TWI739846B - 用於連續牽引處理的閘閥 - Google Patents

用於連續牽引處理的閘閥 Download PDF

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Publication number
TWI739846B
TWI739846B TW106118249A TW106118249A TWI739846B TW I739846 B TWI739846 B TW I739846B TW 106118249 A TW106118249 A TW 106118249A TW 106118249 A TW106118249 A TW 106118249A TW I739846 B TWI739846 B TW I739846B
Authority
TW
Taiwan
Prior art keywords
gate valve
chamber
volumes
processing
main body
Prior art date
Application number
TW106118249A
Other languages
English (en)
Chinese (zh)
Other versions
TW201802382A (zh
Inventor
約瑟夫 尤多夫斯基
大衛正幸 石川
特拉維斯 泰池
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW201802382A publication Critical patent/TW201802382A/zh
Application granted granted Critical
Publication of TWI739846B publication Critical patent/TWI739846B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K3/00—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
    • F16K3/02—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor
    • F16K3/029—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with two or more gates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
    • F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00—Control of fluid pressure
    • G05D16/20—Control of fluid pressure characterised by the use of electric means
    • G05D16/2006—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means
    • G05D16/2066—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using controlling means acting on the pressure source
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Fluid Mechanics (AREA)
  • Automation & Control Theory (AREA)
  • Details Of Valves (AREA)
  • Physical Vapour Deposition (AREA)
  • Sliding Valves (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Detergent Compositions (AREA)
TW106118249A 2016-06-02 2017-06-02 用於連續牽引處理的閘閥 TWI739846B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662344970P 2016-06-02 2016-06-02
US62/344,970 2016-06-02

Publications (2)

Publication Number Publication Date
TW201802382A TW201802382A (zh) 2018-01-16
TWI739846B true TWI739846B (zh) 2021-09-21

Family

ID=60478984

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106118249A TWI739846B (zh) 2016-06-02 2017-06-02 用於連續牽引處理的閘閥

Country Status (7)

Country Link
US (1) US20200292084A1 (enExample)
EP (1) EP3465746A4 (enExample)
JP (1) JP7068197B2 (enExample)
CN (1) CN109219872A (enExample)
SG (2) SG11201810635YA (enExample)
TW (1) TWI739846B (enExample)
WO (1) WO2017210590A1 (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5157851A (en) * 1991-10-02 1992-10-27 United Solar Systems Corporation Pinching gate valve
US20120298033A1 (en) * 2009-04-03 2012-11-29 United Solar Ovonic Llc Continuous processing system with pinch valve

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833018A (en) * 1973-02-21 1974-09-03 Pass Port Syst Corp Low leakage vacuum valve and chamber using same
US4480585A (en) * 1983-06-23 1984-11-06 Energy Conversion Devices, Inc. External isolation module
US4663009A (en) * 1985-02-08 1987-05-05 Hewlett-Packard Company System and method for depositing plural thin film layers on a substrate
US5016562A (en) * 1988-04-27 1991-05-21 Glasstech Solar, Inc. Modular continuous vapor deposition system
JP2905038B2 (ja) * 1993-06-15 1999-06-14 松下電器産業株式会社 化学反応装置およびその使用方法
JP3673584B2 (ja) * 1996-01-16 2005-07-20 キヤノン株式会社 ロール・ツー・ロール処理方法および装置
JPH09307128A (ja) * 1996-05-20 1997-11-28 Fuji Electric Co Ltd 薄膜光電変換素子の製造装置および製造方法
JP2000065249A (ja) 1998-08-20 2000-03-03 Irie Koken Kk 真空ゲートバルブ
JP2001077169A (ja) * 1999-06-29 2001-03-23 Mitsubishi Heavy Ind Ltd 真空処理装置
US6298685B1 (en) * 1999-11-03 2001-10-09 Applied Materials, Inc. Consecutive deposition system
US6777352B2 (en) * 2002-02-11 2004-08-17 Applied Materials, Inc. Variable flow deposition apparatus and method in semiconductor substrate processing
WO2003096410A1 (en) * 2002-05-10 2003-11-20 Tokyo Electron Limited Substrate processing device
US7207766B2 (en) * 2003-10-20 2007-04-24 Applied Materials, Inc. Load lock chamber for large area substrate processing system
JP4398262B2 (ja) 2004-01-08 2010-01-13 大日本スクリーン製造株式会社 基板処理装置
US8794896B2 (en) * 2005-12-14 2014-08-05 Tokyo Electron Limited Vacuum processing apparatus and zonal airflow generating unit
US20090304924A1 (en) * 2006-03-03 2009-12-10 Prasad Gadgil Apparatus and method for large area multi-layer atomic layer chemical vapor processing of thin films
EP2013396A1 (en) 2006-05-02 2009-01-14 Dow Corning Ireland Limited Fluid replacement system
JP4714714B2 (ja) 2007-07-30 2011-06-29 株式会社ブイテックス 気密を保持するゲートバルブ、このゲートバルブを使用したフィルム製造装置およびフィルム製造方法
JP2012099723A (ja) * 2010-11-04 2012-05-24 Hitachi Kokusai Electric Inc 基板処理装置
KR101293590B1 (ko) * 2011-12-16 2013-08-13 주식회사 뉴파워 프라즈마 양방향 게이트 밸브 및 이를 구비한 기판 처리 시스템
TWM476362U (en) * 2012-09-07 2014-04-11 Applied Materials Inc Load lock chamber with slit valve doors

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5157851A (en) * 1991-10-02 1992-10-27 United Solar Systems Corporation Pinching gate valve
US20120298033A1 (en) * 2009-04-03 2012-11-29 United Solar Ovonic Llc Continuous processing system with pinch valve

Also Published As

Publication number Publication date
CN109219872A (zh) 2019-01-15
US20200292084A1 (en) 2020-09-17
SG11201810635YA (en) 2018-12-28
SG10202011719QA (en) 2020-12-30
TW201802382A (zh) 2018-01-16
JP7068197B2 (ja) 2022-05-16
WO2017210590A1 (en) 2017-12-07
JP2019526751A (ja) 2019-09-19
EP3465746A1 (en) 2019-04-10
EP3465746A4 (en) 2020-03-04

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