CN107709259B - Method for manufacturing glass substrate and device for manufacturing glass substrate - Google Patents
Method for manufacturing glass substrate and device for manufacturing glass substrate Download PDFInfo
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- CN107709259B CN107709259B CN201680033810.4A CN201680033810A CN107709259B CN 107709259 B CN107709259 B CN 107709259B CN 201680033810 A CN201680033810 A CN 201680033810A CN 107709259 B CN107709259 B CN 107709259B
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- 239000011521 glass Substances 0.000 title claims abstract description 207
- 239000000758 substrate Substances 0.000 title claims abstract description 207
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 title claims description 75
- 238000005530 etching Methods 0.000 claims abstract description 19
- 230000002265 prevention Effects 0.000 claims description 5
- 239000007789 gas Substances 0.000 description 56
- 229910000831 Steel Inorganic materials 0.000 description 8
- 239000010959 steel Substances 0.000 description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000007786 electrostatic charging Methods 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Surface Treatment Of Glass (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A glass substrate manufacturing method is provided, wherein a glass substrate (3) carried into a chamber (2) from a carrying-in port (2aa) is carried along a horizontal direction, etching treatment is carried out in a treatment area (4) arranged on a carrying path of the glass substrate (3) in the chamber (2) by using a treatment gas (5), then the treated glass substrate (3) is carried out from a carrying-out port (2ab) to the outside of the chamber (2), and a windproof member (12) provided with an opening (12a) for allowing the glass substrate (3) in the carrying path to pass through is respectively arranged between the carrying-in port (2aa) and the treatment area (4) and between the treatment area (4) and the carrying-out port (2 ab).
Description
Technical Field
The present invention relates to a method for manufacturing a glass substrate and an apparatus for manufacturing a glass substrate, in which a glass substrate is etched using a process gas such as hydrogen fluoride.
Background
As is well known, glass substrates are incorporated in various electronic devices, as typified by Flat Panel Displays (FPDs), plasma displays, organic E L displays, field emission displays, and the like, as typified by mobile devices such as Flat Panel Displays (FPDs), smart phones, tablet PCs, and the like.
However, in the process of manufacturing a glass substrate, there may be a problem caused by electrostatic charging. For example, when a glass substrate is placed on a mounting table in order to perform a predetermined process on the glass substrate, the glass substrate may adhere to the mounting table due to electrostatic charging, and when the glass substrate whose process is completed is to be peeled off from the mounting table, the glass substrate may be damaged.
As a countermeasure against the above-described problem, the following method is known: the surface of a glass substrate is roughened by performing an etching process by spraying a process gas such as hydrogen fluoride on the glass substrate, thereby avoiding the occurrence of problems due to electrostatic charging. Further, patent document 1 discloses a specific example of this method.
The following method is disclosed in this document: the etching process is performed by spraying a process gas from a blow nozzle onto a glass substrate on the upstream side of a conveyance path of the glass substrate during conveyance, and the process gas is sucked and exhausted by a suction nozzle on the downstream side of the conveyance path. Although not explicitly shown in this document, when this method is used, an etching process is often performed in a chamber in order to prevent a process gas from leaking out. The chamber is provided with a carrying-in port for carrying in the glass substrate into the chamber and a carrying-out port for carrying out the glass substrate out of the chamber.
Prior art documents
Patent document
Patent document 1: international publication No. 2011/105331
Disclosure of Invention
Problems to be solved by the invention
However, when the etching treatment is performed on the glass substrate by the method disclosed in patent document 1, the following problems still occur.
That is, since the transfer port and the transfer port for the glass substrate are formed in the chamber, when an air flow flowing into the chamber through the transfer port and the transfer port is generated due to a difference in air pressure between the inside and the outside of the chamber, the air flow blows off the processing gas sprayed on the glass substrate, and there is a problem that the surface of the glass substrate is not uniformly roughened.
In view of the above, an object of the present invention is to provide a method for etching a glass substrate using a process gas in a chamber in which a transfer port and a transfer port of the glass substrate are formed, which can be reliably performed.
Means for solving the problems
The method of the present invention, which is created to solve the above-described problems, is a method for manufacturing a glass substrate, in which a glass substrate carried into a chamber from a carrying-in port is carried in a horizontal direction, the glass substrate is etched by a process gas in a process area provided on a carrying path of the glass substrate in the chamber, and then the processed glass substrate is carried out of the chamber from a carrying-out port, wherein a wind shielding member is provided at least one of between the carrying-in port and the process area and between the process area and the carrying-out port on the carrying path of the glass substrate. Here, "conveying the glass substrate in the horizontal direction" includes not only a case where the glass substrate is conveyed in the horizontal direction, which is a non-inclined direction, but also a case where the glass substrate is conveyed in a direction inclined by 30 ° or less from the upper and lower sides with respect to the horizontal plane. The posture of the glass substrate in these cases includes not only a posture in which the glass substrate is in a non-inclined state with respect to both sides in the conveyance direction, but also a posture in which the glass substrate is in an inclined state within a range of 30 ° or less from one side to the other side in the conveyance direction (the same applies hereinafter).
