CN101781091B - Device for bearing transparent conductive film glass during thinning single surface and thinning method for transparent conductive film glass - Google Patents

Device for bearing transparent conductive film glass during thinning single surface and thinning method for transparent conductive film glass Download PDF

Info

Publication number
CN101781091B
CN101781091B CN2009101050755A CN200910105075A CN101781091B CN 101781091 B CN101781091 B CN 101781091B CN 2009101050755 A CN2009101050755 A CN 2009101050755A CN 200910105075 A CN200910105075 A CN 200910105075A CN 101781091 B CN101781091 B CN 101781091B
Authority
CN
China
Prior art keywords
vacuum
sheet glass
glass
bogey
vacuum pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009101050755A
Other languages
Chinese (zh)
Other versions
CN101781091A (en
Inventor
金弼
张莉
刘志斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen CSG Display Devices Co., Ltd.
Original Assignee
SHENZHEN CSG DISPLAY DEVICES CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENZHEN CSG DISPLAY DEVICES CO Ltd filed Critical SHENZHEN CSG DISPLAY DEVICES CO Ltd
Priority to CN2009101050755A priority Critical patent/CN101781091B/en
Publication of CN101781091A publication Critical patent/CN101781091A/en
Application granted granted Critical
Publication of CN101781091B publication Critical patent/CN101781091B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The invention relates to a device for bearing transparent conductive film glass during thinning single surface and a thinning method for the transparent conductive film glass. The device comprises a sealed vacuum chuck 1 totally covering the conductive film surface of plane glass 4 and adsorbing the plane glass 4; an enclosed air suction duct 1c and a vacuum buffer cavity 1f communicated with the air suction duct are arranged in the vacuum chuck 1; and through an enclosed cavity formed by the air suction duct 1c and the vacuum buffer cavity 1f, the plane glass 4 is always adsorbed in the whole thinning etching flow by maintaining the vacuum degree between the vacuum chuck 1 and the plane glass 4 under the condition of cutting off an external vacuum pump source. In the process of thinning the plane glass borne by the device, one surface of the plane glass is not provided with any shield so as to facilitate thinning treatment, and the enclosed surface of the plane glass can ensure the transparent conductive film is protected from the corrosion of chemical solution, so that the process of thinning the single surface of the transparent conductive film glass is greatly simplified and the cost is reduced.

