TWI735698B - Manufacturing method of glass substrate - Google Patents

Abstract

A method of manufacturing a glass substrate includes: while conveying the glass substrate 2 in a horizontal position in a conveying direction, passing it through a body part (5a) and a top plate part (5b) that are arranged facing each other. The processing space (13) is used to supply air from the air supply port (14) provided in the main body (5a) to the processing space (13), and is provided at the upstream end of the main body (5a) in the conveying direction. The processing gas (4) exhausted from the processing space (13) at the exhaust port (15) at the downstream end and the downstream side end is a process in which the lower surface (2a) of the glass substrate (2) is etched; its characteristics are: Regarding the distance along the conveying direction, compared to the distance (D1) between the exhaust port (15) at the upstream end and the most upstream air supply port (14) (D1), the exhaust port (15) at the downstream end The distance (D2) between) and the air supply port (14) on the most downstream side is longer.

Description

Manufacturing method of glass substrate

[0001] The present invention relates to a method for manufacturing a glass substrate including a process in which the lower surface of the glass substrate is etched with a processing gas such as hydrogen fluoride while the glass substrate is conveyed in a horizontal position.

[0002] In a well-known manner, glass substrates can be used in flat panel displays represented by liquid crystal displays, plasma displays, organic electroluminescence displays, field emission displays, or mobile terminals such as smart phones and tablet computers. A variety of electronic devices.　　[0003] During the manufacturing process of the glass substrate, there was a problem caused by static electricity. For example, when the glass substrate is placed on a support table where the specified treatment should be performed on the glass substrate, there are occasions where the glass substrate sticks to the support table due to static electricity. In such a case, when the glass substrate that has been processed is lifted from the support table, the glass substrate may be damaged. [0004] Therefore, as a countermeasure to this type of problem, it is known that the surface of the glass substrate is etched with a processing gas such as hydrogen fluoride before the specified processing is performed to roughen the surface and avoid the problem caused by static electricity. The way it happened. Therefore, Patent Document 1 discloses an example of a technique for performing an etching treatment on the surface of a glass substrate. [0005] The method disclosed in this document is to transport the glass substrate in a flat position while using a processing gas supplied from a processor (surface treatment device in the same document) disposed on the transport path to treat the glass substrate. The lower surface is etched. [0006] The processor used in the same technique is equipped with a conveying path that sandwiches the glass substrate up and down and opposes the upper structure and the lower structure (in the same document, a pair of gap forming members). A processing space (in the same document, a gap) for etching processing is formed between each other. The lower structure is provided with a gas supply port for supplying processing gas to the processing space and an exhaust port for discharging processing gas from the processing space. The exhaust ports are respectively provided at the upstream end and the downstream end in the conveying direction of the lower structure. In contrast, the air supply port is located in the middle of the two exhaust ports. [0007] Next, in the same manner, the processing gas is supplied from the gas supply port to the processing space, and the processing gas is discharged from the processing space through the exhaust port, and the lower surface of the glass substrate that passes through the processing space along with the transportation is performed. Etching treatment roughens the lower surface. [Prior Art Document] [Patent Document] 　　[0008] [Patent Document 1] JP 2014-125414 A

[0009] However, when the etching process is performed by the above-mentioned method, the following problems that should be solved may occur.

That is, when the glass substrate passes through the processing space, the processing gas supplied from the air supply port to the processing space is easily dragged by the glass substrate and flows from the upstream side to the downstream side in the conveying direction. Therefore, the supplied processing gas hardly flows to the exhaust port side at the upstream end, but after it flows to the exhaust port side at the downstream end, it is exhausted from the exhaust port at the downstream end. . Because of this, the current situation is that the area in the processing space where the lower surface of the glass substrate can be etched is essentially limited to the area from the air supply port to the exhaust port at the downstream end, which is the entire length of the processing space. Approximately half of the area cannot be used for etching. Therefore, it is impossible to perform sufficient etching treatment on the lower surface of the glass substrate, and it is sometimes difficult to roughen the lower surface to the desired degree.

The present invention made in view of the above circumstances is a technical problem when the lower surface of the glass substrate is etched with a processing gas while the glass substrate is conveyed in a horizontal position, so that it can be implemented reliably.

The present invention, proposed to solve the above-mentioned problems, includes: while conveying the glass substrate in a horizontal position in the conveying direction, passing it through a processing space formed between an upper structure and a lower structure that are arranged facing each other , While using the air supply port provided in the lower structure to supply air to the processing space, and to exhaust air from the processing space through the exhaust ports respectively provided at the upstream end and the downstream end in the conveying direction of the lower structure Processing gas Body, a method for manufacturing glass substrates in which the lower surface of the glass substrate is etched; the characteristic is that the distance along the conveying direction is compared to the exhaust port at the upstream end and the air supply port at the most upstream side The mutual distance between the exhaust port at the downstream end and the air supply port at the most downstream side is relatively long.

