TWI732377B - 基板搬送裝置 - Google Patents

基板搬送裝置 Download PDF

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Publication number
TWI732377B
TWI732377B TW108145321A TW108145321A TWI732377B TW I732377 B TWI732377 B TW I732377B TW 108145321 A TW108145321 A TW 108145321A TW 108145321 A TW108145321 A TW 108145321A TW I732377 B TWI732377 B TW I732377B
Authority
TW
Taiwan
Prior art keywords
substrate
wafer
robot
aligner
substrate mounting
Prior art date
Application number
TW108145321A
Other languages
English (en)
Chinese (zh)
Other versions
TW202032708A (zh
Inventor
開田準一
Original Assignee
日商平田機工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商平田機工股份有限公司 filed Critical 日商平田機工股份有限公司
Publication of TW202032708A publication Critical patent/TW202032708A/zh
Application granted granted Critical
Publication of TWI732377B publication Critical patent/TWI732377B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J5/00—Manipulators mounted on wheels or on carriages
    • B25J5/02—Manipulators mounted on wheels or on carriages travelling along a guideway
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
TW108145321A 2018-12-11 2019-12-11 基板搬送裝置 TWI732377B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018231643A JP7175735B2 (ja) 2018-12-11 2018-12-11 基板搬送装置
JP2018-231643 2018-12-11

Publications (2)

Publication Number Publication Date
TW202032708A TW202032708A (zh) 2020-09-01
TWI732377B true TWI732377B (zh) 2021-07-01

Family

ID=71076455

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108145321A TWI732377B (zh) 2018-12-11 2019-12-11 基板搬送裝置

Country Status (4)

Country Link
JP (1) JP7175735B2 (ja)
CN (1) CN112930251A (ja)
TW (1) TWI732377B (ja)
WO (1) WO2020122133A1 (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090082895A1 (en) * 2007-09-22 2009-03-26 Dynamic Micro Systems, Semiconductor Equipment Gmbh Integrated wafer transfer mechanism
TW201826430A (zh) * 2016-09-13 2018-07-16 日商川崎重工業股份有限公司 基板搬送手、基板搬送機器人、及基板移載裝置
TW201829140A (zh) * 2017-01-27 2018-08-16 德商蘇士微科技印刷術股份有限公司 末端執行器
WO2018204109A1 (en) * 2017-05-03 2018-11-08 Applied Materials, Inc. Image based substrate mapper

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0927536A (ja) * 1995-07-10 1997-01-28 Nissin Electric Co Ltd ロ−ドロック室内に基板位置合わせ機構を有するイオン注入装置
JP2000058625A (ja) 1998-06-02 2000-02-25 Mecs Corp 基板搬送装置
JP2005044882A (ja) * 2003-07-24 2005-02-17 Nikon Corp 搬送装置及び露光装置
JP5120017B2 (ja) * 2007-05-15 2013-01-16 東京エレクトロン株式会社 プローブ装置
JP2009021504A (ja) 2007-07-13 2009-01-29 Ryusyo Industrial Co Ltd ウエハ搬送ロボット
JP5107122B2 (ja) * 2008-04-03 2012-12-26 大日本スクリーン製造株式会社 基板処理装置
WO2010023935A1 (ja) * 2008-08-29 2010-03-04 株式会社ニコン 基板位置合わせ装置、基板位置合わせ方法および積層型半導体の製造方法
JP5212165B2 (ja) * 2009-02-20 2013-06-19 東京エレクトロン株式会社 基板処理装置
KR20120124187A (ko) * 2011-05-03 2012-11-13 주식회사 나인벨 멀티 웨이퍼 이송로봇
EP3866184B1 (en) * 2012-11-30 2024-10-09 Nikon Corporation Carrier system, exposure apparatus and carry-in method
US9511496B2 (en) * 2014-06-20 2016-12-06 The Boeing Company Robot alignment systems and methods of aligning a robot
US10755960B2 (en) 2014-11-04 2020-08-25 Brooks Automation, Inc. Wafer aligner
JP6559976B2 (ja) * 2015-03-03 2019-08-14 川崎重工業株式会社 基板搬送ロボットおよび基板処理システム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090082895A1 (en) * 2007-09-22 2009-03-26 Dynamic Micro Systems, Semiconductor Equipment Gmbh Integrated wafer transfer mechanism
TW201826430A (zh) * 2016-09-13 2018-07-16 日商川崎重工業股份有限公司 基板搬送手、基板搬送機器人、及基板移載裝置
TW201829140A (zh) * 2017-01-27 2018-08-16 德商蘇士微科技印刷術股份有限公司 末端執行器
WO2018204109A1 (en) * 2017-05-03 2018-11-08 Applied Materials, Inc. Image based substrate mapper

Also Published As

Publication number Publication date
TW202032708A (zh) 2020-09-01
CN112930251A (zh) 2021-06-08
WO2020122133A1 (ja) 2020-06-18
JP2020096032A (ja) 2020-06-18
JP7175735B2 (ja) 2022-11-21

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