Description

Transparent conducting film glass thinning single surface bogey and thining method thereof
Technical field
The present invention relates to glass substrate bearing device and thining method thereof, more particularly, relate to a kind of transparent conducting film glass thinning single surface with bogey and utilize this device carrying electropane to carry out the method for thinning single surface.
Background technology
Transparent conducting film glass is a main raw of making flat-panel monitor (FPD), is widely used in liquid-crystal display (LCD), plasma panel (PDP), touch-screen (TP), organic light emitting display fields such as (OLED).Along with world today's new high-tech product develop rapidly, more and more higher to the lightening requirement of FPD panel, thereby the reduction process of transparent conducting film glass becomes terminal and shows that can product realize one of key problem of slimming.
So-called attenuate be exactly with chemical liquid with transparent conducting film glass substrate uniform etching to target thickness, from two kinds of attenuate mode minute thinning single surface and two-sided attenuates.Thinning single surface is promptly taked sfgd. to the wherein one side of glass substrate, and another side is carried out attenuate; Two-sided attenuate promptly carries out attenuate simultaneously to the two sides of glass substrate.From reduction process, the popular reduction process has the reduction process of immersion and spray reduction process at present, soaking reduction process is that glass substrate is immersed in the chemical liquid, auxiliary then with bubbling or throw mechanical means such as moving, its glass fixture normally has the etching basket of draw-in groove, realizes gripping (describing as patent CN101234853A) between adjacent card article by the glass substrate two ends are stuck in; The spray reduction process is to use the horizontal transport roller as support component, realizes gripping by bringing in from the left and right sides support glass plate two of glass throughput direction, evenly sprays chemical liquid to its surface then, (as patent CN1669967A description).Soak reduction process and compare with the spray reduction process, latter's etch-rate is fast, soup utilization ratio height, and the thickness of glass substrate that obtains is even, and visual defects is few, thereby has represented the main flow direction of reduction process.
When adopting above-mentioned spray etch process to carry out the transparent conducting film glass thinning single surface, its clamping fixture is the key that this method is implemented.Will protect plating conduction face to make it avoid chemical liquid on the one hand corrodes; To realize that on the other hand another side is without any the homogeneity of the clamp position of blocking object with the assurance attenuate.The way of prior art is to need not etched surface-coated mask as protective layer before glass substrate carries out chemical reduction, then by realizing the clamping of glass substrate from the conveying roller at the support glass substrate two ends, the left and right sides of glass throughput direction so that finish reduction process (describing as patent CN1669967A).The shortcoming of prior art is as follows:
1. increase protective layer coating, oven dry, removal operation, increased material cost and production process, increased the quality control difficulty, reduced production efficiency.
2. increase the investment of corresponding support equipments such as coating machine, dryer, stripping machine, increased production cost.
3. be to realize to the protection of conduction face and to the clamping of whole glass, thereby increased the integral manufacturing cost by two separate devices.
Summary of the invention
The technical problem to be solved in the present invention is; realize defective that the effective area of glass coating face is protected when can't be implemented in the fixing glass substrate, a kind of transparent conducting film glass thinning single surface bogey is provided and adopts the thining method of this device at prior art.
The technical solution adopted for the present invention to solve the technical problems is: construct a kind of transparent conducting film glass thinning single surface bogey, comprise sealing and the vacuum pad that covers sheet glass conduction face comprehensively and sheet glass is adsorbed; Be provided with the airtight vacuum buffer cavity of bleeding the duct and communicating with the described duct of bleeding in vacuum pad inside, the airtight chamber that forms by bleed duct and vacuum buffer cavity, and external vacuum pumping source disconnection under the vacuum tightness kept between vacuum pad and the sheet glass in whole attenuate etchant flow, adsorb sheet glass.
In above-mentioned bogey, described vacuum pad comprises: as the stiffener plate of support frame, be separately positioned on the airtight enclosure wall at the sheet glass edge that is used on the stiffener plate to fit and be used to control that vacuum pad is bled and/or the normal closed gate of intake operation; Airtight enclosure wall interior region of the described hole link of bleeding and valve.
In above-mentioned bogey, described stiffener plate is formed by dull and stereotyped applying of two homogeneities, and wherein the one side of one flat plate is drilled with the through hole that serves as the duct of bleeding, and another side is milled with a plurality of grooves that serve as the vacuum buffer cavity, and described through hole communicates with groove.
In above-mentioned bogey, the volume of described vacuum buffer cavity is directly proportional with the sheet glass area, and its proportional range is preferably between 200cm 3: 1000cm 2To 600cm 3: 1000cm 2Between.
In above-mentioned bogey, also be provided with the annular opening groove that is used to embed described airtight enclosure wall on the described stiffener plate, the outline shape of described annular opening groove is suitable mutually with airtight enclosure wall frame outline shape, and the face profile shape of the two is suitable mutually with the outline shape of sheet glass.
In above-mentioned bogey, also comprise: be fixed on the delivery roll of vacuum pad bottom, and the leading sheave that is fixed on the vacuum pad top.
In above-mentioned bogey, airtight enclosure wall is the elastic deformation material, and its outer profile size is bigger 2 millimeters to 5 millimeters than sheet glass.
In above-mentioned bogey, described annular opening groove groove width is bigger 0.5 millimeter to 1.5 millimeters than airtight enclosure wall border width, and the airtight enclosure wall seal ring thickness of its depth ratio is little 0.1 millimeter to 0.6 millimeter.
