TWI741062B - Manufacturing method of glass substrate - Google Patents

Abstract

A method for manufacturing a glass substrate. The glass substrate (2) is transported in a horizontal position in the conveying direction and passed between the main body part (5a) and the top plate part (5b) formed in the opposite arrangement. The space (13) is applied to the lower surface (2a) of the glass substrate (2) by the processing gas (4) supplied from the gas supply port (14) provided in the main body (5a) to the processing space (13) During the etching process, the first flushing gas (6) is sprayed toward the downstream side of the conveying direction, so that the gap between the part that enters the processing space (13) and the top plate (5b) formed in the glass substrate (2) (13a), a method for manufacturing a glass substrate (2) that forms a flow of the first flushing gas (6) along the conveying direction, characterized in that the last part (2e) of the glass substrate (2) enters the processing space Before (13), stop the injection of the first flushing gas (6).

Description

Manufacturing method of glass substrate

[0001] The present invention relates to a method for manufacturing a glass substrate including a process of etching the lower surface of the glass substrate with a processing gas such as hydrogen fluoride while conveying the glass substrate in a flat position.

[0002] As conventionally, glass substrates are used in various electronic devices, including flat panel displays such as liquid crystal displays, plasma displays, organic EL displays, field emission displays, smart phones, tablet computers, etc. .　　[0003] In the manufacturing process of this glass substrate, there will be problems caused by static electricity. For example, when it is placed on a support table for performing a predetermined treatment on a glass substrate, the glass substrate may stick to the support table due to static electricity. In such a case, when the processed glass substrate is lifted from the support table, the glass substrate may be damaged. [0004] Therefore, as a countermeasure to solve this problem, before performing a predetermined treatment, the surface of the glass substrate is etched with a processing gas such as hydrogen fluoride to roughen the surface, thereby avoiding the problem caused by static electricity. The method of generation is well known. In addition, Patent Document 1 discloses an example of a method for performing an etching treatment on the surface of a glass substrate. [0005] In the method disclosed in the patent document, while the glass substrate is transported in a flat posture, processing gas supplied by a processor (surface treatment device in the patent document) disposed on the transport path (Reactive gas in this patent document) Only the lower surface of the upper and lower surfaces of the glass substrate is subjected to etching treatment. [0006] The processor used in this method is provided with an upper structure (the top plate in the patent document) and a lower structure (the upper plate in the patent document) opposed to each other via a conveyance path of the glass substrate. Bottom structure), a processing space (a reaction chamber in the patent document) for performing an etching process is formed between the two structures. The lower structure system is equipped with: a gas supply port for supplying processing gas to the processing space; and an exhaust port for discharging processing gas from the processing space. [0007] In this method, while supplying processing gas from the gas supply port to the processing space, and exhausting the processing gas from the processing space through the exhaust port, etching is performed on the lower surface of the glass substrate that passes through the processing space along with the conveyance. Treatment, thereby roughening the lower surface. Furthermore, in this method, a process gas system for roughening only the lower surface of the glass substrate sprays a flushing gas (replacement gas in this patent document) in order to prevent the upper surface from being roughened.　　[0008] The flushing gas system is sprayed toward the downstream side of the conveying direction of the glass substrate to form an airflow along the conveying direction in the gap formed between the processing space entering the glass substrate and the upper structure. In addition, the pressure of the flushing gas flowing through the gap prevents the process gas from entering the gap from the front head side of the glass substrate, thereby preventing the roughening of the upper surface. [Prior Art Document] [Patent Document] 　　[0009] 　　 [Patent Document 1] JP 2012-191001 A

