SG10202011719QA - Gate valve for continuous tow processing - Google Patents

Gate valve for continuous tow processing

Info

Publication number
SG10202011719QA
SG10202011719QA SG10202011719QA SG10202011719QA SG10202011719QA SG 10202011719Q A SG10202011719Q A SG 10202011719QA SG 10202011719Q A SG10202011719Q A SG 10202011719QA SG 10202011719Q A SG10202011719Q A SG 10202011719QA SG 10202011719Q A SG10202011719Q A SG 10202011719QA
Authority
SG
Singapore
Prior art keywords
gate valve
continuous tow
tow processing
processing
continuous
Prior art date
Application number
SG10202011719QA
Inventor
Joseph Yudovsky
David Ishikawa
Travis Tesch
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG10202011719QA publication Critical patent/SG10202011719QA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02Cleaning by the force of jets, e.g. blowing-out cavities
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K3/00Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
    • F16K3/02Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor
    • F16K3/029Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with two or more gates
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K51/00Other details not peculiar to particular types of valves or cut-off apparatus
    • F16K51/02Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00Control of fluid pressure
    • G05D16/20Control of fluid pressure characterised by the use of electric means
    • G05D16/2006Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means
    • G05D16/2066Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using controlling means acting on the pressure source
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Fluid Mechanics (AREA)
  • Automation & Control Theory (AREA)
  • Details Of Valves (AREA)
  • Physical Vapour Deposition (AREA)
  • Sliding Valves (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Detergent Compositions (AREA)
SG10202011719QA 2016-06-02 2017-06-02 Gate valve for continuous tow processing SG10202011719QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201662344970P 2016-06-02 2016-06-02

Publications (1)

Publication Number Publication Date
SG10202011719QA true SG10202011719QA (en) 2020-12-30

Family

ID=60478984

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10202011719QA SG10202011719QA (en) 2016-06-02 2017-06-02 Gate valve for continuous tow processing
SG11201810635YA SG11201810635YA (en) 2016-06-02 2017-06-02 Gate valve for continuous tow processing

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201810635YA SG11201810635YA (en) 2016-06-02 2017-06-02 Gate valve for continuous tow processing

Country Status (7)

Country Link
US (1) US20200292084A1 (en)
EP (1) EP3465746A4 (en)
JP (1) JP7068197B2 (en)
CN (1) CN109219872A (en)
SG (2) SG10202011719QA (en)
TW (1) TWI739846B (en)
WO (1) WO2017210590A1 (en)

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833018A (en) * 1973-02-21 1974-09-03 Pass Port Syst Corp Low leakage vacuum valve and chamber using same
US4480585A (en) * 1983-06-23 1984-11-06 Energy Conversion Devices, Inc. External isolation module
US4663009A (en) * 1985-02-08 1987-05-05 Hewlett-Packard Company System and method for depositing plural thin film layers on a substrate
US5016562A (en) * 1988-04-27 1991-05-21 Glasstech Solar, Inc. Modular continuous vapor deposition system
US5157851A (en) * 1991-10-02 1992-10-27 United Solar Systems Corporation Pinching gate valve
JP2905038B2 (en) * 1993-06-15 1999-06-14 松下電器産業株式会社 Chemical reaction apparatus and method of using the same
JP3673584B2 (en) * 1996-01-16 2005-07-20 キヤノン株式会社 Roll-to-roll processing method and apparatus
JPH09307128A (en) * 1996-05-20 1997-11-28 Fuji Electric Co Ltd Manufacturing equipment and method of thin film photoelectric transducer
JP2000065249A (en) * 1998-08-20 2000-03-03 Irie Koken Kk Vacuum gate valve
JP2001077169A (en) * 1999-06-29 2001-03-23 Mitsubishi Heavy Ind Ltd Vacuum processor
US6298685B1 (en) * 1999-11-03 2001-10-09 Applied Materials, Inc. Consecutive deposition system
US6777352B2 (en) * 2002-02-11 2004-08-17 Applied Materials, Inc. Variable flow deposition apparatus and method in semiconductor substrate processing
US7780391B2 (en) * 2002-05-10 2010-08-24 Tokyo Electron Limited Substrate processing device
US7207766B2 (en) * 2003-10-20 2007-04-24 Applied Materials, Inc. Load lock chamber for large area substrate processing system
JP4398262B2 (en) * 2004-01-08 2010-01-13 大日本スクリーン製造株式会社 Substrate processing equipment
US8794896B2 (en) * 2005-12-14 2014-08-05 Tokyo Electron Limited Vacuum processing apparatus and zonal airflow generating unit
JP2009531535A (en) * 2006-03-03 2009-09-03 ガードギール,プラサード Apparatus and method for chemical vapor deposition processing of a wide range of multilayer atomic layers of thin films
EP2013396A1 (en) * 2006-05-02 2009-01-14 Dow Corning Ireland Limited Fluid replacement system
JP4714714B2 (en) * 2007-07-30 2011-06-29 株式会社ブイテックス Gate valve for maintaining airtightness, film manufacturing apparatus and film manufacturing method using the gate valve
US20100252602A1 (en) 2009-04-03 2010-10-07 United Solar Ovonic Llc Continuous processing system with pinch valve
JP2012099723A (en) * 2010-11-04 2012-05-24 Hitachi Kokusai Electric Inc Substrate processing apparatus
KR101293590B1 (en) * 2011-12-16 2013-08-13 주식회사 뉴파워 프라즈마 Two way gate valve and substrate processing system having the same
TWM476362U (en) * 2012-09-07 2014-04-11 Applied Materials Inc Load lock chamber with slit valve doors

Also Published As

Publication number Publication date
TWI739846B (en) 2021-09-21
SG11201810635YA (en) 2018-12-28
JP7068197B2 (en) 2022-05-16
JP2019526751A (en) 2019-09-19
US20200292084A1 (en) 2020-09-17
CN109219872A (en) 2019-01-15
EP3465746A4 (en) 2020-03-04
EP3465746A1 (en) 2019-04-10
TW201802382A (en) 2018-01-16
WO2017210590A1 (en) 2017-12-07

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