JP6823534B2 - 電子部品試験装置用のキャリア - Google Patents

電子部品試験装置用のキャリア Download PDF

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Publication number
JP6823534B2
JP6823534B2 JP2017089438A JP2017089438A JP6823534B2 JP 6823534 B2 JP6823534 B2 JP 6823534B2 JP 2017089438 A JP2017089438 A JP 2017089438A JP 2017089438 A JP2017089438 A JP 2017089438A JP 6823534 B2 JP6823534 B2 JP 6823534B2
Authority
JP
Japan
Prior art keywords
peripheral side
opening
outer peripheral
inner peripheral
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017089438A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018189391A (ja
Inventor
明浩 筬部
明浩 筬部
明彦 伊藤
明彦 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Priority to JP2017089438A priority Critical patent/JP6823534B2/ja
Priority to TW107111632A priority patent/TWI734002B/zh
Priority to KR1020180040825A priority patent/KR102341037B1/ko
Priority to CN201810365312.0A priority patent/CN108802595B/zh
Publication of JP2018189391A publication Critical patent/JP2018189391A/ja
Application granted granted Critical
Publication of JP6823534B2 publication Critical patent/JP6823534B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Environmental & Geological Engineering (AREA)
JP2017089438A 2017-04-28 2017-04-28 電子部品試験装置用のキャリア Active JP6823534B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017089438A JP6823534B2 (ja) 2017-04-28 2017-04-28 電子部品試験装置用のキャリア
TW107111632A TWI734002B (zh) 2017-04-28 2018-04-02 電子元件測試裝置用之載具
KR1020180040825A KR102341037B1 (ko) 2017-04-28 2018-04-09 전자 부품 시험 장치용 캐리어
CN201810365312.0A CN108802595B (zh) 2017-04-28 2018-04-20 电子部件试验装置用的载体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017089438A JP6823534B2 (ja) 2017-04-28 2017-04-28 電子部品試験装置用のキャリア

Publications (2)

Publication Number Publication Date
JP2018189391A JP2018189391A (ja) 2018-11-29
JP6823534B2 true JP6823534B2 (ja) 2021-02-03

Family

ID=64093768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017089438A Active JP6823534B2 (ja) 2017-04-28 2017-04-28 電子部品試験装置用のキャリア

Country Status (4)

Country Link
JP (1) JP6823534B2 (ko)
KR (1) KR102341037B1 (ko)
CN (1) CN108802595B (ko)
TW (1) TWI734002B (ko)

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06308196A (ja) * 1993-04-22 1994-11-04 Nitto Denko Corp テストヘッド構造
JPH0717591A (ja) * 1993-06-15 1995-01-20 Fujitsu Ltd Ｉｃキャリア
JP3412114B2 (ja) * 1995-07-26 2003-06-03 株式会社アドバンテスト Ｉｃ試験装置
SG98373A1 (en) * 1998-11-25 2003-09-19 Advantest Corp Device testing apparatus
AU2002236231A1 (en) * 2002-03-06 2003-09-16 Advantest Corporation Insert and electronic component handler comprising it
JP4243137B2 (ja) * 2003-05-23 2009-03-25 株式会社日立ハイテクインスツルメンツ 電子部品装着方法
JP2009096523A (ja) * 2007-10-17 2009-05-07 Panasonic Corp 電子部品の搬送フレームおよび電子部品の製造方法
JP5268629B2 (ja) * 2008-12-26 2013-08-21 株式会社エンプラス 電気部品用キャリア
JP5307609B2 (ja) * 2009-04-17 2013-10-02 株式会社マキタ 打撃工具
JP5234521B2 (ja) * 2009-08-21 2013-07-10 Ｔｄｋ株式会社 電子部品及びその製造方法
EP2480371B1 (en) * 2009-09-26 2017-06-28 Centipede Systems, Inc. Carrier for holding microelectronic devices
JP5549808B2 (ja) * 2010-05-24 2014-07-16 株式会社ノーリツ カシメ締結構造及びこのカシメ締結構造を有する燃焼装置
JP2012077769A (ja) * 2010-09-30 2012-04-19 Nippon Pop Rivets & Fasteners Ltd ブラインドリベット及びその締結方法
JP5824337B2 (ja) * 2011-11-16 2015-11-25 株式会社アドバンテスト 試験用キャリア
JP5872391B2 (ja) 2012-06-22 2016-03-01 株式会社アドバンテスト 電子部品試験装置
KR101348204B1 (ko) * 2012-12-28 2014-01-10 주식회사 아이에스시 테스트 소켓 및 소켓본체
KR101464990B1 (ko) * 2013-12-24 2014-11-26 주식회사 아이에스시 반도체 디바이스 얼라인 소켓유닛 및 이를 포함하는 반도체 디바이스 검사장치
KR101646628B1 (ko) 2014-09-04 2016-08-08 (주) 루켄테크놀러지스 반도체 패키지 검사용 소켓 및 그 제조방법
CN105527472B (zh) * 2014-10-17 2018-10-02 株式会社Isc 测试座
KR101706331B1 (ko) * 2014-10-17 2017-02-15 주식회사 아이에스시 검사용 소켓
KR20170037079A (ko) * 2015-09-25 2017-04-04 (주)제이티 소자핸들러
JP6308196B2 (ja) 2015-11-06 2018-04-11 マツダ株式会社 自動車の後部整流構造

Also Published As

Publication number Publication date
KR20180121360A (ko) 2018-11-07
JP2018189391A (ja) 2018-11-29
TWI734002B (zh) 2021-07-21
CN108802595A (zh) 2018-11-13
KR102341037B1 (ko) 2021-12-20
CN108802595B (zh) 2021-10-15
TW201841811A (zh) 2018-12-01

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