TWI742139B - 樹脂組成物、樹脂薄片及半導體裝置 - Google Patents

樹脂組成物、樹脂薄片及半導體裝置 Download PDF

Info

Publication number
TWI742139B
TWI742139B TW106128041A TW106128041A TWI742139B TW I742139 B TWI742139 B TW I742139B TW 106128041 A TW106128041 A TW 106128041A TW 106128041 A TW106128041 A TW 106128041A TW I742139 B TWI742139 B TW I742139B
Authority
TW
Taiwan
Prior art keywords
group
resin
resin composition
general formula
triazine compound
Prior art date
Application number
TW106128041A
Other languages
English (en)
Chinese (zh)
Other versions
TW201815955A (zh
Inventor
柄澤泰紀
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201815955A publication Critical patent/TW201815955A/zh
Application granted granted Critical
Publication of TWI742139B publication Critical patent/TWI742139B/zh

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5477—Silicon-containing compounds containing nitrogen containing nitrogen in a heterocyclic ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
    • C08J2371/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08J2371/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08J2371/12—Polyphenylene oxides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW106128041A 2016-08-30 2017-08-18 樹脂組成物、樹脂薄片及半導體裝置 TWI742139B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016168333 2016-08-30
JP2016-168333 2016-08-30

Publications (2)

Publication Number Publication Date
TW201815955A TW201815955A (zh) 2018-05-01
TWI742139B true TWI742139B (zh) 2021-10-11

Family

ID=61300584

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106128041A TWI742139B (zh) 2016-08-30 2017-08-18 樹脂組成物、樹脂薄片及半導體裝置

Country Status (5)

Country Link
JP (1) JP6940508B2 (ja)
KR (1) KR102392225B1 (ja)
CN (1) CN109563352B (ja)
TW (1) TWI742139B (ja)
WO (1) WO2018043035A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210019009A (ko) * 2018-06-12 2021-02-19 세키스이가가쿠 고교가부시키가이샤 수지 재료 및 다층 프린트 배선판
WO2020026757A1 (ja) * 2018-08-03 2020-02-06 日立化成株式会社 接着剤組成物、フィルム状接着剤、接着シート、及び半導体装置の製造方法
WO2021000265A1 (zh) * 2019-07-02 2021-01-07 山东圣泉新材料股份有限公司 一种粘合促进剂及包含其的光敏树脂组合物
JP7341828B2 (ja) * 2019-09-30 2023-09-11 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、樹脂付き銅箔、硬化物、及び電子部品
JPWO2021149635A1 (ja) * 2020-01-23 2021-07-29
JPWO2021182365A1 (ja) * 2020-03-09 2021-09-16
JPWO2021220726A1 (ja) * 2020-04-30 2021-11-04
CN111690323B (zh) * 2020-06-24 2021-09-10 住井工业（湖南）有限公司 聚酰亚胺清漆及其制备方法和应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005089629A (ja) * 2003-09-18 2005-04-07 Ricoh Co Ltd 導電性接着剤
JP2016065012A (ja) * 2014-09-24 2016-04-28 四国化成工業株式会社 トリアジン化合物、該化合物の合成方法およびその用途

