TWI743368B - 電磁波屏蔽膜及屏蔽印刷配線基板 - Google Patents

電磁波屏蔽膜及屏蔽印刷配線基板 Download PDF

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Publication number
TWI743368B
TWI743368B TW107120007A TW107120007A TWI743368B TW I743368 B TWI743368 B TW I743368B TW 107120007 A TW107120007 A TW 107120007A TW 107120007 A TW107120007 A TW 107120007A TW I743368 B TWI743368 B TW I743368B
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TW
Taiwan
Prior art keywords
resin
electromagnetic wave
wave shielding
shielding film
layer
Prior art date
Application number
TW107120007A
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English (en)
Chinese (zh)
Other versions
TW201927127A (zh
Inventor
青柳慶彥
山內志朗
上農憲治
Original Assignee
日商拓自達電線股份有限公司
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Application filed by 日商拓自達電線股份有限公司 filed Critical 日商拓自達電線股份有限公司
Publication of TW201927127A publication Critical patent/TW201927127A/zh
Application granted granted Critical
Publication of TWI743368B publication Critical patent/TWI743368B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
TW107120007A 2017-11-21 2018-06-11 電磁波屏蔽膜及屏蔽印刷配線基板 TWI743368B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-223434 2017-11-21
JP2017223434A JP6731393B2 (ja) 2017-11-21 2017-11-21 電磁波シールドフィルム

Publications (2)

Publication Number Publication Date
TW201927127A TW201927127A (zh) 2019-07-01
TWI743368B true TWI743368B (zh) 2021-10-21

Family

ID=66601539

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107120007A TWI743368B (zh) 2017-11-21 2018-06-11 電磁波屏蔽膜及屏蔽印刷配線基板

Country Status (4)

Country Link
JP (1) JP6731393B2 (ja)
KR (1) KR102352852B1 (ja)
CN (1) CN109819583B (ja)
TW (1) TWI743368B (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273577A (ja) * 2003-03-06 2004-09-30 Sumitomo Electric Printed Circuit Inc シールドフィルムおよびその製造方法
TWI598033B (zh) * 2015-02-25 2017-09-01 東洋油墨Ｓｃ控股股份有限公司 電磁波遮蔽片、電磁波遮蔽性配線電路基板及電子機器

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03234778A (ja) * 1990-02-08 1991-10-18 Toray Ind Inc 導電性接着剤
JP2007221107A (ja) * 2006-01-17 2007-08-30 Toyo Kohan Co Ltd 複合電磁波シールド材及びその製造方法
JP5133715B2 (ja) * 2008-01-23 2013-01-30 新日鉄住金化学株式会社 電磁波シールド用積層体及びその製造方法
CN104487534B (zh) 2012-07-11 2016-11-09 大自达电线股份有限公司 硬化导电胶组成物、电磁波屏蔽膜、导电胶膜、黏合方法及线路基板
JP6081819B2 (ja) * 2013-02-28 2017-02-15 藤森工業株式会社 Ｆｐｃ用電磁波シールド材
CN103619155B (zh) * 2013-12-09 2018-08-28 保定乐凯新材料股份有限公司 一种具有高阻隔性的电磁波屏蔽膜
KR101956091B1 (ko) * 2014-12-05 2019-03-08 타츠타 전선 주식회사 전자파 차폐 필름
JP6203783B2 (ja) * 2015-05-29 2017-09-27 株式会社タムラ製作所 導電性接着剤および電子基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273577A (ja) * 2003-03-06 2004-09-30 Sumitomo Electric Printed Circuit Inc シールドフィルムおよびその製造方法
TWI598033B (zh) * 2015-02-25 2017-09-01 東洋油墨Ｓｃ控股股份有限公司 電磁波遮蔽片、電磁波遮蔽性配線電路基板及電子機器

Also Published As

Publication number Publication date
CN109819583B (zh) 2022-02-22
JP2019096684A (ja) 2019-06-20
KR102352852B1 (ko) 2022-01-17
CN109819583A (zh) 2019-05-28
TW201927127A (zh) 2019-07-01
JP6731393B2 (ja) 2020-07-29
KR20190058265A (ko) 2019-05-29

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