WO2017043644A1 - Method for manufacturing glass substrate, and apparatus for manufacturing glass substrate - Google Patents

Method for manufacturing glass substrate, and apparatus for manufacturing glass substrate Download PDF

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Publication number
WO2017043644A1
WO2017043644A1 PCT/JP2016/076665 JP2016076665W WO2017043644A1 WO 2017043644 A1 WO2017043644 A1 WO 2017043644A1 JP 2016076665 W JP2016076665 W JP 2016076665W WO 2017043644 A1 WO2017043644 A1 WO 2017043644A1
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WO
WIPO (PCT)
Prior art keywords
glass substrate
carry
processing region
port
chamber
Prior art date
Application number
PCT/JP2016/076665
Other languages
French (fr)
Japanese (ja)
Inventor
祐之 高橋
大野　和宏
弘樹 中塚
隼人 奥
Original Assignee
日本電気硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気硝子株式会社 filed Critical 日本電気硝子株式会社
Priority to CN201680033810.4A priority Critical patent/CN107709259B/en
Priority to KR1020177032680A priority patent/KR102557690B1/en
Priority to JP2017538549A priority patent/JP6691694B2/en
Publication of WO2017043644A1 publication Critical patent/WO2017043644A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Definitions

  • the present invention relates to a glass substrate manufacturing method and an apparatus for manufacturing a glass substrate, in which a glass substrate is etched using a processing gas such as hydrogen fluoride.
  • glass substrates such as flat panel displays (FPD) represented by liquid crystal displays, plasma displays, organic EL displays, field emission displays, and mobile devices such as smart phones and tablet PCs.
  • FPD flat panel displays
  • LCD liquid crystal displays
  • organic EL displays organic EL displays
  • field emission displays and mobile devices
  • smart phones and tablet PCs Embedded in a variety of electronic devices.
  • the glass substrate in the manufacturing process of the glass substrate, there may be a problem due to electrostatic charging.
  • the glass substrate when a glass substrate is placed on a mounting table to perform a predetermined process on the glass substrate, the glass substrate may stick to the mounting table due to electrostatic charging, and the glass substrate has been processed. When it is going to peel off from a mounting base, the said glass substrate may be damaged.
  • Patent Document 1 A technique for avoiding the occurrence of this is known.
  • Patent Document 1 One specific example of this technique is disclosed in Patent Document 1.
  • etching processing is performed on a glass substrate being transported by spraying a processing gas from a blow nozzle on the upstream side of the transport path, and the processing gas is sucked by a suction nozzle on the downstream side of the transport path.
  • a method for exhausting the air is disclosed.
  • an etching process is often performed in the chamber in order to prevent the processing gas from leaking.
  • the chamber is formed with a carry-in port for carrying the glass substrate into the chamber and a carry-out port for carrying out the glass substrate.
  • the glass substrate carry-in port and the carry-out port are formed in the chamber, if an air flow flowing into the chamber through the carry-in port and the carry-out port is generated due to a difference in pressure inside and outside the chamber, this air flow is generated.
  • the processing gas to be sprayed on the glass substrate is blown off, and the surface of the glass substrate is unevenly roughened.
  • This invention made
  • formed in view of said situation enables the reliable execution, when performing an etching process to a glass substrate using process gas in the chamber in which the carrying-in port and carrying-out port of the glass substrate were formed. This is a technical issue.
  • the method according to the present invention which was created to solve the above-mentioned problems, was provided on the transport path of the glass substrate in the chamber while transporting the glass substrate carried into the chamber from the carry-in entrance in the horizontal direction.
  • “transporting the glass substrate in the horizontal direction” means not only when the glass substrate is transported in the non-inclined horizontal direction, but also tilting the glass substrate up and down within a range of 30 ° or less with respect to the horizontal plane. It also includes the case of transporting in the specified direction. Moreover, the attitude
  • windproof members are installed between the carry-in port and the processing region and between the process region and the carry-out port, respectively, the chamber is provided from both the carry-in port and the carry-out port. Even in an environment where airflow easily flows into the airflow, it is possible to prevent the airflow from flowing into the processing region as much as possible by the windproof member.
  • the conveyance path of the glass substrate extends in a straight line.
  • a gap for allowing the glass substrate being conveyed to pass is formed in the windproof member.
  • the gap for allowing the glass substrate being conveyed to pass through is formed in the windproof member, it is possible to reliably avoid the obstruction of the conveyance of the glass substrate by the windproof member. And while preventing the conveyance of the glass substrate from being obstructed, it is possible to provide the windproof member with both a portion existing on the upper side of the track through which the glass substrate passes with a gap and a portion existing on the lower side. it can. As a result, it becomes easier to block the course of the airflow toward the treatment area on both the upper side and the lower side of the track by the windproof member, so that the flow of the airflow into the treatment area can be further avoided.
  • the width of the gap formed between the top of the windproof member and the inner wall of the chamber facing the top is set to the width of the gap formed in the windproof member. It is preferable to make it wider than the width.
  • a gap (hereinafter referred to as a first gap) for allowing the glass substrate being conveyed to pass through is formed in the windproof member, there is a possibility that the airflow flows into the processing region through the first gap.
  • the width of the gap formed between the top of the windbreak member and the inner wall of the chamber facing the top (hereinafter referred to as the second gap) is wider than the width of the first gap, Can be accurately eliminated. That is, since the airflow flowing into the chamber and reaching the windbreak member is easily guided to flow into the second gap, which is a relatively wide gap, a relatively narrow gap It is possible to avoid the flow into the first gap as much as possible.
  • the thickness of the windproof member along the conveyance direction of the glass substrate is 100 mm or more.
  • the thickness of the windproof member As the thickness of the windproof member is increased, it is easier to avoid the airflow that flows into the chamber and reaches the windproof member from flowing into the processing region through the gap formed in the windproof member. And if the thickness of a wind-proof member shall be 100 mm or more, it is possible to prevent the inflow of the airflow to the clearance gap formed in the wind-proof member as much as possible.
  • the width direction both ends of the windproof member are outward from the width direction both ends of the glass substrate in the processing region. It is preferable to position.
  • the airflow that has flowed into the chamber through the carry-in port and the carry-out port flows directly into the processing region from the outside at both ends in the width direction of the windbreak member without being blocked by the windbreak member. It is easy to avoid flowing into the processing region by bypassing both ends in the width direction of the windproof member.
  • the width direction both ends of the windproof member are positioned outward from the width direction both ends of the carry-in port and the carry-out port. It is preferable to make it.
  • the windproof member installed between the carry-in entrance and the processing area is installed on the processing area side with reference to an intermediate point between the carry-in entrance and the processing area on the transport path of the glass substrate. It is preferable to install the windproof member installed between the carry-out port and the wind-proof member on the processing region side with reference to an intermediate point between the process region and the carry-out port on the glass substrate transfer path.
  • a wind-proof member While a wind-proof member will be installed near a processing area among a carrying-in entrance and a processing area, a wind-proof member will be installed near a processing area among a processing area and a carrying-out exit. It becomes easy to avoid the airflow that bypasses the windbreak member from flowing into the processing region.
  • the apparatus according to the present invention transports a glass substrate carried from the carry-in entrance into the chamber in the horizontal direction, on the glass substrate transport path in the chamber.
  • An apparatus for manufacturing a glass substrate configured to carry out an etching process with a processing gas in a processing region provided and then to carry out the processed glass substrate from the carry-out port to the outside of the chamber, on the transport path of the glass substrate
  • a windproof member is installed between at least one of the carry-in port and the treatment area and between the treatment area and the carry-out port.
  • the method for manufacturing a glass substrate and the apparatus for manufacturing a glass substrate according to the present invention when a glass substrate is etched using a processing gas in a chamber in which the glass substrate inlet and outlet are formed. The reliable execution is possible.
  • the glass substrate manufacturing apparatus 1 is configured such that the glass substrate 3 in the chamber 2 is conveyed in the horizontal direction while the glass substrate 3 carried into the chamber 2 from the carry-in port 2aa is conveyed in the horizontal direction.
  • the etching processing is performed with hydrogen fluoride as the processing gas 5, and then the processed glass substrate 3 is transported out of the chamber 2 from the transport outlet 2ab.
  • the glass substrate manufacturing apparatus 1 can transport the glass substrate 3 in a flat position along a transport path extending in a straight line by a plurality of rollers 6 disposed inside and outside the chamber 2. .
  • the outer shape of the chamber 2 is formed in a rectangular parallelepiped shape, and the processing gas 5 is prevented from flowing out of the chamber 2 from the space 7 formed therein.
  • the chamber 2 includes a main body 2a in which a carry-in port 2aa, a carry-out port 2ab and a ceiling hole 2ac of the glass substrate 3 are formed, and a plate-like lid body 2b for closing the ceiling hole 2ac.
  • the material of the main body 2a and the lid 2b is polyvinyl chloride having excellent corrosion resistance to the processing gas 5 (hydrogen fluoride).
  • a barometer (not shown) is installed in the main body 2a (in the space 7) and outside the main body 2a (outside the chamber 2), and the barometric pressure difference between the inside and outside of the chamber 2 can be measured by both barometers. It is possible.
  • the carry-in port 2aa and the carry-out port 2ab are formed in the side wall portion 2ad of the main body 2a, and the width direction perpendicular to the carrying direction of the glass substrate 3 along the main surface (upper surface and lower surface) of the glass substrate 3 (FIG. 1). Is a direction that is perpendicular to the paper surface, and is hereinafter referred to simply as the width direction).
  • Three ceiling holes 2ac are formed in the ceiling portion 2ae of the main body 2a.
  • the lid 2b can block the entire opening of the ceiling hole 2ac, and can be attached to the main body 2a and removed from the main body 2a.
  • the opening width along the vertical direction (the height direction orthogonal to the main surface of the glass substrate 3) can be moved up and down along the side wall 2ad of the main body 2a. It can be adjusted by the opening width adjusting member 8.
  • the opening width adjusting member 8 can adjust the opening widths of the carry-in port 2aa and the carry-out port by removing the lid 2b from the main body 2a, so that an operator can perform it through the ceiling hole 2ac.
  • the adjustment of the opening widths of the carry-in port 2aa and the carry-out port 2ab is performed based on the pressure difference between the inside and outside of the chamber 2 measured by the above-mentioned two barometers. Thereby, it is possible to adjust the flow velocity of the airflow 9 which is generated due to the pressure difference between the inside and outside of the chamber 2 and flows into the chamber 2 through the carry-in port 2aa and the carry-out port 2ab.
  • the opening width adjusting member 8 includes a pair of plate-like members 8a and 8b.
  • Each of the pair of plate-like members 8a and 8b is formed with a pair of long holes 8aa (8ba) elongated in the vertical direction for allowing the bolts 8c to pass therethrough.
  • the material of the pair of plate-like members 8a and 8b and the bolt 8c is polyvinyl chloride.
  • a processing device 10 for performing an etching process by spraying a processing gas 5 on a glass substrate 3 conveyed by a plurality of rollers 6 installed in the chamber 2 is provided in the processing region 4. Is arranged.
  • the processing device 10 includes a main body portion 10 a disposed so as to face the lower surface of the glass substrate 3 carried into the processing region 4, and a top plate portion 10 b disposed so as to face the upper surface of the glass substrate 3. I have.
