JPWO2018092556A1 - ガラス基板の製造方法 - Google Patents
ガラス基板の製造方法 Download PDFInfo
- Publication number
- JPWO2018092556A1 JPWO2018092556A1 JP2018551555A JP2018551555A JPWO2018092556A1 JP WO2018092556 A1 JPWO2018092556 A1 JP WO2018092556A1 JP 2018551555 A JP2018551555 A JP 2018551555A JP 2018551555 A JP2018551555 A JP 2018551555A JP WO2018092556 A1 JPWO2018092556 A1 JP WO2018092556A1
- Authority
- JP
- Japan
- Prior art keywords
- glass substrate
- purge gas
- processing space
- gas
- transport direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 title claims abstract description 174
- 239000000758 substrate Substances 0.000 title claims abstract description 173
- 238000004519 manufacturing process Methods 0.000 title claims description 30
- 238000010926 purge Methods 0.000 claims abstract description 121
- 238000002347 injection Methods 0.000 claims abstract description 64
- 239000007924 injection Substances 0.000 claims abstract description 64
- 238000000034 method Methods 0.000 claims abstract description 51
- 230000008569 process Effects 0.000 claims abstract description 35
- 238000005530 etching Methods 0.000 claims abstract description 25
- 239000007789 gas Substances 0.000 claims description 185
- 238000011144 upstream manufacturing Methods 0.000 claims description 26
- 230000032258 transport Effects 0.000 description 61
- 229910000831 Steel Inorganic materials 0.000 description 8
- 239000010959 steel Substances 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 7
- 239000000428 dust Substances 0.000 description 7
- 238000001514 detection method Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000007788 roughening Methods 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Surface Treatment Of Glass (AREA)
- Cleaning In General (AREA)
- Liquid Crystal (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
2a 下面
2e 最後部
2f 先頭部
4 処理ガス
5a 本体部(下部構成体)
5b 天板部(上部構成体)
6 第一パージガス
13 処理空間
13a 隙間
14 給気口
23 第二パージガス
Claims (5)
- 対向させて配置した上部構成体と下部構成体との相互間に形成される処理空間を通過するようにガラス基板を平置き姿勢で搬送方向に搬送しつつ、前記下部構成体に備わった給気口から前記処理空間に給気した処理ガスで前記ガラス基板の下面にエッチング処理を施すに際し、前記ガラス基板のうちの前記処理空間に進入した部位と前記上部構成体との間に形成される隙間に、前記搬送方向に沿った第一パージガスの流れが形成されるように、前記搬送方向の下流側に向けて前記第一パージガスを噴射するガラス基板の製造方法であって、
前記ガラス基板の最後部が前記処理空間に進入する前に、前記第一パージガスの噴射を停止することを特徴とするガラス基板の製造方法。 - 前記ガラス基板の先頭部が前記処理空間に進入する前に、前記第一パージガスの噴射を開始することを特徴とする請求項1に記載のガラス基板の製造方法。
- 前記搬送方向に沿った長さが前記処理空間よりも長い前記ガラス基板の下面にエッチング処理を施すに際し、
前記ガラス基板の先頭部が前記処理空間から脱出した後、前記第一パージガスの噴射を停止することを特徴とする請求項1又は2に記載のガラス基板の製造方法。 - 前記ガラス基板の最後部が前記処理空間に進入した時点から脱出する時点までの間、
前記隙間に、前記搬送方向とは逆方向に沿った第二パージガスの流れが形成されるように、前記搬送方向の上流側に向けて前記第二パージガスを噴射することを特徴とする請求項1〜3のいずれかに記載のガラス基板の製造方法。 - 前記第一及び第二パージガスとして、クリーンドライエアーを用いることを特徴とする請求項4に記載のガラス基板の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016223258 | 2016-11-16 | ||
JP2016223258 | 2016-11-16 | ||
PCT/JP2017/039032 WO2018092556A1 (ja) | 2016-11-16 | 2017-10-30 | ガラス基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2018092556A1 true JPWO2018092556A1 (ja) | 2019-10-17 |
JP6905672B2 JP6905672B2 (ja) | 2021-07-21 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018551555A Active JP6905672B2 (ja) | 2016-11-16 | 2017-10-30 | ガラス基板の製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6905672B2 (ja) |
KR (1) | KR102373650B1 (ja) |
CN (1) | CN109790064B (ja) |
TW (1) | TWI741062B (ja) |
WO (1) | WO2018092556A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7290103B2 (ja) * | 2019-11-19 | 2023-06-13 | 日本電気硝子株式会社 | ガラス板の製造装置及びその製造方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003042498A (ja) * | 2001-07-31 | 2003-02-13 | Sony Corp | 半導体製造システム、半導体製造装置、半導体製造方法及び半導体装置 |
JP2004103971A (ja) * | 2002-09-12 | 2004-04-02 | Hitachi High-Technologies Corp | ダマシン処理方法、ダマシン処理装置および、ダマシン構造 |
CN1780935B (zh) * | 2003-07-16 | 2010-05-05 | 柯尼卡美能达控股株式会社 | 薄膜制造方法以及具有由此薄膜制造方法形成的薄膜的基材 |
JP2005138010A (ja) * | 2003-11-05 | 2005-06-02 | Sekisui Chem Co Ltd | 常圧プラズマ処理装置およびレジスト剥離装置 |
US7456104B2 (en) * | 2005-05-31 | 2008-11-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
CN101489661A (zh) * | 2006-05-19 | 2009-07-22 | 乔治洛德方法研究和开发液化空气有限公司 | 在处理环境中回收工艺流体的系统和方法 |
CN101781091B (zh) * | 2009-01-16 | 2011-11-09 | 深圳南玻显示器件科技有限公司 | 透明导电膜玻璃单面减薄承载装置及其减薄方法 |
JP5544985B2 (ja) * | 2009-06-23 | 2014-07-09 | 東京エレクトロン株式会社 | 液処理装置 |
CN102770944B (zh) * | 2010-02-25 | 2013-11-06 | 积水化学工业株式会社 | 蚀刻方法及装置 |
JP5670229B2 (ja) | 2011-03-10 | 2015-02-18 | 積水化学工業株式会社 | 表面処理方法及び装置 |
JP6048817B2 (ja) * | 2012-12-27 | 2016-12-21 | 日本電気硝子株式会社 | 板状ガラスの表面処理装置及び表面処理方法 |
CN203382660U (zh) * | 2013-06-27 | 2014-01-08 | 彩虹显示器件股份有限公司 | 玻璃表面刻蚀装置 |
-
2017
- 2017-10-30 JP JP2018551555A patent/JP6905672B2/ja active Active
- 2017-10-30 KR KR1020197007165A patent/KR102373650B1/ko active IP Right Grant
- 2017-10-30 WO PCT/JP2017/039032 patent/WO2018092556A1/ja active Application Filing
- 2017-10-30 CN CN201780059814.4A patent/CN109790064B/zh not_active Expired - Fee Related
- 2017-11-08 TW TW106138538A patent/TWI741062B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2018092556A1 (ja) | 2018-05-24 |
CN109790064B (zh) | 2022-01-07 |
KR102373650B1 (ko) | 2022-03-14 |
TWI741062B (zh) | 2021-10-01 |
CN109790064A (zh) | 2019-05-21 |
TW201830514A (zh) | 2018-08-16 |
KR20190078558A (ko) | 2019-07-04 |
JP6905672B2 (ja) | 2021-07-21 |
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