[Problem to be solved by the invention] 　　[0010] However, the use of the aforementioned method will cause the following problems that must be solved.　　[0011] That is, in the aforementioned method, even after the last part of the glass substrate enters the processing space, the flushing gas is sprayed. Therefore, the pressure of the flushing gas is increased, and the processing gas flows from the rear side of the last part of the processing space into the aforementioned gap, causing the upper surface of the last part to be roughened unduly, resulting in the problem of lowering the quality of the glass substrate. .　　[0012] In view of the foregoing, the subject of the present invention is to prevent the quality of the glass substrate from degrading when the lower surface of the glass substrate is etched with a processing gas while the glass substrate is transported in a flat posture. [Means for Solving the Problem] 　　[0013] The present invention, developed to solve the aforementioned problems, is a method of manufacturing a glass substrate, when the glass substrate is transported in a flat position in the transport direction while passing it through the surface of the glass substrate. In the processing space between the upper structure and the lower structure, the lower surface of the glass substrate is etched by the processing gas supplied from the air supply port provided in the lower structure to the processing space. The first flushing gas is sprayed on the downstream side of the conveying direction, so that the gap between the part of the glass substrate that enters the processing space and the upper structure forms the glass of the flow of the first flushing gas along the conveying direction The method for manufacturing the substrate is characterized in that the spraying of the first flushing gas is stopped before the last part of the glass substrate enters the processing space.　　[0014] In this method, before the last part of the glass substrate enters the processing space, the spraying of the first flushing gas is stopped. Thereby, after the last part enters the processing space, the processing gas aggravated by the first flushing gas can certainly be prevented from flowing into the gap from the rear side of the last part (the part formed in the glass substrate that enters the processing space and the upper part The gap between the constituent bodies is referred to as the upper gap in the following description). As a result, the improperly roughened upper surface of the last part disappears, and it is possible to prevent the quality of the glass substrate from deteriorating.　　[0015] In the aforementioned method, before the front part of the glass substrate enters the processing space, the first flushing gas is started to be sprayed.　　[0016] Thereby, at the time immediately after the front portion of the glass substrate enters the processing space, it can be made into a state where the flow of the first flushing gas has been formed in the upper gap. Thereby, it is possible to reliably prevent the situation in which the upper surface of the front portion is unduly roughened. Therefore, it is more advantageous in preventing the deterioration of the quality of the glass substrate. [0017] In the aforementioned method, when the lower surface of the glass substrate whose length along the conveying direction is longer than the processing space is subjected to etching treatment, after the front part of the glass substrate is separated from the processing space, the spraying of the first flushing gas is stopped Better. [0018] Regarding the length along the conveying direction, when the glass substrate is longer than the processing space, the processing space is at the point in time when the leading part of the glass substrate is separated from the processing space (hereinafter referred to as the leading part separation time). It is in a state where its full length is cut up and down by the glass substrate. In addition, on the upper side of the cut processing space, that is, in the upper gap, a flow of the first flushing gas is formed. Therefore, the upper gap is formed in a state where there is no processing gas. In addition, from the lower side to the upper side (upper gap) in the cut processing space, the processing gas is extremely difficult to bypass and enter. Therefore, it is possible to avoid the roughening of the upper surface even if the first flushing gas is not sprayed after the tip part is separated from the time point. Therefore, if spraying is stopped, the manufacturing cost of the glass substrate can be suppressed in this part. [0019] In the foregoing method, from the time point when the last part of the glass substrate enters the processing space to the time point when it leaves the processing space, the second flushing gas is sprayed toward the upstream side of the conveying direction, so that the upper gap is formed along and conveyed. The flow of the second flushing gas in the opposite direction is better. [0020] With this, after the last part of the glass substrate enters the processing space until it is released, the flow of the second flushing gas formed in the upper gap can reliably prevent the processing gas from flowing from the rear side of the last part. The situation of flowing into the upper gap occurred. As a result, it is possible to more ideally prevent the deterioration of the quality of the glass substrate.　　[0021] In the aforementioned method, it is better to use clean and dry gas as the first and second flushing gas.　　[0022] With this, since cheap clean dry gas is used as the first and second flushing gases, it is possible to suppress the cost associated with the injection of the first and second flushing gases. As a result, the manufacturing cost of the glass substrate can be suppressed. In addition, by using a clean dry gas, it is possible to reliably avoid a situation in which the glass substrate is contaminated by the injection of the first and second flushing gases. [Effects of the Invention] 　　[0023] According to the present invention, when the lower surface of the glass substrate is etched with a processing gas while the glass substrate is transported in a flat position, it is possible to prevent the quality of the glass substrate from deteriorating.

