TWI741410B - 基板處理裝置及基板處理方法 - Google Patents

基板處理裝置及基板處理方法 Download PDF

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Publication number
TWI741410B
TWI741410B TW108142174A TW108142174A TWI741410B TW I741410 B TWI741410 B TW I741410B TW 108142174 A TW108142174 A TW 108142174A TW 108142174 A TW108142174 A TW 108142174A TW I741410 B TWI741410 B TW I741410B
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TW
Taiwan
Prior art keywords
sulfuric acid
substrate
containing liquid
liquid
spm
Prior art date
Application number
TW108142174A
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English (en)
Chinese (zh)
Other versions
TW202030845A (zh
Inventor
遠藤亨
林昌之
柴山宣之
Original Assignee
日商斯庫林集團股份有限公司
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Publication of TW202030845A publication Critical patent/TW202030845A/zh
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Publication of TWI741410B publication Critical patent/TWI741410B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
TW108142174A 2018-11-27 2019-11-20 基板處理裝置及基板處理方法 TWI741410B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018221639A JP7128099B2 (ja) 2018-11-27 2018-11-27 基板処理装置および基板処理方法
JP2018-221639 2018-11-27

Publications (2)

Publication Number Publication Date
TW202030845A TW202030845A (zh) 2020-08-16
TWI741410B true TWI741410B (zh) 2021-10-01

Family

ID=70852071

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108142174A TWI741410B (zh) 2018-11-27 2019-11-20 基板處理裝置及基板處理方法

Country Status (3)

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JP (1) JP7128099B2 (ja)
TW (1) TWI741410B (ja)
WO (1) WO2020110709A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022053635A (ja) 2020-09-25 2022-04-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
TWI816223B (zh) * 2021-03-24 2023-09-21 日商斯庫林集團股份有限公司 電漿產生裝置、使用其之基板處理裝置及電漿產生方法
JP2023039584A (ja) 2021-09-09 2023-03-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
WO2024090473A1 (ja) * 2022-10-28 2024-05-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、及び基板処理方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008021891A (ja) * 2006-07-14 2008-01-31 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
TW201622838A (zh) * 2014-09-30 2016-07-01 Shibaura Mechatronics Corp 基板處理裝置及基板處理方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005123336A (ja) 2003-10-15 2005-05-12 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2005123335A (ja) 2003-10-15 2005-05-12 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2009170554A (ja) 2008-01-11 2009-07-30 Panasonic Corp 半導体装置の製造方法
JP2017175166A (ja) 2017-06-23 2017-09-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008021891A (ja) * 2006-07-14 2008-01-31 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
TW201622838A (zh) * 2014-09-30 2016-07-01 Shibaura Mechatronics Corp 基板處理裝置及基板處理方法

Also Published As

Publication number Publication date
JP7128099B2 (ja) 2022-08-30
TW202030845A (zh) 2020-08-16
JP2020088208A (ja) 2020-06-04
WO2020110709A1 (ja) 2020-06-04

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