According to this method, in an environment where an airflow flowing into the chamber from the carrying-in port is likely to be generated due to a difference in atmospheric pressure between the inside and the outside of the chamber, by providing the wind-shielding member at least between the carrying-in port on the glass substrate conveying path and the processing region in advance, it is possible to prevent the generated airflow from flowing into the processing region as much as possible. Similarly, in an environment where the gas flow flowing into the chamber from the carrying-out port is likely to occur, by providing the wind-shielding member at least between the processing region and the carrying-out port in advance, the generated gas flow can be prevented from flowing into the processing region as much as possible. This prevents the occurrence of a situation in which the processing gas sprayed on the glass substrate is blown off by the gas flow, and thus the etching process for the glass substrate can be reliably performed.
In the above method, preferably, the wind-proof members are provided between the carrying-in port and the processing region and between the processing region and the carrying-out port on the glass substrate conveying path.
In this way, since the wind-shielding members are provided between the carrying-in port and the processing region and between the processing region and the carrying-out port, even in an environment where the gas flow easily flows into the chamber from both the carrying-in port and the carrying-out port, the inflow of the gas flow into the processing region can be prevented as much as possible by the wind-shielding members.
In the above method, the glass substrate transfer path preferably extends in a straight line.
In this way, since the carrying-in port, the processing area, and the carrying-out port are arranged in a straight line, the wind shielding member easily blocks the path of the airflow toward the processing area, and the inflow of the airflow into the processing area is further easily avoided.
In the above method, it is preferable that the wind-shielding member has a gap through which the glass substrate during conveyance passes.
In this way, since the gap for passing the glass substrate during conveyance is formed in the wind-proof member, it is possible to reliably avoid the conveyance of the glass substrate from being hindered by the wind-proof member. In addition, while avoiding the conveyance of the glass substrate from being hindered, both the portion existing on the upper side and the portion existing on the lower side of the rail through which the glass substrate passes can be provided on the wind-proof member with a gap therebetween. This makes it easy to block the air flow from the air flow to the processing area by the wind shielding members on both the upper side and the lower side of the rail, and thus makes it easy to further avoid the air flow from flowing into the processing area.
In the above method, it is preferable that a width of a gap formed between the ceiling portion of the wind-shielding member and the inner wall of the chamber facing the ceiling portion is larger than a width of the gap formed in the wind-shielding member in a height direction orthogonal to the main surface of the glass substrate.
When the wind-shielding member is provided with a gap (hereinafter referred to as a first gap) through which the glass substrate during conveyance passes, there is a possibility that an air flow may flow into the processing region through the first gap. However, if the width of the gap (hereinafter referred to as a second gap) formed between the ceiling portion of the wind-proof member and the inner wall of the chamber facing the ceiling portion is made larger than the width of the first gap, the above-described possibility can be reliably eliminated. That is, the air flow flowing into the chamber and reaching the wind shielding member is easily guided to flow into the second gap, which is a relatively wide gap, and therefore, the air flow into the first gap, which is a relatively narrow gap, can be avoided as much as possible.
In the above method, the thickness of the wind-shielding member along the conveying direction of the glass substrate is preferably 100mm or more.
With the increase in the thickness of the wind-shielding member, it is easy to avoid the air flow that has flowed into the chamber and reached the wind-shielding member from flowing into the treatment region through the gap formed in the wind-shielding member. Further, if the thickness of the wind-shielding member is set to 100mm or more, the inflow of air into the gap formed in the wind-shielding member can be prevented as much as possible.
In the above method, it is preferable that both ends in the width direction of the wind-shielding member are located outside both ends in the width direction of the glass substrate in the processing region in the width direction perpendicular to the conveyance direction of the glass substrate along the main surface of the glass substrate.
In this way, the following is easily avoided: the airflow flowing into the chamber through the carrying-in port and the carrying-out port flows into the processing region directly from the outer side of both ends in the width direction of the wind-shielding member without being blocked by the wind-shielding member, or flows into the processing region while bypassing both ends in the width direction of the wind-shielding member.
In the above method, it is preferable that both ends in the width direction of the wind-shielding member are located outside both ends in the width direction of the carrying-in port and the carrying-out port in the width direction perpendicular to the carrying direction of the glass substrate along the main surface of the glass substrate.
