movement direction D2 does not depend on the rotation of the rotation mechanism 42. On the other hand, the first linear motion mechanism 43 is rotated by the rotation mechanism 42. Therefore, the first moving direction D1 rotates in response to the rotation of the rotating mechanism 42. Therefore, the crossing angle between the first movement direction D1 and the second movement direction D2 varies in accordance with the rotation position of the rotation mechanism 42.

參照圖3,鉛直驅動機構45係包含升降體451以及馬達452,並使升降體451沿著Z方向往復移動。亦即,使升降體451升降。例如,升降體451係嵌合於設置於支柱411且朝鉛直方向延伸的軌道(未圖示)。馬達452係使升降體451沿著該軌道朝鉛直方向往復移動。 3, the vertical drive mechanism 45 includes an elevator body 451 and a motor 452, and reciprocates the elevator body 451 in the Z direction. That is, the lifting body 451 is raised and lowered. For example, the elevating body 451 is fitted to a rail (not shown) that is provided on the pillar 411 and extends in the vertical direction. The motor 452 reciprocates the lifting body 451 in the vertical direction along the track.

在圖3的例子中,升降體451係經由台453連接於第二直動機構44(具體而言為後述的固定體442)。台453係具有例如板狀的形狀,且以台453的厚度方向沿著Z方向之方式配置。於台453上設置有第二直動機構44以及升降體451。升降體451升降,藉此旋轉機構42、第一直動機構43、第二直動機構44以及手部46A、46B係與升降體451一體性地升降。 In the example of FIG. 3, the lift body 451 is connected to the 2nd linear motion mechanism 44 (specifically, the fixed body 442 mentioned later) via the stand 453. The stage 453 has, for example, a plate-like shape, and is arranged such that the thickness direction of the stage 453 is along the Z direction. A second linear motion mechanism 44 and an elevating body 451 are provided on the table 453. The lifting body 451 is raised and lowered, whereby the rotation mechanism 42, the first linear motion mechanism 43, the second linear motion mechanism 44, and the hands 46A and 46B are raised and lowered integrally with the lifting body 451.

為了便於說明,以下將手部46A、46B總稱為手部46。 For ease of description, the hands 46A and 46B are collectively referred to as the hands 46 below.

[第一直動機構] [The first permanent mechanism]

在圖6的例子中,第一直動機構43係包含第一移動體431、固定體432以及馬達433。固定體432係將第一移動體431以可朝第一移動方向D1移動之方式結合。固定體432亦可例如為內置第一直動機構43的各種構成之框體。馬達433係提供用以使第一移動體431朝第一移動方向D1往復移動之驅動力。馬達433係被控制部7控制。 In the example of FIG. 6, the first linear motion mechanism 43 includes a first moving body 431, a fixed body 432, and a motor 433. The fixed body 432 combines the first moving body 431 in a manner capable of moving in the first moving direction D1. The fixed body 432 may be, for example, a frame body having various configurations in which the first linear motion mechanism 43 is incorporated. The motor 433 provides a driving force for reciprocating the first moving body 431 in the first moving direction D1. The motor 433 is controlled by the control unit 7.

在圖6的例子中,第一直動機構43係包含帶子434。帶子434係跨設於複數個滑輪(pulley)(圖中為兩個)。各個滑輪係以滑輪的中心軸與第一移動方向D1正交之方式且以可繞著滑輪的中心軸旋轉之方式結合於固定體432。帶子434係藉由例如橡膠製的彈性體所形成。此種帶子434亦稱為時序帶(timing belt)。馬達433係使帶子434轉動。例如,馬達433係使滑輪轉動,藉此使帶子434轉動。第一移動體431係連結於帶子434,帶子434轉動,藉此第一移動體431係 朝第一移動方向D1往復移動。與採用價格高昂且尺寸大的線性馬達之情形相比,此種第一直動機構43的價格低廉且尺寸小。 In the example of FIG. 6, the first linear motion mechanism 43 includes a belt 434. The belt 434 is straddled across a plurality of pulleys (two in the figure). Each pulley system is coupled to the fixed body 432 in such a manner that the central axis of the pulley is orthogonal to the first moving direction D1 and is rotatable around the central axis of the pulley. The belt 434 is formed of, for example, an elastic body made of rubber. Such a belt 434 is also called a timing belt. The motor 433 rotates the belt 434. For example, the motor 433 rotates the pulley, thereby causing the belt 434 to rotate. The first moving body 431 is connected to the belt 434, and the belt 434 rotates, whereby the first moving body 431 is Move back and forth in the first moving direction D1. Compared with the case of using a linear motor that is expensive and large in size, the first linear motion mechanism 43 is low in price and small in size.

第一直動機構43亦可具有未圖示的線性導件(linear guide)。該線性導件係包含:第一軌道,係沿著第一移動方向D1延伸;以及第一行進部,係卡合至第一軌道並於第一軌道行進。第一行進部係連結於第一移動體431。藉此,第一直動機構43係能以更高的直動精度使第一移動體431朝第一移動方向D1往復移動。 The first linear mechanism 43 may have a linear guide (not shown). The linear guide includes: a first track that extends along the first moving direction D1; and a first traveling portion that is engaged with the first track and travels on the first track. The first traveling part is connected to the first moving body 431. Thereby, the first linear motion mechanism 43 can reciprocate the first moving body 431 in the first moving direction D1 with higher linear motion accuracy.

[旋轉機構] [Rotating Mechanism]

旋轉機構42係包含旋轉體421、固定體422以及馬達423。旋轉體421係例如為沿著旋轉軸線CA1延伸之圓柱狀的旋轉軸。旋轉體421係藉由包含例如鐵等金屬之剛性體所構成。旋轉體421的一端係連結於第一直動機構43的固定體432。 The rotating mechanism 42 includes a rotating body 421, a fixed body 422 and a motor 423. The rotating body 421 is, for example, a cylindrical rotating shaft extending along the rotating axis CA1. The rotating body 421 is constituted by a rigid body including metal such as iron. One end of the rotating body 421 is connected to the fixed body 432 of the first linear motion mechanism 43.

馬達423係直接連結於旋轉體421。在此,所謂的直接連結係包含例如馬達423的轉子(rotor)與旋轉體421直接地結合之狀態。在此情形中,馬達423係與旋轉體421同軸地連結。此外,所謂直接連結亦可包含馬達423的轉子經由由包含例如鐵等金屬的剛性體所構成的變速機(例如諧波齒輪(harmonic gear))結合於旋轉體421之狀態。只要採用減速機作為變速機,即能採用小的馬達423。 The motor 423 is directly connected to the rotating body 421. Here, the so-called direct connection includes, for example, a state in which the rotor of the motor 423 and the rotating body 421 are directly connected. In this case, the motor 423 is coaxially connected with the rotating body 421. In addition, the so-called direct connection may also include a state where the rotor of the motor 423 is coupled to the rotating body 421 via a transmission (for example, a harmonic gear) made of a rigid body including metal such as iron. As long as the speed reducer is used as the speed changer, a small motor 423 can be used.

馬達423的定子(stator)係固定於固定體422。固定體422亦可為用以收納旋轉機構42的各種構成之框體。 The stator of the motor 423 is fixed to the fixed body 422. The fixed body 422 may also be a frame body for accommodating various configurations of the rotating mechanism 42.

馬達423係被控制部7控制。馬達423係使旋轉體421繞著旋轉軸線CA1轉動,藉此使第一直動機構43以及手部46一體地轉動。 The motor 423 is controlled by the control unit 7. The motor 423 rotates the rotating body 421 about the rotation axis CA1, thereby rotating the first linear motion mechanism 43 and the hand 46 integrally.

[第二直動機構] [Second Direct Acting Mechanism]

在圖6的例子中,第二直動機構44係具有與第一直動機構43同樣的構成。具體而言,第二直動機構44係包含第二移動體441、固定體442以及馬達(未圖示)。固定體442係將第二移動體441以可朝第二移動方向D2移動之方式結合。固定體442亦可例如為用以內置第二直動機構44的各種構成之框體。第二直動機構44的馬達係提供用以使第二移動體441朝第二移動方向D2往復移動之驅動力。該馬達係被控制部7控制。 In the example of FIG. 6, the second linear motion mechanism 44 has the same configuration as the first linear motion mechanism 43. Specifically, the second linear motion mechanism 44 includes a second moving body 441, a fixed body 442, and a motor (not shown). The fixed body 442 combines the second moving body 441 in a manner that can move in the second moving direction D2. The fixed body 442 may also be, for example, a frame body with various configurations for incorporating the second linear motion mechanism 44. The motor of the second linear motion mechanism 44 provides a driving force for reciprocating the second moving body 441 in the second moving direction D2. This motor is controlled by the control unit 7.

在圖6的例子中,第二直動機構44係包含帶子444。帶子444係架設於複數個滑輪(未圖示)。該滑輪係以滑輪的中心軸與第二移動方向D2正交之方式可繞著滑輪的中心軸旋轉地結合於固定體442。帶子444係藉由例如橡膠製的彈性體所形成。此種帶子444亦稱為時序帶。第二直動機構44的馬達係例如使滑輪轉動從而使帶子444轉動。第二移動體441係連結於帶子444,帶子444轉動,藉此第二移動體441係朝第二移動方向D2往復移動。 In the example of FIG. 6, the second linear motion mechanism 44 includes a strap 444. The belt 444 is installed on a plurality of pulleys (not shown). The pulley system is rotatably coupled to the fixed body 442 around the central axis of the pulley in such a way that the central axis of the pulley is orthogonal to the second moving direction D2. The belt 444 is formed of, for example, an elastic body made of rubber. Such bands 444 are also called timing bands. The motor of the second linear motion mechanism 44 rotates a pulley to rotate the belt 444, for example. The second moving body 441 is connected to the belt 444, and the belt 444 rotates, whereby the second moving body 441 reciprocates in the second moving direction D2.

在圖6的例子中,第二直動機構44係包含線性導件445。線性導件445係包含:第二導軌,係沿著第二移動方向D2延伸;以及第二行進部,係卡合至第二導軌並於第二導軌行進。第二行進部係連結於第二移動體441。藉此,第二直動機構44係能以更高的直動精度使第二移動體441朝第二移動方向D2往復移動。 In the example of FIG. 6, the second linear motion mechanism 44 includes a linear guide 445. The linear guide 445 includes: a second guide rail, which extends along the second moving direction D2; and a second traveling part, which is engaged with the second guide rail and travels on the second guide rail. The second traveling part is connected to the second moving body 441. Thereby, the second linear motion mechanism 44 can reciprocate the second moving body 441 in the second moving direction D2 with higher linear motion accuracy.

[位置檢測] [Location Detection]

如圖6所示,第二搬運機器人CR2係進一步包含:旋轉檢測部47,係檢測旋轉體421的旋轉位置;第一檢測部48,係檢測第一移動體431的位置;以及第二檢測部49,係檢測第二移動體441的位置。 As shown in FIG. 6, the second transfer robot CR2 system further includes: a rotation detection unit 47 that detects the rotation position of the rotating body 421; a first detection unit 48 that detects the position of the first moving body 431; and a second detection unit 49. Detect the position of the second moving body 441.

旋轉檢測部47亦可例如為光學式感測器或者磁性式感測器。旋轉檢測部47亦稱為旋轉編碼器(rotary encoder)。旋轉檢測部47係例如包含:圓板狀的碟(disk),係固定於旋轉體421(或者馬達423的旋轉軸);光源以及受光元件,係隔著碟彼此相互相對。於碟形成有隙縫圖案(slit pattern),來自光源的光線係藉由隙縫圖案並因應碟的旋轉位置而透過或者被阻隔。藉由被受光元件接收的光線的圖案檢測出旋轉體421的旋轉位置。旋轉檢測部47係將用以顯示所檢測出的馬達423的旋轉位置之檢測訊號輸出至控制部7。 The rotation detecting unit 47 may also be, for example, an optical sensor or a magnetic sensor. The rotation detecting unit 47 is also referred to as a rotary encoder. The rotation detecting unit 47 includes, for example, a disk-shaped disk, which is fixed to the rotating body 421 (or the rotating shaft of the motor 423); and the light source and the light receiving element are opposed to each other through the disk. A slit pattern is formed on the disc, and the light from the light source is transmitted through or blocked by the slit pattern according to the rotation position of the disc. The rotation position of the rotating body 421 is detected by the pattern of the light received by the light receiving element. The rotation detection unit 47 outputs a detection signal for displaying the detected rotation position of the motor 423 to the control unit 7.