In above-mentioned bogey, described vacuum pad holds and seals 1 millimeter of described sheet glass conducting film identity distance isolated edge at least with interior part.
The present invention solves another technical scheme that its technical problem adopts: provide a kind of said apparatus carrying transparent conducting film glass that utilizes to carry out the thinning single surface method, comprise the steps:
A: the plated film face of sheet glass and the airtight enclosure wall zone of vacuum pad are carried out the contraposition applying;
B: connect the vacuum pumping source, open the vacuum pad valve vacuum pad is vacuumized;
C: the bogey of the sheet glass of will having fitted is conveyed into the attenuate workspace, to being exposed to the another side of outer sheet glass, finishes thinning single surface to utilize chemical liquid spray mode;
D: unload sheet glass.
In above-mentioned thining method, described step B further comprises: after reaching the vacuum tightness of enough absorption sheet glass between vacuum pad and the sheet glass, valve-off cuts off the vacuum pumping source.
In above-mentioned thining method, the transmission to sheet glass among the described step C is to realize by being separately positioned on upper and lower leading sheave of bogey and delivery roll.
In described thining method, described step D further comprises: open valve, treat the air pressure balance of the inside and outside portion of vacuum pad after, unload sheet glass.
Implement bogey provided by the invention; the sheet glass that makes its vacuum pad absorption; its one side is convenient to the chemical liquid attenuate without any blocking; and the nesa coating of another side is sealed fully and avoid chemical solution and corrode; under protection nesa coating prerequisite; making processes with chemical solution etching glass another side entire area is greatly simplified, and has also reduced tooling cost.In addition, the vacuum buffer cavity in the described stiffener plate is under the prerequisite that guarantees the effect of stiffener plate rigid support, and its cumulative volume is directly proportional with the sheet glass area, and proportional range is between 200cm 3: 1000cm 2To 600cm 3: 1000cm 2Between, keep the unlikely required vacuum tightness that drops in the glass thinning etching process to guarantee enough volumes, be valve-off, cut off behind the vacuum pumping source described vacuum pad and can guarantee before all attenuate etching work procedures are finished the glass substrate stable holding on sucker and unlikely dropping that the described attenuate operation used time of whole process was at least 1 hour.
Specifically, the thining method of implementing bogey of the present invention and adopting this bogey to carry out has following beneficial effect:
1. be thinned under the vertical loaded state of glass, realizing being thinned no any shelter on the glass surface vertical direction;
2. vertically the glass of carrying can not drop in transport process, can not topple, can be damaged when etching face is subjected to than the spray liquid pressure of big vertical direction;
3. need not cover the one side that needs protection by chemical masking film, but adopt the face of repeatedly used structural part protection transparent conducting film glass;
4. the measure with above-mentioned carrying and protection is integrated in the covering device.
Various advantage of the present invention, all respects and character of innovation, and the details of the embodiment of example shown in it will describe in detail in following description and accompanying drawing.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 carries out the schema of reduction process for prior art;
Fig. 2 carries out the schematic flow sheet of thinning single surface for adopting bogey of the present invention;
Fig. 3 is the structural representation of transparent conducting film glass thinning single surface bogey one preferred embodiment of the present invention;
Fig. 4 is the side-view of Fig. 3;
Fig. 5 is the schematic flow sheet that transparent conducting film glass is carried out the method for thinning single surface provided by the invention;
Fig. 6 is for adopting the structural representation of bogey of the present invention;
Fig. 7 is the synoptic diagram of described bogey one embodiment of invention;
Fig. 8 is the synoptic diagram of described another embodiment of bogey of invention.
Reference numeral is unitedly described as follows:
The 1-vacuum pad; The 2-delivery roll; The 3-leading sheave; 4-sheet glass; The 7-sprinkling equipment; The 1a-stiffener plate; The airtight enclosure wall of 1b-; The 1c-duct of bleeding; The 1d-valve; The 1e-open groove; 1f-vacuum buffer cavity
Embodiment
Fig. 1 carries out the schema of glass thinning technology for prior art.As shown in the figure, the way of prior art is before glass substrate carries out the chemical reduction etching, need not etched surface-coated mask as protective layer, then by realizing the clamping of glass substrate from the conveying roller at the support glass substrate two ends, the left and right sides of glass throughput direction so that finish reduction processing (be CN1669967A patent as described in) as the patent No., its production process as shown in Figure 1, the weak point of this technology has been to increase the operation bidirectional outside a lot of attenuates, thereby caused the increase of cost, such as: increased the protective layer coating, oven dry, remove operation, material cost and production process have been increased, increase the control difficulty of good article rate, reduced production efficiency; Increase the investment of corresponding support equipments such as coating machine, dryer, stripping machine, increased production cost.Realize when in addition, prior art can't be implemented in the clamping glass substrate that glass be need not etched effective area to be protected.
Fig. 2 carries out the schema of reduction process for adopting bogey of the present invention.As shown in the figure; after adopting bogey of the present invention; the reduction process flow process has obtained obvious simplification; mainly show: saved the production process that the plated film face is carried out the protective layer coating and the protective layer of being correlated with; in addition, after the attenuate operation is finished, also saved the operation of corresponding removal protective layer; thereby simplified technical process on the whole, reduced whole cost.