[0025] Hereinafter, a method of manufacturing a glass substrate according to an embodiment of the present invention will be described with reference to the drawings. First, the manufacturing apparatus of the glass substrate used for the manufacturing method of a glass substrate is demonstrated.　　[0026] Here, in the following description, the conveying direction of the glass substrate (the direction from the right to the left in FIG. 1) is referred to as the "conveying direction". In addition, the width direction of the glass substrate perpendicular to the conveying direction (in FIG. 1, the direction perpendicular to the paper surface) is called [width direction], and the length along the [width direction] is called [full width] , [Width Size]. In addition, the direction perpendicular to the upper and lower surfaces of the glass substrate is referred to as the "up and down direction". [0027] As shown in FIG. 1, the main components of the glass substrate manufacturing apparatus 1 are provided with: a conveying means 3 for horizontally conveying the glass substrate 2 in a flat position; and a processing gas 4 (in this embodiment , Hydrogen fluoride) is used to etch the lower surface 2a of the glass substrate 2 being transported; the processor 5 is used to etch the first flushing gas 6 and the second to prevent the upper surface 2b of the glass substrate 2 from being etched. The first flushing gas injection nozzle 7 and the second flushing gas injection nozzle 24 of the second flushing gas 23 (refer to FIG. 6); have a carrying inlet 8aa and a carrying outlet 8ab of the glass substrate 2, and are used to prevent the processing gas 4 from being removed from The space 9 formed in its own leaks out to the external chamber 8; the first virtual processor 10 arranged between the processor 5 and the export port 8ab on the conveyance path of the glass substrate 2 is arranged in the processor 5 and the import port The second virtual processor 11 between 8aa; and the product produced by the reaction between the processing gas 4 and the lower surface 2a of the glass substrate 2 is sucked and then discharged to the suction nozzle 12 outside the chamber 8.　　[0028] The conveying means 3 is composed of a plurality of rollers 3a arranged on the conveying path of the glass substrate 2. With this plurality of rollers 3a, the glass substrate 2 can be conveyed along a conveying path extending on a straight line. Between the rollers 3a adjacent to each other in the conveying direction, the entire width of the lower surface 2a of the glass substrate 2 is exposed. The lower surface 2a thus exposed reacts with the processing gas 4, and an etching process is performed to roughen the full width of the lower surface 2a. Furthermore, as the conveying means 3, a device other than a plurality of rollers 3a can be used, and if the full width of the lower surface 2a of the glass substrate 2 can be exposed during conveyance, another device can be used. [0029] The processor 5 is provided with: a main body portion 5a as a lower structure that faces the glass substrate 2 through a conveyance path; a top plate portion 5b as an upper structure body; The deflection caused by its own weight is H steel 5c as a reinforcing member. Moreover, between the main body part 5a and the top plate part 5b, the processing space 13 for performing an etching process to the glass substrate 2 which passed this part is formed. The processing space 13 is formed as a flat space. The width dimension W1 (refer to FIG. 2) of the processing space 13 and the thickness dimension T1 along the vertical direction are formed to be larger than the full width W2 (refer to FIG. 2) of the glass substrate 2 and the thickness T2 of the glass substrate 2 respectively. [0030] Here, when the glass substrate 2 enters from the outside to the inside of the processing space 13, in order to prevent this action, gas such as air existing around the glass substrate 2 flows into the processing space 13, and moves along the conveying direction. The length L1 of the processing space 13 is desirably set in the range of 300 mm to 2000 mm, and more desirably set in the range of 600 mm to 1000 mm. In addition, from the viewpoint of ideally injecting the first flushing gas 6, the aforementioned length dimension L1 is different from the aspect of the present embodiment, and is preferably longer than the length along the conveying direction of the glass substrate 2. In addition, the thickness dimension T1 of the processing space 13 is preferably set to be in the range of 4 mm to 30 mm. In addition, the ratio of the aforementioned length dimension L1 to the thickness dimension T1 (length dimension L1/thickness dimension T1) is preferably set to be in the range of 10 to 250.　　[0031] The main body part 5a has a rectangular parallelepiped outer shape. The main body 5a is provided with: a gas supply port 14 for spraying and supplying the processing gas 4 to the processing space 13; an exhaust port 15 for sucking and discharging the processing gas 4 from the processing space 13; and processing gas 4 for supplying the processing space 13 Heating means (not shown) such as a heater for heating and preventing condensation of the processing gas 4. The exhaust ports 15 are respectively arranged at the upstream end and the downstream end in the conveying direction of the main body part 5a. In contrast, the air supply port 14 is located between the exhaust port 15 at the upstream end and the exhaust port 15 at the downstream end, and plural (three in this embodiment) are arranged along the conveying direction. [0032] Among the plurality of gas supply ports 14, the gas supply port 14 on the most downstream side in the conveying direction has the largest flow rate of the processing gas 4 supplied to the processing space 13. In this embodiment, compared to the other gas supply ports 14, Supply the processing gas 4 with twice the flow rate. In addition, the concentration of the supplied processing gas 4 among the plurality of gas supply ports 14 is formed to be the same. Each air supply port 14 is connected to the processing space 13 between the rollers 3a adjacent to each other along the conveying direction. In addition, the flow rate of the processing gas 4 supplied from each gas supply port 14 is set to be constant per unit time. Here, regarding the distance along the conveying direction, the distance L2 from the most upstream air supply port 14 to the center air supply port 14 and the distance L3 from the center air supply port 14 to the most downstream air supply port 14 Formed to be equal. Furthermore, in this embodiment, three air supply ports 14 are arranged, but it is not limited to this, and two or more than four may be arranged.　　[0033] The exhaust port 15 at the upstream end and the exhaust port 15 at the downstream end respectively allow the processing gas 4 sucked from the processing space 13 to be fed into the space 16 formed inside the main body 5a. The space 16 is connected to an exhaust pipe 17 which is connected to a cleaning dust collector (not shown) arranged outside the chamber 8. Thereby, the processing gas 4 system sent from the processing space 13 to the space 16 through the exhaust port 15 passes through the exhaust pipe 17 and is exhausted from the space 16 to the cleaning dust collector. Furthermore, the exhaust pipe 17 is connected to the downstream end of the space 16 in the conveying direction. The exhaust port 15 at the upstream end and the exhaust port 15 at the downstream end can also be provided with individually regulated gas for exhaust (the gas is not only the processing gas 4, but also includes suction from the outside of the processing space 13). After going to the inside, it is a mechanism of the flow rate of the air sucked by the exhaust port 15). In addition, the opening of the exhaust port 15 in contact with the processing space 13 may be blocked, or the part constituting the exhaust port 15 may be removed from the main body portion 5a and the hole communicating with the space 16 may be blocked. Exhaust port 15.　　[0034] Here, the flow rate of the gas discharged from the processing space 13 by each exhaust port 15 is larger than the flow rate of the processing gas 4 supplied to the processing space 13 by each gas supply port 14. In addition, the flow rate of the gas discharged from each exhaust port 15 is constant per unit time. Also, with regard to the distance along the conveying direction, compared to the mutual distance D1 between the exhaust port 15 at the upstream end and the air supply port 14 on the most upstream side, the exhaust port 15 at the downstream end and the most downstream distance D1 The distance D2 between the air supply ports 14 becomes longer. The length of the mutual distance D2 is desirably 1.2 times or more the length of the mutual distance D1, more desirably 1.5 times or more, and most desirably 2 times or more.　　