第一檢測部48係安裝於固定體432,用以檢測第一移動體431在第一移動方向D1中的位置。第一檢測部48亦可為例如光學式感測器或者磁性式感測器。第一檢測部48亦稱為線性編碼器。第一檢測部48係直接地檢測第一移動體431的位置。例如,第一檢測部48係包含:刻度尺(scale),係朝第一移動方向D1延伸;以及掃描構件,係以可朝第一移動方向D1移動之方式相對於刻度尺設置。掃描構件係連結於第一移動體431,並與第一移動體431一體地移動。掃描構件係例如內置有:光源,係對刻度尺照射光線;以及受光元件,係接收透過刻度尺或者在刻度尺反射的光線;掃描構件係藉由將光線照射至刻度尺從而檢測出掃描構件相對於刻度尺之位置,亦即檢測出第一移動體431在第一移動方向D1中的位置。 The first detection unit 48 is installed on the fixed body 432 to detect the position of the first moving body 431 in the first moving direction D1. The first detection unit 48 may also be, for example, an optical sensor or a magnetic sensor. The first detection unit 48 is also called a linear encoder. The first detection unit 48 directly detects the position of the first moving body 431. For example, the first detection unit 48 includes a scale that extends in the first moving direction D1; and the scanning member is disposed relative to the scale in a manner movable in the first moving direction D1. The scanning member is connected to the first moving body 431 and moves integrally with the first moving body 431. For example, the scanning member is built-in: a light source, which irradiates light to the scale; and a light-receiving element, which receives light transmitted through the scale or reflected on the scale; At the position of the scale, that is, the position of the first moving body 431 in the first moving direction D1 is detected.

由於第一檢測部48係直接地檢測第一移動體431的位置,因此能高精度地檢測第一移動體431的位置。第一檢測部48係將用以顯示所檢測出的第一移動體431的位置之檢測訊號輸出至控制部7。 Since the first detection unit 48 directly detects the position of the first moving body 431, the position of the first moving body 431 can be detected with high accuracy. The first detection unit 48 outputs a detection signal for displaying the detected position of the first moving body 431 to the control unit 7.

第二檢測部49係安裝於固定體442,用以檢測第二移動體441在第二移動方向D2中的位置。第二檢測部49亦可為例如光學式感測器或者磁性式感 測器。第二檢測部49亦稱為線性編碼器。第二檢測部49係直接地檢測第二移動體441的位置。第二檢測部49的具體性的構成係與第一檢測部48相同。 The second detecting part 49 is installed on the fixed body 442 to detect the position of the second moving body 441 in the second moving direction D2. The second detection part 49 may also be, for example, an optical sensor or a magnetic sensor. Detector. The second detection unit 49 is also called a linear encoder. The second detection unit 49 directly detects the position of the second moving body 441. The specific configuration of the second detection unit 49 is the same as that of the first detection unit 48.

由於第二檢測部49係直接地檢測第二移動體441的位置,因此能高精度地檢測第二移動體441的位置。第二檢測部49係將用以顯示所檢測出的第二移動體441的位置之檢測訊號輸出至控制部7。 Since the second detection unit 49 directly detects the position of the second moving body 441, the position of the second moving body 441 can be detected with high accuracy. The second detection unit 49 outputs a detection signal for displaying the detected position of the second moving body 441 to the control unit 7.

[控制部] [Control Department]

圖7係顯示基板處理裝置1的各個要素與控制部7之間的連接的一例之方塊圖。控制部7的硬體構成係與一般的電腦相同。亦即,控制部7係包含:CPU(Central Processing Unit;中央處理單元)71,係用以進行各種運算處理;ROM(Read Only Memory;唯讀記憶體)72,係屬於讀出專用的記憶體,用以記憶基本程式;RAM(Random Access Memory;隨機存取記憶體)73,係屬於讀寫自如的記憶體,用以記憶各種資訊;以及非暫時性的記憶部74,係用以記憶控制應用(control application)(程式(program))或者資料等。CPU71、ROM72、RAM73以及記憶部74係藉由匯流排配線75彼此連接。 FIG. 7 is a block diagram showing an example of the connection between the various elements of the substrate processing apparatus 1 and the control unit 7. The hardware configuration of the control unit 7 is the same as that of a general computer. That is, the control unit 7 includes: a CPU (Central Processing Unit; central processing unit) 71, which is used to perform various arithmetic processing; ROM (Read Only Memory; read-only memory) 72, which is a memory dedicated for reading , Used to memorize basic programs; RAM (Random Access Memory; random access memory) 73, is a freely readable memory, used to store various information; and non-temporary memory 74, used for memory control Control application (program) or data, etc. The CPU 71, the ROM 72, the RAM 73, and the storage unit 74 are connected to each other by a bus wire 75.

控制應用或者資料亦可在已記錄於非暫時性的記錄媒體(半導體記憶體、光學媒體、磁性媒體等)之狀態下提供至控制部7。在此情形中,只要於匯流排配線75連接有用以從記錄媒體讀取控制應用或者資料之讀取裝置即可。此外,控制應用或者資料亦可經由網際網路從伺服器等提供至控制部7。在此情形中,只要於匯流排配線75連接有用以與外部裝置進行網際網路通訊之通訊部即可。此外,控制部7的功能不一定需要藉由軟體來實現,亦可藉由包含邏輯電路等硬體電路來實現。 The control application or data can also be provided to the control unit 7 in a state where it has been recorded on a non-transitory recording medium (semiconductor memory, optical medium, magnetic medium, etc.). In this case, it is only necessary to connect a reading device for reading control applications or data from the recording medium to the bus line 75. In addition, control applications or data may also be provided to the control unit 7 from a server or the like via the Internet. In this case, it is only necessary to connect a communication unit for Internet communication with an external device to the bus line 75. In addition, the functions of the control unit 7 do not necessarily need to be realized by software, and may be realized by hardware circuits including logic circuits.

於匯流排配線75連接有輸入部76以及顯示部77。輸入部76係包含鍵盤以及滑鼠等各種輸入器件。作業者係經由輸入部76對控制部7輸入各種資訊。顯示部77係藉由液晶螢幕等顯示器件所構成,用以顯示各種資訊。 The input unit 76 and the display unit 77 are connected to the bus wire 75. The input unit 76 includes various input devices such as a keyboard and a mouse. The operator inputs various information to the control unit 7 via the input unit 76. The display unit 77 is composed of a display device such as a liquid crystal screen for displaying various information.

控制部7係連接於處理單元P1至處理單元P18的作動部(自轉馬達51d以及閥56等)、梭搬運裝置36的作動部(馬達等)、第一搬運機器人CR1以及第二搬運機器人CR2的作動部(馬達423、433等),並控制這些作動部的動作。 The control unit 7 is connected to the operating unit (rotation motor 51d and valve 56 etc.) of the processing unit P1 to the processing unit P18, the operating unit (motor etc.) of the shuttle transport device 36, the first transport robot CR1 and the second transport robot CR2. Actuating parts (motors 423, 433, etc.), and control the actions of these actuating parts.

此外,控制部7亦電性地連接於第一搬運機器人CR1以及第二搬運機器人CR2的旋轉檢測部47、第一檢測部48以及第二檢測部49。控制部7係從旋轉檢測部47、第一檢測部48以及第二檢測部49接受檢測訊號。控制部7係依據旋轉檢測部47所檢測出的旋轉位置控制旋轉機構42,依據第一檢測部48所檢測出的位置控制第一直動機構43,依據第二檢測部49所檢測出的位置控制第二直動機構44。 In addition, the control unit 7 is also electrically connected to the rotation detection unit 47, the first detection unit 48, and the second detection unit 49 of the first transfer robot CR1 and the second transfer robot CR2. The control unit 7 receives detection signals from the rotation detection unit 47, the first detection unit 48, and the second detection unit 49. The control unit 7 controls the rotation mechanism 42 based on the rotation position detected by the rotation detection unit 47, controls the first linear mechanism 43 based on the position detected by the first detection unit 48, and based on the position detected by the second detection unit 49 Control the second direct-acting mechanism 44.

於記憶部74記憶有教學資料,該教學資料係規定了第一搬運機器人CR1以及第二搬運機器人CR2的手部46的移動路徑。控制部7係依循教學資料控制第一搬運機器人CR1以及第二搬運機器人CR2。 Teaching materials are stored in the memory 74, and the teaching materials define the movement paths of the hands 46 of the first transfer robot CR1 and the second transfer robot CR2. The control unit 7 controls the first transfer robot CR1 and the second transfer robot CR2 according to the teaching materials.

在以下中,代表性地說明第二搬運機器人CR2將基板W搬運至處理單元P10之情形。亦即,控制部7係依循規定了朝向處理單元P10的搬運路徑之教學資料以下述方式控制第二搬運機器人CR2。 In the following, a case where the second transfer robot CR2 transfers the substrate W to the processing unit P10 will be representatively described. That is, the control unit 7 follows the teaching data that defines the transport path toward the processing unit P10 to control the second transport robot CR2 in the following manner.

第二搬運機器人CR2係例如以手部46從第二傳遞部PS2取出基板W並保持基板W。接著,旋轉機構42係調整手部46的方向,鉛直驅動機構45係調整手部46的高度位置,使手部46在與處理單元P10相向之規定的對向位置停止。接著,第一直動機構43係使手部46朝處理單元P10移動並在自轉夾具51的上方的 規定的停止位置停止。在此種狀態下,理想上基板W的中心係位於旋轉軸線X1上。接著,鉛直驅動機構45係使手部46下降並將基板W載置於自轉夾具51。因此,停止位置係相當於俯視觀看時自轉夾具51上的基板W的載置位置。藉此,在基板W的中心位於旋轉軸線X1上的狀態下基板W被載置於自轉夾具51上。接著,第一直動機構43係使手部46退避至處理單元P10的外部。 The second transfer robot CR2 uses, for example, the hand 46 to take out the substrate W from the second transfer portion PS2 and hold the substrate W. Next, the rotation mechanism 42 adjusts the direction of the hand 46, and the vertical drive mechanism 45 adjusts the height position of the hand 46 to stop the hand 46 at a predetermined facing position facing the processing unit P10. Next, the first linear mechanism 43 moves the hand 46 toward the processing unit P10 and is positioned above the rotation jig 51 Stop at the specified stop position. In this state, the center of the upper substrate W is ideally located on the rotation axis X1. Next, the vertical drive mechanism 45 lowers the hand 46 and places the substrate W on the rotation jig 51. Therefore, the stop position corresponds to the placement position of the substrate W on the rotation jig 51 in a plan view. Thereby, the substrate W is placed on the rotation jig 51 in a state where the center of the substrate W is located on the rotation axis X1. Next, the first linear motion mechanism 43 retracts the hand 46 to the outside of the processing unit P10.

此外,亦可於處理單元P10設置有複數個升降銷(lift pin)(未圖示)。複數個升降銷係繞著旋轉軸線X1略等間隔地設置並進行升降。在複數個升降銷已經上升的狀態下,第二搬運機器人CR2係使手部46從規定的停止位置下降,藉此將基板W載置於升降銷上。第二搬運機器人CR2使手部46退避後,升降銷下降並將基板W載置於自轉夾具51上。在此情形中,理想上基板W的中心亦位於旋轉軸線X1上。 In addition, a plurality of lift pins (not shown) may be provided in the processing unit P10. A plurality of lifting pins are arranged at slightly equal intervals around the rotation axis X1 and are raised and lowered. In the state where the plurality of lift pins have been raised, the second transfer robot CR2 lowers the hand 46 from the predetermined stop position, thereby placing the substrate W on the lift pins. After the second transfer robot CR2 retracts the hand 46, the lift pins are lowered and the substrate W is placed on the rotation jig 51. In this case, ideally the center of the upper substrate W is also located on the rotation axis X1.

然而,當教學資料中的規定的停止位置本身包含水平方向的誤差時,基板W的中心係因應水平方向的誤差而從自轉夾具51的旋轉軸線X1朝水平方向偏移。由於此種位置偏移係不佳,因此期望在教學資料中高精度地規定與旋轉軸線X1(理想位置)一致之停止位置。 However, when the predetermined stop position in the teaching material itself includes an error in the horizontal direction, the center of the substrate W is offset from the rotation axis X1 of the rotation jig 51 in the horizontal direction due to the error in the horizontal direction. Since such a positional deviation system is not good, it is desirable to specify a stop position that coincides with the rotation axis X1 (ideal position) with high accuracy in the teaching materials.

此外,在教學資料中實質性地規定旋轉機構42、第一直動機構43、第二直動機構44以及鉛直驅動機構45的各個驅動量,從而規定手部46的移動路徑。所謂驅動量係顯示旋轉體421的旋轉量、第一移動體431的移動量、第二移動體441的移動量以及升降體451的移動量。亦即,停止位置係藉由來自手部46的初始位置的各個驅動量而被實質性地規定。因此,期望以規定的停止位置接近理想位置之方式規定各個驅動量。 In addition, the respective driving amounts of the rotating mechanism 42, the first linear motion mechanism 43, the second linear motion mechanism 44, and the vertical drive mechanism 45 are substantially specified in the teaching materials, thereby specifying the movement path of the hand 46. The so-called driving amount indicates the amount of rotation of the rotating body 421, the amount of movement of the first moving body 431, the amount of movement of the second moving body 441, and the amount of movement of the lifting body 451. That is, the stop position is substantially defined by the respective driving amounts from the initial position of the hand 46. Therefore, it is desirable to specify each drive amount so that the predetermined stop position is close to the ideal position.