Fig. 3 is the structural representation of transparent conducting film glass thinning single surface bogey one preferred embodiment of the present invention, and Fig. 4 is the side-view of Fig. 3.The described bogey of present embodiment comprises the vacuum pad 1 of clamping sheet glass, and this vacuum pad 1 comprises stiffener plate 1a, is arranged on valve 1d and airtight enclosure wall 1b on the stiffener plate 1a.Stiffener plate 1a is than at least 20 millimeters greatly of sheet glass 4 sizes, with support frame as this vacuum pad 1, the material of stiffener plate 1a can be materials such as PVC, synthetic glass, be provided with annular opening groove 1e at least in the zone that stiffener plate 1a surface distance edge is 5 millimeters, its degree of depth is preferably 0.4 millimeter to 0.9 millimeter, width is preferably 3 millimeters to 7 millimeters, and its overall size is preferably big 2 millimeters to 5 millimeters than treating clamping sheet glass.
On open groove 1e, closely be pasted with the elastic deformation material (as rubber, flexiplast etc.) the airtight enclosure wall 1b that makes, the degree of depth of the preferred ratio open groove of this elastic deformation material's thickness 1e is big 0.2 millimeter to 0.6 millimeter, its outline shape is suitable mutually with sheet glass 4 face profile shapes, described elastic deformation material is attached on the open groove 1e hermetically, stiffener plate 1a inside is provided with the airtight duct 1c that bleeds, and extend at least 5 millimeters places of the outlet of homonymy outside the vacuum pad edge valve 1d, in addition, duct 1c one end of bleeding communicates with vacuum buffer cavity 1f, the other end then communicates with the inside of airtight enclosure wall 1b enclosed space, as shown in Figure 4.Valve 1d is perpendicular to the perforate of stiffener plate 1a, bleeds and/or air inlet realizes the loading and unloading flat glass film thereby control by the switch of this valve 1d.When sheet glass is coated with the one side of nesa coating with the corresponding attaching of airtight enclosure wall 1b profile, glass substrate was clamped on the vacuum pad 1 securely when closed cavity was evacuated.In concrete the making, stiffener plate 1a is formed by dull and stereotyped applying of two homogeneities, and wherein the one side of one flat plate is drilled with the through hole that serves as the duct 1c that bleeds, and another side is milled with a plurality of grooves that serve as vacuum buffer cavity 1f, and this through hole communicates with groove.
Vacuum pad in the present embodiment is upright state, and its bottom is fixed with delivery roll 2, and delivery roll 2 front and back end quality awards from the ministry are elected taper as and its axis is parallel with the stiffener plate bottom margin on the vacuum pad and on same plane; Vacuum pad 1 tip position is fixed with many group leading sheaves 3, the rotational plane of leading sheave 3 be on horizontal plane and its axis and the vacuum pad 1 the stiffener plate bottom margin perpendicular to and on same plane.In transport process, delivery roll 2 drops on the matrix roller of peripherals, leading sheave 3 enters in the guide path of relevant device, and the rotation by troughing roller drives device and moves, and leading sheave 3 can guarantee that bogey moves and reduces resistance under plumbness.
When using bogey of the present invention that transparent conducting film glass 4 is carried out thinning single surface, its concrete operations operation as shown in Figure 5.Fix for carrying out sheet glass, at first carrying out the contraposition of sheet glass 4 in step 501 fits, concrete operations are the one side zones that airtight enclosure wall 1b surrounds on stiffener plate 1a that sheet glass 4 are coated with nesa coating, carry out contraposition at least along airtight enclosure wall 1b in its edge 1mm regional extent and fit; In step 502, open valve 1d, connect external vacuum pumping source so that the closed cavity between sheet glass 4 and the stiffener plate reaches required vacuum tightness, compress mutually with the stiffener plate 1a of vacuum pad 1 at this process middle plateform glass 4, thereby airtight enclosure wall 1b makes whole vacuum pad 1 inside constitute an airtight integral body with tight contact of sidewall of sheet glass 4 simultaneously; In step 503, valve-off, cut-out vacuum pumping source; In step 504, bogey begins stable transfer by the delivery roll 2 of bottom and the leading sheave 3 at top in specific stripping apparatus transporting rail, and sheet glass 4 is conveyed into the attenuate workspace, in the present embodiment, bogey transmits sheet glass 4 and enters into the spray tunnel so that sheet glass is sprayed attenuate; In step 505, sheet glass is finished the operation of spray etching attenuate in the spray tunnel, and synoptic diagram as shown in Figure 7; In step 506, treat that whole reduction process is finished after, open valve, treat can carry out unloading piece behind the stiffener plate inside and outside air pressure balance.
Bogey of the present invention can carry out the loading and unloading sheet of transparent conducting film glass thinning single surface technological process easily; guarantee air tight, the liquid-impermeable of whole device in the working process; and in the airtight protection that the transparent conducting film glass fixed is realized simultaneously to the plated film face; need not to increase extra plated film face protective layer and make and remove operation; the manufacturing process that one side has been simplified the thinning single surface transparent conducting glass; reduce starting material and facility investment, reduced production cost.On the other hand, bogey of the present invention has realized that the non-plated film face of transparent conducting film glass does not have any clamp position of blocking.Thereby the non-plated film face of chemical liquid and glass is contacted comprehensively, the transparent conducting film glass thickness uniformity behind the attenuate uniformly.
In addition, vacuum pad on the bogey of the present invention is after reaching required vacuum tightness, promptly disconnect with the vacuum pumping source, in whole attenuate etching process, rely on the enough volumetrical vacuum buffer cavitys that are provided with in the stiffener plate on the described vacuum pad, realization is fixed the firm absorption of transparent conducting film glass, this method had both reduced the consumption of the energy in the thinning process, had simplified the structure of bogey again greatly.Its ultimate principle is utilized The Ideal-Gas Equation, and details are as follows:
Under the normal conditions, the volume of 1mol perfect gas is about 22.4L.The Ideal-Gas Equation is: PV=nRT, wherein P represents that pressure, V represent that gas volume, n represent that amount of substance, T represent that absolute temperature, R are universal gas constant.