In this method, the area from the air supply port on the most upstream side to the air outlet port on the downstream side in the processing space becomes an area where the lower surface of the glass substrate can be substantially etched. Based on this point, the distance along the conveying direction is compared with the distance between the exhaust port at the upstream end and the air supply port at the most upstream side. If the distance between the air supply ports is lengthened, the following effects can be obtained. That is, in this way, since the most upstream air supply port is arranged on the upstream side than the middle position of the two exhaust ports in the processing space, only the part of the air supply port on the upstream side can be Extend the area where the lower surface of the glass substrate can be etched. That is, the reaction time between the processing gas and the lower surface of the glass substrate can be lengthened. As a result, it is possible to reliably perform the etching treatment on the lower surface of the glass substrate.

In the above method, it is preferable to form the air supply port into a slit shape elongated in the width direction orthogonal to the conveying direction of the glass substrate.

This method can be advantageous in that the processing gas is evenly supplied to the processing space in the width direction. As a result, the lower surface of the glass substrate can be easily etched uniformly in the width direction.

In the above method, it is preferable to arrange a plurality of gas supply ports along the conveying direction and supply the processing gas from each gas supply port.

[0017] In this way, regarding the processing gas in the processing space, since the occurrence of uneven concentration along the width direction can be easily avoided, it is more advantageous to uniformly etch the lower surface of the glass substrate in the width direction. .　　[0018] In the above method, it is preferable to maximize the flow rate of the processing gas supplied from the gas supply port on the most downstream side among the plurality of gas supply ports.　　[0019] In this way, the lower surface of the glass substrate can be etched more effectively.

[0020] According to the present invention, when the glass substrate is transported in a horizontal position while etching the lower surface of the glass substrate with a processing gas, it can be performed reliably.