[0035] As shown in FIG. 2, both the air supply port 14 and the exhaust port 15 are formed in a slit shape elongated in the width direction. The width dimension of the air supply port 14 is as shown in the figure, which is slightly shorter than the full width of the glass substrate 2, and may be different from the same figure, and is slightly longer than the full width of the glass substrate 2. In addition, the width dimension of the exhaust port 15 is slightly longer than the full width of the glass substrate 2. Here, in order to facilitate the uniform supply of the processing gas 4 along the width direction, the opening length S1 of the gas supply port 14 along the conveying direction is preferably set to be in the range of 0.5 mm to 5 mm. Furthermore, the opening length of the exhaust port 15 along the conveying direction is longer than the opening length S1 of the air supply port 14 along the conveying direction. In addition, in order to avoid the obstruction of the smooth etching process formed by the suction of the gas from the exhaust port 15, the distance L4 from the upstream edge 5aa of the main body portion 5a to the exhaust port 15 at the upstream end and from The distance L4 from the downstream end edge 5ab to the exhaust port 15 at the downstream end is preferably set to be in the range of 1 mm to 20 mm. [0036] As shown in FIG. 1, the top portion of the main body 5a opposite to the lower surface 2a of the glass substrate 2 passing through the processing space 13 is a plurality of units arranged without gaps along the conveying direction (in this embodiment There are eight forms, including the air supply unit 18 and the connection unit 19 described later). These plural units constitute the top portion of the main body portion 5a and constitute the ceiling portion of the aforementioned space 16. [0037] Among the plurality of units, the air supply unit 18 formed with the air supply port 14 and the connection unit 19 not formed with the air supply port 14 (in FIG. 2, the air supply unit 18 and the air supply unit 18 are surrounded by thick lines). Connection unit 19). In this embodiment, in the arrangement of a plurality of units, the air supply unit 18 is arranged at the second, fourth, and sixth positions from the upstream side in the conveying direction. In addition, the connecting unit 19 is arranged at the first, third, fifth, seventh, and eighth positions from the upstream side in the conveying direction. The air supply unit 18 is provided with an air supply nozzle 18 a connected to the air supply port 14, and the air supply nozzle 18 a is connected to a generator (not shown) of the processing gas 4 arranged outside the chamber 8. The connecting unit 19 connects the adjacent air supply units 18 and between the air supply unit 18 and the exhaust port 15.　　[0038] Here, the connection unit 19 (19x) existing at the first position (the position on the most upstream side) from the upstream side in the conveying direction is fixedly arranged at this position. In addition, the connecting unit 19 existing at the third, fifth, seventh, and eighth positions from the upstream side can be replaced with the air supply unit 18, or replaced with the air supply port 14 to form an exhaust port. 20a The exhaust unit 20 described later (in FIG. 1, the exhaust unit 20 is not used). In addition, the air supply unit 18 existing at the second, fourth, and sixth positions from the upstream side may be replaced with a connection unit 19 or an exhaust unit 20 described later. Thereby, it is possible to change the number of the air supply ports 14, the position of the air supply ports 14 in the conveying direction, and the like. In addition, even when the exhaust unit 20 is arranged, the process gas 4 can be exhausted from the exhaust ports 15 and 15 at the upstream end and the downstream end. Hereinafter, the replacement of these units will be described with reference to FIGS. 3a to 3d.　　[0039] In FIGS. 3a to 3c, the air supply unit 18, the connection unit 19, and the exhaust unit 20 shown surrounded by thick lines have the same length along the conveying direction. In this way, in the case of the replacement of these units, the newly configured unit with the replacement can be connected to the two adjacent units (in Figures 3a to 3c, the two adjacent units are shown respectively). (In the case of the connection unit 19), they are arranged without gaps. Moreover, the newly arranged unit system can be arranged in the vertical direction with no step difference with the adjacent two units.　　[0040] Here, as shown in FIG. 3a, the peripheral area 14a of the air supply port 14 of the air supply unit 18 is higher in the vertical direction than other areas. Thereby, in the peripheral area 14a of the air supply port 14, the separation distance from the lower surface 2a of the glass substrate 2 passing through the processing space 13 becomes shorter than other areas. In the present embodiment, the separation distance between the peripheral area 14a of the air supply port 14 and the lower surface 2a of the glass substrate 2 is a half of the separation distance from the lower surface 2a of the glass substrate 2 in other areas . In addition, the portion where the separation distance is shortened is formed in a state where the tip of the gas supply port 14 (the outflow port of the processing gas 4) is close to the lower surface 2a of the glass substrate 2. Furthermore, as shown in FIG. 3c, assuming that the exhaust unit 20 is arranged, the exhaust port 20a formed in the exhaust unit 20 is formed in a state connected to the aforementioned space 16. Thereby, after the processing gas 4 system sent from the processing space 13 to the space 16 through the exhaust port 20a, it passes through the exhaust pipe 17, and is exhausted from the space 16 to the cleaning dust collector. In addition, the air supply port 20a is the same as the exhaust port 15 at the upstream end and the exhaust port 15 at the downstream end, and is formed in the shape of a slit elongated in the width direction. Here, as shown in FIG. 3d, the peripheral area 14a of the air supply port 14 of the air supply unit 18 can also be made to have the same height as other areas. [0041] As shown in FIG. 1, the top plate portion 5b is composed of a single plate body (a plate body having a rectangular shape in a plan view), and has a surface facing the upper surface 2b of the glass substrate 2 passing through the processing space 13. Flat surface. In addition, the top plate part 5b has built-in heating means (not shown) such as a heater for preventing condensation by the processing gas 4. The H steel 5c is installed so as to extend in the width direction on the top plate part 5b. In addition, a plurality of H steel 5c is provided (three in this embodiment), and these plural H steel 5c are arranged at equal intervals in the conveying direction.　　[0042] The first flushing gas injection nozzle 7 is arranged on the upstream side of the processor 5 and above the conveying path of the glass substrate 2 in the conveying direction. The first flushing gas injection nozzle 7 can inject the first flushing gas 6 toward the downstream side of the conveying direction so that the gap 13a formed between the portion of the glass substrate 2 that enters the processing space 13 and the top plate portion 5b, A flow of the first flushing gas 6 along the conveying direction is formed. The gas flow of the first flushing gas 6 may be formed in the full width range of the gap 13a. In addition, the first flushing gas 6 is sprayed so that the flow velocity along the conveying direction becomes faster than the conveying speed of the glass substrate 2 by the conveying means 3. Thereby, when the front portion 2f of the glass substrate 2 is conveyed in the processing space 13, the processing gas 4 that is about to flow into the gap 13a from the front portion 2f side is rushed to the downstream in the conveying direction under the pressure of the first flushing gas 6 On the other hand, the inflow into the gap 13a can be prevented. In addition, the roughening of the upper surface 2b of the glass substrate 2 can be avoided. In addition, in this embodiment, a clean dry gas (CDA) is used as the first flushing gas 6.　　[0043] As shown in FIG. 4a, the first flushing gas 6 is sprayed before the front part 2f of the glass substrate 2 being transported enters the processing space 13. And, as shown in FIG. 4b, the jetting of the first flushing gas 6 is stopped before the last part 2e of the glass substrate 2 being transported enters the processing space 13. Here, in the present embodiment, the timing at which the injection of the first flushing gas 6 is started and stopped is determined as follows. First, on the upstream side of the first flushing gas injection nozzle 7 in the conveying direction, a detection means (not shown) such as a sensor capable of detecting the leading part 2f and the last part 2e of the glass substrate 2 is arranged. If this detection means detects that the front part 2f of the glass substrate 2 passes, it is determined to start the first flushing gas based on the conveying speed of the glass substrate 2 and the distance along the conveying path from the front part 2f to the processing space 13 The time point of the injection of 6. Similarly, if the detection means detects the passage of the last part 2e, the time point when the ejection stops is determined based on the conveying speed and the distance from the last part 2e to the processing space 13.　　