External atmosphere pressure is 1 standard atmospheric pressure, i.e. P 1=10 5Pa, suppose: the required transparent conducting film glass that carries out thinning single surface is of a size of 14 inches * 16 inches, i.e. S=35.56 * 40.64=1445cm 2According to the volume of incompressible vacuum buffer cavity 1f and the ratio of sheet glass 4 areas is 200cm 3: 1000cm 2Calculate, in sheet glass 4 zones that a slice is 14 inches * 16 inches, the airtight vacuum buffering cavity volume V that is provided with in the stiffener plate 0For: 1445 * 20%=289cm 3Depress at 1 standard atmosphere, the amount of substance of air is in this volume: n 1=V 0/ 22.4=289 * 10 -3/ 22.4=1.29 * 10 -2Mol.If during load on the bogey of the present invention vacuum tightness in the vacuum pad be P 2=10 3Pa then utilizes The Ideal-Gas Equation as can be known, and the amount of substance of the interior air of closed cavity this moment is
n 2=P 2n 1/ P 1=10 3* 1.29 * 10 -2/ 10 5=1.29 * 10 -4Mol, this moment 14 inches * 16 inches of a slices transparent conducting film glass on the barometric point that bears be:
N Just=(P 1-P 2) * S=(10 5-10 3) * 35.56 * 40.64 * 10 -4=14307N promptly is equivalent to be pressed in glass surface (pressing g=9.8N/kg calculates) with the weight of 1460kg.
If the continual gas leakage of bogey of the present invention in the reduction process process constantly has the vacuum buffer cavity in the air admission stiffener plate, suppose that it is 3cm that per minute enters vacuum buffer cavity air capacity 3/ min, pressure are that a standard atmospheric pressure is 10 5Pa, the reduction process 60min that presses consuming time calculates.Total leaked air quantity is in the then whole thinning process: n Let out=3 * 60 * 10 -3/ 22.4=8.0 * 10 -3Mol, then during unloading piece in the vacuum pad in the vacuum buffer cavity the total amount of substance of gas be: n 3=n 2+ n Let out=1.29 * 10 -4+ 8.0 * 10 -3Mol=8.13 * 10 -3Mol utilizes The Ideal-Gas Equation to get, and this moment, pressure was:
P 3=P 2n 3/ n 2=10 3* 8.13 * 10 -3/ 1.29 * 10 -4Mol=6.3 * 10 4Pa, this moment 14 inches * 16 inches of a slices transparent conducting film glass on the barometric point that bears be: N The end=(P 1-P 3) * S=(10 5-6.3 * 10 4) * 35.56 * 40.64 * 10 -4=5347N promptly is equivalent to be pressed in glass surface (pressing g=9.8N/kg calculates) with the weight of 546kg.Promptly cut off vacuum pump, reduction process carries out still having the masterpiece that is equivalent to the 546kg weight to be used for the coated glass surface after 1 hour, this shows that the vacuum buffer cavity 1f that is provided with on the bogey of the present invention can guarantee to cut off behind the vacuum pump in the 1 hour time that reduction process carries out at least to the firm absorption of sheet glass 4 and unlikely dropping.
Obviously, can sheet glass realize the sealing and fixing in the reduction process process, mainly sees the pressure P in the final vacuum pad 3With external atmosphere pressure P 1Between the pressure N that produces of draught head The endWhether enough with on the airtight vacuum pad that is fixed on the carrying anchor clamps of sheet glass, and the inside and outside pressure difference N of vacuum pad The endDepend primarily on the vacuum buffer cavity volume and the leakage of air amount that are provided with in the bogey, relational expression is as follows:
N The end=P 1S (1-22.4n Let out/ V 0)-P 2S
Wherein, P 1Be constant; When one timing of sheet glass size, S also is a constant; Therefore want to improve N The end, then to reduce leakage of air amount n Let outOr increase vacuum buffer cavity volume V 0, n Let outCan reduce by the resistance to air loss of controlling each several part junction on the bogey as far as possible, and V 0Then realize by the vacuum buffer cavity design of patterns on the bogey stiffener plate.But be not V 0Be the bigger the better, also will consider the rigid support effect of stiffener plate itself, so the volume of incompressible vacuum buffer cavity and the proportional range of sheet glass area are 200cm on the preferred described stiffener plate of the present invention 3: 1000cm 2To 600cm 3: 1000cm 2
The bogey of the present invention that is to use shown in Figure 6 sprays the synoptic diagram of attenuate.Wherein, sheet glass 4 is positioned at and accepts sprinkling equipment 7 on the vacuum pad 1 to its spray attenuate that carries out operation.Bogey of the present invention, realizing the airtight fixed of transparent conducting film glass plated film face simultaneously, can be by the delivery roll 2 of bogey bottom and leading sheave 3 stable transfer in specific stripping apparatus transporting rail at top, this method makes the chemical liquid uniform contact that the attenuate face of transparent conducting film glass ejects with stripping apparatus in moving process, in time dispose the reaction product that the glass surface chemical reaction produces by the souring of soup, avoid adhering to and piling up of product, thereby improved the apparent mass and the thickness evenness of transparent conducting film glass attenuate face.
As shown in Figure 7 in the present embodiment, airtight enclosure wall 1b and valve 1d can also be set independently in the both sides of stiffener plate 1a, be used for loading simultaneously two relative transparent conducting film glass 4, among the stiffener plate 1a of vacuum buffer cavity 1f between two sheet glass 4, vacuum buffer cavity 1f regional identical by in bleed duct 1c and the airtight enclosure wall 1b, leading sheave 3 is arranged at the top of the vacuum pad 1 of stiffener plate 1a, delivery roll 3 is arranged at the bottom, thereby realize two transparent conducting glass of a bogey carrying, carry out thinning single surface simultaneously.
Further, as shown in Figure 8,4 groups of airtight enclosure wall 1b and valve 1d can also be set independently, realize loading simultaneously 4 transparent conducting film glass 4, simultaneously the single face of 4 sheet glass be carried out attenuate and another conducting film is able to perfect protection in stiffener plate 1a both sides.Same, leading sheave 3 is arranged at the top of vacuum pad 1, and delivery roll 3 is arranged at the bottom.
In conjunction with the accompanying drawings embodiments of the invention are described above; but the present invention is not limited to above-mentioned embodiment; above-mentioned embodiment only is schematic; rather than it is restrictive; those of ordinary skill in the art is under enlightenment of the present invention; not breaking away under the scope situation that aim of the present invention and claim protect, also can make a lot of forms, these all belong to protection scope of the present invention.