[0022] Hereinafter, the manufacturing method of the glass substrate of the embodiment of the present invention will be described with reference to the accompanying drawings. First, the manufacturing apparatus of the glass substrate used in the manufacturing method of a glass substrate is demonstrated.　　[0023] Here, in the following description, the conveyance direction of the glass substrate (the direction from right to left in FIG. 1) is marked as the "conveyance direction". In addition, the width direction of the glass substrate orthogonal to the conveying direction (the direction perpendicular to the paper surface in Figure 1) is marked as "width direction", and the length along the "width direction" is marked as "full width" or " Width size". In addition, the vertical direction facing the upper and lower surfaces of the glass substrate is referred to as the "up and down direction". [0024] As shown in FIG. 1, a glass substrate manufacturing apparatus 1 is provided as a main constituent element: a conveying means 3 for horizontally conveying a glass substrate 2 in a flat position, for facing the glass substrate 2 being conveyed The lower surface 2a of the glass substrate 2 uses a processing gas 4 (hydrogen fluoride in this embodiment) to perform an etching process with a processor 5, and a rinse gas jet nozzle 7 for spraying a rinse gas 6 for preventing the upper surface 2b of the glass substrate 2 from being etched. , A chamber 8 for preventing the processing gas 4 from leaking to the outside from the space 9 formed inside the glass substrate 2 is provided with the import port 8aa and the export port 8ab of the glass substrate 2 and is arranged on the conveyance path of the glass substrate 2 The first dummy processor 10 between the processor 5 and the export port 8ab, and the second dummy processor 11 arranged between the processor 5 and the import port 8aa, and the lower part for the processing gas 4 and the glass substrate 2 The product generated by the reaction on the surface 2a is sucked and discharged from the suction nozzle 12 to the outside of the chamber 8.　　[0025] The conveying means 3 is composed of a plurality of rollers 3a arranged on the conveying path of the glass substrate 2. With the plurality of rollers 3a, the glass substrate 2 can be conveyed along a conveying path extending in a straight line. Between the rollers 3a adjacent to each other in the conveying direction, the entire width of the lower surface 2a of the glass substrate 2 is exposed. By reacting the exposed lower surface 2a with the processing gas 4, an etching process is performed and the entire width of the lower surface 2a is roughened. In addition, as the conveying means 3, something other than a plurality of rollers 3a may be used, and other materials may be used as long as the whole width of the lower surface 2a of the glass substrate 2 can be exposed during conveyance. [0026] The processor 5 is provided with a main body portion 5a as a lower structure, a top board portion 5b as an upper structure body, and a top board portion 5b as a preventive factor, which sandwiches and opposes the conveying path of the glass substrate 2 up and down. H steel 5c is used as a reinforcing member for the deflection caused by its own weight. Between the main body part 5a and the top plate part 5b, a processing space 13 for performing an etching process on the glass substrate 2 passing therethrough is formed. The processing space 13 is formed as a flat space. The width dimension W1 (refer to FIG. 2) of the processing space 13 and the thickness dimension T1 along the vertical direction are respectively larger than the entire width W2 (refer to FIG. 2) of the glass substrate 2 and the thickness T2 of the glass substrate 2. [0027] Here, when the glass substrate 2 enters the interior from outside the processing space 13, in order to prevent the air and other gases accompanying this and existing around the glass substrate 2 from flowing into the processing space 13, the processing space along the conveying direction is made The length dimension L1 of 13 is preferably in the range of 300 mm to 2000 mm, and more preferably in the range of 600 mm to 1000 mm. In addition, from the viewpoint of properly injecting the flushing gas 6, the above-mentioned length dimension L1 is preferably different from the aspect of this embodiment, and is preferably longer than the length along the conveying direction of the glass substrate 2. In addition, the thickness dimension T1 of the processing space 13 is preferably made in the range of 4 mm to 30 mm. Furthermore, the ratio of the aforementioned length dimension L1 to the thickness dimension T1 (length dimension L1/thickness dimension T1) is preferably set in the range of 10 to 250.　　[0028] The main body part 5a has a rectangular parallelepiped shape. The main body 5a is provided with a gas supply port 14 for injecting and supplying the processing gas 4 to the processing space 13, an exhaust port 15 for sucking and exhausting the processing gas 4 from the processing space 13, and a heating valve The processing gas 4 supplied to the processing space 13 and heating means (not shown) such as a heater for preventing condensation caused by the processing gas 4. The exhaust ports 15 are respectively arranged at the upstream end and the downstream end in the conveying direction of the main body 5a. On the other hand, the air supply ports 14 are arranged in plural (three in this embodiment) between the exhaust port 15 at the upstream end and the exhaust port 15 at the downstream end along the conveying direction. . [0029] The gas supply port 14 on the most downstream side in the conveying direction of the plurality of gas supply ports 14 has the largest flow rate of the processing gas 4 that supplies gas to the processing space 13. In this embodiment, compared to the others The gas supply port 14 supplies processing gas 4 at twice the flow rate. On the other hand, among the plurality of gas supply ports 14, the concentration of the supplied processing gas 4 is made the same. Each air supply port 14 is connected to the processing space 13 between the rollers 3a adjacent to each other along the conveying direction. In addition, the flow rate of the processing gas 4 supplied from each gas supply port 14 is constant per unit time. Here, regarding the distance along the conveying direction, the distance L2 from the air supply port 14 on the most upstream side to the air supply port 14 in the center is set to be the same as that from the air supply port 14 in the center to the air supply port 14 on the most downstream side. The distance L3 is equal to each other. Furthermore, in this embodiment, three air supply ports 14 are configured, but it is not limited to this, and two or more than four may be configured.　　[0030] Each of the exhaust port 15 at the upstream end and the exhaust port 15 at the downstream end can send the processing gas 4 sucked from the processing space 13 into the space 16 formed inside the main body portion 5a. The space 16 is connected to an exhaust pipe 17 of a cleaning dust collecting device (not shown) arranged outside the chamber 8. Thereby, the processing gas 4 sent from the processing air 13 into the space 16 through the exhaust port 15 is then exhausted from the space 16 toward the cleaning dust collector through the exhaust pipe 17. In addition, the exhaust pipe 17 is connected to the downstream end of the space 16 in the conveying direction. The exhaust port 15 at the upstream end and the exhaust port 15 at the downstream end can also be provided with a mechanism to individually adjust the exhaust gas ("gas", not only the processing gas 4, but also included in the processing space After the outside 13 is drawn into the inside, it is sucked into the exhaust port 15). On the other hand, it is also possible to close the opening of the exhaust port 15 connected to the processing space 13, or to remove the part constituting the exhaust port 15 from the main body 5a to close the hole communicating with the space 16. , And the exhaust port 15 is omitted.　　