TWI727244B - 放射線硬化型晶圓切割用黏著膠帶 - Google Patents

放射線硬化型晶圓切割用黏著膠帶 Download PDF

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Publication number
TWI727244B
TWI727244B TW107147409A TW107147409A TWI727244B TW I727244 B TWI727244 B TW I727244B TW 107147409 A TW107147409 A TW 107147409A TW 107147409 A TW107147409 A TW 107147409A TW I727244 B TWI727244 B TW I727244B
Authority
TW
Taiwan
Prior art keywords
radiation
curing
adhesive tape
adhesive layer
adhesive
Prior art date
Application number
TW107147409A
Other languages
English (en)
Chinese (zh)
Other versions
TW201930517A (zh
Inventor
大田郷史
Original Assignee
日商古河電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商古河電氣工業股份有限公司 filed Critical 日商古河電氣工業股份有限公司
Publication of TW201930517A publication Critical patent/TW201930517A/zh
Application granted granted Critical
Publication of TWI727244B publication Critical patent/TWI727244B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
TW107147409A 2017-12-27 2018-12-27 放射線硬化型晶圓切割用黏著膠帶 TWI727244B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-250326 2017-12-27
JP2017250326 2017-12-27

Publications (2)

Publication Number Publication Date
TW201930517A TW201930517A (zh) 2019-08-01
TWI727244B true TWI727244B (zh) 2021-05-11

Family

ID=67063743

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107147409A TWI727244B (zh) 2017-12-27 2018-12-27 放射線硬化型晶圓切割用黏著膠帶

Country Status (6)

Country Link
JP (1) JP7222919B2 (ko)
KR (1) KR102545004B1 (ko)
CN (1) CN110582839B (ko)
SG (1) SG11201911458PA (ko)
TW (1) TWI727244B (ko)
WO (1) WO2019131603A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220156542A (ko) * 2020-03-30 2022-11-25 도요보 가부시키가이샤 접착제 조성물
CN116348565B (zh) * 2021-03-31 2024-03-12 株式会社寺冈制作所 粘合组合物和粘合带

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010135494A (ja) * 2008-12-03 2010-06-17 Furukawa Electric Co Ltd:The ダイシングテープ
TW201420714A (zh) * 2012-09-27 2014-06-01 Furukawa Electric Co Ltd 放射線硬化型晶圓切割用黏著膠帶

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3951091B2 (ja) 2000-08-04 2007-08-01 セイコーエプソン株式会社 半導体装置の製造方法
JP2005236245A (ja) 2004-01-23 2005-09-02 Seiko Epson Corp 半導体装置およびその製造方法、半導体チップおよびその製造方法、並びに電子機器
JP2006202926A (ja) 2005-01-19 2006-08-03 Sekisui Chem Co Ltd ダイシングテープ
JP4549239B2 (ja) * 2005-06-22 2010-09-22 日東電工株式会社 ダイシング用粘着シート
CN102217040B (zh) * 2008-11-19 2013-10-23 电气化学工业株式会社 电子部件的制造方法
JP5681374B2 (ja) * 2010-04-19 2015-03-04 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム
JP5911284B2 (ja) * 2011-12-12 2016-04-27 日東電工株式会社 積層シート、及び、積層シートを用いた半導体装置の製造方法
JP6261115B2 (ja) 2013-09-19 2018-01-17 日東電工株式会社 粘着シート
JP5607847B1 (ja) * 2013-11-29 2014-10-15 古河電気工業株式会社 半導体加工用粘着テープ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010135494A (ja) * 2008-12-03 2010-06-17 Furukawa Electric Co Ltd:The ダイシングテープ
TW201420714A (zh) * 2012-09-27 2014-06-01 Furukawa Electric Co Ltd 放射線硬化型晶圓切割用黏著膠帶

Also Published As

Publication number Publication date
KR102545004B1 (ko) 2023-06-20
CN110582839A (zh) 2019-12-17
TW201930517A (zh) 2019-08-01
JPWO2019131603A1 (ja) 2020-11-19
WO2019131603A1 (ja) 2019-07-04
CN110582839B (zh) 2023-06-06
JP7222919B2 (ja) 2023-02-15
KR20200101831A (ko) 2020-08-28
SG11201911458PA (en) 2020-01-30

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