Claims (10)

1. a transparent conducting film glass thinning single surface bogey is characterized in that, described device comprises sealing and the vacuum pad (1) that covers sheet glass (4) conduction face comprehensively and sheet glass (4) is adsorbed; The vacuum buffer cavity (1f) that is provided with the airtight duct of bleeding (1c) and communicates in vacuum pad (1) inside with the described duct of bleeding, the airtight chamber that forms by the duct of bleeding (1c) and vacuum buffer cavity (1f), and external vacuum pumping source disconnection under the vacuum tightness kept between vacuum pad (1) and the sheet glass (4) in whole attenuate etchant flow, adsorb sheet glass (4).
2. bogey according to claim 1, it is characterized in that described vacuum pad (1) comprising: as the stiffener plate (1a) of support frame, be separately positioned on the airtight enclosure wall (1b) at sheet glass (4) edge that is used on the stiffener plate (1a) to fit and be used to control that vacuum pad (1) is bled and/or the normal closed gate (1d) of intake operation; The described duct of bleeding (1c) is communicated with airtight enclosure wall (1b) interior region and valve (1d).
3. bogey according to claim 2, it is characterized in that, described stiffener plate (1a) is formed by dull and stereotyped applying of two homogeneities, wherein the one side of one flat plate is drilled with the through hole that serves as the duct of bleeding (1c), another side is milled with a plurality of grooves that serve as vacuum buffer cavity (1f), and described through hole communicates with groove.
4. bogey according to claim 3 is characterized in that, the volume of described vacuum buffer cavity (1f) is directly proportional with the sheet glass area, and its proportional range is preferably between 200cm 3: 1000cm 2To 600cm 3: 1000cm 2Between.
5. bogey according to claim 3, it is characterized in that, also be provided with the annular opening groove (1e) that is used to embed described airtight enclosure wall (1b) on the described stiffener plate (1a), the outline shape of described annular opening groove (1e) is suitable mutually with airtight enclosure wall (1b) frame outline shape, and the face profile shape of the two is suitable mutually with the outline shape of sheet glass (4).
6. according to each described bogey in the claim 1~5, it is characterized in that, also comprise: be fixed on the delivery roll (2) of vacuum pad (1) bottom, and the leading sheave (3) that is fixed on vacuum pad (1) top.
7. a utilization is installed the carrying transparent conducting film glass according to claim 1 and is carried out the thinning single surface method, it is characterized in that, comprises the steps:
A: the plated film face of sheet glass (4) and airtight enclosure wall (1b) zone of vacuum pad (1) are carried out the contraposition applying;
B: connect the vacuum pumping source, open vacuum pad valve (1d) vacuum pad (1) is vacuumized;
C: the bogey of will fit sheet glass (4) is conveyed into the attenuate workspace, to being exposed to the another side of outer sheet glass (4), finishes thinning single surface to utilize chemical liquid spray mode;
D: unload sheet glass (4).
8. thining method according to claim 7 is characterized in that, described step B further comprises: after reaching the vacuum tightness of enough absorption sheet glass (4) between vacuum pad (1) and the sheet glass (4), valve-off (1d) cuts off the vacuum pumping source.
9. thining method according to claim 7 is characterized in that, the transmission to sheet glass (4) among the described step C is to realize by being separately positioned on upper and lower leading sheave of bogey (3) and delivery roll (2).
10. thining method according to claim 7 is characterized in that, described step D further comprises: open valve (1d), treat the air pressure balance of the inside and outside portion of vacuum pad (1) after, unload sheet glass (4).
CN2009101050755A 2009-01-16 2009-01-16 Device for bearing transparent conductive film glass during thinning single surface and thinning method for transparent conductive film glass Expired - Fee Related CN101781091B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009101050755A CN101781091B (en) 2009-01-16 2009-01-16 Device for bearing transparent conductive film glass during thinning single surface and thinning method for transparent conductive film glass

