CN102108009B - Automatic etching and thinning device - Google Patents

Automatic etching and thinning device Download PDF

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Publication number
CN102108009B
CN102108009B CN 201110081582 CN201110081582A CN102108009B CN 102108009 B CN102108009 B CN 102108009B CN 201110081582 CN201110081582 CN 201110081582 CN 201110081582 A CN201110081582 A CN 201110081582A CN 102108009 B CN102108009 B CN 102108009B
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automatic
etching
reduction processing
unit
self
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CN102108009A (en
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蔡良照
郑志智
何基强
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Truly Opto Electronics Ltd
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Truly Semiconductors Ltd
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Abstract

The invention discloses an automatic etching and thinning device which comprises a thinning processor, a detection platform and a back processor, wherein, the thinning processor is provided with an automatic incoming material distributing platform, an etching machine and an automatic material discharging platform; the etching machine is provided with at least a thinning processing position; the automatic incoming material distributing platform automatically conveys material to a set thinning processing position; the material is thinned in the thinning processing position; the automatic material discharging platform conveys the thinned material to a material discharging position; the detection platform supports and conveys the material processed by the thinning processor; and the back processor, which comprises an incoming material conveying platform, a processing machine and a discharged material conveying platform, cleans, sprays and dries the material conveyed by the detection platform. The automatic etching and thinning device disclosed by the invention can greatly reduce direct operations of the operating personnel, reduce carrying movement of the operating personnel in the etching process, and reduce the labor intensity of the operating personnel.