[0044] As shown in FIG. 5, the first flushing gas injection nozzle 7 is provided with a cylindrical pipe 7a extending in the width direction. To this pipe 7a, a plurality of pipes 7b are inserted at intervals in the width direction. The first flushing gas 6 can be supplied from each tube 7b into the pipeline 7a. Also, inside the pipe 7a, a plate 7c elongated in the width direction is installed, and the first flushing gas 6 flowing from each pipe 7b into the pipe 7a is looped around the plate 7c. , It is injected from the injection part 7d connected to the pipeline 7a. The ejection port of the first flushing gas 6 formed in the ejection portion 7d is formed in a slit shape elongated in the width direction. The jetting angle θ of the first flushing gas 6 by the jetting part 7d (the angle of the upper surface 2b of the glass substrate 2 when the direction of the jetting part 7d is inclined) is within the range of 25°~70°. change. In addition, the posture of the first flushing gas injection nozzle 7 is as shown by the solid line in FIG. The part 7d points out of the processing space 13.　　[0045] As shown in FIG. 6, the second flushing gas injection nozzle 24 is arranged on the downstream side of the processor 5 and above the conveying path of the glass substrate 2 in the conveying direction. The second flushing gas injection nozzle 24 can inject the second flushing gas 23 toward the upstream side of the conveying direction, so that a flow of the second flushing gas 23 in the direction opposite to the conveying direction is formed in the gap 13a. The flow of the second flushing gas 23 may be formed in the full width range of the gap 13a. With this second flushing gas 23, when the last part 2e of the glass substrate 2 is transported in the processing space 13, the second flushing gas 23 is used to transfer the process gas 4 that is going to flow into the gap 13a from the last part 2e side. The pressure rushes to the upstream side in the conveying direction, which prevents the inflow into the gap 13a. In addition, the roughening of the upper surface 2b of the glass substrate 2 can be avoided. In addition, in this embodiment, similarly to the first flushing gas 6, a clean dry gas is used as the second flushing gas 23.　　[0046] In addition, the second flushing gas 23 starts to be injected after the first flushing gas 6 stops jetting, and before the last part 2e of the glass substrate 2 being transported enters the processing space 13. And, as shown in FIG. 7, just after the last part 2e of the 2nd flushing gas 23 of the glass substrate 2 being conveyed is separated from the processing space 13, the spraying is stopped. Here, the timing of the start and stop of the injection of the second flushing gas 23 can be achieved by using the aforementioned detection means to arrange a sensor on the downstream side of the second flushing gas injection nozzle 24 in the conveying direction. What is necessary is just to detect the last part 2e of the glass substrate 2, etc., such as a new detection means (not shown), etc., and to determine.　　[0047] The second gas injection nozzle 24 for flushing is different from the aforementioned first gas injection nozzle 7 for flushing, and differs only in configuration, posture, etc., and a nozzle having the same structure as the first flushing gas injection nozzle 7 can be used. Therefore, with regard to the structure of the second flushing gas injection nozzle 24, repeated descriptions are omitted here.　　[0048] As shown in Fig. 1, the chamber 8 has a rectangular parallelepiped shape. This chamber 8 is provided with a main body 8a having a ceiling hole 8ac in addition to the aforementioned carrying inlet 8aa and carrying outlet 8ab, and a cover 8b for sealing the ceiling hole 8ac.　　[0049] The carry-in port 8aa and the carry-out port 8ab are formed in the side wall portion 8ad of the main body 8a, and are formed as a flat opening that is elongated in the width direction. A plurality of top plate holes 8ac are formed in the top plate portion 8ae of the main body 8a (three in this embodiment). The cover 8b can seal the entire opening of the top plate hole 8ac, and can be attached to and detached from the main body 8a. Thereby, by removing the cover 8b from the main body 8a, the top plate hole 8ac is opened, and operations such as adjustment, maintenance, and inspection of the processor 5 can be performed through the top plate hole 8ac. [0050] The first virtual processor 10 is provided with: a rectangular parallelepiped box 10a arranged below the conveying path of the glass substrate 2; and a top plate 10b arranged above the conveying path so as to face the box 10a; And H steel 10c as a reinforcing member to prevent deflection by the dead weight of the top plate 10b. Furthermore, between the box body 10a and the top plate 10b, a gap 21 for the glass substrate 2 to pass through is formed. The first virtual processor 10 functions as a windproof member for preventing the airflow flowing from the export port 8ab into the chamber 8 from reaching the processing space 13 and adversely affecting the etching process. Here, in order to effectively function as a windproof member, the length of the first virtual processor 10 along the conveying direction is desirably 50 mm or more, and more desirably 100 mm or more.　　[0051] At the upper end of the box body 10a, a rectangular opening 10aa that is elongated in the width direction is formed. In addition, an exhaust pipe 22 connected to a cleaning dust collector (not shown) arranged outside the chamber 8 is connected to the bottom of the box body 10a. Thereby, the first virtual processor 10 treats the processing gas 4 that is attracted by the lower surface 2a of the glass substrate 2 and flows out from the processing space 13 toward the downstream side in the conveying direction, and allows the processing gas 4 to pass through the opening 10aa to be exhausted. After being sucked by the tube 22, it is discharged to the cleaning dust collector. The top plate 10b is composed of a single plate body (a plate body having a rectangular shape in a plan view), and has a flat surface facing the upper surface 2b of the glass substrate 2 passing through the gap 21. The H steel 10c is installed so as to extend in the width direction on the top plate 10b.　　[0052] The first virtual processor 10 has the same appearance as the processor 5 when viewed from the direction along the conveying direction, and is arranged to appear to overlap the processor 5. That is, between the main body portion 5a of the processor 5 and the box body 10a of the first virtual processor 10, the width dimension and the dimension along the vertical direction are set to be the same. Similarly, (A) the top plate part 5b of the processor 5 and the top plate 10b of the first virtual processor 10, (B) the H steel 5c of the processor 5 and the H steel 10c of the first virtual processor 10, (C) The processing space 13 of the processor 5 and the gap 21 of the first virtual processor 10, the mutual width dimension of each combination of (A) to (C), and the dimension along the vertical direction are also set to be the same.　　[0053] The second virtual processor 11 has the same structure as the aforementioned first virtual processor 10 except for the two points (1) and (2) shown below. Therefore, in FIG. 1, the same figure number as the first virtual processor 10 is added to the second virtual processor 11, and the repeated description between the two processors 10 and 11 is omitted. (1) The configuration is different from the first virtual processor 10 in this point. (2) It functions as a wind-proof member for avoiding that the airflow that flows into the chamber 8 not from the export port 8ab but from the import port 8aa reaches the processing space 13 and adversely affects the etching process. Furthermore, the second virtual processor 11 is the same as the first virtual processor 10, when viewed from the direction along the conveying direction, it has the same appearance as the processor 5, and is arranged to look like the processor 5 overlapping.　　[0054] The suction nozzle 12 is installed on the ceiling portion 8ae of the chamber 8, and the suction port 12a is communicated with the space 9. The suction port 12a is arranged on the downstream side of the first virtual processor 10 in the conveying direction, and is arranged at the downstream end of the space 9 in the conveying direction. The suction nozzle 12 is connected to a cleaning dust collecting device (not shown) outside the chamber 8, and can discharge the sucked products to the cleaning dust collecting device. In addition, the suction port 12a is not limited to the same arrangement as in the present embodiment, and may be arranged above the conveyance path of the glass substrate 2. However, since it has the function of sucking the products generated by the etching process and then discharging it out of the chamber 8, even if the suction port 12a is arranged in a different arrangement from this embodiment, it is still arranged relatively far in the conveying direction. The processor 5 is preferably further downstream.　　[0055] Hereinafter, a method of manufacturing a glass substrate according to an embodiment of the present invention using the aforementioned glass substrate manufacturing apparatus 1 will be described.　　[0056] First, by transporting the glass substrate 2 by the transporting means 3, the glass substrate 2 is carried into the chamber 8 from the carry-in port 8aa. In addition, in this embodiment, the glass substrate 2 whose total length along the conveyance path is longer than this distance is made into the object of an etching process based on the distance along the conveyance path from 8aa to export exit 8ab. In addition, in this embodiment, the glass substrate 2 is conveyed at a constant conveying speed.　　