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009101050755A CN101781091B (en) 2009-01-16 2009-01-16 Device for bearing transparent conductive film glass during thinning single surface and thinning method for transparent conductive film glass

Publications (2)

Publication Number Publication Date
CN101781091A CN101781091A (en) 2010-07-21
CN101781091B true CN101781091B (en) 2011-11-09

Family

ID=42521259

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009101050755A Expired - Fee Related CN101781091B (en) 2009-01-16 2009-01-16 Device for bearing transparent conductive film glass during thinning single surface and thinning method for transparent conductive film glass

Country Status (1)

Country Link
CN (1) CN101781091B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102108009B (en) * 2011-03-31 2013-05-01 信利半导体有限公司 Automatic etching and thinning device
TWI543037B (en) * 2013-08-01 2016-07-21 仁寶電腦工業股份有限公司 Touch module and assembling method thereof
CN103440067B (en) * 2013-08-07 2016-06-29 北京京东方光电科技有限公司 A kind of display floater, preparation method and display device
CN104671669B (en) * 2015-03-17 2017-07-11 蚌埠玻璃工业设计研究院 A kind of thinning glass substrate bogey
CN105523381B (en) * 2016-03-08 2017-12-29 陈妍雨 A kind of glass for vehicle window handling device
CN109790064B (en) * 2016-11-16 2022-01-07 日本电气硝子株式会社 Method for manufacturing glass substrate
CN109806728A (en) * 2018-12-26 2019-05-28 上海谷奇核孔膜科技股份有限公司 Prepare the device and method of nucleopore membranes
CN110078381B (en) * 2019-05-05 2023-06-09 蚌埠市羚旺新工艺材料研发科技有限公司 Spray type glass substrate thinning line
CN112408805B (en) * 2020-11-16 2022-05-17 中建材玻璃新材料研究院集团有限公司 Ultrathin glass thinning bearing device and thinning device
CN112592070B (en) * 2020-12-16 2022-05-17 中建材玻璃新材料研究院集团有限公司 Sheet glass single-side processing device
CN113307501B (en) * 2021-06-02 2022-05-17 中建材玻璃新材料研究院集团有限公司 Glass thinning processing device
CN113649346A (en) * 2021-07-13 2021-11-16 蚌埠国显科技有限公司 Stripping jig
CN114394759B (en) * 2021-12-24 2023-08-01 凯盛科技股份有限公司蚌埠华益分公司 Glass single-sided thinning method and glass thinning equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2233674Y (en) * 1995-04-07 1996-08-28 罗国胜 Vacuum preservation box
CN101082713A (en) * 2007-07-02 2007-12-05 信利半导体有限公司 Method for making Electric impedance type glass/glass type touch screen
CN201362646Y (en) * 2009-01-16 2009-12-16 中国南玻集团股份有限公司 Single-sided thinning bearing device of transparent conducting film glass

