CN112930251A - 基板输送装置 - Google Patents

基板输送装置 Download PDF

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Publication number
CN112930251A
CN112930251A CN201980071082.XA CN201980071082A CN112930251A CN 112930251 A CN112930251 A CN 112930251A CN 201980071082 A CN201980071082 A CN 201980071082A CN 112930251 A CN112930251 A CN 112930251A
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CN
China
Prior art keywords
substrate
wafer
robot
aligner
end effector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980071082.XA
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English (en)
Chinese (zh)
Inventor
开田准一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hirata Corp
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Hirata Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirata Corp filed Critical Hirata Corp
Publication of CN112930251A publication Critical patent/CN112930251A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J5/00—Manipulators mounted on wheels or on carriages
    • B25J5/02—Manipulators mounted on wheels or on carriages travelling along a guideway
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
CN201980071082.XA 2018-12-11 2019-12-11 基板输送装置 Pending CN112930251A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018-231643 2018-12-11
JP2018231643A JP7175735B2 (ja) 2018-12-11 2018-12-11 基板搬送装置
PCT/JP2019/048527 WO2020122133A1 (ja) 2018-12-11 2019-12-11 基板搬送装置

Publications (1)

Publication Number Publication Date
CN112930251A true CN112930251A (zh) 2021-06-08

Family

ID=71076455

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980071082.XA Pending CN112930251A (zh) 2018-12-11 2019-12-11 基板输送装置

Country Status (4)

Country Link
JP (1) JP7175735B2 (ja)
CN (1) CN112930251A (ja)
TW (1) TWI732377B (ja)
WO (1) WO2020122133A1 (ja)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0927536A (ja) * 1995-07-10 1997-01-28 Nissin Electric Co Ltd ロ−ドロック室内に基板位置合わせ機構を有するイオン注入装置
JP2005044882A (ja) * 2003-07-24 2005-02-17 Nikon Corp 搬送装置及び露光装置
CN101308194A (zh) * 2007-05-15 2008-11-19 东京毅力科创株式会社 探测装置
CN101552220A (zh) * 2008-04-03 2009-10-07 大日本网屏制造株式会社 基板处理装置和基板处理方法
TW201009994A (en) * 2008-08-29 2010-03-01 Nikon Corp Substrate aligning apparatus, substrate aligning method and method for manufacturing multilayer semiconductor
CN101814420A (zh) * 2009-02-20 2010-08-25 东京毅力科创株式会社 基板处理装置
JP2010541200A (ja) * 2007-09-22 2010-12-24 ダイナミック マイクロシステムズ セミコンダクター イクイップメント ゲーエムベーハー 一体化されたウェハ受渡し機構
US20150367516A1 (en) * 2014-06-20 2015-12-24 The Boeing Company Robot alignment systems and methods of aligning a robot
CN107534007A (zh) * 2015-03-03 2018-01-02 川崎重工业株式会社 衬底搬送机器人及衬底处理系统
CN108336011A (zh) * 2012-11-30 2018-07-27 株式会社尼康 搬入方法、搬送系统及曝光装置、和器件制造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000058625A (ja) 1998-06-02 2000-02-25 Mecs Corp 基板搬送装置
JP2009021504A (ja) 2007-07-13 2009-01-29 Ryusyo Industrial Co Ltd ウエハ搬送ロボット
KR20120124187A (ko) * 2011-05-03 2012-11-13 주식회사 나인벨 멀티 웨이퍼 이송로봇
US10755960B2 (en) 2014-11-04 2020-08-25 Brooks Automation, Inc. Wafer aligner
JP6774276B2 (ja) * 2016-09-13 2020-10-21 川崎重工業株式会社 基板移載装置
NL2018244B1 (en) * 2017-01-27 2018-08-07 Suss Microtec Lithography Gmbh Endeffektor
US10784134B2 (en) * 2017-05-03 2020-09-22 Applied Materials, Inc. Image based substrate mapper

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0927536A (ja) * 1995-07-10 1997-01-28 Nissin Electric Co Ltd ロ−ドロック室内に基板位置合わせ機構を有するイオン注入装置
JP2005044882A (ja) * 2003-07-24 2005-02-17 Nikon Corp 搬送装置及び露光装置
CN101308194A (zh) * 2007-05-15 2008-11-19 东京毅力科创株式会社 探测装置
JP2010541200A (ja) * 2007-09-22 2010-12-24 ダイナミック マイクロシステムズ セミコンダクター イクイップメント ゲーエムベーハー 一体化されたウェハ受渡し機構
CN101552220A (zh) * 2008-04-03 2009-10-07 大日本网屏制造株式会社 基板处理装置和基板处理方法
TW201009994A (en) * 2008-08-29 2010-03-01 Nikon Corp Substrate aligning apparatus, substrate aligning method and method for manufacturing multilayer semiconductor
CN101814420A (zh) * 2009-02-20 2010-08-25 东京毅力科创株式会社 基板处理装置
CN108336011A (zh) * 2012-11-30 2018-07-27 株式会社尼康 搬入方法、搬送系统及曝光装置、和器件制造方法
US20150367516A1 (en) * 2014-06-20 2015-12-24 The Boeing Company Robot alignment systems and methods of aligning a robot
CN107534007A (zh) * 2015-03-03 2018-01-02 川崎重工业株式会社 衬底搬送机器人及衬底处理系统

Also Published As

Publication number Publication date
TW202032708A (zh) 2020-09-01
JP7175735B2 (ja) 2022-11-21
TWI732377B (zh) 2021-07-01
WO2020122133A1 (ja) 2020-06-18
JP2020096032A (ja) 2020-06-18

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