  • a processing space 10c for etching the glass substrate 3 is formed between the main body portion 10a and the top plate portion 10b.
  • the length along the width direction of the processing space 10c is longer than the entire width of the glass substrate 3 (length along the width direction).
  • the material of the main-body part 10a and the top-plate part 10b is polyvinyl chloride.
  • the main body portion 10a supplies the processing gas 5 sprayed to the lower surface of the glass substrate 3 to the processing space 10c, and a supply path 10aa provided relatively upstream of the transport path of the glass substrate 3, and the processing space 10c.
  • the processing gas 5 is recovered, and a recovery path 10ab provided relatively downstream of the transport path of the glass substrate 3 is provided.
  • the processing gas 5 supplied from the supply path 10aa to the processing space 10c is sprayed to the lower surface of the glass substrate 3, and then flows toward the downstream side of the transport path of the glass substrate 3, thereby collecting the recovery path 10ab. Is recovered from the processing space 10c.
  • the main body 10a incorporates a heating member 10ac (for example, a heater or the like) that can heat the main body 10a in order to prevent the formation of condensation due to the processing gas 5.
  • the outlet of the processing gas 5 in the supply path 10aa and the inlet of the processing gas 5 in the recovery path 10ab are both formed in a slit shape that is long in the width direction.
  • the total width along the width direction of the outlet and the inlet is longer than the total width of the glass substrate 3 in the width direction.
  • the outlet of the processing gas 5 in the supply path 10aa has an opening width along the transport direction of the glass substrate 3 that is fixed by the spacer 11 installed in the supply path 10aa. It is adjusted to become.
  • a plurality of spacers 11 are provided along the width direction in a state of being separated from each other.
  • the depth dimension D from the outlet of the processing gas 5 in the supply path 10aa to the position where the spacer 11 is installed is preferably in the range of 10 mm to 100 mm. If the depth dimension D is too small, the spacer 11 may disturb the flow of the processing gas 5 in the supply path 10aa, and may cause unevenness in the roughening of the lower surface of the glass substrate 3 due to the etching process. On the other hand, if the depth dimension D is too large, it is difficult to adjust the opening width along the transport direction of the glass substrate 3 to a desired width at the outlet of the processing gas 5 in the supply path 10aa. Therefore, the supply amount of the processing gas 5 from the outlet to the processing space 10c is excessive or too small, and there is a possibility that the lower surface of the glass substrate 3 cannot be roughened to a desired surface roughness.
  • the top plate portion 10 b is made of a single plate-like member and has a flat surface facing the upper surface of the glass substrate 3 carried into the processing region 4. Further, the top plate portion 10b has a built-in heating member 10ba (for example, a heater or the like) capable of heating the top plate portion 10b in order to prevent the formation of condensation due to the processing gas 5 in the same manner as the main body portion 10a. Has been.
  • a built-in heating member 10ba for example, a heater or the like
  • the airflow 9 that has flowed into the chamber 2 flows into the processing region 4 between the carry-in port 2aa and the processing region 4 on the transport path of the glass substrate 3 and between the processing region 4 and the carry-out port 2ab.
  • One windproof member 12 is installed for each of them.
  • the windproof member 12 installed between the carry-in port 2aa and the processing region 4 is installed on the processing region 4 side with an intermediate point between the carry-in port 2aa and the processing region 4 as a reference.
  • the windproof member 12 installed between the processing region 4 and the carry-out port 2ab is installed on the processing region 4 side with reference to an intermediate point between the processing region 4 and the carry-out port 2ab.
  • one windproof member 12 is installed between the carry-in port 2aa and the processing region 4 and between the processing region 4 and the carry-out port 2ab, but the present invention is not limited thereto. Is not to be done.
  • a plurality of windproof members 12 may be installed between the carry-in port 2aa and the processing region 4 and between the processing region 4 and the carry-out port 2ab, respectively. Further, the number of windproof members 12 to be installed may be different between the carry-in port 2aa and the processing region 4 and between the processing region 4 and the carry-out port 2ab.
  • the windproof member 12 installed between the carry-in port 2aa and the processing region 4 is installed on the processing region 4 side with an intermediate point between the carry-in port 2aa and the processing region 4 as a reference. This is not the case.
  • the windproof member 12 may be installed at an arbitrary position as long as it is between the carry-in entrance 2aa and the processing region 4 (the same applies to the windproof member 12 installed between the treatment region 4 and the carry-out port 2ab).
  • the wind-proof member 12 is a single plate-like member, and an opening 12a is formed as a gap for allowing the glass substrate 3 being conveyed to pass therethrough.
  • the opening 12 a is formed in a rectangular shape, and the opening width W along the width direction and the opening width H along the vertical direction are respectively larger than the total width along the width direction of the glass substrate 3 and the thickness of the glass substrate 3. It is getting bigger.
  • the thickness T of the windbreak member 12 along the conveyance direction of the glass substrate 3 prevents the airflow 9 that has flowed into the chamber 2 and reached the windbreak member 12 from flowing into the processing region 4 through the opening 12a. Therefore, the thickness is preferably 100 mm or more, and more preferably 150 mm or more.
  • the upper limit of the thickness T is preferably 300 mm.
  • a plate-like member is used as the wind-proof member 12, but the present invention is not limited to this, and various shapes may be used as the wind-proof member 12.
  • the rectangular opening 12a is formed in the wind-proof member 12, if it is a shape which can let the glass substrate 3 in conveyance pass, the shape of the opening 12a will be Any shape may be used.
  • the width HH of the gap formed between the top portion 12b of the windproof member 12 and the ceiling portion 2ae of the main body 2a facing the top portion 12b in the vertical direction is formed in the windproof member 12.
  • the opening 12a is wider than the opening width H.
  • the top portion 12 b of the windbreak member 12 is located above the top plate portion 10 b of the processor 10.
  • both end portions 12c in the width direction of the windproof member 12 are located outward from both end portions in the width direction of the glass substrate 3 in the processing region 4, and both ends in the width direction of the carry-in port 2aa and the carry-out port 2ab. It is located outside the part.
  • the glass substrate manufacturing apparatus 1 is operated, the conveyance of the glass substrate 3 by a plurality of rollers 6 is started, and the glass substrate 3 is carried into the chamber 2 from the carry-in port 2aa. Thereafter, the opening 12 a of the wind-proof member 12 installed between the carry-in port 2 aa and the processing region 4 is passed through the glass substrate 3, and the glass substrate 3 is carried into the processing region 4.
  • the processing gas 5 supplied to the processing space 10c from the supply path 10aa is transferred to the glass while the glass substrate 3 is transported in the processing space 10c formed in the processing unit 10. While spraying on the substrate 3 to perform the etching process, the processing gas 5 in the processing space 10c is recovered from the recovery path 10ab. At this time, the wind-proof member 12 prevents the airflow 9 flowing into the chamber 2 through the carry-in port 2aa and the carry-out port 2ab from flowing into the processing region 4.
  • the glass substrate 3 is unloaded from the processing region 4. Then, the opening 12a of the windproof member 12 installed between the process area
  • the pressure difference between the inside and outside of the chamber 2 is determined by both barometers installed inside the main body 2 a (inside the space 7) and outside the main body 2 a (outside the chamber 2). taking measurement. And when adjusting the opening width along the up-down direction of the carrying-in port 2aa of the glass substrate 3 and the carrying-out port 2ab based on the measured atmospheric
  • the air flow 9 flowing into the chamber 2 through the carry-in port 2aa and the carry-out port 2ab is generated due to the pressure difference between the inside and outside of the chamber 2.
  • the windproof member 12 is installed between the carry-in port 2aa and the processing region 4 on the transport path of the glass substrate 3 and between the processing region 4 and the carry-out port 2ab, respectively. It is possible to prevent the generated airflow 9 from flowing into the processing region 4 by the windproof member 12 as much as possible. Thereby, the occurrence of a situation where the processing gas 5 to be sprayed on the glass substrate 3 is blown off by the air flow 9 is prevented, and the etching process on the glass substrate 3 can be reliably performed.
  • the glass substrate manufacturing apparatus 1 according to the second embodiment is different from the glass substrate manufacturing apparatus 1 according to the first embodiment in the following (1), ( 2).
  • the H steel 17 is installed on the top plate part 10b of the processor 10.
  • the windproof member has both the same external shape as the processing unit 10 and the dummy processing unit 18 that does not perform the etching process on the glass substrate 3 and the H steel 19 installed on the dummy processing unit 18. 12 is configured.
  • the H steel 17 on the top plate portion 10b extends along the width direction of the glass substrate 3, and is installed along the entire width of the top plate portion 10b.
  • the H steel 17 prevents the top plate portion 10b from being bent by its own weight in order to avoid contact between the upper surface of the glass substrate 3 being conveyed in the processing space 10c and the flat surface of the top plate portion 10b facing the upper surface. It has a function as a reinforcement member for doing.
  • the dummy processor 18 includes a box-shaped main body portion 18 a having an opening 18 aa formed at the upper end and a top plate portion 18 b made of a single plate-like member, and both 18 a and 18 b convey the glass substrate 3. It arrange
  • the main body portion 18a is formed in a rectangular parallelepiped shape, and the opening 18aa of the main body portion 18a is formed in a rectangular shape.
  • the length along the width direction of the opening 18aa is longer than the entire width of the glass substrate 3.
  • a through hole 18ab is formed in the bottom of the main body 18a, and the through hole 18ab is connected to a cleaning dust collector (scrubber) (not shown). Then, the processing gas 5 that has flowed out of the processing space 10c along with the conveyance of the glass substrate 3 can be exhausted through the opening 18aa and the through hole 18ab, and sent to the cleaning dust collector.
  • the top plate portion 18 b has a flat surface facing the upper surface of the glass substrate 3 that passes through the dummy processor 18. Moreover, the H steel 19 installed on the top plate portion 18b extends along the width direction of the glass substrate 3 in the same manner as the H steel 17 on the top plate portion 10b, and extends along the entire width of the top plate portion 18b. Installed. The H steel 19 is bent by its own weight of the top plate portion 18b in order to avoid contact between the upper surface of the glass substrate 3 passing through the dummy processor 18 and the flat surface of the top plate portion 18b facing the upper surface. It has a function as a reinforcement member for preventing.
  • the aspect which performs the manufacturing method of the glass substrate which concerns on 2nd embodiment of this invention using said glass substrate manufacturing apparatus 1 is processing space via opening 18aa and through-hole 18ab of the dummy processing device 18.
  • the glass substrate manufacturing apparatus and the glass substrate manufacturing method according to the present invention are not limited to the configurations and aspects described in the above embodiments.
  • the windproof member is a single plate-like member, but this is not restrictive.
  • the windbreak member 12 is formed.
  • the opening 12a (gap 13) may be opened and closed by the vertical movement of the shutter 16 as a gap opening / closing member. In this case, it is preferable that the opening 12a (gap 13) is opened only when the glass substrate 3 passes through the windproof member 12, as shown in FIG.
  • the operation direction of the shutter 16 is not necessarily the vertical direction, and may be any direction as long as the opening 12a (gap 13) formed in the windproof member 12 can be opened and closed.
  • the glass substrate manufacturing apparatus and the glass substrate manufacturing method described in the above embodiment have an environment in which airflow easily flows into the chamber from both the entrance and exit of the glass substrate formed in the chamber.