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2233674Y (en) * 1995-04-07 1996-08-28 罗国胜 Vacuum preservation box
CN101082713A (en) * 2007-07-02 2007-12-05 信利半导体有限公司 Method for making Electric impedance type glass/glass type touch screen
CN201362646Y (en) * 2009-01-16 2009-12-16 中国南玻集团股份有限公司 Single-sided thinning bearing device of transparent conducting film glass

Also Published As

Publication number Publication date
CN101781091A (en) 2010-07-21

Similar Documents

Publication Publication Date Title
CN101781091B (en) Device for bearing transparent conductive film glass during thinning single surface and thinning method for transparent conductive film glass
US9555607B2 (en) Tape sticking apparatus
TWI742023B (en) Substrate processing apparatus, method of detaching substrate from vacuum suction table of substrate processing apparatus, and method of placing substrate onto vacuum suction table of substrate processing apparatus
US9390948B2 (en) Tape attaching apparatus and tape attaching method
KR20060059824A (en) Reduced pressure drying apparatus
CN103779184A (en) Semiconductor wafer mounting method and semiconductor wafer mounting apparatus
JP2003270609A (en) Apparatus for producing assembled substrate and method for producing assembled substrate
WO2012061277A3 (en) Rapid and uniform gas switching for a plasma etch process
US20200122446A1 (en) Bonding device for flexible panel and method for bonding flexible panel
US20230219120A1 (en) Cover plate bearing device, cover plate cleaning device and cleaning method for cover plate
KR101605806B1 (en) Protective Film Removal Device
JP2004037594A (en) Substrate assembling device
CN203545883U (en) Novel transparent conductive film glass thinning bearing device
CN201362646Y (en) Single-sided thinning bearing device of transparent conducting film glass
KR20100062134A (en) Dry type ultrasonic wave cleaner for substrate
JP5989501B2 (en) Transport method
CN112408805A (en) Ultrathin glass thinning bearing device and thinning device
JP2015187648A (en) Bonding method and bonding device
CN205907184U (en) A glass processes protection device for glass is sour to be lost
KR101688842B1 (en) Substrate processing apparatus
WO2022137588A1 (en) Cleaning table for electronic device laminated body, cleaning device, and cleaning method
KR20150129195A (en) Loading chamber in thin film depositing apparatus and method for removing dust using the same
KR101990854B1 (en) Apparatus for Attaching Substrate and Method for Manufacturing Attached Substrate using the same
KR102023392B1 (en) Glass substrate separating apparatus and method thereof
KR20120136436A (en) Tray for transporting substrate

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: SHENZHEN NANBO DISPLAY DEVICE SCIENCE + TECHNOLOGY

Free format text: FORMER OWNER: CSG HOLDING CORPORATION

Effective date: 20110506

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 518067 NANBO BUILDING, NO. 1, GONGYE 6TH ROAD, SHEKOU, SHENZHEN CITY, GUANGDONG PROVINCE TO: 518067 NANBO INDUSTRY BUILDING, NO. 33, YANSHAN ROAD, SHEKOU, SHENZHEN, CHINA

TA01 Transfer of patent application right

Effective date of registration: 20110506

Address after: 518067 Chinese Shekou in Shenzhen along the mountain road No. 33 CSG Arts crafts emporium

Applicant after: Shenzhen CSG Display Devices Co., Ltd.

Address before: 518067 Guangdong province Shenzhen Shekou Industrial Road No. six building, CSG

Applicant before: CSG Holding Co., Ltd.

C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20111109

Termination date: 20190116