Description

The automatic etching thinning device
Technical field
The present invention relates to a kind of glass substrate be carried out the equipment of etching attenuate, relate in particular to a kind of automatic etching thinning device.
Background technology
Present indicating meter just is being devoted to lighter, thinner future development.These indicating meters comprise flat-panel monitor (being called for short FPD), and wherein, FPD comprises electroluminescent display (ELD), liquid-crystal display (LCD) and plasma display (PDP).Glass substrate is the vitals among the FPD, and its weight and thickness are directly determining weight and the thickness of indicating meter.
In order to reduce the thickness of glass substrate, make it reach predetermined thickness, general technology is glass substrate to be immersed carry out etching in the etching solution, reaches the effect of attenuate through techniques such as polishings again.And traditional, be used for glass substrate is carried out etched stripping apparatus, generally comprise feeding mouth, etch bath, detection place, discharge port.Wherein, feeding mouth is used for treating that the glass substrate of attenuate sends into etch bath; Be equipped with etching solution in the etch bath, be used for glass substrate is carried out etching and cleaning; Detection place is used for detecting at the thickness of etching process to glass substrate; Discharge port then is the equipment that the glass that etching is finished is cleaned, dries and sends.
In traditional stripping apparatus and method, no matter be pan feeding, detection or discharging, all need technician's execute-in-place, and generally through pan feeding, detect after, if thickness is below standard, needs again pan feeding, detect such cyclical operation again, waste time and energy, production efficiency is not high.Because the etching solution of using in the etching is a kind of acidic solution with severe corrosive, and production environment and operator are had certain harm, so traditional stripping apparatus and method are unfavorable for that environment protection and operator's is healthy.
Summary of the invention
The technical problem to be solved in the present invention is to overcome the defective that prior art exists, and a kind of automatic etching thinning device is provided, and can carry out automatic reduction processing to glass substrate, reduces manual operation.
A kind of automatic etching thinning device provided by the invention comprises:
The reduction processing device, have automatic feeding dispense station, etching machine, self-emptying platform, described etching machine has at least one reduction processing position, described automatic feeding dispense station is with the reduction processing position of material automatic transport to setting, reduction processing is carried out to material in described reduction processing position, and described self-emptying platform will be through the mass transport of reduction processing to going out material level;
Monitor station supports and carries the material of processing through the reduction processing device;
Preprocessor comprises pan feeding transport platform, handler, discharging transport platform, and the material that monitor station is transported cleans, spray, drying and processing.
Preferably, also comprise crane, handle, hanging basket and controller, described crane is connected with handle, and described controller is provided with the overhead crane control unit, controls described crane crawl and moving hanging basket.
Preferably, described etching machine has at least two reduction processing positions, and each reduction processing position comprises cleaning unit, etching unit, secondary cleaning unit, spray unit successively.
Preferably, described automatic feeding dispense station is provided with automatic transport table, automatic feeding door, and described self-emptying platform is provided with automatic transport table and self-emptying door.
Preferably, described handler comprises alkali cleaning unit, spray unit, washing unit, first, the drying unit of the slow bill of lading that sets gradually.
Preferably, described alkali cleaning unit comprises alkali cleaning unit, secondary alkali cleaning unit, and described washing unit comprises once washes unit, secondary washing unit.
Preferably, described controller also comprises the reduction processing control unit, the folding of the movement of control automatic feeding dispense station and self-emptying platform along continuous straight runs and automatic feeding door, self-emptying door.
Preferably, described automatic feeding door, self-emptying door are respectively equipped with infrared inductor, and described infrared inductor and described reduction processing control unit are electrically connected.
Preferably, described controller also comprises the aftertreatment control unit, the folding of the folding of the feeding gate in the control pan feeding Transport Desk, the discharge door of discharging Transport Desk.
Preferably, described controller also comprises and returns the etching control unit, according to the instruction of setting material is delivered to via the self-emptying platform from monitor station and is re-started reduction processing the etching machine.
Compared with prior art, automatic etching thinning device of the present invention is owing to arrange reduction processing device, monitor station, preprocessor, automatic feeding dispense station, etching machine, self-emptying platform by the reduction processing device, material is carried out reduction processing, then to deliver to monitor station etc. to be detected, arrives after testing pre-determined thickness, then sends into preprocessor, as not reaching pre-determined thickness, then enter from the self-emptying platform and return reduction processing the etching machine; Pan feeding Transport Desk, handler, the discharging Transport Desk of preprocessor by its setting, the material that monitor station is transported cleans, spray, drying and processing.Because the setting of automatic feeding dispense station, self-emptying platform, monitor station, pan feeding Transport Desk, discharging Transport Desk, in the whole treating processes, operator only need detect the material through reduction processing on the monitor station and whether reach pre-determined thickness and get final product, thereby, utilize automatic etching thinning device of the present invention can reduce dramatically operator's direct control, reduce the action of operator's carrying at etching process, reduce operator's labour intensity, and reduced the healthy harm of etching solution to operator.