  • a configuration and an embodiment suitable for the above are given as an example.
  • the manufacturing apparatus of the glass substrate which concerns on this invention, and the manufacturing method of a glass substrate are applicable also in environments other than this.
  • the windproof member may be installed only between the carry-in port and the processing region on the glass substrate transfer path.
  • a windproof member may be installed only between the processing region and the carry-out port on the glass substrate transfer path.

Abstract

In a method for manufacturing a glass substrate, the method comprising performing an etching process through use of a processing gas 5 in a processing region 4 provided above a conveyance path of a glass substrate 3 in a chamber 2 while the glass substrate 3 is conveyed in a horizontal direction, the glass substrate 3 being carried into the chamber 2 from a loading port 2aa, and then carrying the processed glass substrate 3 out of the chamber 2 from a delivery port 2ab, windbreak members 12 in which openings 12a for allowing passage of the conveyed glass substrate 3 therethrough are provided between the loading port 2aa and the processing region 4 and between the processing region 4 and the delivery port 2ab on the conveyance path of the glass substrate 3.

Description

ガラス基板の製造方法、及びガラス基板の製造装置Glass substrate manufacturing method and glass substrate manufacturing apparatus
　本発明は、フッ化水素等の処理ガスを用いてガラス基板にエッチング処理を施すガラス基板の製造方法、及びガラス基板の製造装置に関する。 The present invention relates to a glass substrate manufacturing method and an apparatus for manufacturing a glass substrate, in which a glass substrate is etched using a processing gas such as hydrogen fluoride.
　周知のように、ガラス基板は、液晶ディスプレイ、プラズマディスプレイ、有機ＥＬディスプレイ、フィールドエミッションディスプレイ等に代表されるフラットパネルディスプレイ（ＦＰＤ）や、スマートホン、タブレット型ＰＣ等のモバイル機器をはじめとして、多種多様な電子デバイスに組み込まれている。 As is well known, there are various types of glass substrates such as flat panel displays (FPD) represented by liquid crystal displays, plasma displays, organic EL displays, field emission displays, and mobile devices such as smart phones and tablet PCs. Embedded in a variety of electronic devices.
　ところで、ガラス基板の製造工程においては、静電気の帯電に起因した問題が生じることがある。例えば、ガラス基板に所定の処理を施すべく載置台上にガラス基板を置いた際に、静電気の帯電に起因してガラス基板が載置台に貼り付いてしまう場合があり、処理を終えたガラス基板を載置台から剥離させようとした際に、当該ガラス基板が破損してしまうことがある。 By the way, in the manufacturing process of the glass substrate, there may be a problem due to electrostatic charging. For example, when a glass substrate is placed on a mounting table to perform a predetermined process on the glass substrate, the glass substrate may stick to the mounting table due to electrostatic charging, and the glass substrate has been processed. When it is going to peel off from a mounting base, the said glass substrate may be damaged.
　そこで、上記のような問題への対策として、フッ化水素等の処理ガスをガラス基板に噴き付けてエッチング処理を施し、当該ガラス基板の表面を粗化させることにより、静電気の帯電に起因した問題の発生を回避する手法が知られている。そして、この手法の一つの具体例が特許文献１に開示されている。 Therefore, as a countermeasure to the above problems, a problem arises due to electrostatic charging by spraying a processing gas such as hydrogen fluoride onto the glass substrate to perform etching and roughening the surface of the glass substrate. A technique for avoiding the occurrence of this is known. One specific example of this technique is disclosed in Patent Document 1.
　同文献には、搬送中のガラス基板に対し、その搬送経路の上流側で吹出ノズルから処理ガスを噴き付けることでエッチング処理を施すと共に、搬送経路の下流側で吸引ノズルにより処理ガスを吸引して排気する方法が開示されている。なお、同文献において明示されてはいないが、このような方法を採用する場合には、処理ガスが漏れ出すことを防止するため、エッチング処理をチャンバー内で施す場合が多い。このチャンバーには、ガラス基板をチャンバー内へと搬入するための搬入口と、チャンバー外へと搬出するための搬出口とが形成されている。 In this document, etching processing is performed on a glass substrate being transported by spraying a processing gas from a blow nozzle on the upstream side of the transport path, and the processing gas is sucked by a suction nozzle on the downstream side of the transport path. A method for exhausting the air is disclosed. Although not explicitly disclosed in the same document, when such a method is employed, an etching process is often performed in the chamber in order to prevent the processing gas from leaking. The chamber is formed with a carry-in port for carrying the glass substrate into the chamber and a carry-out port for carrying out the glass substrate.
国際公開第２０１１／１０５３３１号International Publication No. 2011/105331
　しかしながら、特許文献１に開示された方法を採用してガラス基板にエッチング処理を施す場合には、未だ下記のような解決すべき問題が生じている。 However, when the glass substrate is etched using the method disclosed in Patent Document 1, the following problems to be solved still arise.
　すなわち、チャンバーにはガラス基板の搬入口、及び搬出口が形成されているため、チャンバー内外の気圧差に起因して、搬入口、搬出口を通じてチャンバー内へと流入する気流が発生すると、この気流がガラス基板に噴き付けられるべき処理ガスを吹き飛ばしてしまう場合があり、ガラス基板の表面の粗化にむらが生じてしまう問題があった。 That is, since the glass substrate carry-in port and the carry-out port are formed in the chamber, if an air flow flowing into the chamber through the carry-in port and the carry-out port is generated due to a difference in pressure inside and outside the chamber, this air flow is generated. However, there is a case where the processing gas to be sprayed on the glass substrate is blown off, and the surface of the glass substrate is unevenly roughened.
　上記の事情に鑑みなされた本発明は、ガラス基板の搬入口及び搬出口が形成されたチャンバー内で、処理ガスを用いてガラス基板にエッチング処理を施す場合に、その確実な実行を可能とすることを技術的な課題とする。 This invention made | formed in view of said situation enables the reliable execution, when performing an etching process to a glass substrate using process gas in the chamber in which the carrying-in port and carrying-out port of the glass substrate were formed. This is a technical issue.
　上記の課題を解決するために創案された本発明に係る方法は、搬入口からチャンバー内へと搬入したガラス基板を水平方向に搬送しつつ、チャンバー内でのガラス基板の搬送経路上に設けた処理領域で処理ガスによりエッチング処理を施した後、処理後のガラス基板を搬出口からチャンバー外へと搬出するガラス基板の製造方法であって、ガラス基板の搬送経路上における搬入口と処理領域との間、及び、処理領域と搬出口との間の少なくとも一方に、防風部材を設置したことに特徴付けられる。ここで、「ガラス基板を水平方向に搬送」とは、ガラス基板を非傾斜方向である水平方向に搬送する場合のみならず、ガラス基板を水平面に対して上下に３０°以下の範囲内で傾斜した方向に搬送する場合をも含む。また、これらの場合におけるガラス基板の姿勢は、ガラス基板が搬送方向の両側方に対して非傾斜状態となる姿勢のみならず、ガラス基板が搬送方向の一側方から他側方に対して３０°以下の範囲内で傾斜状態となる姿勢をも含む（以下、同じ）。 The method according to the present invention, which was created to solve the above-mentioned problems, was provided on the transport path of the glass substrate in the chamber while transporting the glass substrate carried into the chamber from the carry-in entrance in the horizontal direction. A method of manufacturing a glass substrate in which a processed glass substrate is carried out from a carry-out port to the outside of a chamber after etching with a treatment gas in a treatment region, wherein the carry-in port and the treatment region on the conveyance path of the glass substrate And at least one between the treatment area and the carry-out port. Here, “transporting the glass substrate in the horizontal direction” means not only when the glass substrate is transported in the non-inclined horizontal direction, but also tilting the glass substrate up and down within a range of 30 ° or less with respect to the horizontal plane. It also includes the case of transporting in the specified direction. Moreover, the attitude | position of the glass substrate in these cases is not only the attitude | position in which a glass substrate becomes a non-inclined state with respect to the both sides of a conveyance direction, but a glass substrate is 30 with respect to the other side from the one side of a conveyance direction. Also includes postures that are inclined within the following range (the same applies hereinafter).
　このような方法によれば、チャンバー内外の気圧差に起因して、搬入口からチャンバー内へと流入する気流が発生しやすい環境下では、少なくともガラス基板の搬送経路上における搬入口と処理領域との間に防風部材を設置しておくことで、発生した気流が処理領域へと流れ込むことを可及的に回避することができる。同様にして、搬出口からチャンバー内へと流入する気流が発生しやすい環境下では、少なくとも処理領域と搬出口との間に防風部材を設置しておくことで、発生した気流が処理領域へと流れ込むことを可及的に回避することができる。これにより、気流によってガラス基板に噴き付けられるべき処理ガスが吹き飛ばされるような事態の発生が防止され、ガラス基板に対するエッチング処理を確実に実行することが可能となる。 According to such a method, in an environment in which an airflow flowing from the carry-in port into the chamber due to a pressure difference between the inside and outside of the chamber is likely to occur, at least the carry-in port and the processing region on the glass substrate carrying path. By installing a wind-proof member between them, it is possible to avoid as much as possible that the generated airflow flows into the processing region. Similarly, in an environment where airflow flowing from the carry-out port into the chamber is likely to occur, by installing a windproof member at least between the treatment region and the carry-out port, the generated airflow is transferred to the treatment region. Inflow can be avoided as much as possible. Thereby, it is possible to prevent the occurrence of a situation in which the processing gas to be sprayed on the glass substrate is blown off by the air flow, and it is possible to reliably perform the etching process on the glass substrate.
　上記の方法では、ガラス基板の搬送経路上における搬入口と処理領域との間、及び、処理領域と搬出口との間の双方に、それぞれ防風部材を設置することが好ましい。 In the above method, it is preferable to install windproof members both between the carry-in entrance and the treatment area on the glass substrate carrying path and between the treatment area and the carry-out exit.
　このようにすれば、搬入口と処理領域との間、及び、処理領域と搬出口との間の双方に、それぞれ防風部材を設置していることから、搬入口と搬出口との両方からチャンバー内へと気流が流入しやすい環境下においても、気流が処理領域へと流れ込むことを防風部材によって可及的に回避することができる。 In this way, since windproof members are installed between the carry-in port and the processing region and between the process region and the carry-out port, respectively, the chamber is provided from both the carry-in port and the carry-out port. Even in an environment where airflow easily flows into the airflow, it is possible to prevent the airflow from flowing into the processing region as much as possible by the windproof member.
　上記の方法では、ガラス基板の搬送経路が一直線に延びていることが好ましい。 In the above method, it is preferable that the conveyance path of the glass substrate extends in a straight line.
　このようにすれば、搬入口と処理領域と搬出口とが一直線上に並ぶことから、防風部材によって気流の処理領域へと向かう進路を遮りやすくなり、処理領域への気流の流れ込みを更に回避しやすくなる。 In this way, since the carry-in entrance, the processing region, and the carry-out port are arranged in a straight line, it becomes easy to block the course of the air flow toward the treatment region by the windbreak member, and further avoids the flow of the air flow into the treatment region. It becomes easy.
　上記の方法では、防風部材に、搬送中のガラス基板を通過させるための隙間が形成されていることが好ましい。 In the above method, it is preferable that a gap for allowing the glass substrate being conveyed to pass is formed in the windproof member.
