KR102352852B1 - 전자파 차폐 필름 - Google Patents

전자파 차폐 필름 Download PDF

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Publication number
KR102352852B1
KR102352852B1 KR1020180081284A KR20180081284A KR102352852B1 KR 102352852 B1 KR102352852 B1 KR 102352852B1 KR 1020180081284 A KR1020180081284 A KR 1020180081284A KR 20180081284 A KR20180081284 A KR 20180081284A KR 102352852 B1 KR102352852 B1 KR 102352852B1
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KR
South Korea
Prior art keywords
electromagnetic wave
layer
resin
conductive adhesive
wave shielding
Prior art date
Application number
KR1020180081284A
Other languages
English (en)
Korean (ko)
Other versions
KR20190058265A (ko
Inventor
요시히코 아오야기
시로 야마우치
겐지 가미노
Original Assignee
타츠타 전선 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 타츠타 전선 주식회사 filed Critical 타츠타 전선 주식회사
Publication of KR20190058265A publication Critical patent/KR20190058265A/ko
Application granted granted Critical
Publication of KR102352852B1 publication Critical patent/KR102352852B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
KR1020180081284A 2017-11-21 2018-07-12 전자파 차폐 필름 KR102352852B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2017-223434 2017-11-21
JP2017223434A JP6731393B2 (ja) 2017-11-21 2017-11-21 電磁波シールドフィルム

Publications (2)

Publication Number Publication Date
KR20190058265A KR20190058265A (ko) 2019-05-29
KR102352852B1 true KR102352852B1 (ko) 2022-01-17

Family

ID=66601539

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180081284A KR102352852B1 (ko) 2017-11-21 2018-07-12 전자파 차폐 필름

Country Status (4)

Country Link
JP (1) JP6731393B2 (ja)
KR (1) KR102352852B1 (ja)
CN (1) CN109819583B (ja)
TW (1) TWI743368B (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273577A (ja) * 2003-03-06 2004-09-30 Sumitomo Electric Printed Circuit Inc シールドフィルムおよびその製造方法
JP2007221107A (ja) * 2006-01-17 2007-08-30 Toyo Kohan Co Ltd 複合電磁波シールド材及びその製造方法
JP2016222804A (ja) * 2015-05-29 2016-12-28 株式会社タムラ製作所 導電性接着剤および電子基板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03234778A (ja) * 1990-02-08 1991-10-18 Toray Ind Inc 導電性接着剤
JP5133715B2 (ja) * 2008-01-23 2013-01-30 新日鉄住金化学株式会社 電磁波シールド用積層体及びその製造方法
CN104487534B (zh) 2012-07-11 2016-11-09 大自达电线股份有限公司 硬化导电胶组成物、电磁波屏蔽膜、导电胶膜、黏合方法及线路基板
JP6081819B2 (ja) * 2013-02-28 2017-02-15 藤森工業株式会社 Ｆｐｃ用電磁波シールド材
CN103619155B (zh) * 2013-12-09 2018-08-28 保定乐凯新材料股份有限公司 一种具有高阻隔性的电磁波屏蔽膜
KR101956091B1 (ko) * 2014-12-05 2019-03-08 타츠타 전선 주식회사 전자파 차폐 필름
JP5861790B1 (ja) * 2015-02-25 2016-02-16 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273577A (ja) * 2003-03-06 2004-09-30 Sumitomo Electric Printed Circuit Inc シールドフィルムおよびその製造方法
JP2007221107A (ja) * 2006-01-17 2007-08-30 Toyo Kohan Co Ltd 複合電磁波シールド材及びその製造方法
JP2016222804A (ja) * 2015-05-29 2016-12-28 株式会社タムラ製作所 導電性接着剤および電子基板

Also Published As

Publication number Publication date
CN109819583B (zh) 2022-02-22
JP2019096684A (ja) 2019-06-20
TWI743368B (zh) 2021-10-21
CN109819583A (zh) 2019-05-28
TW201927127A (zh) 2019-07-01
JP6731393B2 (ja) 2020-07-29
KR20190058265A (ko) 2019-05-29

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