Description of drawings
Fig. 1 is the structural representation of automatic etching thinning device one preferred embodiment of the present invention.
Embodiment
For making purpose of the present invention, technical scheme, effect clearer, below in conjunction with accompanying drawing and a preferred embodiment automatic etching thinning device of the present invention is further described.
Referring to Fig. 1, automatic etching thinning device of the present invention comprises:
The reduction processing device has loading bay 1, automatic feeding dispense station 2, etching machine 3, self-emptying platform 4.Etching machine among the present invention has two reduction processing position 3A, 3B, the automatic feeding dispense station is with the reduction processing position of material automatic transport to setting, reduction processing is carried out to material in the reduction processing position, and self-emptying platform 4 will be from reduction processing position 3A, 3B mass transport out to going out material level 4A;
Monitor station 5 supports and carries the material of processing through the reduction processing device;
Preprocessor comprises pan feeding Transport Desk 6, handler 7, discharging Transport Desk 8, and the material that monitor station 5 is transported cleans, spray, drying and processing.
Automatic etching thinning device of the present invention also comprises crane, handle, hanging basket and controller (all not shown among the figure), crane is connected with handle, place material in the hanging basket, controller is provided with the overhead crane control unit, the control crane moves handle, lifting handle grabbing and moving hanging basket be to loading bay, loading bay with mass transport to the automatic feeding dispense station.Wherein, handle comprises pan feeding handle, reduction processing handle, discharging handle, is respectively applied to grasp in respective process hanging basket.
Each reduction processing position comprises cleaning unit, etching unit, second etch unit, secondary cleaning unit, three cleaning units, spray unit successively from being fed to the discharging direction.Wherein, one time cleaning unit, secondary cleaning unit, three cleaning units all take DI water that material is cleaned, and one time etching unit, second etch unit all take HF (hydrofluoric acid) liquid that material is carried out etching, attenuate; The spray unit takes DI water that material is sprayed.
Wherein, the automatic feeding dispense station is provided with automatic transport table, automatic feeding door, and the self-emptying platform is provided with automatic transport table and self-emptying door.
Wherein, handler comprises alkali cleaning unit, spray unit, washing unit, first, the drying unit of the slow bill of lading that sets gradually.The alkali cleaning unit adopts alkali lye that material is cleaned, and comprises alkali cleaning unit, secondary alkali cleaning unit; The spray unit adopts DI water that material is sprayed; The washing unit adopts DI water that material is cleaned, and comprises once washing unit, secondary washing unit; Drying unit carries out drying to the material through washing, prepares for discharging, comprises first drying unit, secondary drying unit.
Wherein, controller also comprises the reduction processing control unit, the folding of the movement of control automatic feeding dispense station and self-emptying platform along continuous straight runs and automatic feeding door, self-emptying door.
Wherein, automatic feeding door, self-emptying door are respectively equipped with infrared inductor, obtain the signal of hanging basket after, send a signal to the reduction processing control unit of controller, controller sends the shutter door instruction, automatic feeding door, self-emptying door are opened or are closed.
Wherein, controller also comprises the aftertreatment control unit, the folding of the discharge door of the folding of the feeding gate of automatic feed platform, self-feeding platform in the control preprocessor.
Wherein, controller also comprises and returns the etching control unit, according to the instruction of setting, sends steering order to crane, and crane is delivered to from monitor station material by handle and re-started reduction processing the etching machine via the self-emptying platform.
Wherein, automatic etching thinning device of the present invention also is provided with screen 9.
Wherein, automatic etching thinning device of the present invention is provided with an operator's console (not shown), and to the request of controller input control, various buttons also are provided with corresponding pilot lamp by the various buttons on this operator's console, when pilot lamp is bright, represent that the operation of corresponding button representative is carried out.
The working process of automatic etching thinning device of the present invention is as follows:
Automatic feeding:
This process can operate manually or automatically.
Select when manual, execution action separately behind the button of push platform, this moment, the pilot lamp of middle button was bright.