　このようにすれば、防風部材に搬送中のガラス基板を通過させるための隙間が形成されていることから、防風部材によってガラス基板の搬送が阻害されることを確実に回避できる。そして、ガラス基板の搬送が阻害されることを回避しつつ、防風部材に、隙間を挟んでガラス基板が通過する軌道の上方側に存する部位と、下方側に存する部位との双方を設けることができる。これにより、防風部材によって軌道の上方側と下方側との両側で気流の処理領域へと向かう進路を遮りやすくなるため、処理領域への気流の流れ込みをより一層回避しやすくなる。 In this way, since the gap for allowing the glass substrate being conveyed to pass through is formed in the windproof member, it is possible to reliably avoid the obstruction of the conveyance of the glass substrate by the windproof member. And while preventing the conveyance of the glass substrate from being obstructed, it is possible to provide the windproof member with both a portion existing on the upper side of the track through which the glass substrate passes with a gap and a portion existing on the lower side. it can. As a result, it becomes easier to block the course of the airflow toward the treatment area on both the upper side and the lower side of the track by the windproof member, so that the flow of the airflow into the treatment area can be further avoided.
　上記の方法では、ガラス基板の主面に直交する高さ方向において、防風部材の頂部と頂部に対向するチャンバーの内壁との間に形成される隙間の幅を、防風部材に形成された隙間の幅よりも広くすることが好ましい。 In the above method, in the height direction perpendicular to the main surface of the glass substrate, the width of the gap formed between the top of the windproof member and the inner wall of the chamber facing the top is set to the width of the gap formed in the windproof member. It is preferable to make it wider than the width.
　防風部材に、搬送中のガラス基板を通過させるための隙間（以下、第一の隙間と表記する）が形成されていると、第一の隙間を通じて気流が処理領域へと流れ込むおそれがある。しかしながら、第一の隙間の幅よりも、防風部材の頂部と頂部に対向するチャンバーの内壁との間に形成される隙間（以下、第二の隙間と表記する）の幅を広くすれば、上記のおそれを的確に排除することができる。すなわち、チャンバー内へと流入して防風部材へと到達した気流が、相対的に幅の広い隙間である第二の隙間へと流入するように誘導しやすくなるため、相対的に幅の狭い隙間である第一の隙間への流入を可及的に回避することが可能となる。 If a gap (hereinafter referred to as a first gap) for allowing the glass substrate being conveyed to pass through is formed in the windproof member, there is a possibility that the airflow flows into the processing region through the first gap. However, if the width of the gap formed between the top of the windbreak member and the inner wall of the chamber facing the top (hereinafter referred to as the second gap) is wider than the width of the first gap, Can be accurately eliminated. That is, since the airflow flowing into the chamber and reaching the windbreak member is easily guided to flow into the second gap, which is a relatively wide gap, a relatively narrow gap It is possible to avoid the flow into the first gap as much as possible.
　上記の方法では、ガラス基板の搬送方向に沿った防風部材の厚みを、１００ｍｍ以上とすることが好ましい。 In the above method, it is preferable that the thickness of the windproof member along the conveyance direction of the glass substrate is 100 mm or more.
　防風部材の厚みを大きくしていくに従って、チャンバー内へと流入して防風部材へと到達した気流が、防風部材に形成された隙間を通じて処理領域へと流れ込むことを回避しやすくなる。そして、防風部材の厚みを１００ｍｍ以上とすれば、防風部材に形成された隙間への気流の流入を可及的に防止することが可能である。 As the thickness of the windproof member is increased, it is easier to avoid the airflow that flows into the chamber and reaches the windproof member from flowing into the processing region through the gap formed in the windproof member. And if the thickness of a wind-proof member shall be 100 mm or more, it is possible to prevent the inflow of the airflow to the clearance gap formed in the wind-proof member as much as possible.
　上記の方法では、ガラス基板の主面に沿ってガラス基板の搬送方向と直交する幅方向において、防風部材の幅方向両端部を、処理領域にあるガラス基板の幅方向両端部よりも外方に位置させることが好ましい。 In the above method, in the width direction perpendicular to the conveyance direction of the glass substrate along the main surface of the glass substrate, the width direction both ends of the windproof member are outward from the width direction both ends of the glass substrate in the processing region. It is preferable to position.
　このようにすれば、搬入口、搬出口を通じてチャンバー内へと流入した気流が、防風部材によって進路を遮られることなく、防風部材の幅方向両端部の外方から直接に処理領域へと流れ込んだり、防風部材の幅方向両端部を迂回して処理領域へと流れ込むことを回避しやすくなる。 In this way, the airflow that has flowed into the chamber through the carry-in port and the carry-out port flows directly into the processing region from the outside at both ends in the width direction of the windbreak member without being blocked by the windbreak member. It is easy to avoid flowing into the processing region by bypassing both ends in the width direction of the windproof member.
　上記の方法では、ガラス基板の主面に沿ってガラス基板の搬送方向と直交する幅方向において、防風部材の幅方向両端部を、搬入口及び搬出口の幅方向両端部よりも外方に位置させることが好ましい。 In the above method, in the width direction orthogonal to the glass substrate transport direction along the main surface of the glass substrate, the width direction both ends of the windproof member are positioned outward from the width direction both ends of the carry-in port and the carry-out port. It is preferable to make it.
　このようにすれば、搬入口、搬出口を通じてチャンバー内へと流入した気流の進路を防風部材によって遮りやすくなる。そのため、気流が直接に処理領域へと流れ込むことを可及的に回避することができる。 In this way, the path of the airflow that has flowed into the chamber through the carry-in and carry-out ports can be easily blocked by the windbreak member. Therefore, it is possible to avoid as much as possible that the airflow flows directly into the processing region.
　上記の方法では、搬入口と処理領域との間に設置される防風部材を、ガラス基板の搬送経路上における搬入口と処理領域との中間地点を基準として処理領域側に設置し、処理領域と搬出口との間に設置される防風部材を、ガラス基板の搬送経路上における処理領域と搬出口との中間地点を基準として処理領域側に設置することが好ましい。 In the above method, the windproof member installed between the carry-in entrance and the processing area is installed on the processing area side with reference to an intermediate point between the carry-in entrance and the processing area on the transport path of the glass substrate. It is preferable to install the windproof member installed between the carry-out port and the wind-proof member on the processing region side with reference to an intermediate point between the process region and the carry-out port on the glass substrate transfer path.
　このようにすれば、搬入口と処理領域とのうち、防風部材が処理領域寄りに設置されると共に、処理領域と搬出口とのうち、防風部材が処理領域寄りに設置されることになるため、防風部材を迂回した気流が処理領域へと流れ込むことを回避しやすくなる。 If it does in this way, while a wind-proof member will be installed near a processing area among a carrying-in entrance and a processing area, a wind-proof member will be installed near a processing area among a processing area and a carrying-out exit. It becomes easy to avoid the airflow that bypasses the windbreak member from flowing into the processing region.
　上記の方法では、防風部材として板状部材を用いることが好ましい。 In the above method, it is preferable to use a plate-like member as the windproof member.
　このようにすれば、搬入口と処理領域との間、及び、処理領域と搬出口との間に、それぞれ板状部材を設置するだけで、気流の処理領域への流れ込みを可及的に回避することが可能となる。そのため、気流の処理領域への流れ込みを回避するために要するコストや手間を少なくすることができる。 In this way, the flow of airflow into the processing area can be avoided as much as possible by simply installing plate-like members between the carry-in entrance and the treatment area and between the treatment area and the carry-out exit. It becomes possible to do. Therefore, it is possible to reduce the cost and labor required to avoid the flow of airflow into the processing area.
　また、上記の課題を解決するために創案された本発明に係る装置は、搬入口からチャンバー内へと搬入したガラス基板を水平方向に搬送しつつ、チャンバー内でのガラス基板の搬送経路上に設けた処理領域で処理ガスによりエッチング処理を施した後、処理後のガラス基板を搬出口からチャンバー外へと搬出するように構成されたガラス基板の製造装置であって、ガラス基板の搬送経路上における搬入口と処理領域との間、及び、処理領域と搬出口との間の少なくとも一方に、防風部材が設置されていることに特徴付けられる。 In addition, the apparatus according to the present invention, which was created to solve the above-described problems, transports a glass substrate carried from the carry-in entrance into the chamber in the horizontal direction, on the glass substrate transport path in the chamber. An apparatus for manufacturing a glass substrate configured to carry out an etching process with a processing gas in a processing region provided and then to carry out the processed glass substrate from the carry-out port to the outside of the chamber, on the transport path of the glass substrate Is characterized in that a windproof member is installed between at least one of the carry-in port and the treatment area and between the treatment area and the carry-out port.
　このような構成によれば、上記のガラス基板の製造方法に係る説明で既に述べた事項と同一の作用・効果を奏することが可能である。 According to such a configuration, it is possible to achieve the same operations and effects as the matters already described in the description relating to the method for manufacturing the glass substrate.
　本発明に係るガラス基板の製造方法、及びガラス基板の製造装置によれば、ガラス基板の搬入口及び搬出口が形成されたチャンバー内で、処理ガスを用いてガラス基板にエッチング処理を施す場合に、その確実な実行が可能となる。 According to the method for manufacturing a glass substrate and the apparatus for manufacturing a glass substrate according to the present invention, when a glass substrate is etched using a processing gas in a chamber in which the glass substrate inlet and outlet are formed. The reliable execution is possible.
本発明の第一実施形態に係るガラス基板の製造装置を示す概略縦断側面図である。It is a schematic longitudinal side view which shows the manufacturing apparatus of the glass substrate which concerns on 1st embodiment of this invention. 本発明の第一実施形態に係るガラス基板の製造装置に備えられた開口幅調節部材を示す正面図である。It is a front view which shows the opening width adjustment member with which the manufacturing apparatus of the glass substrate which concerns on 1st embodiment of this invention was equipped. 本発明の第一実施形態に係るガラス基板の製造装置に備えられた供給路の近傍を示す縦断側面図である。It is a vertical side view which shows the vicinity of the supply path with which the manufacturing apparatus of the glass substrate which concerns on 1st embodiment of this invention was equipped. 本発明の第一実施形態に係るガラス基板の製造装置に備えられた防風部材を示す斜視図である。It is a perspective view which shows the windproof member with which the manufacturing apparatus of the glass substrate which concerns on 1st embodiment of this invention was equipped. 本発明の第二実施形態に係るガラス基板の製造装置を示す概略縦断側面図である。It is a schematic longitudinal cross-sectional side view which shows the manufacturing apparatus of the glass substrate which concerns on 2nd embodiment of this invention. 本発明の他の実施形態に係るガラス基板の製造装置に備えられた防風部材を示す斜視図である。It is a perspective view which shows the windproof member with which the manufacturing apparatus of the glass substrate which concerns on other embodiment of this invention was equipped. 本発明の他の実施形態に係るガラス基板の製造装置に備えられた防風部材の近傍を示す縦断側面図である。It is a vertical side view which shows the vicinity of the wind-proof member with which the manufacturing apparatus of the glass substrate which concerns on other embodiment of this invention was equipped. 本発明の他の実施形態に係るガラス基板の製造装置に備えられた防風部材の近傍を示す縦断側面図である。It is a vertical side view which shows the vicinity of the wind-proof member with which the manufacturing apparatus of the glass substrate which concerns on other embodiment of this invention was equipped. 本発明の他の実施形態に係るガラス基板の製造装置に備えられた防風部材の近傍を示す縦断側面図である。It is a vertical side view which shows the vicinity of the wind-proof member with which the manufacturing apparatus of the glass substrate which concerns on other embodiment of this invention was equipped.