在本實施形態中,作為用以使手部46水平地移動之機構,設置有旋轉機構42、第一直動機構43以及第二直動機構44。因此,能以三個軸的驅動量規定教學資料中的停止位置(水平面內的位置)。所謂三個軸係指沿著第一移動方向D1之軸、沿著第二移動方向D2之軸以及沿著旋轉軸線CA1之軸。藉此,能以更高的位置精度規定停止位置。以下,說明具體性的一例。 In this embodiment, as a mechanism for horizontally moving the hand 46, a rotation mechanism 42, a first linear motion mechanism 43, and a second linear motion mechanism 44 are provided. Therefore, the stop position (position in the horizontal plane) in the teaching material can be specified by the drive amount of the three axes. The so-called three axes refer to the axis along the first movement direction D1, the axis along the second movement direction D2, and the axis along the rotation axis CA1. Thereby, the stop position can be specified with higher position accuracy. Hereinafter, a specific example will be explained.

例如,控制部7亦可以下述方式控制手部46的位置,藉此規定手部46的停止位置。例如,控制部7係依據旋轉檢測部47以及第一檢測部48的檢測訊號將理想位置作為目標位置分別驅動旋轉機構42以及第一直動機構43。藉此,能在俯視觀看時將手部46的位置接近至理想位置(旋轉軸線X1)。用以顯示理想位置(旋轉軸線X1)之資訊係例如可藉由作業員輸入至輸入部76或者亦可以後述的方式檢測出。 For example, the control unit 7 may also control the position of the hand 46 in the following manner, thereby specifying the stop position of the hand 46. For example, the control unit 7 drives the rotation mechanism 42 and the first linear mechanism 43 with the ideal position as the target position based on the detection signals of the rotation detection unit 47 and the first detection unit 48. Thereby, the position of the hand 46 can be approached to an ideal position (rotation axis X1) in a plan view. The information used to display the ideal position (rotation axis X1) can be input to the input unit 76 by an operator, for example, or can be detected in a manner described later.

在此,設定成藉由旋轉機構42以及第一直動機構43使手部46停止至第一位置。接著,控制部7係驅動旋轉機構42與第一直動機構43中的一者以及第二直動機構44。作為具體性的一例,控制部7係驅動第一直動機構43以及第二直動機構44。控制部7係依據第一檢測部48以及第二檢測部49的檢測訊號將理想位置作為目標位置驅動第一直動機構43以及第二直動機構44。藉由此種驅動,在手部46的位置比第一位置還接近理想位置之情形中,控制部7係結束第一直動機構43以及第二直動機構44的驅動。控制部7係將此時的旋轉機構42、第一直動機構43以及第二直動機構44的驅動量作為用以顯示停止位置之資訊包含於教學資料。在此情形中,教學資料中的停止位置(水平面內的位置)係被旋轉機構42、第一直動機構43以及第二直動機構44的各個驅動量規定。另一方面,在手部46的位置從理想位置遠離之情形中,控制部7係驅動第一直動機構43以及第二直動 機構44並使手部46返回至原本的第一位置。控制部7係將此時的旋轉機構42以及第一直動機構43的驅動量作為用以顯示停止位置之資訊包含於教學資料。在此情形中,教學資料中的停止位置(水平面內的位置)係被旋轉機構42以及第一直動機構43的驅動量規定。 Here, it is set to stop the hand 46 to the first position by the rotation mechanism 42 and the first linear motion mechanism 43. Next, the control unit 7 drives one of the rotating mechanism 42 and the first linear motion mechanism 43 and the second linear motion mechanism 44. As a specific example, the control unit 7 drives the first linear motion mechanism 43 and the second linear motion mechanism 44. The control unit 7 drives the first linear motion mechanism 43 and the second linear motion mechanism 44 based on the detection signals of the first detection unit 48 and the second detection unit 49 with the ideal position as the target position. With this driving, when the position of the hand 46 is closer to the ideal position than the first position, the control unit 7 ends the driving of the first linear motion mechanism 43 and the second linear motion mechanism 44. The control unit 7 includes the driving amounts of the rotating mechanism 42, the first linear motion mechanism 43, and the second linear motion mechanism 44 at this time as information for displaying the stop position in the teaching data. In this case, the stop position (position in the horizontal plane) in the teaching material is specified by the respective driving amounts of the rotating mechanism 42, the first linear motion mechanism 43, and the second linear motion mechanism 44. On the other hand, when the position of the hand 46 is far away from the ideal position, the control unit 7 drives the first linear motion mechanism 43 and the second linear motion The mechanism 44 returns the hand 46 to its original first position. The control unit 7 includes the driving amounts of the rotating mechanism 42 and the first linear motion mechanism 43 at this time as information for displaying the stop position in the teaching data. In this case, the stop position (position in the horizontal plane) in the teaching material is specified by the driving amount of the rotating mechanism 42 and the first linear mechanism 43.

如上所述,第二搬運機器人CR2係能適當地調整三個軸並以手部46的位置最接近理想位置之方式規定教學資料的停止位置。因此,與僅調整兩個軸之情形相比,能以高的位置精度生成教學資料。依循教學資料而驅動之第二搬運機器人CR2係能一邊以高的位置精度將基板W的中心接近至旋轉軸線X1一邊將基板W載置於自轉夾具51上。 As described above, the second transfer robot CR2 can appropriately adjust the three axes and specify the stopping position of the teaching material in such a way that the position of the hand 46 is closest to the ideal position. Therefore, compared with the case where only two axes are adjusted, teaching materials can be generated with high position accuracy. The second transfer robot CR2 driven in accordance with the teaching materials can place the substrate W on the rotation jig 51 while approaching the center of the substrate W to the rotation axis X1 with high position accuracy.

此外,在圖1的基板處理裝置1中,第二搬運機器人CR2的手部46的初始位置係在俯視觀看時被處理塔TW3至處理塔TW6以及第二傳遞部PS2圍繞。亦即,第二搬運機器人CR2所為之基板W的搬運目的地單元係以圍繞第二搬運機器人CR2的周圍之方式配置,且三個以上的搬運目的地單元並未排列於水平的一個方向中。依據此種構造,第二搬運機器人CR2係藉由旋轉機構42調整手部46的方向,藉此能使手部46與處理塔TW3至處理塔TW6以及第二傳遞部PS2分別相向。例如,在手部46與處理塔TW3相向的狀態中,第一直動機構43的第一移動方向D1係與連結手部46以及處理塔TW3之直線方向一致。因此,第一直動機構43係使手部46朝處理塔TW3移動,藉此能使手部46進入至處理塔TW3的一個處理單元內。 In addition, in the substrate processing apparatus 1 of FIG. 1, the initial position of the hand 46 of the second transfer robot CR2 is surrounded by the processing tower TW3 to the processing tower TW6 and the second transfer portion PS2 in a plan view. That is, the transfer destination unit of the substrate W for the second transfer robot CR2 is arranged so as to surround the periphery of the second transfer robot CR2, and three or more transfer destination units are not arranged in one horizontal direction. According to this structure, the second transfer robot CR2 adjusts the direction of the hand 46 by the rotation mechanism 42 so that the hand 46 can face the processing tower TW3 to the processing tower TW6 and the second transfer portion PS2, respectively. For example, in a state where the hand 46 faces the processing tower TW3, the first movement direction D1 of the first linear motion mechanism 43 coincides with the linear direction connecting the hand 46 and the processing tower TW3. Therefore, the first linear motion mechanism 43 moves the hand 46 toward the processing tower TW3, thereby allowing the hand 46 to enter one processing unit of the processing tower TW3.

如上所述,在基板W的搬運方面,只要於第二搬運機器人CR2設置有旋轉機構42以及第一直動機構43即可。而且,處理單元內的手部46的水平面內的位置亦可藉由旋轉機構42以及第一直動機構43進行某種程度的調整。 As described above, in terms of the transfer of the substrate W, the second transfer robot CR2 only needs to provide the rotation mechanism 42 and the first linear motion mechanism 43. Furthermore, the position in the horizontal plane of the hand 46 in the processing unit can also be adjusted to some extent by the rotation mechanism 42 and the first linear motion mechanism 43.

然而,在本實施形態中,不僅設置有旋轉機構42以及第一直動機構43,亦設置有第二直動機構44。藉此,能增大用以進行手部46的位置調整的軸數,從而能更高精度地進行手部46的位置調整。 However, in this embodiment, not only the rotation mechanism 42 and the first linear motion mechanism 43 are provided, but also the second linear motion mechanism 44 is provided. Thereby, the number of axes for adjusting the position of the hand 46 can be increased, and the position of the hand 46 can be adjusted with higher accuracy.

而且,第一檢測部48以及第二檢測部49係分別直接地檢測第一直動機動43的第一移動體431以及第二直動機構44的第二移動體441的位置。因此,能高精度地檢測第一移動體431以及第二移動體441的位置。因此,控制部7係能更高精度地反饋(feedback)控制手部46的第一移動方向D1的位置以及第二移動方向D2的位置。例如,如上所述,在第一直動機構43中,即使在馬達433經由變速機(例如帶子434)對第一移動體431傳達驅動力之情形中,亦能高精度地檢測第一移動體431的位置並依據第一移動體431的檢測位置調整第一移動體431的位置,藉此能高精度地控制第一移動體431的位置。第二移動體441亦同樣。 Furthermore, the first detection unit 48 and the second detection unit 49 directly detect the positions of the first moving body 431 of the first linear motion motor 43 and the second moving body 441 of the second linear motion mechanism 44, respectively. Therefore, the positions of the first moving body 431 and the second moving body 441 can be detected with high accuracy. Therefore, the control unit 7 can feedback the position of the first movement direction D1 and the position of the second movement direction D2 of the control hand 46 with higher accuracy. For example, as described above, in the first linear mechanism 43, even in the case where the motor 433 transmits the driving force to the first movable body 431 via the speed changer (for example, the belt 434), the first movable body can be detected with high accuracy. The position of the first movable body 431 is adjusted according to the detected position of the first movable body 431, so that the position of the first movable body 431 can be controlled with high precision. The same is true for the second moving body 441.

旋轉機構42係與第一直動機構43以及第二直動機構44不同,用以使手部46朝針對旋轉軸線CA1的周方向往復移動。因此,旋轉軸線CA1與手部46之間的距離愈長則手部46的周方向的位置精度愈降低。 The rotation mechanism 42 is different from the first linear motion mechanism 43 and the second linear motion mechanism 44, and is used to reciprocate the hand 46 in the circumferential direction with respect to the rotation axis CA1. Therefore, the longer the distance between the rotation axis CA1 and the hand 46, the lower the position accuracy of the hand 46 in the circumferential direction.

此外,在上述例子中,馬達423係直接連結於旋轉體421。因此,馬達423的旋轉位置係高精度地顯示旋轉體421的旋轉位置。因此,旋轉機構42係能高精度地控制旋轉體421的旋轉位置。從而,即使手部46與旋轉軸線CA1之間的距離變長,亦能高精度地調整手部46的周方向的位置。 In addition, in the above example, the motor 423 is directly connected to the rotating body 421. Therefore, the rotational position of the motor 423 displays the rotational position of the rotating body 421 with high accuracy. Therefore, the rotating mechanism 42 can control the rotating position of the rotating body 421 with high accuracy. Therefore, even if the distance between the hand 46 and the rotation axis CA1 becomes longer, the position of the hand 46 in the circumferential direction can be adjusted with high accuracy.

亦即,在周方向的位置精度因為手部46的位置而降低之旋轉機構42中,使馬達423直接連結於旋轉體421,從而抑制位置精度降低或者提升位置精度。另一方面,在第一直動機構43以及第二直動機構44中採用帶子機構,藉此降低第一直動機構43以及第二直動機構44的成本以及尺寸。此外,在成本以 及尺寸不會成為問題之情形中,第一直動機構43以及第二直動機構44亦可採用直接連結線性馬達。 That is, in the rotating mechanism 42 in which the position accuracy in the circumferential direction is reduced by the position of the hand 46, the motor 423 is directly connected to the rotating body 421, thereby suppressing the decrease in the position accuracy or improving the position accuracy. On the other hand, adopting a belt mechanism in the first linear motion mechanism 43 and the second linear motion mechanism 44 reduces the cost and size of the first linear motion mechanism 43 and the second linear motion mechanism 44. In addition, the cost is If the size is not a problem, the first linear motion mechanism 43 and the second linear motion mechanism 44 can also be directly connected to linear motors.

此外,由於旋轉檢測部47能高精度地檢測旋轉體421的旋轉位置,因此控制部7係能更高精度地反饋控制手部46的周方向的位置。 In addition, since the rotation detection unit 47 can detect the rotation position of the rotating body 421 with high accuracy, the control unit 7 can feedback and control the position of the hand 46 in the circumferential direction with higher accuracy.