[0031] Here, compared with the flow rate of the processing gas 4 supplied to the processing space 13 by each gas supply port 14, the gas flow rate of each exhaust port 15 exhausting from the processing space 13 is relatively large. In addition, the gas flow rate for exhausting each exhaust port 15 is constant per unit time. In addition, with regard to the distance along the conveying direction, compared to the distance D1 between the exhaust port 15 at the upstream end and the air supply port 14 on the most upstream side, the exhaust port 15 at the downstream end and the most downstream distance D1 The distance D2 between the air supply ports 14 is relatively long. The length of the mutual distance D2 is preferably 1.2 times or more of the mutual distance D1, preferably 1.5 times or more, and most preferably 2 times or more.　　[0032] As shown in FIG. 2, both the air supply port 14 and the exhaust port 15 are formed in a slit shape elongated in the width direction. The width dimension of the air supply port 14 can be made slightly shorter than the full width of the glass substrate 2 as shown in the figure, or it can be made slightly longer than the full width of the glass substrate 2 differently from the same figure. On the other hand, the width dimension of the exhaust port 15 is slightly longer than the entire width of the glass substrate 2. Here, in order to make it easy to supply the processing gas 4 uniformly along the width direction, the opening length S1 of the gas supply port 14 along the conveying direction is preferably made in the range of 0.5 mm to 5 mm. In addition, the opening length of the exhaust port 15 along the conveying direction is longer than the opening length S1 of the air supply port 14 along the conveying direction. Furthermore, in order to avoid that the gas suction formed by the exhaust port 15 hinders the execution of the smooth etching process, the distance L4 from the upstream end edge 5aa of the main body 5a to the exhaust port 15 at the upstream end is compared with The distance L4 from the downstream end edge 5ab to the exhaust port 15 at the downstream end is preferably common and should be in the range of 1 mm to 20 mm. [0033] As shown in FIG. 1, the top portion of the main body portion 5a opposite to the lower surface 2a of the glass substrate 2 passing through the processing space 13 is composed of a plurality of units arranged side by side without gaps along the conveying direction (in this embodiment) There are eight types, including the air supply unit 18 and the connecting unit 19) which will be described later. These plural units constitute the top of the main body portion 5a and constitute the ceiling of the aforementioned space 16. [0034] Among the plurality of units, the air supply unit 18 that forms the air supply port 14 and the connection unit 19 that forms the air supply port 14 are included (in FIG. 2, the air supply unit 18 and the connection unit are surrounded by thick lines, respectively). 19). In this embodiment, among a plurality of units side-by-side, the air supply unit 18 is side-by-side at the second, fourth, and sixth positions from the upstream side in the conveying direction. On the other hand, the connecting unit 19 is arranged side by side at the first, third, fifth, seventh, and eighth positions from the upstream side in the conveying direction. The gas supply unit 18 is provided with a gas supply nozzle 18 a connected to the gas supply port 14, and the gas supply nozzle 18 a is connected to a generator (not shown) of the processing gas 4 arranged outside the chamber 8. The connecting unit 19 connects the adjacent air supply units 18 and between the air supply unit 18 and the exhaust port 15.　　[0035] Here, the connection unit 19 (19x) at the first position (the position on the most upstream side) from the upstream side in the conveying direction is arranged and fixed at this position. On the other hand, the connection unit 19 at the third, fifth, seventh, and eighth positions from the upstream side can be replaced with the air supply unit 18, or the air supply port 14 can be replaced by being formed The exhaust unit 20 described later of the exhaust port 20a (in FIG. 1, the exhaust unit 20 is not used). In addition, the air supply unit 18 at the second, fourth, and sixth positions from the upstream side may be replaced with a connection unit 19 or an exhaust unit 20 described later. Thereby, it is possible to add and change the number of the air supply ports 14 or the position of the air supply ports 14 for changing the conveying direction. Furthermore, assuming that the exhaust unit 20 is arranged, the process gas 4 may be exhausted from the exhaust ports 15 and 15 at the upstream end and the downstream end. Hereinafter, the replacement of these units will be described with reference to FIGS. 3a to 3d.　　[0036] In each of FIGS. 3a to 3c, the air supply unit 18, the connection unit 19, and the exhaust unit 20 shown are surrounded by thick lines, and their lengths along the conveying direction are made equal to each other. Therefore, in the case of replacing these units, the unit newly arranged with the replacement can be connected to the two adjacent units (in each of Figures 3a to 3c, the two adjacent units shown in the figure are both connecting units. 19 In case), they are arranged side by side without gaps. Furthermore, the newly arranged units can be arranged side by side with no difference in the vertical direction from the two adjacent units.　　[0037] Here, as shown in FIG. 3a, the peripheral area 14a of the air supply port 14 of the air supply unit 18 is located at a higher position in the up and down direction than other areas. Thereby, in the peripheral area 14a of the air supply port 14, the distance from the lower surface 2a of the glass substrate 2 passing through the processing space 13 can be made shorter compared to other areas. In this embodiment, the distance between the peripheral area 14a of the air supply port 14 and the lower surface 2a of the glass substrate 2 is half the distance from the lower surface 2a of the glass substrate 2 in other areas. Then, the separation distance is shortened by this part, and the tip of the gas supply port 14 (the outflow port of the processing gas 4) is in a state close to the lower surface 2a of the glass substrate 2. In addition, as shown in FIG. 3c, assuming that the exhaust unit 20 is arranged, the exhaust port 20a formed in the exhaust unit 20 is connected to the aforementioned space 16. Thereby, the processing gas 4 sent from the processing air 13 into the space 16 through the exhaust port 20a is then exhausted from the space 16 toward the cleaning dust collector through the exhaust pipe 17. In addition, the exhaust port 20a is formed in a slit shape elongated in the width direction similarly to the exhaust port 15 at the upstream end and the exhaust port 15 at the downstream end. Here, as shown in FIG. 3d, the peripheral area 14a of the air supply port 14 of the air supply unit 18 can also be made to be the same height as other areas.　　[0038] As shown in FIG. 1, the top plate 5b is a single plate (a rectangular plate in plan view), and has a flat surface facing the upper surface 2b of the glass substrate 2 passing through the processing space 13. In addition, the top plate portion 5b is a built-in heating means (illustration omitted) such as a heater for preventing condensation caused by the processing gas 4. The H steel 5c is attached to the top plate part 5b to extend in the width direction. Furthermore, there are a plurality of H steels 5c (three in this embodiment), and these plural H steels 5c are arranged at equal intervals along the conveying direction.　　