　以下、本発明の実施形態に係るガラス基板の製造方法、及びガラス基板の製造装置について添付の図面を参照して説明する。なお、以下に説明する実施形態は、チャンバーに形成されたガラス基板の搬入口と搬出口との両方からチャンバー内へと気流が流入しやすい環境に適した形態を一例として挙げたものである。 Hereinafter, a glass substrate manufacturing method and a glass substrate manufacturing apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings. The embodiment described below is an example of a form suitable for an environment where airflow easily flows into the chamber from both the carry-in port and the carry-out port of the glass substrate formed in the chamber.
＜第一実施形態＞
　はじめに、本発明の第一実施形態に係るガラス基板の製造装置について説明する。 <First embodiment>
First, the manufacturing apparatus of the glass substrate which concerns on 1st embodiment of this invention is demonstrated.
　図１に示すように、第一実施形態に係るガラス基板の製造装置１は、搬入口２ａａからチャンバー２内へと搬入したガラス基板３を水平方向に搬送しつつ、チャンバー２内でのガラス基板３の搬送経路上に設けた処理領域４で、処理ガス５としてのフッ化水素によりエッチング処理を施した後、処理後のガラス基板３を搬出口２ａｂからチャンバー２外へと搬出する構成とされている。このガラス基板の製造装置１は、チャンバー２内外に配置された複数のローラー６により、水平に一直線に延びた搬送経路に沿ってガラス基板３を平置き姿勢で搬送することが可能となっている。 As shown in FIG. 1, the glass substrate manufacturing apparatus 1 according to the first embodiment is configured such that the glass substrate 3 in the chamber 2 is conveyed in the horizontal direction while the glass substrate 3 carried into the chamber 2 from the carry-in port 2aa is conveyed in the horizontal direction. In the processing region 4 provided on the transfer path 3, the etching processing is performed with hydrogen fluoride as the processing gas 5, and then the processed glass substrate 3 is transported out of the chamber 2 from the transport outlet 2ab. ing. The glass substrate manufacturing apparatus 1 can transport the glass substrate 3 in a flat position along a transport path extending in a straight line by a plurality of rollers 6 disposed inside and outside the chamber 2. .
　チャンバー２は、その外形が直方体状に形成されており、その内部に形成される空間７から処理ガス５がチャンバー２外へと流出することを防止している。このチャンバー２は、ガラス基板３の搬入口２ａａ、搬出口２ａｂ、及び天井孔２ａｃが形成された本体２ａと、天井孔２ａｃを塞ぐための板状の蓋体２ｂとを備えている。なお、本体２ａ及び蓋体２ｂの材質は、処理ガス５（フッ化水素）への耐食性に優れたポリ塩化ビニルとなっている。また、本体２ａ内（空間７内）及び本体２ａ外（チャンバー２外）には、それぞれ気圧計（図示省略）が設置されており、両気圧計によりチャンバー２内外の気圧差を測定することが可能となっている。 The outer shape of the chamber 2 is formed in a rectangular parallelepiped shape, and the processing gas 5 is prevented from flowing out of the chamber 2 from the space 7 formed therein. The chamber 2 includes a main body 2a in which a carry-in port 2aa, a carry-out port 2ab and a ceiling hole 2ac of the glass substrate 3 are formed, and a plate-like lid body 2b for closing the ceiling hole 2ac. The material of the main body 2a and the lid 2b is polyvinyl chloride having excellent corrosion resistance to the processing gas 5 (hydrogen fluoride). Further, a barometer (not shown) is installed in the main body 2a (in the space 7) and outside the main body 2a (outside the chamber 2), and the barometric pressure difference between the inside and outside of the chamber 2 can be measured by both barometers. It is possible.
　搬入口２ａａ及び搬出口２ａｂは、本体２ａの側壁部２ａｄに形成されると共に、ガラス基板３の主面（上面及び下面）に沿って当該ガラス基板３の搬送方向に直交する幅方向（図１において紙面に鉛直な方向であり、以下、単に幅方向と表記する）に長尺な矩形に形成されている。天井孔２ａｃは、本体２ａの天井部２ａｅに三つ形成されている。蓋体２ｂは、天井孔２ａｃの開口全体を塞ぐことが可能であると共に、本体２ａへの取り付け、及び、本体２ａからの取り外しが可能となっている。 The carry-in port 2aa and the carry-out port 2ab are formed in the side wall portion 2ad of the main body 2a, and the width direction perpendicular to the carrying direction of the glass substrate 3 along the main surface (upper surface and lower surface) of the glass substrate 3 (FIG. 1). Is a direction that is perpendicular to the paper surface, and is hereinafter referred to simply as the width direction). Three ceiling holes 2ac are formed in the ceiling portion 2ae of the main body 2a. The lid 2b can block the entire opening of the ceiling hole 2ac, and can be attached to the main body 2a and removed from the main body 2a.
　搬入口２ａａ及び搬出口２ａｂの各々について、上下方向（ガラス基板３の主面に直交する高さ方向）に沿った開口幅は、本体２ａの側壁部２ａｄに沿って上下動させることが可能な開口幅調節部材８によって調節できるようになっている。この開口幅調節部材８による搬入口２ａａ及び搬出口の開口幅の調節は、本体２ａから蓋体２ｂを取り外すことにより、天井孔２ａｃを介して作業者が行うことが可能となっている。この搬入口２ａａ及び搬出口２ａｂの開口幅の調節は、上記の両気圧計によって測定されたチャンバー２内外の気圧差に基づいて行われる。これにより、チャンバー２内外の気圧差に起因して発生し、搬入口２ａａ、搬出口２ａｂを通じてチャンバー２内へと流入する気流９の流速を調節することが可能となっている。 For each of the carry-in port 2aa and the carry-out port 2ab, the opening width along the vertical direction (the height direction orthogonal to the main surface of the glass substrate 3) can be moved up and down along the side wall 2ad of the main body 2a. It can be adjusted by the opening width adjusting member 8. The opening width adjusting member 8 can adjust the opening widths of the carry-in port 2aa and the carry-out port by removing the lid 2b from the main body 2a, so that an operator can perform it through the ceiling hole 2ac. The adjustment of the opening widths of the carry-in port 2aa and the carry-out port 2ab is performed based on the pressure difference between the inside and outside of the chamber 2 measured by the above-mentioned two barometers. Thereby, it is possible to adjust the flow velocity of the airflow 9 which is generated due to the pressure difference between the inside and outside of the chamber 2 and flows into the chamber 2 through the carry-in port 2aa and the carry-out port 2ab.
　図２に示すように、開口幅調節部材８は一対の板状部材８ａ，８ｂを備えている。一対の板状部材８ａ，８ｂの各々には、ボルト８ｃを貫通させるための上下方向に長尺な一対の長孔８ａａ（８ｂａ）が形成されている。なお、一対の板状部材８ａ，８ｂ及びボルト８ｃの材質は、ポリ塩化ビニルとなっている。そして、長孔８ａａ（８ｂａ）と当該長孔８ａａ（８ｂａ）を貫通したボルト８ｃとの相対的な位置関係を調節すると共に、当該ボルト８ｃを本体２ａの側壁部２ａｄに形成されたネジ穴（図示省略）に固定し、一対の板状部材８ａ，８ｂの各々の上下方向における位置を位置決めすることで、搬入口２ａａ及び搬出口２ａｂの上下方向に沿った開口幅を調節することが可能となっている。 As shown in FIG. 2, the opening width adjusting member 8 includes a pair of plate- like members 8a and 8b. Each of the pair of plate- like members 8a and 8b is formed with a pair of long holes 8aa (8ba) elongated in the vertical direction for allowing the bolts 8c to pass therethrough. The material of the pair of plate- like members 8a and 8b and the bolt 8c is polyvinyl chloride. And while adjusting the relative positional relationship of the long hole 8aa (8ba) and the volt | bolt 8c which penetrated the said long hole 8aa (8ba), the said screw | thread 8c is formed in the side wall part 2ad of the main body 2a ( It is possible to adjust the opening width along the vertical direction of the carry-in port 2aa and the carry-out port 2ab by fixing the position in the vertical direction of each of the pair of plate- like members 8a and 8b. It has become.
　図１に示すように、処理領域４には、チャンバー２内に設置された複数のローラー６によって搬送されるガラス基板３に処理ガス５を噴き付けることでエッチング処理を施すための処理器１０が配置されている。処理器１０は、処理領域４へと搬入されたガラス基板３の下面と対向するように配置された本体部１０ａと、ガラス基板３の上面と対向するように配置された天板部１０ｂとを備えている。これら本体部１０ａと天板部１０ｂとの相互間には、ガラス基板３にエッチング処理を施すための処理空間１０ｃが形成される。処理空間１０ｃの幅方向に沿った長さは、ガラス基板３の全幅（幅方向に沿った長さ）よりも長くなっている。なお、本体部１０ａ及び天板部１０ｂの材質は、ポリ塩化ビニルとなっている。 As shown in FIG. 1, a processing device 10 for performing an etching process by spraying a processing gas 5 on a glass substrate 3 conveyed by a plurality of rollers 6 installed in the chamber 2 is provided in the processing region 4. Is arranged. The processing device 10 includes a main body portion 10 a disposed so as to face the lower surface of the glass substrate 3 carried into the processing region 4, and a top plate portion 10 b disposed so as to face the upper surface of the glass substrate 3. I have. A processing space 10c for etching the glass substrate 3 is formed between the main body portion 10a and the top plate portion 10b. The length along the width direction of the processing space 10c is longer than the entire width of the glass substrate 3 (length along the width direction). In addition, the material of the main-body part 10a and the top-plate part 10b is polyvinyl chloride.
　本体部１０ａは、ガラス基板３の下面に噴き付ける処理ガス５を処理空間１０ｃに供給し、且つ相対的にガラス基板３の搬送経路の上流側に設けられた供給路１０ａａと、処理空間１０ｃから処理ガス５を回収し、且つ相対的にガラス基板３の搬送経路の下流側に設けられた回収路１０ａｂとを有している。これにより、供給路１０ａａから処理空間１０ｃに供給された処理ガス５は、ガラス基板３の下面へと噴き付けられた後、ガラス基板３の搬送経路の下流側へと向かって流れ、回収路１０ａｂによって処理空間１０ｃから回収されるようになっている。また、本体部１０ａには、処理ガス５による結露の発生を防止するために、本体部１０ａの加熱が可能な加熱部材１０ａｃ（例えば、ヒーター等）が内蔵されている。 The main body portion 10a supplies the processing gas 5 sprayed to the lower surface of the glass substrate 3 to the processing space 10c, and a supply path 10aa provided relatively upstream of the transport path of the glass substrate 3, and the processing space 10c. The processing gas 5 is recovered, and a recovery path 10ab provided relatively downstream of the transport path of the glass substrate 3 is provided. As a result, the processing gas 5 supplied from the supply path 10aa to the processing space 10c is sprayed to the lower surface of the glass substrate 3, and then flows toward the downstream side of the transport path of the glass substrate 3, thereby collecting the recovery path 10ab. Is recovered from the processing space 10c. In addition, the main body 10a incorporates a heating member 10ac (for example, a heater or the like) that can heat the main body 10a in order to prevent the formation of condensation due to the processing gas 5.