In this way, the wind shielding member easily shields the path of the airflow flowing into the chamber through the carrying-in port and the carrying-out port. Therefore, the direct inflow of the gas flow into the processing region can be avoided as much as possible.
In the above method, it is preferable that the wind shielding member provided between the carrying-in port and the processing area is provided on the processing area side with reference to a point intermediate between the carrying-in port and the processing area on the glass substrate carrying path, and the wind shielding member provided between the processing area and the carrying-out port is provided on the processing area side with reference to a point intermediate between the processing area and the carrying-out port on the glass substrate carrying path.
In this way, the wind shielding member is provided at a position close to the processing region with respect to the carrying-in port and the processing region, and the wind shielding member is provided at a position close to the processing region with respect to the processing region and the carrying-out port, so that it is easy to avoid the inflow of the gas flow bypassing the wind shielding member into the processing region.
In the above method, it is preferable to use a plate-like member as the wind-shielding member.
In this way, the inflow of the gas into the processing region can be avoided as much as possible only by providing the plate-like members between the carrying-in port and the processing region and between the processing region and the carrying-out port. Therefore, the cost and effort required to avoid the inflow of the gas flow into the processing area can be reduced.
Further, in order to solve the above-described problems, the apparatus of the present invention is configured such that, while a glass substrate carried into a chamber from a carrying-in port is carried in a horizontal direction, the glass substrate is subjected to etching treatment by a treatment gas in a treatment region provided on a carrying path of the glass substrate in the chamber, and then the treated glass substrate is carried out of the chamber from a carrying-out port, and is characterized in that a wind-shielding member is provided at least one of between the carrying-in port and the treatment region and between the treatment region and the carrying-out port on the carrying path of the glass substrate.
With such a configuration, the same operations and effects as those described above in the description of the method for manufacturing a glass substrate can be obtained.
Effects of the invention
According to the method and apparatus for manufacturing a glass substrate of the present invention, when etching processing is performed on a glass substrate using a processing gas in a chamber in which a transfer port and a transfer port of the glass substrate are formed, reliable execution can be achieved.
Drawings
Fig. 1 is a schematic vertical cross-sectional side view showing an apparatus for manufacturing a glass substrate according to a first embodiment of the present invention.
Fig. 2 is a front view showing an opening width adjustment member provided in the apparatus for manufacturing a glass substrate according to the first embodiment of the present invention.
Fig. 3 is a vertical cross-sectional side view showing the vicinity of a supply passage provided in the apparatus for manufacturing a glass substrate according to the first embodiment of the present invention.
Fig. 4 is a perspective view showing a wind shield member provided in the apparatus for manufacturing a glass substrate according to the first embodiment of the present invention.
Fig. 5 is a schematic vertical cross-sectional side view showing an apparatus for manufacturing a glass substrate according to a second embodiment of the present invention.
Fig. 6 is a perspective view showing a wind shield member provided in a glass substrate manufacturing apparatus according to another embodiment of the present invention.
Fig. 7a is a vertical cross-sectional side view showing the vicinity of a wind shield member provided in a glass substrate manufacturing apparatus according to another embodiment of the present invention.
Fig. 7b is a vertical cross-sectional side view showing the vicinity of the wind-shielding member provided in the apparatus for manufacturing a glass substrate according to another embodiment of the present invention.
Fig. 7c is a vertical cross-sectional side view showing the vicinity of the wind-shielding member provided in the apparatus for manufacturing a glass substrate according to another embodiment of the present invention.
Detailed Description
Hereinafter, a method for manufacturing a glass substrate and an apparatus for manufacturing a glass substrate according to an embodiment of the present invention will be described with reference to the drawings. The embodiments described below are exemplified by a mode suitable for an environment in which gas flows easily into the chamber from both the transfer port and the transfer port of the glass substrate formed in the chamber.
< first embodiment >
First, an apparatus for manufacturing a glass substrate according to a first embodiment of the present invention will be described.
As shown in fig. 1, the glass substrate manufacturing apparatus 1 according to the first embodiment is configured to carry out an etching process using hydrogen fluoride as a process gas 5 in a process field 4 provided in a conveyance path of a glass substrate 3 in a chamber 2 while conveying the glass substrate 3 carried into the chamber 2 from a carrying-in port 2aa in a horizontal direction, and then carry out the processed glass substrate 3 from a carrying-out port 2ab to the outside of the chamber 2. In the glass substrate manufacturing apparatus 1, the glass substrate 3 can be conveyed in a horizontally placed posture along a conveying path extending horizontally in a straight line by the plurality of rollers 6 disposed inside and outside the chamber 2.