[0039] The flushing gas injection nozzle 7 is arranged on the upstream side of the processor 5 in the conveying direction and above the conveying path of the glass substrate 2. The flushing gas injection nozzle 7 can form a gap 13a between the portion of the glass substrate 2 that enters the processing space 13 and the top plate portion 5b, and inject the flushing gas 6 downstream in the conveying direction to form the flushing gas 6 along the conveying direction flow. The flow of the flushing gas 6 can form a full width across the gap 13a. In addition, the flow velocity of the flushing gas 6 injected along the conveying direction is relatively faster than the conveying speed of the glass substrate 2 formed by the conveying means 3. Thereby, the processing gas 4 that is about to flow into the gap 13a is driven to the downstream side in the conveying direction by the pressure of the flushing gas 6, and the inflow into the gap 13a can be prevented. Therefore, the roughening of the upper surface 2b of the glass substrate 2 is avoided. Moreover, in this embodiment, compressed dry air (CDA) is used as the flushing gas 6.　　[0040] As shown in FIG. 4a, the flushing gas 6 is attached to the leading head 2f of the glass substrate 2 that is being transported and starts to spray immediately before entering the processing space 13. Furthermore, as shown in FIG. 4b, the flushing gas 6 is tied to the last part 2e of the glass substrate 2 being transported and stops jetting immediately before entering the processing space 13. Here, in the present embodiment, the timing of the start or stop of the flushing gas 6 injection is determined in the following manner. First, on the upstream side of the flushing gas injection nozzle 7 in the conveying direction, a detection means (not shown) such as an induction device capable of detecting the passage of the leading portion 2f or the trailing portion 2e of the glass substrate 2 is arranged. When the detection means detects that the leading head 2f of the glass substrate 2 passes, it is determined to start the flushing gas 6 injection based on the transport speed of the glass substrate 2 and the distance along the transport path from the leading head 2f to the processing space 13 The timing. Similarly, when the detecting means detects that the last part 2e has passed, the timing to stop spraying is determined based on the conveying speed and the distance from the last part 2e to the processing space 13.　　[0041] As shown in FIG. 5, the flushing gas injection nozzle 7 is provided with a cylindrical pipe 7a extending in the width direction. A plurality of hoses 7b are inserted into the pipe 7a at intervals in the width direction. Each hose 7b can supply flushing gas 6 into the pipe 7a. In addition, inside the pipe 7a, an elongated plate 7c in the width direction is installed, so that the flushing gas 6 flowing from each hose 7b into the pipe 7a is formed after the plate 7c in a circuitous manner, from and the pipe 7c The ejection portion 7d connected to 7a ejects. The injection port of the flushing gas 6 formed in the injection portion 7d is formed in a slit shape elongated in the width direction. The spraying angle θ of the flushing gas 6 formed by the spraying portion 7d (the angle at which the spraying portion 7d is inclined with respect to the pointing direction of the upper surface 2b of the glass substrate 2) can be changed within the range of 25° to 70°. In addition, the posture of the flushing gas injection nozzle 7 is shown as the solid line in FIG. 5, or it can be adjusted so that the injection portion 7d points into the processing space 13, or as shown by the broken line in the figure, the injection portion 7d can be adjusted so that the injection portion 7d points out of the processing space 13.　　[0042] As shown in Fig. 1, the chamber 8 has a rectangular parallelepiped shape. In addition to the aforementioned carry-in port 8aa and carry-out port 8ab, the chamber 8 also includes a main body 8a that forms a ceiling hole 8ac, and a lid body 8b for plugging the ceiling hole 8ac.　　[0043] The carry-in port 8aa and the carry-out port 8ab are formed on the side wall portion 8ad of the main body 8a, and are formed as elongated flat openings along the width direction. There are a plurality of chamber top holes 8ac (three in this embodiment) formed on the chamber top 8ae of the main body 8a. The cover 8b can plug the entire opening of the ceiling hole 8ac, and can be attached to and detached from the main body 8a. Thereby, by removing the cover 8b from the main body 8a, the ceiling hole 8ac can be opened, and the adjustment, maintenance, and inspection of the processor 5 can be performed through the ceiling hole 8ac. [0044] The first dummy processor 10 is provided with a rectangular box body 10a arranged below the conveying path of the glass substrate 2, a top plate 10b arranged above the conveying path so as to face the box 10a, and H steel 10c is a reinforcing member for preventing deflection caused by the weight of the top plate 10b. Between the box body 10a and the top plate 10b, a gap 21 for the glass substrate 2 to pass through is formed. The first dummy processor 10 functions as a windproof member for avoiding the airflow flowing from the export port 8ab into the chamber 8 to the processing space 13 and adversely affecting the etching process. Here, in order to effectively function as a windproof member, the length of the first dummy processor 10 along the conveying direction is preferably 50 mm or more, and more preferably 100 mm or more.　　[0045] At the upper end of the box body 10a, a rectangular opening 10aa that is elongated in the width direction is formed. On the other hand, at the bottom of the box body 10a, an exhaust pipe 22 of a cleaning dust collecting device (not shown) arranged outside the chamber 8 is connected. Thereby, the first dummy processor 10 can be dragged by the lower surface 2a of the glass substrate 2 and flow out from the processing space 13 toward the downstream side in the conveying direction. The processing gas 4 can be discharged from the exhaust pipe through the opening 10aa. 22 After suction, exhaust air to the cleaning dust collector. The top plate 10b is made as a single plate body (a rectangular plate body in plan view), and has a flat surface facing the upper surface 2b of the glass substrate 2 through which the gap 21 passes. The H steel 10c is tied to the top plate 10b and extends in the width direction.　　[0046] The first dummy processor 10 has the same external shape as the processor 5 when viewed from the direction along the conveying direction, and is arranged to appear to overlap the processor 5. In other words, between the main body portion 5a of the processor 5 and the box body 10a of the first dummy processor 10, the width dimension and the dimension along the vertical direction can be made the same. Similarly, (A) the top plate portion 5b of the processor 5 and the top plate 10b of the first dummy processor 10, (B) the H steel 5c of the processor 5 and the H steel 10c of the first dummy processor 10, (C) processing The processing space 13 of the device 5 and the gap 21 of the first dummy processor 10 are made the same in the width dimension and the dimension along the vertical direction between the combinations (A) to (C).　　