[0057] Next, the glass substrate 2 after the loading is passed through the gap 21 of the second virtual processor 11 disposed between the loading port 8aa and the processor 5. Furthermore, the gas that flows into the chamber 8 from the carry-in port 8aa and flows along the lower surface 2a of the glass substrate 2 toward the downstream side in the carrying direction is in a row connected to the bottom of the box 10a of the second virtual processor 11 The trachea 22 is attracted. In addition, by making the second virtual processor 11 function as a windproof member, it is possible to prevent the gas flowing into the chamber 8 from the import port 8aa from reaching the processing space 13 of the processor 5.　　[0058] Next, the glass substrate 2 passing through the gap 21 of the second virtual processor 11 is passed through the processing space 13 of the processor 5. At this time, before entering the processing space 13 from the front portion 2f of the glass substrate 2, the first flushing gas 6 starts to be sprayed. In addition, on the lower surface 2a side of the glass substrate 2 passing through the processing space 13, the lower surface 2a is etched by the processing gas 4 supplied from each gas supply port 14, while the upstream end and downstream The respective exhaust ports 15 at the side ends exhaust the processing gas 4 from the processing space 13. In addition, on the upper surface 2b side of the glass substrate 2 passing through the processing space 13, the flow of the first flushing gas 6 formed in the gap 13a prevents the inflow into the gap 13a from the front portion 2f side of the glass substrate 2 The processing gas 4 performs etching processing on the upper surface 2b. In addition, the product generated in the etching process is sucked by the suction nozzle 12 and discharged to the outside of the chamber 8. The jetting of the first flushing gas 6 is stopped before the last part 2e of the glass substrate 2 enters the processing space 13.　　[0059] Here, in this embodiment, before the last part 2e of the glass substrate 2 enters the processing space 13, the injection of the first flushing gas 6 is stopped, but it is not limited to this. If the front portion 2f of the glass substrate 2 is separated from the processing space 13, it may be a state in which the injection of the first flushing gas 6 is stopped before the last portion 2e of the glass substrate 2 enters the processing space 13. It may also be a state where the first flushing gas 6 is stopped immediately after the front portion 2f of the glass substrate 2 is separated from the processing space 13.　　 [0060] If the injection of the first flushing gas 6 is stopped, the first flushing gas 6 is replaced, and the injection of the second flushing gas 23 is started. Along with this, on the upper surface 2b side of the glass substrate 2 passing through the processing space 13, the flow of the second flushing gas 23 formed in the gap 13a prevents the inflow into the gap 13a from the last part 2e side of the glass substrate 2 The processing gas 4 etches the upper surface 2b. In addition, on the lower surface 2a side of the glass substrate 2 passing through the processing space 13, the lower surface 2a is then etched by the processing gas 4 supplied from each gas supply port 14, while the upstream end and The respective exhaust ports 15 at the downstream end portion discharge the processing gas 4 from the processing space 13. The second flushing gas 23 stops spraying immediately after the last part 2e of the glass substrate 2 is separated from the processing space 13. [0061] Here, in this embodiment, the second flushing gas 23 is formed to start spraying before the last part 2e of the glass substrate 2 enters the processing space 13, and stop spraying immediately after leaving the glass substrate 2. , But not limited to this. The second flushing gas 23 may be sprayed at least between the time when the last part 2e of the glass substrate 2 enters the processing space 13 and the time when it leaves.　　[0062] In the present embodiment, immediately after the injection of the first flushing gas 6 is stopped, the injection of the second flushing gas 23 is started, but it is not limited to this. After stopping the injection of the first flushing gas 6, the injection of the second flushing gas 23 may be started after a predetermined time has elapsed. Thereby, it is possible to prevent the first flushing gas 6 and the second flushing gas 23 from colliding in the processing space 13 and causing turbulence in the air flow in the processing space 13. In addition, the usage amount of the first flushing gas 6 and the second flushing gas 23 can also be saved. Furthermore, the first flushing gas 6 and the second flushing gas 23 can also prevent the processing gas 4 from detouring from the lower surface 2a side of the glass substrate 2 via the side surface (along the width direction end of the glass substrate 2) in the conveying direction. The effect of entering the upper surface 2b side. Therefore, the predetermined time from the stop of the injection of the first flushing gas 6 to the start of the injection of the second flushing gas 23 is from the viewpoint of preventing the gas from colliding with each other in the processing space 13 and preventing the aforementioned bypassing entry. It is better to be as short as possible, ideally 0.5 second to 2 seconds, more ideally 0.5 second to 1 second. In addition, from the viewpoint of saving the usage of the first flushing gas 6 and the second flushing gas 23, the aforementioned predetermined time is preferably as long as possible, and the predetermined time is ensured so that the leading part 2f of the glass substrate 2 After the processing space 13 is separated, the injection of the first flushing gas 6 is stopped, and the second flushing gas 23 is injected before the last part 2e of the glass substrate 2 enters the processing space 13. [0063] Also, in the present embodiment, before the last part 2e of the glass substrate 2 enters the processing space 13, the jetting of the first flushing gas 6 is stopped, and the jetting of the first flushing gas 6 The time is longer than the injection time of the second flushing gas 23, but it is not limited to this. It is also possible to stop the injection of the first flushing gas 6 immediately after the front portion 2f of the glass substrate 2 separates from the processing space 13, and then immediately start the injection of the second flushing gas 23, so that the second flushing gas 23 can be removed. The injection time of is set to be longer than the injection time of the first flushing gas 6. In addition, by appropriately securing the aforementioned predetermined time, the injection time of the first flushing gas 6 and the injection time of the second flushing gas 23 may be set to the same time. In addition, in order to ensure the aforementioned predetermined time, the injection time of the first flushing gas 6 may be set to be longer than the injection time of the second flushing gas 23, or may be set to be shorter.　　[0064] Next, the glass substrate 2 that has passed through the etching process in the processing space 13 of the processor 5 is passed through the gap 21 of the first virtual processor 10 arranged between the processor 5 and the export port 8ab. Furthermore, the gas flowing from the outlet 8ab into the chamber 8 and flowing along the lower surface 2a of the glass substrate 2 toward the upstream side in the conveying direction is a row connected to the bottom of the box 10a of the first virtual processor 10 The trachea 22 is attracted. In addition, by making the first virtual processor 10 function as a windproof member, it is possible to prevent the gas flowing into the chamber 8 from the export port 8ab from reaching the processing space 13 of the processor 5. In addition, the processing gas 4 sucked by the lower surface 2a of the glass substrate 2 by the exhaust pipe 22 and flowing out of the processing space 13 toward the downstream side in the conveying direction is exhausted to the outside of the chamber 8.　　[0065] Finally, the glass substrate 2 after passing through the gap 21 of the first virtual processor 10 is carried out from the export port 8ab to the outside of the chamber 8. Then, the glass substrate 2 which performed the etching process on the lower surface 2a was obtained. As shown above, the manufacturing method of the glass substrate of the embodiment of this invention is completed.　　[0066] Hereinafter, the main functions and effects of the manufacturing method of the glass substrate according to the embodiment of the present invention will be described.　　[0067] In this method, before the last portion 2e of the glass substrate 2 enters the processing space 13, the spraying of the first flushing gas 6 is stopped. Thereby, after the final portion 2e enters the processing space 13, it is possible to prevent the processing gas 4 aggravated by the first flushing gas 6 from flowing into the gap 13a from the rear side of the final portion 2e. As a result, the improper roughening of the upper surface 2b of the last part 2e disappears, and the deterioration of the quality of the glass substrate 2 can be prevented.