The chamber 2 is formed in a rectangular parallelepiped shape, and prevents the process gas 5 from flowing out of the chamber 2 from a space 7 formed therein. The chamber 2 includes a main body 2a in which a carrying-in port 2aa of the glass substrate 3, a carrying-out port 2ab, and a ceiling hole 2ac are formed, and a plate-like lid body 2b for closing the ceiling hole 2 ac. The material of the main body 2a and the lid body 2b is polyvinyl chloride having excellent corrosion resistance against the process gas 5 (hydrogen fluoride). Further, barometers (not shown) are provided in the main body 2a (in the space 7) and outside the main body 2a (outside the chamber 2), respectively, and the difference in air pressure between the inside and the outside of the chamber 2 can be measured by the two barometers.
The carrying-in port 2aa and the carrying-out port 2ab are formed in the side wall portion 2ad of the main body 2a, and are formed in a rectangular shape elongated in a width direction (a direction perpendicular to the paper surface in fig. 1, hereinafter simply referred to as a width direction) perpendicular to the carrying direction of the glass substrate 3 along the main surface (upper surface and lower surface) of the glass substrate 3. Three ceiling holes 2ac are formed in the ceiling portion 2ae of the main body 2 a. The lid body 2b can close the entire opening of the ceiling hole 2ac, and can be attached to and detached from the main body 2 a.
The opening width of each of the carry-in port 2aa and the carry-out port 2ab in the vertical direction (the height direction perpendicular to the main surface of the glass substrate 3) can be adjusted by the opening width adjusting member 8, and the opening width adjusting member 8 can be moved vertically along the side wall portion 2ad of the main body 2 a. The adjustment of the opening widths of the carry-in port 2aa and the carry-out port by the opening width adjusting member 8 can be performed by an operator by detaching the cover 2b from the main body 2a through the ceiling hole 2 ac. The adjustment of the opening widths of the carry-in port 2aa and the carry-out port 2ab is performed based on the difference in the atmospheric pressures inside and outside the chamber 2 measured by the two barometers. This makes it possible to adjust the flow velocity of the gas flow 9 flowing into the chamber 2 through the carrying inlet 2aa and the carrying outlet 2ab due to the difference in the gas pressure between the inside and the outside of the chamber 2.
As shown in fig. 2, the opening width adjustment member 8 includes a pair of plate- like members 8a and 8 b. A pair of elongated holes 8aa (8ba) elongated in the vertical direction for passing the bolts 8c are formed in the pair of plate- like members 8a, 8b, respectively. The pair of plate- like members 8a and 8b and the bolt 8c are made of polyvinyl chloride. Further, the opening widths of the carry-in port 2aa and the carry-out port 2ab along the vertical direction can be adjusted by adjusting the relative positional relationship between the elongated hole 8aa (8ba) and the bolt 8c penetrating the elongated hole 8aa (8ba) and fixing the bolt 8c to a screw hole (not shown) formed in the side wall portion 2ad of the main body 2a to position the respective positions of the pair of plate- like members 8a, 8b in the vertical direction.
As shown in fig. 1, a processing chamber 10 is disposed in the processing area 4, and the processing chamber 10 applies a processing gas 5 to the glass substrate 3 conveyed by the plurality of rollers 6 disposed in the chamber 2 to perform an etching process. The processor 10 includes: a main body 10a disposed to face a lower surface of the glass substrate 3 carried into the processing region 4; and a top plate 10b disposed to face the upper surface of the glass substrate 3. A processing space 10c for performing an etching process on the glass substrate 3 is formed between the main body portion 10a and the top plate portion 10 b. The length of the processing space 10c in the width direction is larger than the entire width of the glass substrate 3 (length in the width direction). The material of the main body 10a and the top plate 10b is polyvinyl chloride.
The main body 10a includes: a supply passage 10aa which supplies the processing gas 5 to be sprayed on the lower surface of the glass substrate 3 to the processing space 10c and is provided on the upstream side of the conveyance path of the glass substrate 3; and a recovery path 10ab provided on the downstream side of the conveyance path of the glass substrate 3 to recover the processing gas 5 from the processing space 10 c. Thus, the processing gas 5 supplied from the supply path 10aa to the processing space 10c flows toward the downstream side of the conveyance path of the glass substrate 3 after being sprayed on the lower surface of the glass substrate 3, and is collected from the processing space 10c by the collection path 10 ab. The main body portion 10a incorporates a heating member 10ac (e.g., a heater) capable of heating the main body portion 10a to prevent condensation caused by the process gas 5.