雖然在上述例子中以第二搬運機器人CR2作為例子進行說明,然而第一搬運機器人CR1亦同樣。此外,在圖1的基板處理裝置1中,第一搬運機器人CR1的手部的初始位置係被處理塔TW1、TW2、第一傳遞部PS1以及第二傳遞部PS2圍繞。依據此種構造,與第二搬運機器人CR2同樣地,在基板W的搬運方面,只要設置有旋轉機構42以及第一直動機構43即可。然而,如本實施形態般,不僅設置有旋轉機構42以及第一直動機構43亦設置有第二直動機構44,藉此能增大用以進行手部46的位置調整的軸數,從而能更高精度地進行位置調整。 Although the second transfer robot CR2 has been described as an example in the above example, the same is true for the first transfer robot CR1. In addition, in the substrate processing apparatus 1 of FIG. 1, the initial position of the hand of the first transfer robot CR1 is surrounded by the processing towers TW1, TW2, the first transfer unit PS1, and the second transfer unit PS2. According to this structure, in the same way as the second transfer robot CR2, in terms of the transfer of the substrate W, the rotation mechanism 42 and the first linear motion mechanism 43 may be provided. However, as in this embodiment, not only the rotation mechanism 42 and the first linear motion mechanism 43 are provided, but also the second linear motion mechanism 44 is provided, thereby increasing the number of axes used to adjust the position of the hand 46. The position can be adjusted with higher accuracy.

此外,在上述例子中,雖然第二直動機構44係使旋轉機構42以及第一直動機構43一體地移動,但並未限定於此。例如,亦可為第二直動機構44設置於比旋轉機構42還接近手部46的位置,且旋轉機構42係使第一直動機構43以及第二直動機構44一體地轉動。 In addition, in the above example, although the second linear motion mechanism 44 integrally moves the rotation mechanism 42 and the first linear motion mechanism 43, it is not limited to this. For example, the second linear motion mechanism 44 may be provided at a position closer to the hand 46 than the rotation mechanism 42, and the rotation mechanism 42 may integrally rotate the first linear motion mechanism 43 and the second linear motion mechanism 44.

[教學資料生成] [Generation of Teaching Materials]

接著,說明教學資料的生成方法的具體性的一例。在此,首先,生成初始的教學資料,藉由修正初始的教學資料來生成教學資料。初始的教學資料係例如藉由作業員朝輸入部76或者專用的輸入裝置輸入而生成。 Next, an example of the specificity of the method of generating teaching materials will be explained. Here, first, the initial teaching materials are generated, and the teaching materials are generated by modifying the initial teaching materials. The initial teaching materials are generated, for example, by the operator inputting to the input unit 76 or a dedicated input device.

首先,第二搬運機器人CR2係依循初始的教學資料使手部46移動並在自轉夾具51的上方的既定的停止位置停止。接著,一邊監視此種狀態的基 板W的中心的位置一邊以俯視觀看時基板W的中心與自轉夾具51的旋轉軸線X1(理想位置)一致之方式修正停止位置。以下具體地說明。 First, the second transfer robot CR2 moves the hand 46 according to the initial teaching materials and stops at a predetermined stop position above the rotation jig 51. Then, while monitoring the status of the basic The position of the center of the plate W corrects the stop position so that the center of the substrate W coincides with the rotation axis X1 (ideal position) of the rotation jig 51 when viewed from above. This will be specifically explained below.

如圖5所例示般,於處理單元P10設置有攝影機57。攝影機57係例如包含CCD(Charge Coupled Device;電荷耦合元件)成像感測器(imaging sensor)或者CMOS(Complementary Metal-Oxide Semiconductor;互補式金屬氧化物半導體)成像感測器,並設置於自轉夾具51的上方。在圖5的例子中,攝影機57的拍攝方向為鉛直下方。於攝影機57的拍攝區域包含有自轉夾具51的周緣部的至少一部分。亦可於拍攝區域包含有自轉夾具51整體。攝影機57係對拍攝區域進行拍攝並取得影像資料,將且該影像資料輸出至控制部7。 As illustrated in FIG. 5, a camera 57 is provided in the processing unit P10. The camera 57 includes, for example, a CCD (Charge Coupled Device) imaging sensor or a CMOS (Complementary Metal-Oxide Semiconductor) imaging sensor, and is set in the rotation jig 51 Above. In the example of FIG. 5, the shooting direction of the camera 57 is vertically downward. The imaging area of the camera 57 includes at least a part of the peripheral portion of the rotation jig 51. The entire rotation jig 51 may also be included in the shooting area. The camera 57 photographs the shooting area and obtains image data, and outputs the image data to the control unit 7.

在第二搬運機器人CR2將基板W搬入至處理單元P10時,保持有基板W的手部46係移動至自轉夾具51的上方的規定的停止位置。在圖5的例子中,以假想線顯示已在規定的停止位置停止的基板W以及手部46。於攝影機57的拍攝區域包含有已在既定的停止位置停止的基板W的周緣部的至少一部分。換言之,以拍攝區域包含有基板W的至少一部分之方式調整攝影機57的設置位置。亦可於拍攝區域包含有基板W的整體。 When the second transfer robot CR2 carries the substrate W into the processing unit P10, the hand 46 holding the substrate W moves to a predetermined stop position above the rotation jig 51. In the example of FIG. 5, the substrate W and the hand 46 that have stopped at a predetermined stop position are displayed by imaginary lines. The imaging area of the camera 57 includes at least a part of the peripheral portion of the substrate W that has stopped at a predetermined stop position. In other words, the installation position of the camera 57 is adjusted so that the imaging area includes at least a part of the substrate W. The entire substrate W may be included in the imaging area.

此外,亦可於處理單元P10設置有用以使攝影機57移動之攝影機移動機構(未圖示)。攝影機移動機構係使攝影機57移動,藉此能適當地變更拍攝區域。 In addition, a camera moving mechanism (not shown) for moving the camera 57 can also be provided in the processing unit P10. The camera moving mechanism moves the camera 57 so that the shooting area can be changed appropriately.

控制部7係對攝影機57所取得的影像資料進行影像處理,並檢測基板W的中心位置。控制部7係以基板W的中心位置與自轉夾具51的旋轉軸線X1一致之方式算出針對既定的停止位置的修正量。 The control unit 7 performs image processing on the image data obtained by the camera 57 and detects the center position of the substrate W. The control unit 7 calculates the correction amount for the predetermined stop position so that the center position of the substrate W coincides with the rotation axis X1 of the rotation jig 51.

圖8係顯示位置修正方法的一例之流程圖。初始時,基板W尚未被搬入至處理單元P10。首先,攝影機57係拍攝自轉夾具51(步驟S1)。具體而言,例如攝影機移動機構係使攝影機57移動至適合拍攝自轉夾具51的第一拍攝位置。接著,攝影機57對拍攝區域進行拍攝並取得影像資料,且將該影像資料輸出至控制部7。於該影像資料包含有自轉夾具51。 Fig. 8 is a flowchart showing an example of a position correction method. Initially, the substrate W has not been carried in to the processing unit P10. First, the camera 57 photographs the rotation jig 51 (step S1). Specifically, for example, the camera moving mechanism moves the camera 57 to the first shooting position suitable for shooting the rotation jig 51. Then, the camera 57 photographs the shooting area and obtains image data, and outputs the image data to the control unit 7. The image data includes a rotation jig 51.

接著,控制部7係藉由對於該影像資料的影像處理來檢測自轉夾具51的旋轉軸線X1的位置(步驟S2)。圖9係用以說明用以求出旋轉軸線X1的位置之手法的一例之圖。自轉基座51a係俯視觀看時形成為略圓形狀,且自轉基座51a的曲率半徑R1為已知。因此,只要求出通過自轉基座51a的周緣上的一點之接線L的式子,即能從接線L的式子與曲率半徑R1求出自轉基座51a的旋轉軸線X1的位置(X座標以及Y座標)。旋轉軸線X1的位置成為針對停止位置的理想位置。 Next, the control unit 7 detects the position of the rotation axis X1 of the rotation jig 51 by image processing on the image data (step S2). FIG. 9 is a diagram for explaining an example of a method for obtaining the position of the rotation axis X1. The rotation base 51a is formed in a substantially circular shape in plan view, and the curvature radius R1 of the rotation base 51a is known. Therefore, only the equation of the line L passing through a point on the periphery of the rotation base 51a is required, that is, the position of the rotation axis X1 of the rotation base 51a (X coordinate and Y coordinate). The position of the rotation axis X1 becomes an ideal position for the stop position.

接著,第二搬運機器人CR2係使保持著基板W之手部46在自轉夾具51的上方的規定的停止位置停止(步驟S3)。接著,攝影機57係拍攝基板W(步驟S4)。具體而言,例如攝影機移動機構係使攝影機57移動至適合拍攝手部46上的基板W之第二拍攝位置。例如,第二拍攝位置為比第一拍攝位置還位於+Z側的位置。接著,攝影機57係對拍攝區域進行拍攝並取得影像資料,且將該影像資料輸出至控制部7。於該影像資料包含有基板W。 Next, the second transfer robot CR2 stops the hand 46 holding the substrate W at a predetermined stop position above the rotation jig 51 (step S3). Next, the camera 57 images the substrate W (step S4). Specifically, for example, the camera moving mechanism moves the camera 57 to a second imaging position suitable for imaging the substrate W on the hand 46. For example, the second shooting position is a position on the +Z side than the first shooting position. Then, the camera 57 photographs the shooting area and obtains image data, and outputs the image data to the control unit 7. The image data includes a substrate W.

控制部7係對該影像資料進行影像處理並檢測基板W的中心的位置(步驟S5)。用以求出基板W的中心的位置之手法係例如與用以求出旋轉軸線X1之手法同樣。亦即,由於基板W的曲率半徑為已知,因此只要求出通過基板W的周緣上的一點之接線,即能依據已知的曲率半徑與該接線的式子求出基板W的中心位置。 The control unit 7 performs image processing on the image data and detects the position of the center of the substrate W (step S5). The method for obtaining the position of the center of the substrate W is the same as the method for obtaining the rotation axis X1, for example. That is, since the radius of curvature of the substrate W is known, only a wire passing through a point on the periphery of the substrate W is required, that is, the center position of the substrate W can be obtained based on the equation of the known radius of curvature and the wire.

接著,控制部7係算出基板W的中心位置與旋轉軸線X1之間的差(步驟S6)。接著,控制部7係判定該差的絕對值是否為容許值以上(步驟S7)。當差未滿容許值時,由於無須修正教學資料,因此不執行後述的步驟S8而是結束處理。亦即,直接採用初始的教學資料作為教學資料。 Next, the control unit 7 calculates the difference between the center position of the substrate W and the rotation axis X1 (step S6). Next, the control unit 7 determines whether the absolute value of the difference is equal to or greater than the allowable value (step S7). When the difference is less than the allowable value, since there is no need to modify the teaching data, the process ends without executing step S8 described later. That is, the original teaching materials are directly used as teaching materials.

當差為容許值以上時,控制部7係求出用以使基板W的中心位置與旋轉軸線X1一致之第一修正量與第一修正方向,並依據該第一修正量以及該第一修正方向修正教學資料(具體而言為停止位置)(步驟S8)。該第一修正量係與基板W的中心位置與旋轉軸線X1之間的差的絕對值相等,該第一修正方向為從基板W的中心朝向旋轉軸線X1之方向。 When the difference is greater than or equal to the allowable value, the control unit 7 obtains the first correction amount and the first correction direction for making the center position of the substrate W coincide with the rotation axis X1, and based on the first correction amount and the first correction direction The teaching material (specifically, the stop position) is corrected (step S8). The first correction amount is equal to the absolute value of the difference between the center position of the substrate W and the rotation axis X1, and the first correction direction is a direction from the center of the substrate W to the rotation axis X1.

為了修正既定的停止位置,修正用以使手部46移動至修正後的停止位置之各個驅動機構的驅動量。在此,由於在水平面內修正停止位置,因此控制部7係將修正後的停止位置作為目標位置以例如上述方式驅動旋轉機構42、第一直動機構43以及第二直動機構44。藉此,決定用以使手部46移動至修正後的停止位置之各個驅動機構的驅動量(修正量)。藉此,修正初始的教學資料。 In order to correct the predetermined stop position, the drive amount of each drive mechanism for moving the hand 46 to the corrected stop position is corrected. Here, since the stop position is corrected in the horizontal plane, the control unit 7 drives the rotation mechanism 42, the first linear motion mechanism 43, and the second linear motion mechanism 44 in the above-described manner using the corrected stop position as the target position, for example. Thereby, the drive amount (correction amount) of each drive mechanism for moving the hand 46 to the corrected stop position is determined. In this way, the original teaching materials are revised.