[0068] 2. ‧ ‧ glass substrate 2a ‧ ‧ lower surface 2e ‧ ‧ last part 2f ‧ ‧ front part 4 ‧ ‧ processing gas 5a ‧ ‧ body part (lower structure) 5b ‧ ‧ top plate part (Upper structure) 6‧‧‧First flushing gas 13‧‧‧Processing space 13a‧‧‧Gap 14‧‧‧Air supply port 23‧‧‧Second flushing gas

[0024] 　　 FIG. 1 is a longitudinal sectional side view showing the outline of a manufacturing apparatus of a glass substrate.　　 FIG. 2 is a plan view of the main body of the processor included in the glass substrate manufacturing apparatus viewed from above.　　 Fig. 3a is a longitudinal sectional side view showing an enlarged part of a processor included in the manufacturing apparatus of a glass substrate.　　 FIG. 3b is an enlarged longitudinal sectional side view showing a part of the processor included in the glass substrate manufacturing apparatus.　　 Fig. 3c is an enlarged longitudinal sectional side view showing a part of the processor included in the glass substrate manufacturing apparatus.　　 FIG. 3d is an enlarged longitudinal sectional side view showing a part of the processor included in the manufacturing apparatus of the glass substrate.　　 FIG. 4a is an enlarged longitudinal sectional side view showing the vicinity of the first flushing gas injection nozzle included in the glass substrate manufacturing apparatus.　　 FIG. 4b is an enlarged longitudinal sectional side view showing the vicinity of the first flushing gas injection nozzle included in the glass substrate manufacturing apparatus.　　 Fig. 5 is an enlarged longitudinal sectional side view showing the vicinity of the first flushing gas injection nozzle included in the glass substrate manufacturing apparatus.　　 Fig. 6 is a longitudinal sectional side view showing the vicinity of the processing space of the glass substrate manufacturing apparatus.　　 FIG. 7 is a longitudinal sectional side view showing the vicinity of the processing space of the glass substrate manufacturing apparatus.