Both the outlet port of the process gas 5 in the supply path 10aa and the inlet port of the process gas 5 in the recovery path 10ab are formed in a slit shape elongated in the width direction. The entire width of the outflow port and the inflow port in the width direction is larger than the entire width of the glass substrate 3 in the width direction. As shown in fig. 3, the opening width of the outlet of the processing gas 5 in the supply passage 10aa along the conveying direction of the glass substrate 3 is adjusted to a constant width by the spacer 11 provided in the supply passage 10 aa. The plurality of spacers 11 are provided in a spaced state from each other in the width direction.
Here, the depth dimension D from the outlet of the process gas 5 in the supply passage 10aa to the position where the spacer 11 is provided is preferably in the range of 10mm to 100 mm. If the depth dimension D is too small, the flow of the process gas 5 in the supply passage 10aa is disturbed by the spacer 11, and the lower surface of the glass substrate 3 may be unevenly roughened by the etching process. On the other hand, if the depth dimension D is too large, it is difficult to adjust the opening width of the outlet of the process gas 5 in the supply passage 10aa along the conveying direction of the glass substrate 3 to a desired width. Therefore, the supply amount of the processing gas 5 supplied from the outlet port to the processing space 10c may be too large or too small to roughen the lower surface of the glass substrate 3 to a desired surface roughness.
As shown in fig. 1, the top plate 10b is formed of a single plate-like member and has a flat surface facing the upper surface of the glass substrate 3 carried into the processing region 4. Further, similarly to the main body portion 10a, a heating member 10ba (e.g., a heater) capable of heating the top plate portion 10b is incorporated in the top plate portion 10b to prevent the occurrence of condensation caused by the process gas 5.
One wind-prevention member 12 is provided between the carrying-in port 2aa and the processing region 4 and between the processing region 4 and the carrying-out port 2ab on the carrying path of the glass substrate 3, respectively, and the wind-prevention member 12 prevents the gas flow 9 flowing into the chamber 2 from flowing into the processing region 4. The wind-prevention member 12 provided between the carry-in port 2aa and the processing region 4 is provided on the processing region 4 side with reference to an intermediate point between the carry-in port 2aa and the processing region 4. Similarly, the wind-shielding member 12 provided between the processing area 4 and the carrying-out port 2ab is provided on the processing area 4 side with reference to a point intermediate between the processing area 4 and the carrying-out port 2 ab.
Here, in the present embodiment, the wind-prevention members 12 are provided between the carrying-in port 2aa and the processing area 4 and between the processing area 4 and the carrying-out port 2ab, respectively, but the present invention is not limited thereto. A plurality of wind-prevention members 12 may be provided between the carrying-in port 2aa and the processing region 4 and between the processing region 4 and the carrying-out port 2ab, respectively. The number of the wind-shielding members 12 provided between the carrying-in port 2aa and the processing area 4 may be different from the number of the wind-shielding members 12 provided between the processing area 4 and the carrying-out port 2 ab. In the present embodiment, the wind-proof member 12 provided between the carry-in port 2aa and the processing region 4 is provided on the processing region 4 side with reference to the intermediate point between the carry-in port 2aa and the processing region 4, but the present invention is not limited thereto. The wind-prevention member 12 may be provided at any position as long as it is provided between the carrying-in port 2aa and the processing region 4 (the same applies to the wind-prevention member 12 provided between the processing region 4 and the carrying-out port 2 ab).
As shown in fig. 4, the wind-shielding member 12 is formed of a single plate-shaped member, and has an opening 12a as a gap through which the glass substrate 3 during conveyance passes. The opening 12a is formed in a rectangular shape, and an opening width W along the width direction and an opening width H along the vertical direction are larger than the entire width of the glass substrate 3 along the width direction and the thickness of the glass substrate 3, respectively. In order to prevent the gas flow 9, which has flowed into the chamber 2 and reached the wind shielding member 12, from flowing into the processing region 4 through the opening 12a, the thickness T of the wind shielding member 12 in the conveyance direction of the glass substrate 3 is preferably 100mm or more, and more preferably 150mm or more. The upper limit of the thickness T is preferably 300 mm.
Here, in the present embodiment, a plate-shaped member is used as the wind prevention member 12, but the present invention is not limited thereto, and members having various shapes may be used as the wind prevention member 12. In the present embodiment, the rectangular opening 12a is formed in the wind-proof member 12, but the shape is not limited to this, and the shape of the opening 12a may be any shape as long as it is a shape that allows the glass substrate 3 during conveyance to pass through.