　供給路１０ａａにおける処理ガス５の流出口、及び、回収路１０ａｂにおける処理ガス５の流入口は、いずれも幅方向に長尺なスリット状に形成されている。これら流出口及び流入口の幅方向に沿った全幅は、ガラス基板３の幅方向の全幅よりも長くなっている。さらに、図３に示すように、供給路１０ａａにおける処理ガス５の流出口は、そのガラス基板３の搬送方向に沿った開口幅が、当該供給路１０ａａ内に設置されたスペーサー１１によって一定の幅となるように調節されている。スペーサー１１は、相互に離間した状態で幅方向に沿って複数が設置されている。 The outlet of the processing gas 5 in the supply path 10aa and the inlet of the processing gas 5 in the recovery path 10ab are both formed in a slit shape that is long in the width direction. The total width along the width direction of the outlet and the inlet is longer than the total width of the glass substrate 3 in the width direction. Further, as shown in FIG. 3, the outlet of the processing gas 5 in the supply path 10aa has an opening width along the transport direction of the glass substrate 3 that is fixed by the spacer 11 installed in the supply path 10aa. It is adjusted to become. A plurality of spacers 11 are provided along the width direction in a state of being separated from each other.
　ここで、供給路１０ａａにおける処理ガス５の流出口からスペーサー１１が設置された位置までの深さ寸法Ｄは、１０ｍｍ～１００ｍｍの範囲内とすることが好ましい。この深さ寸法Ｄが小さすぎると、スペーサー１１によって供給路１０ａａ内の処理ガス５の流れに乱れが生じ、エッチング処理によるガラス基板３の下面の粗化にむらが生じるおそれがある。一方、深さ寸法Ｄが大きすぎると、供給路１０ａａにおける処理ガス５の流出口について、そのガラス基板３の搬送方向に沿った開口幅を所望の幅に調節することが困難となる。そのため、流出口から処理空間１０ｃへの処理ガス５の供給量が過大、或いは、過少となってガラス基板３の下面を所望の表面粗さに粗化できないおそれがある。 Here, the depth dimension D from the outlet of the processing gas 5 in the supply path 10aa to the position where the spacer 11 is installed is preferably in the range of 10 mm to 100 mm. If the depth dimension D is too small, the spacer 11 may disturb the flow of the processing gas 5 in the supply path 10aa, and may cause unevenness in the roughening of the lower surface of the glass substrate 3 due to the etching process. On the other hand, if the depth dimension D is too large, it is difficult to adjust the opening width along the transport direction of the glass substrate 3 to a desired width at the outlet of the processing gas 5 in the supply path 10aa. Therefore, the supply amount of the processing gas 5 from the outlet to the processing space 10c is excessive or too small, and there is a possibility that the lower surface of the glass substrate 3 cannot be roughened to a desired surface roughness.
　図１に示すように、天板部１０ｂは単一の板状部材からなると共に、処理領域４へと搬入されたガラス基板３の上面と対向する平坦面を有している。また、天板部１０ｂには、本体部１０ａと同様にして、処理ガス５による結露の発生を防止するために、天板部１０ｂの加熱が可能な加熱部材１０ｂａ（例えば、ヒーター等）が内蔵されている。 As shown in FIG. 1, the top plate portion 10 b is made of a single plate-like member and has a flat surface facing the upper surface of the glass substrate 3 carried into the processing region 4. Further, the top plate portion 10b has a built-in heating member 10ba (for example, a heater or the like) capable of heating the top plate portion 10b in order to prevent the formation of condensation due to the processing gas 5 in the same manner as the main body portion 10a. Has been.
　ガラス基板３の搬送経路上における搬入口２ａａと処理領域４との間、及び、処理領域４と搬出口２ａｂとの間には、チャンバー２内へと流入した気流９の処理領域４への流れ込みを防止するための防風部材１２が、それぞれ一つずつ設置されている。搬入口２ａａと処理領域４との間に設置された防風部材１２は、搬入口２ａａと処理領域４との中間地点を基準として処理領域４側に設置されている。同様にして、処理領域４と搬出口２ａｂとの間に設置された防風部材１２は、処理領域４と搬出口２ａｂとの中間地点を基準として処理領域４側に設置されている。 The airflow 9 that has flowed into the chamber 2 flows into the processing region 4 between the carry-in port 2aa and the processing region 4 on the transport path of the glass substrate 3 and between the processing region 4 and the carry-out port 2ab. One windproof member 12 is installed for each of them. The windproof member 12 installed between the carry-in port 2aa and the processing region 4 is installed on the processing region 4 side with an intermediate point between the carry-in port 2aa and the processing region 4 as a reference. Similarly, the windproof member 12 installed between the processing region 4 and the carry-out port 2ab is installed on the processing region 4 side with reference to an intermediate point between the processing region 4 and the carry-out port 2ab.
　ここで、本実施形態では、搬入口２ａａと処理領域４との間、及び、処理領域４と搬出口２ａｂとの間に、それぞれ一つずつ防風部材１２が設置されているが、これに限定されるものではない。搬入口２ａａと処理領域４との間、及び、処理領域４と搬出口２ａｂとの間に、それぞれ複数の防風部材１２を設置してもよい。また、搬入口２ａａと処理領域４との間と、処理領域４と搬出口２ａｂとの間とで、設置される防風部材１２の数が異なっていてもよい。さらに、本実施形態では、搬入口２ａａと処理領域４との間に設置された防風部材１２が、搬入口２ａａと処理領域４との中間地点を基準として処理領域４側に設置されているが、この限りではない。防風部材１２は、搬入口２ａａと処理領域４との間であれば、任意の位置に設置してよい（処理領域４と搬出口２ａｂとの間に設置された防風部材１２についても同様）。 Here, in the present embodiment, one windproof member 12 is installed between the carry-in port 2aa and the processing region 4 and between the processing region 4 and the carry-out port 2ab, but the present invention is not limited thereto. Is not to be done. A plurality of windproof members 12 may be installed between the carry-in port 2aa and the processing region 4 and between the processing region 4 and the carry-out port 2ab, respectively. Further, the number of windproof members 12 to be installed may be different between the carry-in port 2aa and the processing region 4 and between the processing region 4 and the carry-out port 2ab. Further, in the present embodiment, the windproof member 12 installed between the carry-in port 2aa and the processing region 4 is installed on the processing region 4 side with an intermediate point between the carry-in port 2aa and the processing region 4 as a reference. This is not the case. The windproof member 12 may be installed at an arbitrary position as long as it is between the carry-in entrance 2aa and the processing region 4 (the same applies to the windproof member 12 installed between the treatment region 4 and the carry-out port 2ab).
　図４に示すように、防風部材１２は単一の板状部材でなると共に、搬送中のガラス基板３を通過させるための隙間としての開口１２ａが形成されている。この開口１２ａは矩形に形成されており、その幅方向に沿った開口幅Ｗ、上下方向に沿った開口幅Ｈは、それぞれガラス基板３の幅方向に沿った全幅、ガラス基板３の厚みよりも大きくなっている。また、防風部材１２のガラス基板３の搬送方向に沿った厚みＴは、チャンバー２内へと流入して防風部材１２へと到達した気流９が、開口１２ａを通じて処理領域４へと流れ込むことを防止するために、１００ｍｍ以上とすることが好ましく、１５０ｍｍ以上とすることが更に好ましい。なお、厚みＴの上限は、３００ｍｍとすることが好ましい。 As shown in FIG. 4, the wind-proof member 12 is a single plate-like member, and an opening 12a is formed as a gap for allowing the glass substrate 3 being conveyed to pass therethrough. The opening 12 a is formed in a rectangular shape, and the opening width W along the width direction and the opening width H along the vertical direction are respectively larger than the total width along the width direction of the glass substrate 3 and the thickness of the glass substrate 3. It is getting bigger. Further, the thickness T of the windbreak member 12 along the conveyance direction of the glass substrate 3 prevents the airflow 9 that has flowed into the chamber 2 and reached the windbreak member 12 from flowing into the processing region 4 through the opening 12a. Therefore, the thickness is preferably 100 mm or more, and more preferably 150 mm or more. The upper limit of the thickness T is preferably 300 mm.
　ここで、本実施形態では、防風部材１２として板状部材を用いているが、この限りではなく、種々の形状のものを防風部材１２として用いてよい。また、本実施形態では、防風部材１２に矩形の開口１２ａが形成されているが、この限りではなく、搬送中のガラス基板３を通過させることが可能な形状であれば、開口１２ａの形状は任意の形状としてよい。 Here, in the present embodiment, a plate-like member is used as the wind-proof member 12, but the present invention is not limited to this, and various shapes may be used as the wind-proof member 12. Moreover, in this embodiment, although the rectangular opening 12a is formed in the wind-proof member 12, if it is a shape which can let the glass substrate 3 in conveyance pass, the shape of the opening 12a will be Any shape may be used.
　図１に示すように、上下方向において、防風部材１２の頂部１２ｂと、この頂部１２ｂに対向する本体２ａの天井部２ａｅとの間に形成される隙間の幅ＨＨは、防風部材１２に形成された開口１２ａの開口幅Ｈよりも広くなっている。また、防風部材１２の頂部１２ｂは、処理器１０の天板部１０ｂよりも上方に位置している。さらに、幅方向において、防風部材１２の幅方向両端部１２ｃは、処理領域４にあるガラス基板３の幅方向両端部よりも外方に位置すると共に、搬入口２ａａ及び搬出口２ａｂの幅方向両端部よりも外方に位置するようになっている。 As shown in FIG. 1, the width HH of the gap formed between the top portion 12b of the windproof member 12 and the ceiling portion 2ae of the main body 2a facing the top portion 12b in the vertical direction is formed in the windproof member 12. The opening 12a is wider than the opening width H. Further, the top portion 12 b of the windbreak member 12 is located above the top plate portion 10 b of the processor 10. Furthermore, in the width direction, both end portions 12c in the width direction of the windproof member 12 are located outward from both end portions in the width direction of the glass substrate 3 in the processing region 4, and both ends in the width direction of the carry-in port 2aa and the carry-out port 2ab. It is located outside the part.
　以下、上記のガラス基板の製造装置１を用いた本発明の第一実施形態に係るガラス基板の製造方法について説明する。 Hereinafter, the manufacturing method of the glass substrate which concerns on 1st embodiment of this invention using said glass substrate manufacturing apparatus 1 is demonstrated.
　まず、ガラス基板の製造装置１を稼働させ、複数のローラー６によるガラス基板３の搬送を開始し、搬入口２ａａからチャンバー２内へとガラス基板３を搬入する。その後、搬入口２ａａと処理領域４との間に設置された防風部材１２の開口１２ａをガラス基板３に通過させ、ガラス基板３を処理領域４へと搬入する。 First, the glass substrate manufacturing apparatus 1 is operated, the conveyance of the glass substrate 3 by a plurality of rollers 6 is started, and the glass substrate 3 is carried into the chamber 2 from the carry-in port 2aa. Thereafter, the opening 12 a of the wind-proof member 12 installed between the carry-in port 2 aa and the processing region 4 is passed through the glass substrate 3, and the glass substrate 3 is carried into the processing region 4.