2‧‧‧Glass substrate

2a‧‧‧Lower surface

2b‧‧‧Upper surface

2e‧‧‧The last part

3a‧‧‧roller

5‧‧‧Processor

5a‧‧‧Main body (lower structure)

5aa‧‧‧Upstream side edge

5b‧‧‧Top plate (upper body)

5c‧‧‧H steel

7‧‧‧Gas jet nozzle for the first flush

13‧‧‧Processing space

13a‧‧‧Gap

15‧‧‧Exhaust port

19(19x)‧‧‧Connecting unit

Claims (5)

A method of manufacturing a glass substrate, when the glass substrate is transported in a horizontal position in the conveying direction, and passed through the processing space formed between the upper and lower structures that are arranged oppositely, while the When the processing gas is supplied to the processing space through the air supply port of the lower structure, when the lower surface of the glass substrate is etched, the first flushing gas is sprayed toward the downstream side of the conveying direction, so that the glass is formed on the glass substrate. A method for manufacturing a glass substrate in which the gap between the portion of the substrate that enters the processing space and the upper structural body forms a flow of the first flushing gas along the conveying direction and along the upper surface of the glass substrate It is characterized in that the spraying of the first flushing gas is stopped before the last part of the glass substrate enters the processing space. For example, the manufacturing method of the glass substrate of the first item of the scope of patent application, wherein, before the front part of the glass substrate enters the processing space, the injection of the first flushing gas is started. For example, the manufacturing method of the glass substrate of the first or second patent application, wherein, when the lower surface of the glass substrate whose length along the conveying direction is longer than the processing space is etched, After the part is separated from the processing space, the injection of the first flushing gas is stopped. For example, the manufacturing method of the glass substrate of the first or second patent application, wherein, from the time point when the last part of the glass substrate enters the processing space to the time point when it leaves, the spray is directed toward the upstream side of the conveying direction The second flushing gas forms a flow of the second flushing gas along the upper surface of the glass substrate in the direction opposite to the conveying direction in the gap. For example, the manufacturing method of the glass substrate of the fourth item of the scope of patent application, wherein a clean and dry gas is used as the first and second flushing gas.

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