When automatic, the middle button pilot lamp goes out, pan feeding handle automatic aligning, and the complete rear pan feeding handle of contraposition remains on the mid-way, and the pan feeding handle goes downwards to the lower limit standby; At this moment, the hanging basket that glass substrate is housed is put into the fixed position, after placing hanging basket, press " afterwards " key on the operator's console, the pan feeding handle lifting basket that automatically moves ahead, then it is moved and be put on the loading bay, be sent on the automatic feeding dispense station by loading bay, pan feeding handle self-return under the effect of controller is waited for.After hanging basket is placed on the automatic feeding dispense station, the automatic feeding door is opened automatically, hanging basket advances in company with the automatic feeding dispense station, (can arrange to enter first reduction processing position 3A or 3B or reduction processing position 3A, 3B and divide inflow at control panel before this), arriving reduction processing position 3A or 3B place stops, hang etc. the reduction processing handle and to get, at this moment, automatic feeding door autoshutdown, after the reduction processing handle is taken hanging basket away, the automatic transport table automatic backing of automatic feeding dispense station, the automatic feeding door is opened automatically, automatic transport table falls back on the position and waits to expect automatic feeding door autoshutdown.
Etching:
Hanging basket by crane from the automatic lifting of automatic feeding dispense station to etching machine, enter respectively reduction processing position 3A, 3B, in reduction processing position 3A or 3B, once wash successively, after the washing of etching, secondary, spray, it is to be conveyed to hang self-emptying platform etc.; Each groove time and etching time number average can be in the operator's console setting, and water level control, spray control are automatically and finish (but also manual operation); Draining, acid discharge liquid are electronic control, but the manual palpation operation is provided with video monitoring devices in the etching machine, monitor the etching situation of glass substrate.
After crane has been finished etchant flow, directly hanging basket is placed on the self-emptying platform, then returns and go to the spray cylinder; The automatic transport table of self-emptying platform is advanced to the material level that goes out of centre at this moment, stops behind the in-position, goes lifting before the discharging handle is automatic under the control of controller.The action of discharging handle is as follows: (when the middle button lamp is bright) pressed each corresponding button and carried out each action in the time of manually; Reaching " rear position " in " anteposition " could upper and lower action when putting in place; Automatically the time (the middle button lamp goes out), handle automatically after row go downwards to lower limit after putting in place, contraposition this moment is complete; Automatically mode of motion is the time: be up to interposition, move ahead that it is rear up to put in place, go downwards to lower limit after row puts in place behind the up rear row that puts in place.
Thickness detects:
After hanging basket being put into the pan feeding Transport Desk of preprocessor when handle, this moment, the self-emptying door was opened automatically, and the pan feeding transport platform of preprocessor is transported to inspecting stand with hanging basket, wait to be detected, self-emptying door autoshutdown.On monitor station, through detecting, when if the thickness of glass substrate does not reach pre-determined thickness, then need to return etching, returning etched process is: check complete after, press and return the erosion button on the operator's console, this moment, the self-emptying door was opened automatically, and the pan feeding Transport Desk of preprocessor is retracted in the etching machine automatically, and the self-emptying door is closed, handle is automatically sling and need be returned etched glass substrate, be put back on the self-emptying platform of etching machine, self-emptying platform return treats that crane hangs in again etching in the etching machine, the etching process of this moment needs to revise etching parameter.Then, the discharging handle is got back to rear position standby automatically.Wherein, the mode of motion when the discharging handle returns etching is: move ahead after being up to upper limit, moving ahead goes downwards to interposition after putting in place, then goes afterwards, and rear row is to rear position, goes downwards to lower limit.
Clean:
When, hanging basket complete when etching goes out to inspecting stand, after testing, after the thickness of glass substrate reaches requirement, check completely, press into the basket button that the bin gate that enters of preprocessor rises, hanging basket is automatically sent into handler and is cleaned, and enters the bin gate autoshutdown this moment.
After hanging basket put in place, a crane drove hanging basket and carries out successively an alkali cleaning, secondary alkali cleaning, spray washing, secondary spraying washing, carries cylinder slowly, and crane drives that hanging basket is carried automatically slowly, the flow process of first drying, secondary drying, then discharging.Wherein, in the cleaning process, each water level and temperature control all can be controlled automatically, and each groove position soak time can be changed at operator's console, and adding water and draining can carry out in operation in manual operation.
After crane is finished cleaning process flow, hanging basket is placed on the discharging Transport Desk, this moment, the self-emptying door was opened automatically, at this moment transportation hanging basket discharging, the discharging rear self-emptying door autoshutdown that puts in place can take off hanging basket, press " advancing " button, discharge door is opened, and Transport Desk is retracted into waits to expect the discharge door autoshutdown in the machine.
Only be preferred implementation of the present invention below, should be pointed out that above-mentioned preferred implementation should not be considered as limitation of the present invention, protection scope of the present invention should be as the criterion with the claim limited range.For those skilled in the art, without departing from the spirit and scope of the present invention, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.