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0507028A1 (en) 1991-04-04 1992-10-07 Malden Mills Industries, Inc. Treating velvet-like fabric
JP2006160953A (ja) * 2004-12-09 2006-06-22 Sekisui Chem Co Ltd エポキシ系硬化性組成物及び電子部品
KR100909169B1 (ko) * 2006-09-11 2009-07-23 제일모직주식회사 선 경화형 반도체 조립용 접착 필름 조성물
JP5195454B2 (ja) * 2009-01-22 2013-05-08 味の素株式会社 樹脂組成物
TWI494364B (zh) * 2009-01-30 2015-08-01 Ajinomoto Kk Resin composition
KR101045262B1 (ko) * 2009-12-21 2011-06-29 제일모직주식회사 스텔스 다이싱용 반도체용 접착 조성물 및 이를 이용한 접착 필름
KR101791713B1 (ko) * 2010-02-05 2017-10-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 전계 효과 트랜지스터 및 반도체 장치
KR20130056863A (ko) * 2010-04-20 2013-05-30 닛토덴코 가부시키가이샤 플립칩형 반도체 이면용 필름, 다이싱 테이프 일체형 반도체 이면용 필름, 반도체 장치의 제조방법, 및 플립칩형 반도체 장치
JP2012099574A (ja) * 2010-10-29 2012-05-24 Nippon Valqua Ind Ltd フィルムの製造方法および該製造方法で得られたフィルム
CN102634167B (zh) * 2011-02-10 2014-05-07 台光电子材料股份有限公司 树脂组合物
JP2013023667A (ja) * 2011-07-25 2013-02-04 Sekisui Chem Co Ltd エポキシ樹脂材料及び多層基板
KR101506766B1 (ko) * 2012-07-31 2015-04-06 주식회사 엘지화학 무도장용 폴리카보네이트 수지 조성물
JP2014148418A (ja) * 2013-02-04 2014-08-21 Hitachi Ltd エレベーターとその乗場操作装置
JP6257333B2 (ja) * 2014-01-10 2018-01-10 四国化成工業株式会社 エポキシ樹脂組成物およびトリアジン化合物の合成方法
JP6351062B2 (ja) * 2014-02-27 2018-07-04 インテル・コーポレーション 硬化性エポキシ組成物、フィルム、積層フィルム、プリプレグ、積層体、硬化物、及び複合体
JP6221846B2 (ja) * 2014-03-07 2017-11-01 日本ゼオン株式会社 硬化性樹脂組成物、フィルム、プリプレグ、積層体、硬化物、及び複合体
JP2015174898A (ja) * 2014-03-14 2015-10-05 日本ゼオン株式会社 硬化性樹脂組成物、フィルム、積層フィルム、プリプレグ、積層体、硬化物、及び複合体
JP6507506B2 (ja) * 2014-07-16 2019-05-08 住友ベークライト株式会社 封止用樹脂組成物及び半導体装置
JP6300680B2 (ja) * 2014-08-01 2018-03-28 四国化成工業株式会社 トリアジン化合物、該化合物の合成方法およびエポキシ樹脂組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005089629A (ja) * 2003-09-18 2005-04-07 Ricoh Co Ltd 導電性接着剤
JP2016065012A (ja) * 2014-09-24 2016-04-28 四国化成工業株式会社 トリアジン化合物、該化合物の合成方法およびその用途

Also Published As

Publication number Publication date
KR102392225B1 (ko) 2022-04-28
CN109563352A (zh) 2019-04-02
CN109563352B (zh) 2021-10-22
JP6940508B2 (ja) 2021-09-29
JPWO2018043035A1 (ja) 2019-06-24
WO2018043035A1 (ja) 2018-03-08
TW201815955A (zh) 2018-05-01
KR20190049716A (ko) 2019-05-09

Similar Documents

Publication Publication Date Title
TWI742139B (zh) 樹脂組成物、樹脂薄片及半導體裝置
JP5549559B2 (ja) 接着剤組成物、その製造方法、これを用いた接着フィルム、半導体搭載用基板及び半導体装置
US9382455B2 (en) Adhesive composition, an adhesive sheet and a production method of a semiconductor device
US9434865B2 (en) Adhesive composition, an adhesive sheet and a production method of a semiconductor device
TWI787242B (zh) 樹脂組成物及樹脂薄片
JP7034232B2 (ja) 樹脂組成物、樹脂シート、積層体、及び半導体素子
JPWO2020157805A1 (ja) 接着剤組成物、フィルム状接着剤、接着シート、及び半導体装置の製造方法
WO2021145416A1 (ja) 樹脂シート
TWI758489B (zh) 樹脂組成物及樹脂薄片
WO2020196070A1 (ja) 樹脂シート
JP2009124133A (ja) 接着部材、半導体素子搭載用支持部材及び半導体装置
JP7329513B2 (ja) 積層体
JP5549106B2 (ja) 半導体用接着シート及びダイシング一体型半導体用接着シート
WO2021182365A1 (ja) 樹脂組成物及び樹脂シート
JP4839564B6 (ja) 接着フィルム及びその製造方法
KR20150069156A (ko) 반도체 다이 본딩용 양면접착 테이프