TWI734002B - 電子元件測試裝置用之載具 - Google Patents

電子元件測試裝置用之載具 Download PDF

Info

Publication number
TWI734002B
TWI734002B TW107111632A TW107111632A TWI734002B TW I734002 B TWI734002 B TW I734002B TW 107111632 A TW107111632 A TW 107111632A TW 107111632 A TW107111632 A TW 107111632A TW I734002 B TWI734002 B TW I734002B
Authority
TW
Taiwan
Prior art keywords
opening
outer peripheral
trunk
sheet
center
Prior art date
Application number
TW107111632A
Other languages
English (en)
Chinese (zh)
Other versions
TW201841811A (zh
Inventor
筬部明浩
伊藤明彦
Original Assignee
日商阿德潘鐵斯特股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商阿德潘鐵斯特股份有限公司 filed Critical 日商阿德潘鐵斯特股份有限公司
Publication of TW201841811A publication Critical patent/TW201841811A/zh
Application granted granted Critical
Publication of TWI734002B publication Critical patent/TWI734002B/zh

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Environmental & Geological Engineering (AREA)
TW107111632A 2017-04-28 2018-04-02 電子元件測試裝置用之載具 TWI734002B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-089438 2017-04-28
JP2017089438A JP6823534B2 (ja) 2017-04-28 2017-04-28 電子部品試験装置用のキャリア

Publications (2)

Publication Number Publication Date
TW201841811A TW201841811A (zh) 2018-12-01
TWI734002B true TWI734002B (zh) 2021-07-21

Family

ID=64093768

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107111632A TWI734002B (zh) 2017-04-28 2018-04-02 電子元件測試裝置用之載具

Country Status (4)

Country Link
JP (1) JP6823534B2 (ko)
KR (1) KR102341037B1 (ko)
CN (1) CN108802595B (ko)
TW (1) TWI734002B (ko)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06308196A (ja) * 1993-04-22 1994-11-04 Nitto Denko Corp テストヘッド構造
JPH0717591A (ja) * 1993-06-15 1995-01-20 Fujitsu Ltd Ｉｃキャリア
TW305025B (ko) * 1995-07-26 1997-05-11 Adoban Tesuto Kk
US20040070416A1 (en) * 1998-11-25 2004-04-15 Advantest Corporation Device testing apparatus
JP2010156546A (ja) * 2008-12-26 2010-07-15 Enplas Corp 電気部品用キャリア
JP2010247299A (ja) * 2009-04-17 2010-11-04 Makita Corp 打撃工具
TW201530166A (zh) * 2013-12-24 2015-08-01 Isc Co Ltd 半導體元件對準插座單元以及含其之半導體元件測試裝置
CN105527472A (zh) * 2014-10-17 2016-04-27 株式会社Isc 测试座
TWI588493B (zh) * 2014-10-17 2017-06-21 Isc股份有限公司 測試座
JP6308196B2 (ja) 2015-11-06 2018-04-11 マツダ株式会社 自動車の後部整流構造

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2002236231A1 (en) * 2002-03-06 2003-09-16 Advantest Corporation Insert and electronic component handler comprising it
JP4243137B2 (ja) * 2003-05-23 2009-03-25 株式会社日立ハイテクインスツルメンツ 電子部品装着方法
JP2009096523A (ja) * 2007-10-17 2009-05-07 Panasonic Corp 電子部品の搬送フレームおよび電子部品の製造方法
JP5234521B2 (ja) * 2009-08-21 2013-07-10 Ｔｄｋ株式会社 電子部品及びその製造方法
WO2011038295A1 (en) * 2009-09-26 2011-03-31 Centipede Systems, Inc. Carrier for holding microelectronic devices
JP5549808B2 (ja) * 2010-05-24 2014-07-16 株式会社ノーリツ カシメ締結構造及びこのカシメ締結構造を有する燃焼装置
JP2012077769A (ja) * 2010-09-30 2012-04-19 Nippon Pop Rivets & Fasteners Ltd ブラインドリベット及びその締結方法
JP5824337B2 (ja) * 2011-11-16 2015-11-25 株式会社アドバンテスト 試験用キャリア
JP5872391B2 (ja) * 2012-06-22 2016-03-01 株式会社アドバンテスト 電子部品試験装置
KR101348204B1 (ko) * 2012-12-28 2014-01-10 주식회사 아이에스시 테스트 소켓 및 소켓본체
KR101646628B1 (ko) * 2014-09-04 2016-08-08 (주) 루켄테크놀러지스 반도체 패키지 검사용 소켓 및 그 제조방법
KR20170037079A (ko) * 2015-09-25 2017-04-04 (주)제이티 소자핸들러