[0047] The second dummy processor 11 has the same configuration as the first dummy processor 10, except for the following two points (1) and (2). Therefore, by attaching the same figure number to the second dummy processor 11 as that attached to the first dummy processor 10 in FIG. 1, the repeated description between the two processors 10 and 11 is omitted. (1) The configuration is different from the first dummy processor 10. (2) It serves as a point for avoiding the function of a windproof member for avoiding the airflow flowing into the chamber 8 from the carry-in port 8aa instead of the carry-out port 8ab to the processing space 13 and adversely affect the etching process. Also, the second dummy processor 11, like the first dummy processor 10, has the same external shape as the processor 5 when viewed from the direction along the conveying direction, and is arranged so as to overlap the processor 5 .　　[0048] The suction nozzle 12 is installed on the top 8ae of the chamber 8, and the suction port 12a is connected to the space 9. The suction port 12a is arranged on the downstream side of the first dummy processor 10 in the conveying direction, and is arranged at the downstream end of the space 9 in the conveying direction. The suction nozzle 12 is connected to a cleaning dust collecting device (not shown) arranged outside the chamber 8 and can discharge the sucked product to the cleaning dust collecting device. In addition, the suction port 12a is not limited to the same arrangement as in the present embodiment, as long as it is arranged above the conveyance path of the glass substrate 2. However, because it has the function of sucking and expelling the products generated during the etching process to the outside of the chamber 8, the suction port 12a is preferably arranged even if it is arranged differently from this embodiment. On the downstream side of the processor 5 in the conveying direction.　　[0049] Hereinafter, a method for manufacturing a glass substrate of the embodiment of the present invention using the above-mentioned glass substrate manufacturing apparatus 1 will be described.　　[0050] First, by transporting the glass substrate 2 by the transporting means 3, the glass substrate 2 is transported into the chamber 8 from the transport port 8aa. In addition, in this embodiment, the distance along the conveyance path from the import port 8aa to the export port 8ab is used as a reference, and the glass substrate 2 whose total length along the conveyance path is longer than this distance is regarded as the target of the etching process. . In addition, in this embodiment, the glass substrate 2 is conveyed at a fixed conveying speed.　　[0051] Next, the imported glass substrate 2 is passed through the gap 21 of the second dummy processor 11 arranged between the import port 8aa and the processor 5. In addition, the gas flowing from the inlet 8aa into the chamber 8 and flowing to the downstream side in the conveying direction along the lower surface 2a of the glass substrate 2 is connected to the exhaust pipe 22 at the bottom of the box 10a of the second dummy processor 11. Suction. In addition, by using the second dummy processor 11 as a windproof member, the gas flowing into the chamber 8 from the import port 8aa is prevented from reaching the processing space 13 of the processor 5.　　[0052] Next, the glass substrate 2 passed through the gap 21 of the second dummy processor 11 passes through the processing space 13 of the processor 5. At this time, the flushing gas 6 is sprayed from the leading head 2f of the glass substrate 2 immediately before entering the processing space 13. Then, on the lower surface 2a side of the glass substrate 2 through which the processing space 13 passes, the lower surface 2a is etched using the processing gas 4 supplied from each gas supply port 14 and the upstream end and downstream end are used to etch the lower surface 2a. Each exhaust port 15 exhausts the processing gas 4 from the processing space 13. On the other hand, on the upper surface 2b side of the glass substrate 2 through which the processing space 13 passes, the flow of the flushing gas 6 formed in the gap 13a prevents the upper surface 2b from being etched by the processor body 4. In addition, the product generated during the etching process is sucked by the suction nozzle 12 and discharged to the outside of the chamber 8. The flushing gas 6 is connected to the last part 2e of the glass substrate 2 and stops spraying immediately before entering the processing space 13.　　[0053] Here, in this embodiment, the spraying of the flushing gas 6 is stopped immediately before the last part 2e of the glass substrate 2 enters the processing space 13, but it is not limited to this. If the leading head 2f of the glass substrate 2 comes out of the processing space 13, it may be configured to stop spraying the flushing gas 6 before the last part 2e of the glass substrate 2 enters the processing space 13.　　[0054] Next, the glass substrate 2 after the etching process passed through the processing space 13 of the processor 5 is passed through the gap 21 of the first dummy processor 10 arranged between the processor 5 and the export port 8ab. In addition, the gas flowing from the outlet 8ab into the chamber 8 along the lower surface 2a of the glass substrate 2 toward the upstream side in the conveying direction is connected to the exhaust pipe 22 at the bottom of the box 10a of the first dummy processor 10. Suction. Furthermore, by using the function of the first dummy processor 10 as a windproof member, the gas flowing into the chamber 8 from the export port 8ab is prevented from reaching the processing space 13 of the processor 5. In addition, the exhaust pipe 22 sucks and exhausts the processing gas 4 that is dragged by the lower surface 2 a of the glass substrate 2 and flows out from the processing space 13 toward the downstream side in the conveying direction, and is exhausted to the outside of the chamber 8.　　[0055] Finally, the glass substrate 2 after passing through the gap 21 of the first dummy processor 10 is carried out from the export port 8ab to the outside of the chamber 8. As a result, the glass substrate 2 on which the lower surface 2a has been etched is obtained. According to the above, the manufacturing method of the glass substrate of the embodiment of the present invention is completed.　　[0056] The following describes the main functions and effects of the glass substrate manufacturing method according to the embodiment of the present invention. [0057] In this method, since the most upstream air supply port 14 is arranged on the upstream side than the middle position of the two exhaust ports 15, 15 in the processing space 13, only the air supply port 14 is skewed. On the upstream side, the substantial area (the area from the air supply port 14 on the most upstream side to the exhaust port 15 at the downstream end) that can be etched on the lower surface 2a of the glass substrate 2 can be elongated . In other words, the reaction time between the processing gas 4 and the lower surface 2a of the glass substrate 2 can be lengthened. As a result, it is possible to reliably perform the etching treatment on the lower surface 2a of the glass substrate 2.　　[0058] Herein, the manufacturing method of the glass substrate of the present invention is not limited to the aspects described in the above-mentioned embodiments. For example, it can also be formed between the exhaust port at the upstream end and the exhaust port at the downstream end, and a single air supply port is arranged on the upstream side than the middle position of the two exhaust ports. The state of supplying processing gas to the port. In this case, the only air supply port becomes the air supply port on the most upstream side and also the air supply port on the most downstream side. Therefore, even in this case, the exhaust port at the downstream end is compared with the most downstream side due to the distance between the exhaust port at the upstream end and the most upstream air supply port (the only air supply port). The air supply ports (the only air supply port) have a long mutual distance, so the above-mentioned functions and effects of the present invention can also be obtained in the same way.