As shown in fig. 1, the width HH of the gap formed between the ceiling portion 2ae of the main body 2a opposed to the ceiling portion 12b and the ceiling portion 12b of the wind shielding member 12 is larger than the opening width H of the opening 12a formed in the wind shielding member 12 in the up-down direction. The top 12b of the wind-shielding member 12 is located above the top 10b of the disposer 10. Further, both width-direction end portions 12c of the wind-shielding member 12 are positioned outside both width-direction end portions of the glass substrate 3 in the processing region 4 and outside both width-direction end portions of the carry-in port 2aa and the carry-out port 2ab in the width direction.
A method for producing a glass substrate according to a first embodiment of the present invention using the above-described apparatus 1 for producing a glass substrate will be described below.
First, the glass substrate manufacturing apparatus 1 is operated to start conveyance of the glass substrate 3 by the plurality of rollers 6, and the glass substrate 3 is carried into the chamber 2 from the carrying-in port 2 aa. Then, the glass substrate 3 is passed through the opening 12a of the windshield member 12 provided between the carrying-in port 2aa and the processing region 4, and the glass substrate 3 is carried into the processing region 4.
When the glass substrate 3 is carried into the processing region 4, the glass substrate 3 is carried in the processing space 10c formed in the processing unit 10, and the processing gas 5 supplied from the supply passage 10aa to the processing space 10c is sprayed on the glass substrate 3 to perform the etching process, and the processing gas 5 in the processing space 10c is collected from the collection passage 10 ab. At this time, the flow of the gas flow 9 flowing into the chamber 2 through the carrying-in port 2aa and the carrying-out port 2ab into the processing region 4 is prevented by the wind-prevention member 12.
When the etching process for the glass substrate 3 is completed, the glass substrate 3 is carried out from the processing area 4. Then, the glass substrate 3 is passed through the opening 12a of the windshield member 12 provided between the processing area 4 and the carrying-out port 2 ab. Then, the glass substrate 3 is carried out of the chamber 2 through the carrying-out port 2 ab. Through the above steps, the glass substrate 3 subjected to the etching treatment is obtained.
During operation of the glass substrate manufacturing apparatus 1, the difference in air pressure between the inside and the outside of the chamber 2 is measured by two barometers respectively provided inside the main body 2a (inside the space 7) and outside the main body 2a (outside the chamber 2) of the chamber 2. Then, when the opening widths of the carrying-in port 2aa and the carrying-out port 2ab of the glass substrate 3 in the vertical direction are adjusted based on the measured air pressure difference, the operation of the glass substrate manufacturing apparatus 1 is temporarily stopped, and the opening widths are adjusted.
The main operation and effects in the case of using the glass substrate manufacturing apparatus 1 and the glass substrate manufacturing method described above will be described below.
According to the above-described apparatus 1 for manufacturing a glass substrate and the method for manufacturing a glass substrate, even when the gas flow 9 flowing into the chamber 2 through the carrying-in port 2aa and the carrying-out port 2ab is generated due to the difference in the gas pressure between the inside and the outside of the chamber 2, the wind-shielding members 12 are provided between the carrying-in port 2aa and the processing region 4 and between the processing region 4 and the carrying-out port 2ab in the carrying path of the glass substrate 3, and therefore, the generated gas flow 9 can be prevented from flowing into the processing region 4 as much as possible by the wind-shielding members 12. This prevents the process gas 5 sprayed on the glass substrate 3 from being blown off by the gas flow 9, and thus the etching process for the glass substrate 3 can be reliably performed.
< second embodiment >
Hereinafter, a glass substrate manufacturing apparatus and a glass substrate manufacturing method according to a second embodiment of the present invention will be described. In the description of the second embodiment, the same reference numerals are given to the items already described in the above-described first embodiment in the drawings referred to in the description of the second embodiment, and overlapping descriptions are omitted, and only the differences from the first embodiment will be described.
First, an apparatus for manufacturing a glass substrate according to a second embodiment of the present invention will be described.
As shown in fig. 5, the apparatus 1 for manufacturing a glass substrate according to the second embodiment differs from the apparatus 1 for manufacturing a glass substrate according to the first embodiment in the following two points (1) and (2). (1) The top plate 10b of the processor 10 is provided with H-steel 17. (2) The windshield member 12 is configured by both the dummy processor 18 having the same outer shape as the processor 10 and not performing the etching process on the glass substrate 3 and the H-steel 19 provided on the dummy processor 18.
The H-shaped steel 17 on the top plate 10b extends in the width direction of the glass substrate 3 and is provided along the entire width of the top plate 10 b. The H-steel 17 functions as a reinforcing member for preventing the top plate 10b from bending due to its own weight, and prevents the top surface of the glass substrate 3 being conveyed in the processing space 10c from contacting the flat surface of the top plate 10b facing the top surface.