如上所述,控制部7係能以使俯視觀看時基板W的中心位置與自轉夾具51的旋轉軸線X1一致之方式修正初始的教學資料(具體而言為停止位置)。而且,在本實施形態中,由於能修正三個軸的驅動量並修正初始的教學資料,因此能更高精度地修正初始的教學資料。 As described above, the control unit 7 can correct the initial teaching data (specifically, the stop position) so that the center position of the substrate W in a plan view coincides with the rotation axis X1 of the rotation jig 51. Furthermore, in this embodiment, since the drive amount of the three axes can be corrected and the initial teaching data can be corrected, the initial teaching data can be corrected with higher accuracy.

藉此,能獲得更高的位置精度的教學資料。由於第二搬運機器人CR2係依循教學資料而動作,因此能在已使基板W的中心與自轉夾具51的旋轉軸線X1高精度地一致的狀態下將基板W傳遞至自轉夾具51。 In this way, teaching materials with higher position accuracy can be obtained. Since the second transfer robot CR2 operates in accordance with the teaching materials, the substrate W can be transferred to the rotation jig 51 in a state where the center of the substrate W and the rotation axis X1 of the rotation jig 51 are aligned with high accuracy.

控制部7只要藉由基於教學資料的前饋(feedforward)控制來控制第二搬運機器人CR2即可。亦即,為了生成教學資料,使用已使用了旋轉檢測部47、第一檢測部48以及第二檢測部49的檢測訊號之反饋控制,藉此能以高的位置精度生成教學資料,並在之後藉由前饋控制高速地搬運基板W。 The control unit 7 only needs to control the second transfer robot CR2 by feedforward control based on teaching materials. That is, in order to generate teaching materials, feedback control using the detection signals of the rotation detection section 47, the first detection section 48, and the second detection section 49 is used to generate the teaching materials with high position accuracy. The substrate W is conveyed at a high speed by the feedforward control.

[即時(real time)修正] [Real time correction]

如上述般,第二搬運機器人CR2係能依循教學資料在適當的位置將基板W傳遞至自轉夾具51。然而,會有在自轉夾具51保持基板W時基板W在水平方向偏移之情形。例如,在自轉夾具51藉由吸附來保持基板W之情形中,在自轉夾具51開始吸引基板W時基板W會朝水平方向滑動,從而導致基板W的中心從旋轉軸線X1偏移。此時的偏移量以及偏移方向係會因為處理單元P1至處理單元P18各者而不同,且亦會因為各個處理單元P1至處理單元P18的經時劣化等而不同。 As described above, the second transfer robot CR2 can transfer the substrate W to the rotation jig 51 at an appropriate position according to the teaching materials. However, there may be cases where the substrate W is shifted in the horizontal direction when the rotation jig 51 holds the substrate W. For example, in the case where the rotation jig 51 holds the substrate W by suction, the substrate W will slide in the horizontal direction when the rotation jig 51 starts to attract the substrate W, causing the center of the substrate W to shift from the rotation axis X1. The offset amount and the offset direction at this time will be different for each of the processing unit P1 to the processing unit P18, and will also be different due to the temporal degradation of the processing unit P1 to the processing unit P18.

因此,考量下述情形:基板處理裝置1係監視自轉夾具51保持基板W時之基板W的中心位置,且在基板W的中心位置從旋轉軸線X1偏移時將基板W重新載置於自轉夾具51。 Therefore, consider the following situation: the substrate processing apparatus 1 monitors the center position of the substrate W when the rotation jig 51 is holding the substrate W, and places the substrate W on the rotation jig again when the center position of the substrate W is shifted from the rotation axis X1 51.

圖10係顯示位置修正方法的另一例之流程圖。首先,攝影機57係拍攝自轉夾具51(步驟S11)。接著,控制部7係對從攝影機57輸入的影像資料進行影像處理,並檢測自轉夾具51的旋轉軸線X1的位置(步驟S12)。 Fig. 10 is a flowchart showing another example of the position correction method. First, the camera 57 photographs the rotation jig 51 (step S11). Next, the control unit 7 performs image processing on the image data input from the camera 57, and detects the position of the rotation axis X1 of the rotation jig 51 (step S12).

接著,第二搬運機器人CR2係使保持著基板W之手部46在自轉夾具51的上方的規定的停止位置停止(步驟S13)。接著,第二搬運機器人CR2係使手部46下降並將基板W載置於自轉夾具51(步驟S14)。接著,自轉夾具51吸附並保持基板W(步驟S15)。基板W會因為吸引而在自轉夾具51上滑動。圖11係概略 性地顯示旋轉軸線X1以及基板W的中心Pc1的位置的一例之圖。在圖11的例子中,吸引後的基板W的中心Pc1係相對於旋轉軸線X1朝右下方偏移。 Next, the second transfer robot CR2 stops the hand 46 holding the substrate W at a predetermined stop position above the rotation jig 51 (step S13). Next, the second transfer robot CR2 lowers the hand 46 and places the substrate W on the rotation jig 51 (step S14). Next, the rotation jig 51 sucks and holds the substrate W (step S15). The substrate W slides on the rotation jig 51 due to suction. Figure 11 system outline A diagram schematically showing an example of the positions of the rotation axis X1 and the center Pc1 of the substrate W. In the example of FIG. 11, the center Pc1 of the substrate W after suction is shifted to the lower right with respect to the rotation axis X1.

接著,攝影機57係拍攝自轉夾具51上的基板W(步驟S16)。接著,控制部7係對從攝影機57輸入的影像資料進行影像處理並檢測基板W的中心Pc1的位置(步驟S17)。接著,控制部7係算出基板W的中心Pc1的位置與旋轉軸線X1之間的差(偏離量)△H(步驟S18)。接著,控制部7係判斷該差△H的絕對值是否為容許值以上(步驟S19)。該差△H的絕對值為未滿容許值時,由於不需要重新載置基板W,因此不執行後述的步驟S20至步驟S24而是結束處理。 Next, the camera 57 photographs the substrate W on the rotation jig 51 (step S16). Next, the control unit 7 performs image processing on the image data input from the camera 57 and detects the position of the center Pc1 of the substrate W (step S17). Next, the control unit 7 calculates the difference (deviation amount) ΔH between the position of the center Pc1 of the substrate W and the rotation axis X1 (step S18). Next, the control unit 7 determines whether the absolute value of the difference ΔH is greater than or equal to the allowable value (step S19). When the absolute value of the difference ΔH is less than the allowable value, since there is no need to remount the substrate W, the process ends without executing steps S20 to S24 described later.

在差△H的絕對值為容許值以上時,控制部7係求出用以使基板W的中心Pc1的位置與旋轉軸線X1一致之第二修正量與第二修正方向,並依據第二修正量以及第二修正方向修正停止位置且算出停止位置SP1(修正後位置)(步驟S20)。第二修正量係與該差△H的絕對值的兩倍相等,第二修正方向為俯視觀看時從基板W的中心Pc1朝向旋轉軸線X1之方向。亦即,由於基板W的中心Pc1因為自轉夾具51的吸附而從旋轉軸線X1朝偏移方向偏移達至差△H(偏移量)的分量,因此預先使基板W的停止位置SP1相對於旋轉軸線X1朝與該偏移方向的相反側挪動達至該偏離量的分量。此外,停止位置SP1係相當於重新載置基板W時之自轉夾具51上的基板W的載置位置。 When the absolute value of the difference ΔH is greater than or equal to the allowable value, the control unit 7 obtains the second correction amount and the second correction direction for making the position of the center Pc1 of the substrate W coincide with the rotation axis X1, and the second correction direction is based on the second correction The stop position is corrected by the amount and the second correction direction, and the stop position SP1 (position after correction) is calculated (step S20). The second correction amount is equal to twice the absolute value of the difference ΔH, and the second correction direction is the direction from the center Pc1 of the substrate W toward the rotation axis X1 in a plan view. That is, since the center Pc1 of the substrate W is shifted from the rotation axis X1 in the offset direction by the component of the difference ΔH (offset) due to the suction of the rotation jig 51, the stop position SP1 of the substrate W is set relative to The rotation axis X1 moves to the side opposite to the offset direction by the amount of the offset. In addition, the stop position SP1 is equivalent to the mounting position of the substrate W on the rotation jig 51 when the substrate W is newly mounted.

接著,第二搬運機器人CR2係從自轉夾具51抬起基板W(步驟S21)。具體而言,自轉夾具51解除基板W的保持,升降銷係抬起基板W,手部46係將該基板W抬起。 Next, the second transfer robot CR2 lifts the substrate W from the rotation jig 51 (step S21). Specifically, the rotation jig 51 releases the holding of the substrate W, the lift pin lifts the substrate W, and the hand 46 lifts the substrate W.

接著,第二搬運機器人CR2係使手部46移動至步驟S20中所求出的停止位置SP1(步驟S22)。具體而言,控制部7係將停止位置SP1作為目標位置以 例如已經說明過的方式驅動旋轉機構42、第一直動機構43以及第二直動機構44,從而使手部46移動。藉此,能高精度地使手部46移動至停止位置SP1。 Next, the second transfer robot CR2 moves the hand 46 to the stop position SP1 obtained in step S20 (step S22). Specifically, the control unit 7 sets the stop position SP1 as the target position to For example, the rotation mechanism 42, the first linear motion mechanism 43, and the second linear motion mechanism 44 are driven in the manner already described to move the hand 46. Thereby, the hand 46 can be moved to the stop position SP1 with high precision.

接著,第二搬運機器人CR2係使手部46下降並將基板W載置於自轉夾具51上(步驟S23)。接著,自轉夾具51係吸附基板W並保持基板W(步驟S24)。由於此種吸引時基板W會朝偏移方向滑動達至偏移量(差△H),因此基板W的中心Pc1接近旋轉軸線X1。 Next, the second transfer robot CR2 lowers the hand 46 and places the substrate W on the rotation jig 51 (step S23). Next, the rotation jig 51 sucks and holds the substrate W (step S24). Since the substrate W will slide in the offset direction up to the offset amount (difference ΔH) during such attraction, the center Pc1 of the substrate W is close to the rotation axis X1.

如上所述,能以俯視觀看時基板W的中心Pc1的位置與自轉夾具51的旋轉軸線X1一致之方式將基板W重新載置於自轉夾具51上。從而,能高精度地使吸引後的基板W的中心Pc1與旋轉軸線X1一致。 As described above, the substrate W can be remounted on the rotation jig 51 such that the position of the center Pc1 of the substrate W in a plan view coincides with the rotation axis X1 of the rotation jig 51. Therefore, it is possible to accurately align the center Pc1 of the substrate W after the suction with the rotation axis X1.

[機械學習] [Mechanical Learning]

如上所述,保持(吸引)時的基板W的偏移係有可能在處理單元P1至處理單元P18中不同。因此,亦可藉由機械學習來學習處理單元P1至處理單元P18所造成的不同,並利用機械學習重新載置基板W。 As described above, the offset system of the substrate W at the time of holding (suction) may be different in the processing unit P1 to the processing unit P18. Therefore, it is also possible to learn the difference caused by the processing unit P1 to the processing unit P18 through mechanical learning, and to reposition the substrate W using the mechanical learning.

圖12係概略性地顯示控制部7的內部構成的一例之功能方塊圖。控制部7係包含機械學習部710以及搬運控制部720。對機械學習部710輸入有攝影機57所拍攝的影像資料。具體而言,對機械學習部710輸入有包含了自轉夾具51的影像資料(步驟S11)以及包了含基板W的影像資料(步驟S16)。控制部7係使用基於兩個影像資料的機械學習求出已將基板W重新載置於自轉夾具51時的載置位置(停止位置SP1、修正後位置)。例如,機械學習部710係可依據兩個影像資料求出基板W的偏移量以及偏移方向,亦可依據手部46的停止位置求出第二修正量以及第二修正方向,亦可求出停止位置SP1。在此,機械學習部710係求出偏移量以及偏移方向並將所求出的偏移量以及偏移方向輸出至搬運控制部720。機 械學習部710的機械學習的演算法(algorithm)並未特別限定,但是能採用例如類神經網路(neural network)(例如深度學習(deep learning))等的演算法。 FIG. 12 is a functional block diagram schematically showing an example of the internal structure of the control unit 7. The control unit 7 includes a machine learning unit 710 and a transport control unit 720. The image data taken by the camera 57 is input to the machine learning unit 710. Specifically, the image data including the rotation jig 51 (step S11) and the image data including the substrate W are input to the machine learning unit 710 (step S16). The control unit 7 uses the machine learning based on the two image data to obtain the placement position (stop position SP1, post-correction position) when the substrate W has been remounted on the rotation jig 51. For example, the machine learning unit 710 can obtain the offset amount and the offset direction of the substrate W based on two image data, and can also obtain the second correction amount and the second correction direction based on the stop position of the hand 46, and can also obtain Exit the stop position SP1. Here, the machine learning unit 710 obtains the offset amount and the offset direction, and outputs the obtained offset amount and the offset direction to the conveyance control unit 720. machine The machine learning algorithm (algorithm) of the machine learning unit 710 is not particularly limited, but, for example, an algorithm such as a neural network (for example, deep learning) can be used.

