TWI741062B - 玻璃基板之製造方法 - Google Patents

玻璃基板之製造方法 Download PDF

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Publication number
TWI741062B
TWI741062B TW106138538A TW106138538A TWI741062B TW I741062 B TWI741062 B TW I741062B TW 106138538 A TW106138538 A TW 106138538A TW 106138538 A TW106138538 A TW 106138538A TW I741062 B TWI741062 B TW I741062B
Authority
TW
Taiwan
Prior art keywords
glass substrate
gas
processing space
flushing gas
conveying direction
Prior art date
Application number
TW106138538A
Other languages
English (en)
Chinese (zh)
Other versions
TW201830514A (zh
Inventor
中弘樹
山本好晴
大野和宏
Original Assignee
日商日本電氣硝子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商日本電氣硝子股份有限公司 filed Critical 日商日本電氣硝子股份有限公司
Publication of TW201830514A publication Critical patent/TW201830514A/zh
Application granted granted Critical
Publication of TWI741062B publication Critical patent/TWI741062B/zh

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Surface Treatment Of Glass (AREA)
  • Cleaning In General (AREA)
  • Liquid Crystal (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW106138538A 2016-11-16 2017-11-08 玻璃基板之製造方法 TWI741062B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-223258 2016-11-16
JP2016223258 2016-11-16

Publications (2)

Publication Number Publication Date
TW201830514A TW201830514A (zh) 2018-08-16
TWI741062B true TWI741062B (zh) 2021-10-01

Family

ID=62145308

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106138538A TWI741062B (zh) 2016-11-16 2017-11-08 玻璃基板之製造方法

Country Status (5)

Country Link
JP (1) JP6905672B2 (ja)
KR (1) KR102373650B1 (ja)
CN (1) CN109790064B (ja)
TW (1) TWI741062B (ja)
WO (1) WO2018092556A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7290103B2 (ja) * 2019-11-19 2023-06-13 日本電気硝子株式会社 ガラス板の製造装置及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012191001A (ja) * 2011-03-10 2012-10-04 Sekisui Chem Co Ltd 表面処理方法及び装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003042498A (ja) * 2001-07-31 2003-02-13 Sony Corp 半導体製造システム、半導体製造装置、半導体製造方法及び半導体装置
JP2004103971A (ja) * 2002-09-12 2004-04-02 Hitachi High-Technologies Corp ダマシン処理方法、ダマシン処理装置および、ダマシン構造
JP5082242B2 (ja) * 2003-07-16 2012-11-28 コニカミノルタホールディングス株式会社 薄膜形成方法
JP2005138010A (ja) * 2003-11-05 2005-06-02 Sekisui Chem Co Ltd 常圧プラズマ処理装置およびレジスト剥離装置
US7456104B2 (en) * 2005-05-31 2008-11-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
CN101489661A (zh) * 2006-05-19 2009-07-22 乔治洛德方法研究和开发液化空气有限公司 在处理环境中回收工艺流体的系统和方法
CN101781091B (zh) * 2009-01-16 2011-11-09 深圳南玻显示器件科技有限公司 透明导电膜玻璃单面减薄承载装置及其减薄方法
JP5544985B2 (ja) * 2009-06-23 2014-07-09 東京エレクトロン株式会社 液処理装置
WO2011105331A1 (ja) * 2010-02-25 2011-09-01 積水化学工業株式会社 エッチング方法及び装置
JP6048817B2 (ja) * 2012-12-27 2016-12-21 日本電気硝子株式会社 板状ガラスの表面処理装置及び表面処理方法
CN203382660U (zh) * 2013-06-27 2014-01-08 彩虹显示器件股份有限公司 玻璃表面刻蚀装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012191001A (ja) * 2011-03-10 2012-10-04 Sekisui Chem Co Ltd 表面処理方法及び装置

Also Published As

Publication number Publication date
CN109790064A (zh) 2019-05-21
WO2018092556A1 (ja) 2018-05-24
KR20190078558A (ko) 2019-07-04
JPWO2018092556A1 (ja) 2019-10-17
KR102373650B1 (ko) 2022-03-14
TW201830514A (zh) 2018-08-16
CN109790064B (zh) 2022-01-07
JP6905672B2 (ja) 2021-07-21

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