The dummy processor 18 includes a box-shaped body 18a having an opening 18aa formed in an upper end thereof, and a top plate 18b made of a single plate-shaped member, and the two 18a and 18b are arranged to face each other with the conveyance path of the glass substrate 3 interposed therebetween in the upper and lower directions.
The body portion 18a is formed in a rectangular parallelepiped shape, and the opening 18aa of the body portion 18a is formed in a rectangular shape. The length of the opening 18aa in the width direction is larger than the entire width of the glass substrate 3. A through hole 18ab is formed in the bottom of the main body 18a, and the through hole 18ab is connected to a cleaning dust collecting device (scrubber) not shown. The processing gas 5 flowing out of the processing space 10c along with the conveyance of the glass substrate 3 can be exhausted through the opening 18aa and the through hole 18ab, and can be sent to the dust cleaning and collecting device.
The top plate 18b has a flat surface facing the upper surface of the glass substrate 3 passing through the dummy processor 18. Similarly to the H-steel 17 on the top plate 10b, the H-steel 19 provided on the top plate 18b extends in the width direction of the glass substrate 3 and is provided along the entire width of the top plate 18 b. Further, the H-steel 19 functions as a reinforcing member for preventing the top plate portion 18b from being deflected by its own weight, so as to avoid contact between the upper surface of the glass substrate 3 through which the dummy processor 18 passes and the flat surface of the top plate portion 18b facing the upper surface.
Note that, the method for manufacturing a glass substrate according to the second embodiment of the present invention is performed using the above-described apparatus 1 for manufacturing a glass substrate, and is similar to the above-described first embodiment except that the process gas 5 flowing out of the process space 10c is exhausted through the opening 18aa and the through hole 18ab of the dummy processor 18, and therefore, redundant description is omitted.
Here, the glass substrate manufacturing apparatus and the glass substrate manufacturing method of the present invention are not limited to the configurations and the embodiments described in the above embodiments. For example, in the first embodiment described above, the wind-shielding member is constituted by a single plate-shaped member, but is not limited thereto. As shown in fig. 6, the wind-proof member may be formed by two plate- like members 14 and 15, and the two plate- like members 14 and 15 may be divided vertically with a gap 13 for passing the glass substrate therebetween.
Further, since it is easy to avoid the case where the gas flow flowing into the chamber flows into the processing region through the opening (gap) formed in the wind-proof member, the opening 12a (gap 13) formed in the wind-proof member 12 may be opened and closed by moving the shutter 16 as the gap opening and closing member up and down as shown in fig. 7a to 7 c. In this case, as shown in the figure, it is preferable that the opening 12a (gap 13) is opened only when the glass substrate 3 passes through the wind-shielding member 12. Here, the operation direction of the shutter 16 is not necessarily the vertical direction, and may be any direction as long as the opening 12a (gap 13) formed in the wind-proof member 12 can be opened and closed.
The apparatus for manufacturing a glass substrate and the method for manufacturing a glass substrate described in the above embodiments exemplify a configuration and an embodiment suitable for an environment in which gas flows easily into a chamber from both a carrying-in port and a carrying-out port of a glass substrate formed in the chamber. The glass substrate manufacturing apparatus and the glass substrate manufacturing method of the present invention can be applied to other environments. For example, in an environment where the gas flow easily flows into the chamber only from the carrying-in port, the wind-shielding member may be provided only between the carrying-in port and the processing region on the glass substrate carrying path. Similarly, in an environment where the gas flow easily flows into the chamber only from the carrying-out port, the wind-shielding member may be provided only between the processing region and the carrying-out port on the glass substrate conveying path.
Description of reference numerals:
1 apparatus for manufacturing glass substrate
2 chamber
2a main body
2aa carry-in port
2ab carry-out port
2ac ceiling hole
2ad side wall part
2ae ceiling part
2b cover body
3 glass substrate
4 treatment area
5 treating gas
9 air flow
12 wind-proof member
12a opening
12b top part
12c both ends in the width direction
13 gap
14 plate-like member
15 plate-like member
16 baffle
18 dummy processor
19H steel
Width of H opening
Width of HH gap
T thickness.
Claims (9)
1. A method for manufacturing a glass substrate, wherein a glass substrate carried into a chamber from a carrying-in port is carried in a horizontal direction, and the glass substrate is etched with a processing gas in a processing region provided on a carrying path of the glass substrate in the chamber, and thereafter the processed glass substrate is carried out of the chamber from a carrying-out port,
the method for manufacturing a glass substrate is characterized in that,
a wind-proof member is provided on at least one of the conveyance path of the glass substrate between the conveyance port and the processing area and between the processing area and the conveyance port,
the wind-proof member is provided with a gap for passing the glass substrate during conveyance,
the width of a gap formed between a ceiling portion of the wind-shielding member and an inner wall of the chamber facing the ceiling portion is made larger than the width of the gap formed in the wind-shielding member in a height direction orthogonal to the main surface of the glass substrate.