機械學習部710係藉由使用了教師資料的事前的學習步驟所生成。教師資料係例如在每個處理單元P1至處理單元P18所取得。採用下述的影像資料作為教師資料:藉由攝影機57所取得且包含了自轉夾具51的影像資料;以及藉由攝影機57所取得且包含了被自轉夾具51保持的基板W的影像資料。此外,測定此時的偏移量以及偏移方向。進行複數次此種一連串的處理,藉此取得複數個兩個影像資料以及與該影像資料對應之偏移量以及偏移方向的組。採用各個組作為處理單元P10用的教師資料。此外,亦可測定第二修正量以及第二修正方向或者測定停止位置SP1以取代偏移量以及偏移方向。能藉由使用了教師資料的公知的學習步驟生成處理單元P10用的機械學習部710。同樣地,亦生成其他的處理單元用的機械學習部710。 The machine learning part 710 is created by the prior learning procedure using teacher data. The teacher information is obtained, for example, in each processing unit P1 to processing unit P18. The following image data are used as teacher data: image data obtained by the camera 57 and including the rotation jig 51; and image data obtained by the camera 57 and including the substrate W held by the rotation jig 51. In addition, the amount of shift and the direction of shift at this time are measured. This series of processing is performed a plurality of times, thereby obtaining a plurality of two image data and sets of offsets and offset directions corresponding to the image data. Each group is used as the teacher data for the processing unit P10. In addition, it is also possible to measure the second correction amount and the second correction direction or to measure the stop position SP1 instead of the offset amount and the offset direction. The machine learning unit 710 for the processing unit P10 can be generated by a known learning procedure using teacher data. Similarly, a machine learning unit 710 for other processing units is also generated.

此外,亦會有不同種類的基板W被收容於基板收容器20之情形。自轉夾具51所為之保持(吸引)時的基板W的偏移量以及偏移方向亦會取決於基板W的種類,例如亦會取決於基板W的尺寸(直徑)以及重量。因此,亦可針對每片基板W的種類取得教師資料。例如,將第一種類的基板W搬運至處理單元P10並重複上述處理,藉此能取得第一種類的基板W以及處理單元P10用的教師資料。能藉由使用了此種教師資料的學習步驟生成第一種類的基板W以及處理單元P10用的機械學習部710_1。同樣地,將第二種類的基板W搬運至處理單元P10並重複上述處理,藉此能取得第二種類的基板W以及處理單元P10用的教師資料。能藉由使用了此種教師資料的學習步驟生成第二種類的基板W以及處理單元P10用的機械學習部710_2。 In addition, there may be cases where different types of substrates W are contained in the substrate storage container 20. The offset amount and the offset direction of the substrate W when held (attracted) by the rotation jig 51 also depend on the type of substrate W, for example, the size (diameter) and weight of the substrate W. Therefore, teacher information can also be obtained for each type of substrate W. For example, by transporting the substrate W of the first type to the processing unit P10 and repeating the above-mentioned processing, the substrate W of the first type and teacher data for the processing unit P10 can be obtained. The first type of substrate W and the machine learning unit 710_1 for the processing unit P10 can be generated by the learning procedure using such teacher data. Similarly, by transporting the substrate W of the second type to the processing unit P10 and repeating the above-mentioned processing, the substrate W of the second type and the teacher data for the processing unit P10 can be obtained. The second type of substrate W and the machine learning unit 710_2 for the processing unit P10 can be generated by the learning procedure using such teacher data.

同樣地,能生成已因應了複數種類的基板W與複數個處理單元P1至處理單元P18的組合之複數個機械學習部710_3、…710_n。 Similarly, it is possible to generate a plurality of machine learning parts 710_3,.

在圖12的例子中,亦對機械學習部710輸入有基板資訊以及處理單元資訊。基板資訊係包含用以顯示成為搬運對象的基板W的種類之資訊(例如尺寸資訊),處理單元資訊係包含用以指定處理基板W的處理單元之資訊。機械學習部710係依據基板資訊以及處理單元資訊從機械學習部710_1、…710_n選擇一個對應的機械學習部710_m。機械學習部710_m係依據從攝影機57輸入的影像資料求出基板W的偏移量以及偏移方向並將所出求出的基板W的偏移量以及偏移方向輸出至搬運控制部720。 In the example of FIG. 12, substrate information and processing unit information are also input to the machine learning unit 710. The substrate information includes information (for example, size information) for displaying the type of substrate W to be transported, and the processing unit information includes information for specifying the processing unit for processing the substrate W. The machine learning part 710 selects a corresponding machine learning part 710_m from the machine learning parts 710_1,...710_n according to the substrate information and the processing unit information. The machine learning unit 710_m obtains the offset amount and offset direction of the substrate W based on the image data input from the camera 57 and outputs the obtained offset amount and offset direction of the substrate W to the transport control unit 720.

如上所述,搬運控制部720係依據偏移量以及偏移方向算出停止位置SP1,控制第二搬運機器人CR2從自轉夾具51抬起基板W並使手部46移動至停止位置SP1。此時,控制部7係將停止位置SP1作為目標位置並以例如已經說明過的方式驅動旋轉機構42、第一直動機構43以及第二直動機構44。藉此,能高精度地使手部46移動至停止位置SP1。接著,第二搬運機器人CR2係使手部46下降並將基板W載置於自轉夾具51上。 As described above, the transfer control unit 720 calculates the stop position SP1 based on the offset amount and the offset direction, and controls the second transfer robot CR2 to lift the substrate W from the rotation jig 51 and move the hand 46 to the stop position SP1. At this time, the control unit 7 sets the stop position SP1 as a target position and drives the rotating mechanism 42, the first linear motion mechanism 43, and the second linear motion mechanism 44 in the manner described, for example. Thereby, the hand 46 can be moved to the stop position SP1 with high precision. Next, the second transfer robot CR2 lowers the hand 46 and places the substrate W on the rotation jig 51.

如上所述,控制部7係利用機械學習求出停止位置SP1。因此,能高精度地求出停止位置SP1。從而,能更高精度地使保持後的基板W的中心Pc1的位置與旋轉軸線X1一致。 As described above, the control unit 7 uses machine learning to obtain the stop position SP1. Therefore, the stop position SP1 can be obtained with high accuracy. Therefore, the position of the center Pc1 of the substrate W after the hold can be aligned with the rotation axis X1 with higher accuracy.

而且,由於針對每個處理單元P1至處理單元P18生成機械學習部710,因此控制部7(機械學習部710)係能因應處理單元高精度地求出停止位置SP1。同樣地,由於針對每片基板W的種類生成機械學習部710,因此控制部7(機械學習部710)係能因應基板W的種類高精度地求出停止位置SP1。 Furthermore, since the machine learning unit 710 is generated for each of the processing unit P1 to the processing unit P18, the control unit 7 (machine learning unit 710) can accurately obtain the stop position SP1 in accordance with the processing unit. Similarly, since the machine learning unit 710 is generated for each type of substrate W, the control unit 7 (machine learning unit 710) can accurately obtain the stop position SP1 according to the type of substrate W.

[位置調整] [Position adjustment]

在圖6的例子中,旋轉機構42以及第一直動機構43係設置於比第二直動機構44還接近手部46之位置。因此,手部46的位置調整係只要旋轉機構42以及第一直動機構43優先地進行即可。例如,在重新載置基板W時,第二搬運機器人CR2係使手部46從修正前的停止位置移動至修正後的停止位置SP1。此時,第二搬運機器人CR2係只要至少使用旋轉機構42以及第一直動機構43使手部46移動即可。以下說明理由。 In the example of FIG. 6, the rotation mechanism 42 and the first linear motion mechanism 43 are provided at a position closer to the hand 46 than the second linear motion mechanism 44. Therefore, the position adjustment of the hand 46 may be performed as long as the rotation mechanism 42 and the first linear motion mechanism 43 are performed preferentially. For example, when the substrate W is newly placed, the second transfer robot CR2 moves the hand 46 from the stop position before the correction to the stop position SP1 after the correction. At this time, the second transfer robot CR2 system only needs to use at least the rotation mechanism 42 and the first linear motion mechanism 43 to move the hand 46. The reasons are explained below.

只要驅動第二直動機構44且第二移動體441朝第二移動方向D2移動,則旋轉機構42以及第一直動機構43亦與第二移動體441一體地移動。因此,於旋轉機構42以及第一直動機構43作用有慣性力。因為此種慣性力,旋轉機構42的旋轉體421以及第一直動機構43的第一移動體431會分別在間隙(clearance)的範圍內變動。如此,會使手部46的誤差增大。 As long as the second linear motion mechanism 44 is driven and the second moving body 441 moves in the second moving direction D2, the rotation mechanism 42 and the first linear motion mechanism 43 also move integrally with the second moving body 441. Therefore, inertial force acts on the rotation mechanism 42 and the first linear motion mechanism 43. Because of this inertial force, the rotating body 421 of the rotating mechanism 42 and the first moving body 431 of the first linear motion mechanism 43 respectively fluctuate within the range of clearance. In this way, the error of the hand 46 will increase.

另一方面,當驅動旋轉機構42且旋轉體421旋轉時,第一直動機構43係與旋轉體421一體地旋轉,相對於此第二直動機構44係不旋轉。此外,即使驅動第一直動機構43且第一移動體431移動,旋轉機構42以及第二直動機構44亦不會移動。因此,即使驅動旋轉機構42以及第一直動機構43,亦幾乎不會於第二直動機構44作用慣性力,第二移動體441的變動小。因此,不易導致手部46的誤差增大。 On the other hand, when the rotating mechanism 42 is driven and the rotating body 421 rotates, the first linear motion mechanism 43 rotates integrally with the rotating body 421, and the second linear motion mechanism 44 does not rotate relative to this. In addition, even if the first linear motion mechanism 43 is driven and the first moving body 431 moves, the rotation mechanism 42 and the second linear motion mechanism 44 will not move. Therefore, even if the rotation mechanism 42 and the first linear motion mechanism 43 are driven, little inertial force is applied to the second linear motion mechanism 44, and the second movable body 441 has little fluctuation. Therefore, the error of the hand 46 is not likely to increase.

因此,控制部7亦可以例如下述方式驅動各個驅動機構。亦即,控制部7係依據旋轉檢測部47以及第一檢測部48的檢測訊號分別驅動旋轉機構42以及第一直動機構43,使手部46移動至修正後的停止位置(目標位置)。而且,當手部46的位置與目標位置之間的差在容許範圍外時,控制部7係依據第二檢測 部49的檢測訊號亦驅動第二直動機構44並調整手部46的位置,當手部46的位置與目標位置之間的差在容許範圍內時,不使用第二直動機構44。 Therefore, the control unit 7 may also drive each drive mechanism in the following manner, for example. That is, the control unit 7 drives the rotation mechanism 42 and the first linear mechanism 43 respectively according to the detection signals of the rotation detection unit 47 and the first detection unit 48 to move the hand 46 to the corrected stop position (target position). Moreover, when the difference between the position of the hand 46 and the target position is outside the allowable range, the control section 7 is based on the second detection The detection signal of the portion 49 also drives the second direct motion mechanism 44 and adjusts the position of the hand 46. When the difference between the position of the hand 46 and the target position is within the allowable range, the second direct motion mechanism 44 is not used.

如上所述,在手部46從修正前的停止位置朝修正後的停止位置SP1移動時,優先地利用更接近手部46的旋轉機構42以及第一直動機構43。藉此,能更高精度地執行手部46的位置調整。 As described above, when the hand 46 moves from the stop position before the correction to the stop position SP1 after the correction, the rotation mechanism 42 and the first linear motion mechanism 43 closer to the hand 46 are preferentially used. Thereby, the position adjustment of the hand 46 can be performed with higher accuracy.

[基板的尺寸] [Substrate size]

此外,在基板W的尺寸與基準尺寸不同之情形中,載置於手部46上的基板W的位置會不同。圖13係概略性地顯示手部46上的基板W的一例之俯視圖。手部46係包含一對指部(finger)461、連結構件462、夾持突起部463、按壓部464以及押入量檢測部465。 In addition, when the size of the substrate W is different from the reference size, the position of the substrate W placed on the hand 46 will be different. FIG. 13 is a plan view schematically showing an example of the substrate W on the hand 46. The hand 46 includes a pair of fingers 461, a connecting member 462, a clamping protrusion 463, a pressing portion 464, and a pushing amount detecting portion 465.

