TWI722308B - 多層印刷線路板的製造方法及多層印刷線路板 - Google Patents

多層印刷線路板的製造方法及多層印刷線路板 Download PDF

Info

Publication number
TWI722308B
TWI722308B TW107126847A TW107126847A TWI722308B TW I722308 B TWI722308 B TW I722308B TW 107126847 A TW107126847 A TW 107126847A TW 107126847 A TW107126847 A TW 107126847A TW I722308 B TWI722308 B TW I722308B
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
cured film
film
wiring board
Prior art date
Application number
TW107126847A
Other languages
English (en)
Chinese (zh)
Other versions
TW201910137A (zh
Inventor
樋口倫也
藤原勇佐
田中信也
鈴木文人
橋本壯一
荒井貴
Original Assignee
日商互應化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商互應化學工業股份有限公司 filed Critical 日商互應化學工業股份有限公司
Publication of TW201910137A publication Critical patent/TW201910137A/zh
Application granted granted Critical
Publication of TWI722308B publication Critical patent/TWI722308B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW107126847A 2017-08-09 2018-08-02 多層印刷線路板的製造方法及多層印刷線路板 TWI722308B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017154766 2017-08-09
JP2017-154766 2017-08-09

Publications (2)

Publication Number Publication Date
TW201910137A TW201910137A (zh) 2019-03-16
TWI722308B true TWI722308B (zh) 2021-03-21

Family

ID=65272130

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107126847A TWI722308B (zh) 2017-08-09 2018-08-02 多層印刷線路板的製造方法及多層印刷線路板

Country Status (5)

Country Link
JP (1) JP6705084B2 (ko)
KR (1) KR102189000B1 (ko)
CN (1) CN110999554B (ko)
TW (1) TWI722308B (ko)
WO (1) WO2019031322A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020203790A1 (ja) * 2019-03-29 2020-10-08 太陽インキ製造株式会社 フォトレジスト組成物およびその硬化物
TWI807464B (zh) * 2020-11-06 2023-07-01 日商互應化學工業股份有限公司 印刷線路板及印刷線路板的製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000313693A (ja) * 1999-04-26 2000-11-14 Komatsu Electronic Metals Co Ltd 半導体単結晶製造用熱伝導型種結晶及び該熱伝導型種結晶による単結晶の成長方法
JP2006351646A (ja) * 2005-06-14 2006-12-28 Tokai Rubber Ind Ltd 回路基板およびその製造方法
JP2017129687A (ja) * 2016-01-19 2017-07-27 互応化学工業株式会社 感光性樹脂組成物、ドライフィルム、プリント配線板、及び感光性樹脂組成物の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260808A (ja) * 1996-03-19 1997-10-03 Fujitsu Ltd 光触媒反応による金属配線の形成方法及び基材
JPH11242330A (ja) 1998-02-24 1999-09-07 Nippon Steel Chem Co Ltd 感光性樹脂組成物、それを用いた多層プリント配線板とその製造方法
JP2000313963A (ja) * 1999-04-28 2000-11-14 Sumitomo Metal Ind Ltd 樹脂のめっき方法
JP5238777B2 (ja) * 2010-09-14 2013-07-17 太陽ホールディングス株式会社 感光性樹脂、それを含有する硬化性樹脂組成物及びそのドライフィルム並びにそれらを用いたプリント配線板
CN103969947B (zh) * 2013-01-31 2016-05-04 太阳油墨（苏州）有限公司 碱显影型感光性树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000313693A (ja) * 1999-04-26 2000-11-14 Komatsu Electronic Metals Co Ltd 半導体単結晶製造用熱伝導型種結晶及び該熱伝導型種結晶による単結晶の成長方法
JP2006351646A (ja) * 2005-06-14 2006-12-28 Tokai Rubber Ind Ltd 回路基板およびその製造方法
JP2017129687A (ja) * 2016-01-19 2017-07-27 互応化学工業株式会社 感光性樹脂組成物、ドライフィルム、プリント配線板、及び感光性樹脂組成物の製造方法

Also Published As

Publication number Publication date
CN110999554B (zh) 2021-05-18
JP6705084B2 (ja) 2020-06-03
CN110999554A (zh) 2020-04-10
KR102189000B1 (ko) 2020-12-09
KR20200035008A (ko) 2020-04-01
WO2019031322A1 (ja) 2019-02-14
TW201910137A (zh) 2019-03-16
JPWO2019031322A1 (ja) 2019-11-07

Similar Documents

Publication Publication Date Title
TWI653506B (zh) 感光性樹脂組成物、乾膜及印刷線路板
TWI620012B (zh) 感光性樹脂組成物、乾膜及印刷線路板
TWI734251B (zh) 覆膜的製造方法及印刷線路板
TWI751601B (zh) 感光性黏著劑組成物、乾膜、及多層基板的製造方法
TW202238272A (zh) 感光性樹脂組成物、乾膜、硬化物及印刷線路板
JP6204518B2 (ja) 感光性樹脂組成物、ドライフィルム、及びプリント配線板
JP6391121B2 (ja) 感光性樹脂組成物、ドライフィルム、プリント配線板、及び感光性樹脂組成物の製造方法
TWI656403B (zh) 感光性樹脂組成物、乾膜及印刷線路板（一）
TWI722308B (zh) 多層印刷線路板的製造方法及多層印刷線路板
JP6478351B2 (ja) 感光性樹脂組成物、ドライフィルム、プリント配線板、及びプリント配線板の製造方法
TWI700552B (zh) 感光性樹脂組成物、乾膜及印刷線路板
TWI784125B (zh) 感光性樹脂組成物、乾膜及印刷線路板
CN109791354B (zh) 感光性树脂组合物、干膜和印刷配线板
JP6082083B1 (ja) 感光性樹脂組成物、ドライフィルム、プリント配線板、及び感光性樹脂組成物の製造方法
TWI807464B (zh) 印刷線路板及印刷線路板的製造方法
TWI830081B (zh) 層間絕緣膜的製造方法及層間絕緣膜