[0059] 2. ‧ ‧ glass substrate 2a ‧ ‧ lower surface 4 ‧ ‧ processing gas 5a ‧ ‧ main body (lower structure) 5b ‧ ‧ top plate (upper structure) 13 ‧ ‧ processing space 14 ‧‧‧Air supply port 15‧‧‧Exhaust port D1‧‧‧Distance between each other D2‧‧‧Distance between each other

[0021] 　　 FIG. 1 is a schematic longitudinal sectional side view showing a manufacturing apparatus of a glass substrate.　　 FIG. 2 is a plan view of the main body of the processor included in the glass substrate manufacturing apparatus viewed from above.　　 FIG. 3a is an enlarged longitudinal sectional side view showing a part of the processor included in the manufacturing apparatus of the glass substrate.　　 FIG. 3b is an enlarged longitudinal sectional side view showing a part of the processor included in the manufacturing apparatus of the glass substrate.　　 FIG. 3c is an enlarged longitudinal sectional side view showing a part of the processor included in the manufacturing apparatus of the glass substrate.　　 FIG. 3d is an enlarged longitudinal sectional side view showing a part of the processor included in the manufacturing apparatus of the glass substrate.　　 Fig. 4a is an enlarged longitudinal sectional side view showing the vicinity of the flushing gas injection nozzle provided in the manufacturing apparatus of the glass substrate.　　 FIG. 4b is an enlarged longitudinal sectional side view showing the vicinity of the flushing gas injection nozzle provided in the manufacturing apparatus of the glass substrate.　　 Fig. 5 is an enlarged longitudinal sectional side view showing the vicinity of the flushing gas injection nozzle included in the manufacturing apparatus of the glass substrate.