指部461係具有長條狀的形狀,且以指部461的長邊方向沿著第一移動方向D1之方式配置。兩個指部461係隔著間隔相互平行地配置。指部461的上表面為水平。基板W係載置於兩個指部461的上表面。連結構件462係具有例如板狀的形狀,並連結指部461的基板彼此。包含一對指部461以及連結構件462之構造體係具有俯視觀看時呈U字狀的形狀。 The finger 461 has an elongated shape, and is arranged such that the longitudinal direction of the finger 461 is along the first moving direction D1. The two fingers 461 are arranged in parallel with each other with an interval therebetween. The upper surface of the finger 461 is horizontal. The substrate W is placed on the upper surface of the two fingers 461. The connecting member 462 has, for example, a plate-like shape, and connects the substrates of the fingers 461 to each other. The structural system including the pair of fingers 461 and the connecting member 462 has a U-shape in a plan view.

於各個指部461的前端部立設有夾持突起部463。夾持突起部463係從指部461的上表面朝上方突出。夾持突起部463係在基板W被載置於指部461上的狀態下與基板W的周緣(側面)抵接。 A clamping protrusion 463 is erected on the front end of each finger 461. The clamping protrusion 463 protrudes upward from the upper surface of the finger 461. The clamping protrusion 463 is in contact with the peripheral edge (side surface) of the substrate W in a state where the substrate W is placed on the finger 461.

按壓部464係安裝於連結構件462,將基板W沿著第一移動方向D1按壓至夾持突起部463側。按壓部464亦可具有例如汽缸(cylinder)機構。按壓部464的桿(rod)係沿著第一移動方向D1移動(伸長)至夾持突起部463側,藉此按壓部464的桿的前端係能抵接至基板W的周緣(側面)並將基板W按壓至夾持突起部 463側。手部46係能藉由夾持突起部463以及按壓部464夾持基板W。此外,按壓部464的桿係退避(收縮)至夾持突起部463的相反側,藉此能解除基板W的夾持。 The pressing portion 464 is attached to the connecting member 462 and presses the substrate W to the clamping protrusion 463 side along the first movement direction D1. The pressing portion 464 may have, for example, a cylinder mechanism. The rod (rod) of the pressing portion 464 is moved (extended) to the side of the clamping protrusion 463 along the first movement direction D1, whereby the tip of the rod of the pressing portion 464 can abut the peripheral edge (side surface) of the substrate W and Press the substrate W to the clamping protrusion 463 side. The hand 46 can clamp the substrate W by the clamping protrusion 463 and the pressing portion 464. In addition, the lever system of the pressing portion 464 is retracted (shrinked) to the opposite side of the clamping protrusion 463, whereby the clamping of the substrate W can be released.

押入量檢測部465係檢測按壓部464對於基板W的押入量。押入量檢測部465亦可為例如用以檢測按壓部464的桿的位置之線性編碼器。押入量檢測部465係能內置於按壓部464的汽缸機構。押入量檢測部465係將用以顯示所檢測的押入量之檢測訊號輸出至控制部7。 The pushing amount detection unit 465 detects the pushing amount of the substrate W by the pressing portion 464. The pushing amount detecting unit 465 may be, for example, a linear encoder for detecting the position of the lever of the pressing portion 464. The pushing amount detection unit 465 is a cylinder mechanism that can be built in the pressing unit 464. The bet amount detection unit 465 outputs a detection signal for displaying the detected bet amount to the control unit 7.

此外,在手部46保持尺寸大的基板W之情形以及手部46保持尺寸小的基板W之情形中,基板W相對於手部46的載置位置係不同。在圖13中,將基準尺寸的基板W顯示成基板W1,將比基準尺寸還小的基板W顯示成基板W2。在圖13中以假想線顯示基板W2以及用以按壓基板W2之按壓部464。在圖13中,基板W2的中心Pc2係從基板W1的中心Pc1沿著第一移動方向D1朝夾持突起部463側偏移達至偏移量△P。以下將第一移動方向D1中的夾持突起部463側稱為內側,將連結構件462側稱為前方側。基板W2的中心Pc2係比基板W1的中心Pc1還朝內側偏移。 In addition, in the case where the hand 46 holds the substrate W with a large size and the case where the hand 46 holds the substrate W with a small size, the placement position of the substrate W with respect to the hand 46 is different. In FIG. 13, the substrate W of the reference size is shown as the substrate W1, and the substrate W smaller than the reference size is shown as the substrate W2. In FIG. 13, the substrate W2 and the pressing portion 464 for pressing the substrate W2 are shown by imaginary lines. In FIG. 13, the center Pc2 of the substrate W2 is shifted from the center Pc1 of the substrate W1 to the clamping protrusion 463 side along the first movement direction D1 by the shift amount ΔP. Hereinafter, the clamping protrusion 463 side in the first movement direction D1 is referred to as the inner side, and the connecting member 462 side is referred to as the front side. The center Pc2 of the substrate W2 is shifted inwardly from the center Pc1 of the substrate W1.

此外,由於與第一移動方向D1正交之正交方向中的基板W的位置係被一對夾持突起部463規範限制,因此即使基板W的尺寸不同基板W的中心的正交方向的位置亦幾乎不會不同。 In addition, since the position of the substrate W in the orthogonal direction orthogonal to the first movement direction D1 is regulated by the pair of clamping protrusions 463, even if the size of the substrate W is different from the position of the center of the substrate W in the orthogonal direction It will hardly be different.

在此,教學資料係與基板W1對應地生成並記憶於記憶部74。因此,在第二搬運機器人CR2搬運基板W1之情形中,俯視觀看時基板W1的中心Pc1係高精度地與旋轉軸線X1一致。另一方面,在第二搬運機器人CR2搬運基板W2之情形中,基板W2的中心Pc2係從旋轉軸線X1朝內側偏移達至偏移量△P。因此,期望使手部46的停止位置朝前方側移動達至偏移量△P。 Here, the teaching materials are generated and stored in the memory 74 corresponding to the substrate W1. Therefore, when the second transfer robot CR2 transfers the substrate W1, the center Pc1 of the substrate W1 in a plan view coincides with the rotation axis X1 with high accuracy. On the other hand, in the case where the second transfer robot CR2 transfers the substrate W2, the center Pc2 of the substrate W2 is shifted inward from the rotation axis X1 by the shift amount ΔP. Therefore, it is desirable to move the stop position of the hand 46 toward the front side by the offset amount ΔP.

因此,控制部7係依據按壓部464的押入量檢測手部46上的基板W2的中心Pc2的位置,並依據基板W2的中心Pc2的位置修正教學資料。圖14係顯示教學資料的修正處理的一例之流程圖。 Therefore, the control unit 7 detects the position of the center Pc2 of the substrate W2 on the hand 46 based on the pushing amount of the pressing portion 464, and corrects the teaching data based on the position of the center Pc2 of the substrate W2. Fig. 14 is a flowchart showing an example of correction processing of teaching materials.

首先,控制部7係依據從押入量檢測部465所輸入的檢測訊號求出手部46上的基板W的中心Pc2的位置(步驟S31)。更具體而言,控制部7係求出基板W2的中心Pc2、基準尺寸與基板W1的中心Pc1之間的偏移量△P、中心Pc2相對於中心Pc1的偏移方向。接著,控制部7係依據偏移量△P以及偏移方向修正教學資料(步驟S32)。具體而言,控制部7係將偏移量△P作為第三修正量並將偏移方向相反側的方向作為第三修正方向,並修正既定的停止位置。在圖13的例子中,由於中心Pc2係比中心Pc1還位於內側,因此第三修正方向為前方側。 First, the control unit 7 obtains the position of the center Pc2 of the substrate W on the hand 46 based on the detection signal input from the pushing amount detection unit 465 (step S31). More specifically, the control unit 7 obtains the center Pc2 of the substrate W2, the offset amount ΔP between the reference size and the center Pc1 of the substrate W1, and the offset direction of the center Pc2 with respect to the center Pc1. Next, the control unit 7 corrects the teaching data based on the offset ΔP and the offset direction (step S32). Specifically, the control unit 7 sets the offset amount ΔP as the third correction amount and the direction on the opposite side of the offset direction as the third correction direction, and corrects the predetermined stop position. In the example of FIG. 13, since the center Pc2 is located further inward than the center Pc1, the third correction direction is the front side.

控制部7係將修正後的停止位置作為目標位置並以例如已經說明過的方式驅動旋轉機構42、第一直動機構43以及第二直動機構44,藉此使手部46移動至修正後的停止位置。藉此,能高精度地使手部46移動至修正後的停止位置。因此,即使基板W的尺寸不同,第二搬運機器人CR2亦能在適當的位置將基板W載置於自轉夾具51上。 The control unit 7 sets the corrected stop position as the target position, and drives the rotating mechanism 42, the first linear motion mechanism 43, and the second linear motion mechanism 44 in the manner described, for example, to move the hand 46 to the corrected position. Stop position. Thereby, the hand 46 can be moved to the corrected stop position with high accuracy. Therefore, even if the size of the substrate W is different, the second transfer robot CR2 can place the substrate W on the rotation jig 51 at an appropriate position.

[基板資訊] [Substrate Information]

能依據按壓部464的押入量幾何學性地求出基板W的尺寸。因此,亦可採用按壓部464的押入量作為參照圖12所說明的基板資訊。 The size of the substrate W can be geometrically determined based on the amount of pushing of the pressing portion 464. Therefore, the pushing amount of the pressing portion 464 may also be used as the substrate information described with reference to FIG. 12.

以上雖然已說明實施形態,然而只要基板處理裝置1未逸離本發明的精神範圍則除了上述說明的實施形態以外亦可進行各種變更。本實施形態係能在本發明所揭示的範圍內自由地組合各個實施形態,或者可任意地變化各個實施形態的任意的構成要素,或者可在各個實施形態中省略任意的構成要素。 Although the embodiment has been described above, as long as the substrate processing apparatus 1 does not deviate from the spirit and scope of the present invention, various changes can be made in addition to the embodiment described above. In this embodiment, the respective embodiments can be freely combined within the scope disclosed by the present invention, or any constituent elements of the respective embodiments can be arbitrarily changed, or any constituent elements can be omitted in the respective embodiments.

例如,第一搬運機器人CR1及第二搬運機器人CR2亦可具有彼此不同的構成。第一搬運機器人CR1以及第二搬運機器人CR2的任一者亦可不包含第二直動機構44。 For example, the first transfer robot CR1 and the second transfer robot CR2 may have different configurations from each other. Any one of the first transfer robot CR1 and the second transfer robot CR2 may not include the second direct motion mechanism 44.

圖15係概略性地顯示基板處理裝置1A的構成的一例之圖。基板處理裝置1A係包含索引區2a以及處理區3a。索引區2a的構成係與索引區2同樣。處理區3a係包含處理單元P1A至處理單元P12A、傳遞部PSA以及搬運機器人CRA(基板搬運裝置)。處理單元P1A至處理單元P6A係在搬運機器人CRA的+Y側中並排地排列於X方向。處理單元P7A至處理單元P12A係在搬運機器人CRA的-Y側中並排地排列於X方向。處理單元P1A至處理單元P6A的群以及處理單元P7A至處理單元P12A的群係在Y方向彼此相向。處理單元P1A至處理單元P12A係具有與處理單元P1至處理單元P18同樣的構成。 FIG. 15 is a diagram schematically showing an example of the configuration of the substrate processing apparatus 1A. The substrate processing apparatus 1A includes an index area 2a and a processing area 3a. The structure of the index area 2a is the same as that of the index area 2. The processing area 3a includes the processing unit P1A to the processing unit P12A, the transfer unit PSA, and the transfer robot CRA (substrate transfer device). The processing unit P1A to the processing unit P6A are arranged side by side in the X direction on the +Y side of the transfer robot CRA. The processing unit P7A to the processing unit P12A are arranged side by side in the X direction on the -Y side of the transfer robot CRA. The group of the processing unit P1A to the processing unit P6A and the group of the processing unit P7A to the processing unit P12A face each other in the Y direction. The processing unit P1A to the processing unit P12A have the same configuration as the processing unit P1 to the processing unit P18.

傳遞部PSA係配置於搬運機器人CRA與索引區2a之間。傳遞部PSA係具有與第一傳遞部PS1同樣的構成。傳遞部PSA係在索引區2a與搬運機器人CRA之間中繼基板W。 The transfer part PSA is arranged between the transfer robot CRA and the index area 2a. The transmission part PSA has the same structure as the first transmission part PS1. The transfer unit PSA relays the substrate W between the index area 2a and the transfer robot CRA.

搬運機器人CRA係構成為可沿著Y方向移動,並能在Y方向中與處理單元P1A至處理單元P10A各者相向。搬運機器人CRA係具有與第一搬運機器人CR1以及第二搬運機器人CR2同樣的構成。在此情形中,例如第二直動機構44亦可使搬運機器人CRA朝作為第二移動方向D2的Y方向移動。 The transport robot CRA is configured to be movable in the Y direction, and can face each of the processing unit P1A to the processing unit P10A in the Y direction. The transfer robot CRA has the same configuration as the first transfer robot CR1 and the second transfer robot CR2. In this case, for example, the second linear motion mechanism 44 may also move the transport robot CRA in the Y direction which is the second movement direction D2.

