TWI723612B - 圖案形成裝置、圖案形成方法以及噴出資料生成方法 - Google Patents

圖案形成裝置、圖案形成方法以及噴出資料生成方法 Download PDF

Info

Publication number
TWI723612B
TWI723612B TW108139893A TW108139893A TWI723612B TW I723612 B TWI723612 B TW I723612B TW 108139893 A TW108139893 A TW 108139893A TW 108139893 A TW108139893 A TW 108139893A TW I723612 B TWI723612 B TW I723612B
Authority
TW
Taiwan
Prior art keywords
pattern
area
ink
conductive pattern
data
Prior art date
Application number
TW108139893A
Other languages
English (en)
Chinese (zh)
Other versions
TW202029855A (zh
Inventor
中川雅晴
清水圭吾
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW202029855A publication Critical patent/TW202029855A/zh
Application granted granted Critical
Publication of TWI723612B publication Critical patent/TWI723612B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
    • G03F7/2018—Masking pattern obtained by selective application of an ink or a toner, e.g. ink jet printing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ink Jet (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW108139893A 2019-01-17 2019-11-04 圖案形成裝置、圖案形成方法以及噴出資料生成方法 TWI723612B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019006304A JP7281907B2 (ja) 2019-01-17 2019-01-17 パターン形成装置、パターン形成方法および吐出データ生成方法
JP2019-006304 2019-01-17

Publications (2)

Publication Number Publication Date
TW202029855A TW202029855A (zh) 2020-08-01
TWI723612B true TWI723612B (zh) 2021-04-01

Family

ID=71653911

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108139893A TWI723612B (zh) 2019-01-17 2019-11-04 圖案形成裝置、圖案形成方法以及噴出資料生成方法

Country Status (4)

Country Link
JP (1) JP7281907B2 (ko)
KR (1) KR102327960B1 (ko)
CN (1) CN111446184A (ko)
TW (1) TWI723612B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7501166B2 (ja) 2020-07-03 2024-06-18 オムロン株式会社 Ｘ線検査装置
CN112533393B (zh) * 2020-12-04 2022-04-19 广州兴森快捷电路科技有限公司 Pcb阻焊方法、pcb阻焊系统及存储介质

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201309135A (zh) * 2011-07-15 2013-02-16 Sumitomo Heavy Industries 薄膜形成方法及薄膜形成裝置
TW201716152A (zh) * 2015-11-04 2017-05-16 Meiko Electronics Co Ltd 印刷硬化方法、印刷硬化裝置以及印刷配線基板的製造方法
WO2017164032A1 (ja) * 2016-03-23 2017-09-28 富士フイルム株式会社 印刷版および印刷方法ならびに印刷版の製造方法
WO2017169624A1 (ja) * 2016-03-31 2017-10-05 太陽インキ製造株式会社 硬化装置およびソルダーレジストの製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08288623A (ja) * 1995-04-10 1996-11-01 Canon Inc プリント配線板の製造方法およびプリント配線板
JP4664242B2 (ja) * 2006-06-23 2011-04-06 太陽ホールディングス株式会社 プリント配線板及びその製造方法
CN101681651B (zh) * 2008-02-06 2012-02-01 松下电器产业株式会社 信息记录媒体的制造方法
JP2012081381A (ja) * 2010-10-07 2012-04-26 Sharp Corp 液体描画方法、液体描画装置および太陽電池用機能性マスク
KR101849177B1 (ko) * 2011-11-11 2018-06-01 엘지디스플레이 주식회사 입체 영상 표시장치 및 이의 제조방법
JP6955486B2 (ja) 2016-04-19 2021-10-27 株式会社カネカ プリント配線板の製造方法
JP2018086637A (ja) 2016-11-30 2018-06-07 東レエンジニアリング株式会社 絶縁膜材料の塗布方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201309135A (zh) * 2011-07-15 2013-02-16 Sumitomo Heavy Industries 薄膜形成方法及薄膜形成裝置
TW201716152A (zh) * 2015-11-04 2017-05-16 Meiko Electronics Co Ltd 印刷硬化方法、印刷硬化裝置以及印刷配線基板的製造方法
WO2017164032A1 (ja) * 2016-03-23 2017-09-28 富士フイルム株式会社 印刷版および印刷方法ならびに印刷版の製造方法
WO2017169624A1 (ja) * 2016-03-31 2017-10-05 太陽インキ製造株式会社 硬化装置およびソルダーレジストの製造方法

Also Published As

Publication number Publication date
JP2020115517A (ja) 2020-07-30
KR20200089597A (ko) 2020-07-27
JP7281907B2 (ja) 2023-05-26
KR102327960B1 (ko) 2021-11-17
CN111446184A (zh) 2020-07-24
TW202029855A (zh) 2020-08-01

Similar Documents

Publication Publication Date Title
TWI704016B (zh) 油墨塗佈裝置及油墨塗佈方法
TWI723612B (zh) 圖案形成裝置、圖案形成方法以及噴出資料生成方法
JP2004080041A (ja) 印刷パターン形成方法、プリントヘッド、印刷システム、集積回路、及び印刷システム操作方法
KR101463869B1 (ko) 박막형성장치 및 박막형성방법
KR102327959B1 (ko) 패턴 형성 장치, 패턴 형성 방법 및 토출 데이터 생성 방법
JP2019130447A (ja) 膜形成方法、膜形成装置、及び膜が形成された複合基板
TWI673180B (zh) 膜形成裝置及膜形成方法
JP6952243B2 (ja) 印刷方法および印刷装置
TW201417903A (zh) 基板製造方法及基板製造裝置
KR20060047862A (ko) 배향막 형성 장치, 배향막 형성 방법, 묘화 장치 및 묘화방법
CN115246266A (zh) 打印控制方法、装置、电子设备及计算机可读存储介质
TWI760131B (zh) 圖案形成裝置、圖案形成方法以及噴出資料生成方法
TW201806785A (zh) 凹版、印刷裝置、印刷方法及圖案載體
JP2020080379A (ja) 膜形成装置及び方法
WO2023047768A1 (ja) パターン製造方法、プログラム、及びパターン製造装置
TWI786859B (zh) 畸變校正處理裝置、繪圖方法及程式
JP7488108B2 (ja) インク塗布装置、その制御装置、及びインク塗布方法
JP2023044200A (ja) パターン形成装置、パターン形成方法および吐出データ生成方法
JP4302749B2 (ja) インク吐出装置およびその制御方法
TWI327047B (en) Method for calculating ink-jet printing data
JP2005296857A (ja) 半導体基板へのマーキング方法