Claims (8)

1. an automatic etching thinning device is characterized in that, comprising:
The reduction processing device, have automatic feeding dispense station, etching machine, self-emptying platform, described etching machine has at least one reduction processing position, described automatic feeding dispense station is with the reduction processing position of material automatic transport to setting, reduction processing is carried out to material in described reduction processing position, and described self-emptying platform will be through the mass transport of reduction processing to going out material level;
Monitor station supports and carries the material of processing through the reduction processing device;
Preprocessor comprises pan feeding Transport Desk, handler, discharging Transport Desk, and the material that monitor station is transported cleans, spray, drying and processing;
Also comprise crane, handle, hanging basket and controller, described crane is connected with handle, and described controller is provided with the overhead crane control unit, controls described crane crawl and moving hanging basket;
Described controller also comprises and returns the etching control unit, according to the instruction of setting material is delivered to via the self-emptying platform from monitor station and is re-started reduction processing the etching machine.
2. automatic etching thinning device as claimed in claim 1 is characterized in that, described etching machine has at least two reduction processing positions, and each reduction processing position comprises cleaning unit, etching unit, secondary cleaning unit, spray unit successively.
3. automatic etching thinning device as claimed in claim 1 is characterized in that, described automatic feeding dispense station is provided with automatic transport table, automatic feeding door, and described self-emptying platform is provided with automatic transport table and self-emptying door.
4. automatic etching thinning device as claimed in claim 1 is characterized in that, described handler comprises alkali cleaning unit, spray unit, washing unit, first, the drying unit of the slow bill of lading that sets gradually.
5. automatic etching stripping apparatus as claimed in claim 4 is characterized in that, described alkali cleaning unit comprises alkali cleaning unit, secondary alkali cleaning unit, and described washing unit comprises once washes unit, secondary washing unit.
6. automatic etching thinning device as claimed in claim 3, it is characterized in that, described controller also comprises the reduction processing control unit, the folding of the movement of control automatic feeding dispense station and self-emptying platform along continuous straight runs and automatic feeding door, self-emptying door.
7. automatic etching thinning device as claimed in claim 6 is characterized in that, described automatic feeding door, self-emptying door are respectively equipped with infrared inductor, and described infrared inductor and described reduction processing control unit are electrically connected.
8. automatic etching thinning device as claimed in claim 1 is characterized in that, described controller also comprises the aftertreatment control unit, the folding of the folding of the feeding gate in the control pan feeding Transport Desk, the discharge door of discharging Transport Desk.
CN 201110081582 2011-03-31 2011-03-31 Automatic etching and thinning device Active CN102108009B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103880295B (en) * 2014-02-26 2017-01-11 江西沃格光电股份有限公司 Glass thinning equipment and glass thinning method
CN105870008B (en) * 2016-04-18 2018-10-23 武汉华星光电技术有限公司 Etching machines and engraving method
CN112341004B (en) * 2020-10-26 2021-11-16 恩利克(浙江)显示科技有限公司 Ultra-thin glass substrate processing method and display panel processing method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101209902A (en) * 2006-12-29 2008-07-02 崔灒圭 Glass thinning method
CN101215100A (en) * 2008-01-16 2008-07-09 京东方科技集团股份有限公司 Flat glass substrate attenuation etching groove
WO2008111729A1 (en) * 2007-03-09 2008-09-18 Innoroot Co., Ltd. Method of thinning substrate, apparatus for thinning substrate and system having the same
CN101399195A (en) * 2007-09-26 2009-04-01 中芯国际集成电路制造(上海)有限公司 Thinning method for backing side of wafer
CN101781091A (en) * 2009-01-16 2010-07-21 中国南玻集团股份有限公司 Device for bearing transparent conductive film glass during thinning single surface and thinning method for transparent conductive film glass
JP2010225790A (en) * 2009-03-23 2010-10-07 Dainippon Screen Mfg Co Ltd Method of thinning substrate, and substrate thinning device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101209902A (en) * 2006-12-29 2008-07-02 崔灒圭 Glass thinning method
WO2008111729A1 (en) * 2007-03-09 2008-09-18 Innoroot Co., Ltd. Method of thinning substrate, apparatus for thinning substrate and system having the same
CN101399195A (en) * 2007-09-26 2009-04-01 中芯国际集成电路制造(上海)有限公司 Thinning method for backing side of wafer
CN101215100A (en) * 2008-01-16 2008-07-09 京东方科技集团股份有限公司 Flat glass substrate attenuation etching groove
CN101781091A (en) * 2009-01-16 2010-07-21 中国南玻集团股份有限公司 Device for bearing transparent conductive film glass during thinning single surface and thinning method for transparent conductive film glass
JP2010225790A (en) * 2009-03-23 2010-10-07 Dainippon Screen Mfg Co Ltd Method of thinning substrate, and substrate thinning device

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Effective date of registration: 20170811

Address after: 516600 Guangdong Industrial Zone, Shanwei City Road, Lee Lee Industrial City, a district of the building fifteenth

Patentee after: Truly Opto-Electronics Ltd.

Address before: 516600, Guangdong City, Shanwei Province Industrial Road, Xinli electronic industrial city

Patentee before: Xinli Semiconductor Co., Ltd.