在此種基板處理裝置1A中,搬運機器人CRA亦能以三個軸調整手部的位置,且於各個驅動機構(旋轉機構42、第一直動機構43以及第二直動機構44)設置有旋轉檢測部47、第一檢測部48以及第二檢測部49。因此,搬運機器人CRA係能高精度地調整手部46的位置。 In this substrate processing apparatus 1A, the transfer robot CRA can also adjust the position of the hand with three axes, and is provided with each drive mechanism (rotation mechanism 42, first linear motion mechanism 43, and second linear motion mechanism 44) The rotation detection unit 47, the first detection unit 48, and the second detection unit 49. Therefore, the transfer robot CRA system can adjust the position of the hand 46 with high accuracy.

42:旋轉機構 42: Rotating mechanism

43:第一直動機構 43: The first permanent moving mechanism

44:第二直動機構 44: The second direct-acting mechanism

46,46A,46B:手部 46, 46A, 46B: hands

47:旋轉檢測部 47: Rotation detection section

48:第一檢測部 48: The first detection department

49:第二檢測部 49: The second detection department

421:旋轉體 421: Rotating Body

422,432,442:固定體 422,432,442: fixed body

423,433:馬達 423,433: Motor

431:第一移動體 431: First Moving Body

434,444:帶子 434,444: strap

441:第二移動體 441: second moving body

445:線性導件 445: Linear guide

461:指部 461: finger

462:連結構件 462: Connection member

463:夾持突起部 463: Clamping protrusion

464:按壓部 464: pressing part

CA1:旋轉軸線 CA1: Rotation axis

Claims (9)

一種基板搬運裝置,係用以將基板搬運至用以對前述基板進行處理的處理單元,並具備:手部,係用以載置前述基板;旋轉機構,係包含與前述手部連動之旋轉體,並使前述旋轉體繞著沿著鉛直方向的旋轉軸線旋轉,且使前述手部移動至與以俯視觀看時圍繞前述手部之方式所設置的三個以上的前述處理單元的各個前述處理單元相向之位置;旋轉檢測部,係檢測前述旋轉體的旋轉位置;第一直動機構,係包含與前述手部連動之第一移動體,並使前述第一移動體沿著與鉛直方向交叉之第一移動方向移動;第一檢測部,係檢測前述第一移動體的位置;第二直動機構,係包含與前述手部連動之第二移動體,並使前述第二移動體朝與前述第一移動方向以及鉛直方向交叉之第二移動方向移動;以及第二檢測部,係檢測前述第二移動體的位置。 A substrate conveying device is used to convey a substrate to a processing unit for processing the aforementioned substrate, and is provided with: a hand for placing the aforementioned substrate; a rotating mechanism including a rotating body linked with the aforementioned hand , And make the rotating body rotate around the axis of rotation along the vertical direction, and move the hand to each of the three or more processing units arranged to surround the hand in a plan view The opposite position; the rotation detection unit detects the rotation position of the aforementioned rotating body; the first linear motion mechanism includes a first moving body linked with the aforementioned hand, and makes the aforementioned first moving body cross the vertical direction Move in the first moving direction; the first detection unit detects the position of the first moving body; the second direct-acting mechanism includes the second moving body linked with the hand, and makes the second moving body face the The first moving direction and the second moving direction intersecting the vertical direction move; and the second detecting unit detects the position of the second moving body. 一種基板搬運裝置,係用以搬運基板,並具備:手部,係用以載置前述基板;旋轉機構,係包含與前述手部連動之旋轉體,並使前述旋轉體繞著沿著鉛直方向的旋轉軸線旋轉;旋轉檢測部,係檢測前述旋轉體的旋轉位置;第一直動機構,係包含與前述手部連動之第一移動體,並使前述第一移動體沿著與鉛直方向交叉之第一移動方向移動;第一檢測部,係檢測前述第一移動體的位置; 第二直動機構,係包含與前述手部連動之第二移動體,並使前述第二移動體朝與前述第一移動方向以及鉛直方向交叉之第二移動方向移動;第二檢測部,係檢測前述第二移動體的位置;基台部,係設置於底部;支柱,係設置於前述基台部上;以及鉛直驅動機構,係安裝於前述支柱;於前述鉛直驅動機構與前述手部之間設置有前述旋轉機構、前述第一直動機構以及前述第二直動機構。 A substrate conveying device is used for conveying substrates, and is provided with: a hand for placing the substrate; a rotating mechanism including a rotating body linked with the hand and making the rotating body go around in a vertical direction The rotation axis rotates; the rotation detection unit detects the rotation position of the aforementioned rotating body; the first linear motion mechanism includes a first moving body linked with the aforementioned hand, and makes the aforementioned first moving body cross in the vertical direction The first moving direction moves; the first detection unit detects the position of the first moving body; The second direct-acting mechanism includes a second moving body linked with the hand, and moves the second moving body in a second moving direction that intersects the first moving direction and the vertical direction; the second detecting unit is The position of the second moving body is detected; the base part is arranged at the bottom; the pillar is arranged on the base part; and the vertical drive mechanism is installed on the pillar; between the vertical drive mechanism and the hand The rotation mechanism, the first linear motion mechanism, and the second linear motion mechanism are provided in between. 如請求項1或2所記載之基板搬運裝置,其中前述旋轉機構係包含直接連結於前述旋轉體之馬達。 The substrate conveying device according to claim 1 or 2, wherein the rotating mechanism includes a motor directly connected to the rotating body. 一種基板搬運裝置的手部的位置修正方法,係用以修正如請求項1或2所記載之基板搬運裝置將基板傳遞至基板保持部時之手部的位置之方法,並具備:第一步驟,係前述基板搬運裝置依循教學資料使用以載置前述基板之前述手部移動,並使前述手部移動至比前述基板保持部還上方的規定位置;第二步驟,係藉由攝影機拍攝在前述規定位置停止之前述手部所載置的前述基板並取得影像資料;第三步驟,係依據前述影像資料檢測前述基板的中心的位置;以及第四步驟,係以前述基板的中心的位置接近至前述基板保持部的中心軸之方式修正前述規定位置並修正前述教學資料。 A method for correcting the hand position of a substrate conveying device, which is used to correct the hand position of the substrate conveying device as described in claim 1 or 2 when the substrate is transferred to the substrate holding portion, and includes: the first step , The substrate transport device is used in accordance with the teaching materials to move the hand for placing the substrate and move the hand to a predetermined position higher than the substrate holding part; the second step is to use a camera to shoot the hand The predetermined position is stopped on the substrate placed on the hand and the image data is obtained; the third step is to detect the position of the center of the substrate based on the image data; and the fourth step is to approach the center of the substrate to The central axis of the substrate holding portion corrects the predetermined position and corrects the teaching material. 一種基板搬運裝置的手部的位置修正方法,係用以修正如請求項1所記載之基板搬運裝置將基板傳遞至基板保持部時之手部的位置之方法,並具備:第一步驟,係前述基板搬運裝置使用以載置前述基板之前述手部移動至比前述基板保持部還上方的規定位置;第二步驟,係藉由前述基板搬運裝置所含有的鉛直驅動機構使前述手部下降並將前述基板載置於前述基板保持部;第三步驟,係前述基板保持部保持前述基板;第四步驟,係藉由攝影機拍攝被前述基板保持部保持的前述基板並取得影像資料;第五步驟,係依據前述影像資料求出以下述方式所獲得的前述基板的載置位置:將前述基板的中心相對於前述基板保持部的中心軸錯開至與前述基板保持部保持前述基板時所產生之前述基板的偏移方向為相反側所獲得;第六步驟,係前述基板搬運裝置將前述基板重新載置於前述載置位置;以及第七步驟,係前述基板保持部保持前述基板。 A method for correcting the position of the hand of a substrate conveying device, which is used to correct the position of the hand when the substrate conveying device transfers a substrate to a substrate holding portion as described in claim 1, and includes: the first step: The substrate transfer device is used to move the hand on which the substrate is placed to a predetermined position above the substrate holding portion; the second step is to lower the hand by the vertical drive mechanism included in the substrate transfer device. Place the substrate on the substrate holding portion; the third step is to hold the substrate by the substrate holding portion; the fourth step is to photograph the substrate held by the substrate holding portion by a camera and obtain image data; the fifth step , Based on the aforementioned image data, the placement position of the substrate obtained by the following method: the center of the substrate is shifted from the central axis of the substrate holding portion to the substrate holding portion holding the substrate The offset direction of the substrate is obtained from the opposite side; the sixth step is that the substrate conveying device replaces the substrate in the placement position; and the seventh step is that the substrate holding portion holds the substrate. 一種基板搬運裝置的手部的位置修正方法,係用以修正如請求項2所記載之基板搬運裝置將基板傳遞至基板保持部時之手部的位置之方法,並具備:第一步驟,係前述基板搬運裝置使用以載置前述基板之前述手部移動至比前述基板保持部還上方的規定位置; 第二步驟,係藉由前述鉛直驅動機構使前述手部下降並將前述基板載置於前述基板保持部;第三步驟,係前述基板保持部保持前述基板;第四步驟,係藉由攝影機拍攝被前述基板保持部保持的前述基板並取得影像資料;第五步驟,係依據前述影像資料求出以下述方式所獲得的前述基板的載置位置:將前述基板的中心相對於前述基板保持部的中心軸錯開至與前述基板保持部保持前述基板時所產生之前述基板的偏移方向為相反側所獲得;第六步驟,係前述基板搬運裝置將前述基板重新載置於前述載置位置;以及第七步驟,係前述基板保持部保持前述基板。 A method for correcting the hand position of a substrate conveying device, which is used to correct the position of the hand when the substrate conveying device transfers a substrate to a substrate holding portion as described in claim 2, and includes: the first step is: The aforementioned substrate conveying device is used to move the aforementioned hand on which the aforementioned substrate is placed to a predetermined position higher than the aforementioned substrate holding portion; The second step is to lower the hand by the vertical drive mechanism and place the substrate on the substrate holding portion; the third step is to hold the substrate by the substrate holding portion; and the fourth step is to take a photo by a camera The substrate is held by the substrate holding portion and image data is obtained; the fifth step is to obtain the placement position of the substrate obtained in the following manner based on the image data: the center of the substrate is relative to the center of the substrate holding portion The central axis is shifted to the opposite side of the offset direction of the substrate generated when the substrate holding portion holds the substrate; the sixth step is to reposition the substrate in the placement position by the substrate transport device; and In the seventh step, the substrate holding portion holds the substrate. 如請求項5或6所記載之基板搬運裝置的手部的位置修正方法,其中前述第五步驟係包含下述步驟:依據前述影像資料檢測前述基板保持部保持時所產生的前述基板的偏移量以及前述偏移方向;依據前述偏移量以及前述偏移方向修正前述規定位置,並算出俯視觀看時的位置與前述載置位置相等之修正後位置;前述基板保持部解除前述基板的保持,且前述鉛直驅動機構使前述手部上升至前述規定位置並抬起前述基板;至少驅動設置成比前述第二直動機構還接近前述手部之前述旋轉機構以及前述第一直動機構,並使前述手部移動至前述修正後位置;以及前述鉛直驅動機構使前述手部下降並將前述基板載置於前述基板保持部。 The method for correcting the position of the hand of a substrate conveying device according to claim 5 or 6, wherein the fifth step includes the following step: detecting, based on the image data, the offset of the substrate generated when the substrate holding portion is held Correct the predetermined position based on the offset and the offset direction, and calculate the corrected position at which the position when viewed from above is equal to the placement position; the substrate holding portion releases the holding of the substrate, And the vertical drive mechanism raises the hand to the predetermined position and lifts the substrate; at least it drives the rotation mechanism and the first direct motion mechanism that are arranged closer to the hand than the second direct motion mechanism, and makes The hand moves to the corrected position; and the vertical drive mechanism lowers the hand and places the substrate on the substrate holding portion. 如請求項5或6所記載之基板搬運裝置的手部的位置修正方法,其中在前述第五步驟中使用基於前述影像資料的機械學習求出前述載置位置。 The method for correcting the position of the hand of the substrate conveying device according to claim 5 or 6, wherein the placement position is obtained in the fifth step using machine learning based on the image data. 如請求項8所記載之基板搬運裝置的手部的位置修正方法,其中在前述第五步驟中,從與前述基板的種類以及複數個前述基板保持部的至少任一者對應之複數個機械學習部選擇已與成為搬運對象的前述基板的種類以及搬運目的地的前述基板保持部的至少任一者因應之前述機械學習部,並使用所選擇的前述機械學習部求出前述載置位置。 The method for correcting the hand position of a substrate transport device according to claim 8, wherein in the fifth step, a plurality of machines corresponding to at least any one of the type of the substrate and the plurality of substrate holding parts is learned The section selects the machine learning section corresponding to at least any one of the type of the substrate to be transported and the substrate holding section of the transport destination, and uses the selected machine learning section to find the placement position.
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