2. The method for manufacturing a glass substrate according to claim 1,
wind-proof members are provided between the carrying-in port and the processing area and between the processing area and the carrying-out port on the glass substrate carrying path.
3. The method for manufacturing a glass substrate according to claim 1 or 2,
the conveyance path of the glass substrate extends in a straight line.
4. The method for manufacturing a glass substrate according to claim 1 or 2,
the thickness of the wind-proof member along the conveying direction of the glass substrate is set to be more than 100 mm.
5. The method for manufacturing a glass substrate according to claim 1 or 2,
the two widthwise end portions of the wind shield member are located outward of the two widthwise end portions of the glass substrate in the processing region in a width direction along the main surface of the glass substrate and orthogonal to the conveying direction of the glass substrate.
6. The method for manufacturing a glass substrate according to claim 1 or 2,
the two widthwise end portions of the wind-shielding member are positioned outward of the two widthwise end portions of the carrying-in port and the carrying-out port in a width direction along the main surface of the glass substrate and orthogonal to the carrying direction of the glass substrate.
7. The method for manufacturing a glass substrate according to claim 1 or 2,
the windproof member arranged between the carrying-in opening and the processing area is arranged on the side of the processing area by taking the middle point of the carrying-in opening and the processing area on the conveying path of the glass substrate as a reference,
the wind-prevention member disposed between the processing area and the carrying-out port is disposed on the side of the processing area with reference to a point between the processing area and the carrying-out port on the conveying path of the glass substrate.
8. The method for manufacturing a glass substrate according to claim 1 or 2,
a plate-shaped member is used as the wind prevention member.
9. A glass substrate manufacturing apparatus is configured to carry a glass substrate carried into a chamber from a carrying-in port in a horizontal direction, perform etching processing on the glass substrate with a processing gas in a processing region provided on a carrying path of the glass substrate in the chamber, and then carry out the processed glass substrate from a carrying-out port to the outside of the chamber,
the manufacturing device of the glass substrate is characterized in that,
a wind-proof member is provided on at least one of the conveyance path of the glass substrate between the conveyance port and the processing area and between the processing area and the conveyance port,
the wind-proof member is provided with a gap for passing the glass substrate during conveyance,
the width of a gap formed between a ceiling portion of the wind prevention member and an inner wall of the chamber facing the ceiling portion is larger than the width of the gap formed in the wind prevention member in a height direction orthogonal to the main surface of the glass substrate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-179731 | 2015-09-11 | ||
| JP2015179731 | 2015-09-11 | ||
| PCT/JP2016/076665 WO2017043644A1 (en) | 2015-09-11 | 2016-09-09 | Method for manufacturing glass substrate, and apparatus for manufacturing glass substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107709259A CN107709259A (en) | 2018-02-16 |
| CN107709259B true CN107709259B (en) | 2020-07-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680033810.4A Active CN107709259B (en) | 2015-09-11 | 2016-09-09 | Method for manufacturing glass substrate and device for manufacturing glass substrate |
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| Country | Link |
|---|---|
| JP (1) | JP6691694B2 (en) |
| KR (1) | KR102557690B1 (en) |
| CN (1) | CN107709259B (en) |
| WO (1) | WO2017043644A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100472731C (en) * | 2003-02-06 | 2009-03-25 | 株式会社半导体能源研究所 | Semiconductor manufacturing device |
| JP4681640B2 (en) * | 2008-09-30 | 2011-05-11 | 積水化学工業株式会社 | Surface treatment method |
| WO2011105331A1 (en) | 2010-02-25 | 2011-09-01 | 積水化学工業株式会社 | Etching method and etching apparatus |
| JP6048817B2 (en) * | 2012-12-27 | 2016-12-21 | 日本電気硝子株式会社 | Sheet glass surface treatment apparatus and surface treatment method |
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2016
- 2016-09-09 CN CN201680033810.4A patent/CN107709259B/en active Active
- 2016-09-09 KR KR1020177032680A patent/KR102557690B1/en active IP Right Grant
- 2016-09-09 WO PCT/JP2016/076665 patent/WO2017043644A1/en active Application Filing
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Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2017043644A1 (en) | 2018-06-28 |
| KR20180053274A (en) | 2018-05-21 |
| CN107709259A (en) | 2018-02-16 |
| KR102557690B1 (en) | 2023-07-20 |
| JP6691694B2 (en) | 2020-05-13 |
| WO2017043644A1 (en) | 2017-03-16 |
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