　ガラス基板３の処理領域４への搬入が完了すると、処理器１０に形成された処理空間１０ｃ内でガラス基板３を搬送しつつ、供給路１０ａａから処理空間１０ｃに供給された処理ガス５をガラス基板３に噴き付けてエッチング処理を施すと共に、回収路１０ａｂから処理空間１０ｃ内の処理ガス５を回収する。このとき、搬入口２ａａ、搬出口２ａｂを通じてチャンバー２内へと流入した気流９の処理領域４への流れ込みが防風部材１２によって回避される。 When the loading of the glass substrate 3 into the processing region 4 is completed, the processing gas 5 supplied to the processing space 10c from the supply path 10aa is transferred to the glass while the glass substrate 3 is transported in the processing space 10c formed in the processing unit 10. While spraying on the substrate 3 to perform the etching process, the processing gas 5 in the processing space 10c is recovered from the recovery path 10ab. At this time, the wind-proof member 12 prevents the airflow 9 flowing into the chamber 2 through the carry-in port 2aa and the carry-out port 2ab from flowing into the processing region 4.
　ガラス基板３へのエッチング処理が完了すると、処理領域４からガラス基板３を搬出する。その後、処理領域４と搬出口２ａｂとの間に設置された防風部材１２の開口１２ａをガラス基板３に通過させる。更にその後、搬出口２ａｂからチャンバー２外へとガラス基板３を搬出する。以上により、エッチング処理が施されたガラス基板３が得られる。 When the etching process on the glass substrate 3 is completed, the glass substrate 3 is unloaded from the processing region 4. Then, the opening 12a of the windproof member 12 installed between the process area | region 4 and the carrying-out port 2ab is passed through the glass substrate 3. Thereafter, the glass substrate 3 is carried out of the chamber 2 from the carry-out port 2ab. Thus, the glass substrate 3 subjected to the etching process is obtained.
　なお、ガラス基板の製造装置１の稼働中には、チャンバー２の本体２ａ内（空間７内）及び本体２ａ外（チャンバー２外）にそれぞれ設置された両気圧計によってチャンバー２内外の気圧差を測定する。そして、測定された気圧差に基づいてガラス基板３の搬入口２ａａ、及び搬出口２ａｂの上下方向に沿った開口幅を調節する場合には、ガラス基板の製造装置１の稼働を一旦停止させた上で、開口幅の調節を行う。 During the operation of the glass substrate manufacturing apparatus 1, the pressure difference between the inside and outside of the chamber 2 is determined by both barometers installed inside the main body 2 a (inside the space 7) and outside the main body 2 a (outside the chamber 2). taking measurement. And when adjusting the opening width along the up-down direction of the carrying-in port 2aa of the glass substrate 3 and the carrying-out port 2ab based on the measured atmospheric | air pressure difference, the operation | movement of the manufacturing apparatus 1 of a glass substrate was once stopped. Above, adjust the aperture width.
　以下、上記のガラス基板の製造装置１、及びガラス基板の製造方法を用いた場合の主たる作用・効果について説明する。 Hereinafter, main actions and effects when the glass substrate manufacturing apparatus 1 and the glass substrate manufacturing method are used will be described.
　上記のガラス基板の製造装置１、及びガラス基板の製造方法によれば、チャンバー２内外の気圧差に起因して、搬入口２ａａ、搬出口２ａｂを通じてチャンバー２内へと流入する気流９が発生した場合であっても、ガラス基板３の搬送経路上における搬入口２ａａと処理領域４との間、及び、処理領域４と搬出口２ａｂとの間に、それぞれ防風部材１２が設置されているため、発生した気流９が処理領域４へと流れ込むことを防風部材１２によって可及的に回避することができる。これにより、気流９によってガラス基板３に噴き付けられるべき処理ガス５が吹き飛ばされるような事態の発生が防止され、ガラス基板３に対するエッチング処理を確実に実行することが可能となる。 According to the glass substrate manufacturing apparatus 1 and the glass substrate manufacturing method, the air flow 9 flowing into the chamber 2 through the carry-in port 2aa and the carry-out port 2ab is generated due to the pressure difference between the inside and outside of the chamber 2. Even in this case, since the windproof member 12 is installed between the carry-in port 2aa and the processing region 4 on the transport path of the glass substrate 3 and between the processing region 4 and the carry-out port 2ab, respectively. It is possible to prevent the generated airflow 9 from flowing into the processing region 4 by the windproof member 12 as much as possible. Thereby, the occurrence of a situation where the processing gas 5 to be sprayed on the glass substrate 3 is blown off by the air flow 9 is prevented, and the etching process on the glass substrate 3 can be reliably performed.
＜第二実施形態＞
　以下、本発明の第二実施形態に係るガラス基板の製造装置、及びガラス基板の製造方法について説明する。なお、この第二実施形態の説明において、上記の第一実施形態で既に説明した事項については、第二実施形態の説明で参照する図面に同一の符号を付すことで、重複する説明を省略し、第一実施形態との相違点についてのみ説明する。 <Second embodiment>
Hereinafter, the manufacturing apparatus of the glass substrate which concerns on 2nd embodiment of this invention, and the manufacturing method of a glass substrate are demonstrated. In the description of the second embodiment, the matters already described in the first embodiment are denoted by the same reference numerals in the drawings referred to in the description of the second embodiment, thereby omitting the overlapping description. Only differences from the first embodiment will be described.
　はじめに、本発明の第二実施形態に係るガラス基板の製造装置について説明する。 First, a glass substrate manufacturing apparatus according to a second embodiment of the present invention will be described.
　図５に示すように、第二実施形態に係るガラス基板の製造装置１が、上記の第一実施形態に係るガラス基板の製造装置１と相違している点は、以下の（１）、（２）の二点である。（１）処理器１０の天板部１０ｂ上にＨ鋼１７が設置されている点。（２）処理器１０と同一な外形を有し、且つ、ガラス基板３に対するエッチング処理を実行しないダミー処理器１８と、ダミー処理器１８上に設置されたＨ鋼１９との両者により、防風部材１２が構成されている点。 As shown in FIG. 5, the glass substrate manufacturing apparatus 1 according to the second embodiment is different from the glass substrate manufacturing apparatus 1 according to the first embodiment in the following (1), ( 2). (1) The H steel 17 is installed on the top plate part 10b of the processor 10. (2) The windproof member has both the same external shape as the processing unit 10 and the dummy processing unit 18 that does not perform the etching process on the glass substrate 3 and the H steel 19 installed on the dummy processing unit 18. 12 is configured.
　天板部１０ｂ上のＨ鋼１７は、ガラス基板３の幅方向に沿って延びており、天板部１０ｂの全幅に沿って設置されている。Ｈ鋼１７は、処理空間１０ｃ内を搬送中のガラス基板３の上面と、上面に対向する天板部１０ｂの平坦面との接触を回避するために、天板部１０ｂの自重による撓みを防止するための補強部材としての機能を有する。 The H steel 17 on the top plate portion 10b extends along the width direction of the glass substrate 3, and is installed along the entire width of the top plate portion 10b. The H steel 17 prevents the top plate portion 10b from being bent by its own weight in order to avoid contact between the upper surface of the glass substrate 3 being conveyed in the processing space 10c and the flat surface of the top plate portion 10b facing the upper surface. It has a function as a reinforcement member for doing.
　ダミー処理器１８は、上端に開口１８ａａが形成された箱状の本体部１８ａと、単一の板状部材でなる天板部１８ｂとを備えており、両者１８ａ，１８ｂがガラス基板３の搬送経路を上下に挟んで対向するように配置されている。 The dummy processor 18 includes a box-shaped main body portion 18 a having an opening 18 aa formed at the upper end and a top plate portion 18 b made of a single plate-like member, and both 18 a and 18 b convey the glass substrate 3. It arrange | positions so that a path | route may be pinched | interposed up and down.
　本体部１８ａは直方体状に形成されており、本体部１８ａの開口１８ａａは矩形に形成されている。開口１８ａａの幅方向に沿った長さは、ガラス基板３の全幅よりも長くなっている。また、本体部１８ａの底部には貫通孔１８ａｂが形成されており、貫通孔１８ａｂは、図示省略の洗浄集塵装置（スクラバー）と接続されている。そして、ガラス基板３の搬送に伴って処理空間１０ｃから流出した処理ガス５を開口１８ａａおよび貫通孔１８ａｂを介して排気し、洗浄集塵装置に送ることが可能となっている。 The main body portion 18a is formed in a rectangular parallelepiped shape, and the opening 18aa of the main body portion 18a is formed in a rectangular shape. The length along the width direction of the opening 18aa is longer than the entire width of the glass substrate 3. A through hole 18ab is formed in the bottom of the main body 18a, and the through hole 18ab is connected to a cleaning dust collector (scrubber) (not shown). Then, the processing gas 5 that has flowed out of the processing space 10c along with the conveyance of the glass substrate 3 can be exhausted through the opening 18aa and the through hole 18ab, and sent to the cleaning dust collector.
　天板部１８ｂは、ダミー処理器１８を通過するガラス基板３の上面と対向する平坦面を有する。また、天板部１８ｂ上に設置されたＨ鋼１９は、天板部１０ｂ上のＨ鋼１７と同様に、ガラス基板３の幅方向に沿って延びており、天板部１８ｂの全幅に沿って設置されている。そして、Ｈ鋼１９は、ダミー処理器１８を通過中のガラス基板３の上面と、上面に対向する天板部１８ｂの平坦面との接触を回避するために、天板部１８ｂの自重による撓みを防止するための補強部材としての機能を有する。 The top plate portion 18 b has a flat surface facing the upper surface of the glass substrate 3 that passes through the dummy processor 18. Moreover, the H steel 19 installed on the top plate portion 18b extends along the width direction of the glass substrate 3 in the same manner as the H steel 17 on the top plate portion 10b, and extends along the entire width of the top plate portion 18b. Installed. The H steel 19 is bent by its own weight of the top plate portion 18b in order to avoid contact between the upper surface of the glass substrate 3 passing through the dummy processor 18 and the flat surface of the top plate portion 18b facing the upper surface. It has a function as a reinforcement member for preventing.
　なお、上記のガラス基板の製造装置１を用いて、本発明の第二実施形態に係るガラス基板の製造方法を実行する態様は、ダミー処理器１８の開口１８ａａおよび貫通孔１８ａｂを介して処理空間１０ｃから流出した処理ガス５の排気を行う点以外は、上記の第一実施形態と同様であるので、重複する説明を省略する。 In addition, the aspect which performs the manufacturing method of the glass substrate which concerns on 2nd embodiment of this invention using said glass substrate manufacturing apparatus 1 is processing space via opening 18aa and through-hole 18ab of the dummy processing device 18. FIG. Since it is the same as that of said 1st embodiment except the point which exhausts the process gas 5 which flowed out from 10c, the overlapping description is abbreviate | omitted.
