TWI723966B - Au-Sn合金焊料糊、Au-Sn合金焊料層之製造方法及Au-Sn合金焊料層 - Google Patents

Au-Sn合金焊料糊、Au-Sn合金焊料層之製造方法及Au-Sn合金焊料層 Download PDF

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Publication number
TWI723966B
TWI723966B TW104137337A TW104137337A TWI723966B TW I723966 B TWI723966 B TW I723966B TW 104137337 A TW104137337 A TW 104137337A TW 104137337 A TW104137337 A TW 104137337A TW I723966 B TWI723966 B TW I723966B
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TW
Taiwan
Prior art keywords
alloy
alloy solder
mass
solder paste
alloy powder
Prior art date
Application number
TW104137337A
Other languages
English (en)
Chinese (zh)
Other versions
TW201634707A (zh
Inventor
石川雅之
山本佳史
Original Assignee
日商三菱綜合材料股份有限公司
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Application filed by 日商三菱綜合材料股份有限公司 filed Critical 日商三菱綜合材料股份有限公司
Publication of TW201634707A publication Critical patent/TW201634707A/zh
Application granted granted Critical
Publication of TWI723966B publication Critical patent/TWI723966B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
TW104137337A 2014-11-13 2015-11-12 Au-Sn合金焊料糊、Au-Sn合金焊料層之製造方法及Au-Sn合金焊料層 TWI723966B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014230609A JP6888900B2 (ja) 2014-11-13 2014-11-13 Ａｕ−Ｓｎ合金はんだペースト、Ａｕ−Ｓｎ合金はんだ層の製造方法、及びＡｕ−Ｓｎ合金はんだ層
JP2014-230609 2014-11-13

Publications (2)

Publication Number Publication Date
TW201634707A TW201634707A (zh) 2016-10-01
TWI723966B true TWI723966B (zh) 2021-04-11

Family

ID=55954432

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104137337A TWI723966B (zh) 2014-11-13 2015-11-12 Au-Sn合金焊料糊、Au-Sn合金焊料層之製造方法及Au-Sn合金焊料層

Country Status (4)

Country Link
JP (1) JP6888900B2 (ko)
KR (1) KR20170080536A (ko)
TW (1) TWI723966B (ko)
WO (1) WO2016076353A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102591964B1 (ko) 2021-06-21 2023-10-23 주식회사 코닉에스티 접합 금속 적층체, 금속 접합용 적층 구조체 및 금속 접합 방법
KR102591963B1 (ko) 2021-06-21 2023-10-23 주식회사 코닉에스티 금속 접합용 적층 구조체 및 금속 접합 방법
JP2024104885A (ja) * 2023-01-25 2024-08-06 ミネベアパワーデバイス株式会社 電子部品及び電子部品の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004031697A (ja) * 2002-06-26 2004-01-29 Kyocera Corp 熱電モジュール
JP2008010545A (ja) * 2006-06-28 2008-01-17 Mitsubishi Materials Corp Ａｕ−Ｓｎ合金はんだペーストを用いて素子の接合面全面を基板に接合する方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU4164999A (en) * 1998-06-10 1999-12-30 Showa Denko Kabushiki Kaisha Solder powder, flux, solder paste, method for soldering, soldered circuit board and soldered junction product
JP2008080393A (ja) * 2006-09-29 2008-04-10 Toshiba Corp 包晶系合金を用いた接合体、接合方法、及び半導体装置
JP5733610B2 (ja) * 2010-01-25 2015-06-10 三菱マテリアル株式会社 Ａｕ−Ｓｎ合金はんだペースト、およびこれにより形成されるＡｕ−Ｓｎ合金はんだ
JP5589112B2 (ja) * 2013-03-18 2014-09-10 株式会社フジクラ 接合方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004031697A (ja) * 2002-06-26 2004-01-29 Kyocera Corp 熱電モジュール
JP2008010545A (ja) * 2006-06-28 2008-01-17 Mitsubishi Materials Corp Ａｕ−Ｓｎ合金はんだペーストを用いて素子の接合面全面を基板に接合する方法

Also Published As

Publication number Publication date
JP6888900B2 (ja) 2021-06-18
WO2016076353A1 (ja) 2016-05-19
JP2016093821A (ja) 2016-05-26
KR20170080536A (ko) 2017-07-10
TW201634707A (zh) 2016-10-01

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