1: Manufacturing device

2: Glass substrate

2a: lower surface

2b: upper surface

2e: last part

2f: head first

3: Means of transport

3a: roller

4: Process gas

5: processor

5a: Body part

5b: Top plate

5c: H steel

6: Flushing gas

7: Flushing gas jet nozzle

8: Chamber

8a: body

8aa: move entrance

8ab: move out

8ac: roof hole

8ad: side wall

8ae: top of the room

8b: cover

9: Space

10: The first dummy processor

10a: cabinet

10aa: opening

10b: Top plate

10c: H steel

11: The second dummy processor

12: Suction nozzle

12a: Suction port

13: processing space

13a: gap

14: Air supply port

15: Exhaust port

16: space

17: Exhaust pipe

18: Air supply unit

18a: Air supply nozzle

19, 19x: connection unit

21: gap

22: Exhaust pipe

T1: thickness dimension

T2: thickness

L1: Length dimension

L2, L3: distance

D1, D2: mutual distance

Claims (3)

A method for manufacturing a glass substrate, which includes: transporting the glass substrate in a horizontal position in a conveying direction and passing it through a processing space formed between an upper structure and a lower structure that are arranged facing each other while using it Air is supplied to the processing space from the air supply port provided in the lower structure, and the processing space is supplied from the processing space through exhaust ports respectively provided at the upstream end and the downstream end of the conveying direction of the lower structure The exhausted processing gas is a process in which the lower surface of the glass substrate is etched; the feature is that the gas is supplied between the exhaust port at the upstream end and the exhaust port at the downstream end One or more ports are arranged along the conveying direction; when the supply port is one, it is located on the upstream side than the middle position between the exhaust port at the upstream end and the exhaust port at the downstream end , When the air supply ports are arranged and the air supply ports are plural, the distance along the conveying direction is greater than the distance between the exhaust port at the upstream end and the air supply port on the most upstream side The distance between the exhaust port at the downstream end and the air supply port at the most downstream side is relatively long. As for the manufacturing method of the glass substrate of the 1st patent application range, the said air supply port is formed in the elongate slit shape along the width direction orthogonal to the conveyance direction of the said glass substrate. For example, in the manufacturing method of the glass substrate of item 1 or 2 of the scope of patent application, in the case where there are plural air supply ports, among the plural air supply ports, the processing gas supplied from the air supply port on the most downstream side The traffic is the most.

Images