　ここで、本発明に係るガラス基板の製造装置、及びガラス基板の製造方法は、上記の実施形態で説明した構成や態様に限定されるものではない。例えば、上記の第一実施形態においては、防風部材が単一の板状部材からなっているが、この限りではない。図６に示すように、ガラス基板を通過させるための隙間１３を介して上下に分割された二枚の板状部材１４，１５で防風部材を構成してもよい。 Here, the glass substrate manufacturing apparatus and the glass substrate manufacturing method according to the present invention are not limited to the configurations and aspects described in the above embodiments. For example, in the first embodiment, the windproof member is a single plate-like member, but this is not restrictive. As shown in FIG. 6, you may comprise a wind-proof member with the two plate-shaped members 14 and 15 divided | segmented up and down through the clearance gap 13 for allowing a glass substrate to pass through.
　また、チャンバー内へと流入した気流が防風部材に形成された開口（隙間）を通じて処理領域へと流れ込むことを回避しやすくするため、図７ａ～図７ｃに示すように、防風部材１２に形成された開口１２ａ（隙間１３）は、隙間開閉部材としてのシャッター１６の上下動によって開閉するようにしてもよい。この場合、同図に示すように、ガラス基板３が防風部材１２を通過する際のみ、開口１２ａ（隙間１３）が開いた状態とすることが好ましい。ここで、シャッター１６の動作方向は、必ずしも上下方向とする必要はなく、防風部材１２に形成された開口１２ａ（隙間１３）を開閉できさえすれば、その動作方向は任意の方向としてよい。 Further, in order to make it easier to avoid that the airflow flowing into the chamber flows into the processing region through the opening (gap) formed in the windproof member, as shown in FIGS. 7a to 7c, the windbreak member 12 is formed. The opening 12a (gap 13) may be opened and closed by the vertical movement of the shutter 16 as a gap opening / closing member. In this case, it is preferable that the opening 12a (gap 13) is opened only when the glass substrate 3 passes through the windproof member 12, as shown in FIG. Here, the operation direction of the shutter 16 is not necessarily the vertical direction, and may be any direction as long as the opening 12a (gap 13) formed in the windproof member 12 can be opened and closed.
　また、上記の実施形態で説明したガラス基板の製造装置、及びガラス基板の製造方法は、チャンバーに形成されたガラス基板の搬入口と搬出口との両方からチャンバー内へと気流が流入しやすい環境に適した構成、及び態様を一例として挙げたものである。そして、本発明に係るガラス基板の製造装置、及びガラス基板の製造方法は、これ以外の環境の下でも適用することが可能である。例えば、搬入口のみから気流がチャンバー内へと流入しやすい環境では、ガラス基板の搬送経路上における搬入口と処理領域との間にのみ、防風部材を設置してもよい。同様に、搬出口のみから気流がチャンバー内へと流入しやすい環境では、ガラス基板の搬送経路上における処理領域と搬出口との間にのみ、防風部材を設置してもよい。 In addition, the glass substrate manufacturing apparatus and the glass substrate manufacturing method described in the above embodiment have an environment in which airflow easily flows into the chamber from both the entrance and exit of the glass substrate formed in the chamber. A configuration and an embodiment suitable for the above are given as an example. And the manufacturing apparatus of the glass substrate which concerns on this invention, and the manufacturing method of a glass substrate are applicable also in environments other than this. For example, in an environment where airflow easily flows into the chamber only from the carry-in port, the windproof member may be installed only between the carry-in port and the processing region on the glass substrate transfer path. Similarly, in an environment where airflow easily flows into the chamber only from the carry-out port, a windproof member may be installed only between the processing region and the carry-out port on the glass substrate transfer path.
　１　　　　　ガラス基板の製造装置
　２　　　　　チャンバー
　２ａ　　　　本体
　２ａａ　　　搬入口
　２ａｂ　　　搬出口
　２ａｃ　　　天井孔
　２ａｄ　　　側壁部
　２ａｅ　　　天井部
　２ｂ　　　　蓋体
　３　　　　　ガラス基板
　４　　　　　処理領域
　５　　　　　処理ガス
　９　　　　　気流
　１２　　　　防風部材
　１２ａ　　　開口
　１２ｂ　　　頂部
　１２ｃ　　　幅方向両端部
　１３　　　　隙間
　１４　　　　板状部材
　１５　　　　板状部材
　１６　　　　シャッター
　１８　　　　ダミー処理器
　１９　　　　Ｈ鋼
　Ｈ　　　　　開口幅
　ＨＨ　　　　隙間の幅
　Ｔ　　　　　厚み DESCRIPTION OF SYMBOLS 1 Glass substrate manufacturing apparatus 2 Chamber 2a Main body 2aa Carry-in port 2ab Carry-out port 2ac Ceiling hole 2ad Side wall part 2ae Ceiling part 2b Cover body 3 Glass substrate 4 Process area 5 Process gas 9 Airflow 12 Windproof member 12a Opening 12b Top part 12c Both ends of width direction Part 13 Gap 14 Plate member 15 Plate member 16 Shutter 18 Dummy processor 19 H Steel H Opening width HH Gap width T Thickness

Claims (11)

  1. 　搬入口からチャンバー内へと搬入したガラス基板を水平方向に搬送しつつ、前記チャンバー内での前記ガラス基板の搬送経路上に設けた処理領域で処理ガスによりエッチング処理を施した後、処理後の前記ガラス基板を搬出口から前記チャンバー外へと搬出するガラス基板の製造方法であって、
    　前記ガラス基板の搬送経路上における前記搬入口と前記処理領域との間、及び、前記処理領域と前記搬出口との間の少なくとも一方に、防風部材を設置したことを特徴とするガラス基板の製造方法。     While carrying the glass substrate carried into the chamber from the carry-in entrance in the horizontal direction, after performing the etching treatment with the treatment gas in the treatment region provided on the conveyance path of the glass substrate in the chamber, A method for producing a glass substrate for carrying out the glass substrate from a carry-out port to the outside of the chamber,
    Manufacturing of a glass substrate, characterized in that a windproof member is installed between the carry-in port and the processing region on the transport path of the glass substrate and at least one between the processing region and the carry-out port. Method.
  2. 　前記ガラス基板の搬送経路上における前記搬入口と前記処理領域との間、及び、前記処理領域と前記搬出口との間の双方に、それぞれ防風部材を設置したことを特徴とする請求項１に記載のガラス基板の製造方法。 2. The windbreak member is installed between the carry-in port and the processing region on the transport path of the glass substrate and between the processing region and the carry-out port, respectively. The manufacturing method of the glass substrate of description.
  3. 　前記ガラス基板の搬送経路が一直線に延びていることを特徴とする請求項１又は２に記載のガラス基板の製造方法。 The method for producing a glass substrate according to claim 1 or 2, wherein a conveyance path of the glass substrate extends in a straight line.
  4. 　前記防風部材に、搬送中の前記ガラス基板を通過させるための隙間が形成されていることを特徴とする請求項１～３のいずれかに記載のガラス基板の製造方法。 The method for producing a glass substrate according to any one of claims 1 to 3, wherein a gap for allowing the glass substrate being conveyed to pass through is formed in the windproof member.
  5. 　前記ガラス基板の主面に直交する高さ方向において、前記防風部材の頂部と該頂部に対向する前記チャンバーの内壁との間に形成される隙間の幅を、前記防風部材に形成された前記隙間の幅よりも広くすることを特徴とする請求項４に記載のガラス基板の製造方法。 In the height direction perpendicular to the main surface of the glass substrate, the gap formed between the top of the windproof member and the inner wall of the chamber facing the top is defined as the gap formed in the windproof member. The glass substrate manufacturing method according to claim 4, wherein the glass substrate is wider than the width of the glass substrate.
  6. 　前記ガラス基板の搬送方向に沿った前記防風部材の厚みを、１００ｍｍ以上とすることを特徴とする請求項４又は５に記載のガラス基板の製造方法。 The method for producing a glass substrate according to claim 4 or 5, wherein a thickness of the windproof member along a conveying direction of the glass substrate is 100 mm or more.
  7. 　前記ガラス基板の主面に沿って該ガラス基板の搬送方向と直交する幅方向において、前記防風部材の幅方向両端部を、前記処理領域にある前記ガラス基板の幅方向両端部よりも外方に位置させることを特徴とする請求項１～６のいずれかに記載のガラス基板の製造方法。 In the width direction orthogonal to the conveyance direction of the glass substrate along the main surface of the glass substrate, both ends in the width direction of the windproof member are more outward than both width direction ends of the glass substrate in the processing region. The method for producing a glass substrate according to any one of claims 1 to 6, wherein the glass substrate is positioned.
  8. 　前記ガラス基板の主面に沿って該ガラス基板の搬送方向と直交する幅方向において、前記防風部材の幅方向両端部を、前記搬入口及び前記搬出口の幅方向両端部よりも外方に位置させることを特徴とする請求項１～７のいずれかに記載のガラス基板の製造方法。 In the width direction orthogonal to the conveyance direction of the glass substrate along the main surface of the glass substrate, the width direction both ends of the windproof member are located outward from the width direction both ends of the carry-in port and the carry-out port. The method for producing a glass substrate according to any one of claims 1 to 7, wherein:
  9. 　前記搬入口と前記処理領域との間に設置される前記防風部材を、前記ガラス基板の搬送経路上における前記搬入口と前記処理領域との中間地点を基準として前記処理領域側に設置し、
    　前記処理領域と前記搬出口との間に設置される前記防風部材を、前記ガラス基板の搬送経路上における前記処理領域と前記搬出口との中間地点を基準として前記処理領域側に設置したことを特徴とする請求項１～８のいずれかに記載のガラス基板の製造方法。     The windproof member installed between the carry-in port and the processing region is installed on the processing region side with reference to an intermediate point between the carry-in port and the processing region on the transport path of the glass substrate,
    The windproof member installed between the processing region and the carry-out port is installed on the processing region side with reference to an intermediate point between the processing region and the carry-out port on the transfer path of the glass substrate. The method for producing a glass substrate according to any one of claims 1 to 8, wherein:
  10. 　前記防風部材として板状部材を用いることを特徴とする請求項１～９のいずれかに記載のガラス基板の製造方法。 10. The method for producing a glass substrate according to claim 1, wherein a plate-like member is used as the windproof member.
  11. 　搬入口からチャンバー内へと搬入したガラス基板を水平方向に搬送しつつ、前記チャンバー内での前記ガラス基板の搬送経路上に設けた処理領域で処理ガスによりエッチング処理を施した後、処理後の前記ガラス基板を搬出口から前記チャンバー外へと搬出するように構成されたガラス基板の製造装置であって、
    　前記ガラス基板の搬送経路上における前記搬入口と前記処理領域との間、及び、前記処理領域と前記搬出口との間の少なくとも一方に、防風部材が設置されていることを特徴とするガラス基板の製造装置。     While carrying the glass substrate carried into the chamber from the carry-in entrance in the horizontal direction, after performing the etching treatment with the treatment gas in the treatment region provided on the conveyance path of the glass substrate in the chamber, A glass substrate manufacturing apparatus configured to carry out the glass substrate from the carry-out port to the outside of the chamber,
    A glass substrate, wherein a windproof member is installed between at least one of the carry-in port and the processing region on the transport path of the glass substrate and between the processing region and the carry-out port. Manufacturing equipment.
PCT/JP2016/076665 2015-09-11 2016-09-09 Method for manufacturing glass substrate, and apparatus for manufacturing glass substrate WO2017043644A1 (en)

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