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06308196A (ja) * 1993-04-22 1994-11-04 Nitto Denko Corp テストヘッド構造
JPH0717591A (ja) * 1993-06-15 1995-01-20 Fujitsu Ltd Ｉｃキャリア
TW305025B (ko) * 1995-07-26 1997-05-11 Adoban Tesuto Kk
US20040070416A1 (en) * 1998-11-25 2004-04-15 Advantest Corporation Device testing apparatus
JP2010156546A (ja) * 2008-12-26 2010-07-15 Enplas Corp 電気部品用キャリア
JP2010247299A (ja) * 2009-04-17 2010-11-04 Makita Corp 打撃工具
TW201530166A (zh) * 2013-12-24 2015-08-01 Isc Co Ltd 半導體元件對準插座單元以及含其之半導體元件測試裝置
CN105527472A (zh) * 2014-10-17 2016-04-27 株式会社Isc 测试座
TWI588493B (zh) * 2014-10-17 2017-06-21 Isc股份有限公司 測試座
JP6308196B2 (ja) 2015-11-06 2018-04-11 マツダ株式会社 自動車の後部整流構造

Also Published As

Publication number Publication date
CN108802595B (zh) 2021-10-15
TW201841811A (zh) 2018-12-01
KR20180121360A (ko) 2018-11-07
CN108802595A (zh) 2018-11-13
JP6823534B2 (ja) 2021-02-03
JP2018189391A (ja) 2018-11-29
KR102341037B1 (ko) 2021-12-20

Similar Documents

Publication Publication Date Title
US10338101B2 (en) Prober
JP5664938B2 (ja) プローバ及びプローブ検査方法
KR101335146B1 (ko) 프로브 카드 검출 장치, 웨이퍼의 위치 정렬 장치 및 웨이퍼의 위치 정렬 방법
KR20180043814A (ko) 웨이퍼 검사 방법 및 웨이퍼 검사 장치
TWI787250B (zh) 電子元件測試裝置用之載具
KR101386331B1 (ko) 웨이퍼 반송 장치
KR102355572B1 (ko) 검사 장치, 검사 시스템, 및 위치 맞춤 방법
WO2016024346A1 (ja) プローバ及びプローブ検査方法
JP2016095141A (ja) 半導体デバイスの検査ユニット
TWI734002B (zh) 電子元件測試裝置用之載具
TWI717595B (zh) 電子元件測試裝置用之載具
TWI387761B (zh) 用於檢測微型ｓｄ裝置的方法
TWM536357U (zh) 檢測治具
TWI822010B (zh) 電子元件處理裝置用的載具的芯、載具、以及芯之移除方法
KR101864939B1 (ko) 반도체 소자 테스트 장치
TWI384242B (zh) 用於檢測系統整合型封裝裝置的方法
TWI637182B (zh) Inspection device for electronic components, inspection method for electronic components, and inspection program for electronic components
KR101140917B1 (ko) 전류와 열을 이용한 엘이디 검사장치
US20230105734A1 (en) Electronic component testing apparatus, socket, and carrier
KR20080113825A (ko) 프로브 스테이션
TWI398638B (zh) A method of removing the electronic component, and a control program for carrying out the method