CN110999554B - 多层印刷配线板的制造方法和多层印刷配线板 - Google Patents

多层印刷配线板的制造方法和多层印刷配线板 Download PDF

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Publication number
CN110999554B
CN110999554B CN201880051661.3A CN201880051661A CN110999554B CN 110999554 B CN110999554 B CN 110999554B CN 201880051661 A CN201880051661 A CN 201880051661A CN 110999554 B CN110999554 B CN 110999554B
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China
Prior art keywords
resin composition
photosensitive resin
wiring board
printed wiring
cured film
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CN201880051661.3A
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Chinese (zh)
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CN110999554A (zh
Inventor
樋口伦也
藤原勇佐
田中信也
铃木文人
桥本壮一
荒井贵
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Goo Chemical Industries Co Ltd
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Goo Chemical Industries Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN201880051661.3A 2017-08-09 2018-08-01 多层印刷配线板的制造方法和多层印刷配线板 Active CN110999554B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017-154766 2017-08-09
JP2017154766 2017-08-09
PCT/JP2018/028770 WO2019031322A1 (ja) 2017-08-09 2018-08-01 多層プリント配線板の製造方法及び多層プリント配線板

Publications (2)

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CN110999554A CN110999554A (zh) 2020-04-10
CN110999554B true CN110999554B (zh) 2021-05-18

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JP (1) JP6705084B2 (ko)
KR (1) KR102189000B1 (ko)
CN (1) CN110999554B (ko)
TW (1) TWI722308B (ko)
WO (1) WO2019031322A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202102938A (zh) * 2019-03-29 2021-01-16 日商太陽油墨製造股份有限公司 光阻組成物及其硬化物
TWI807464B (zh) * 2020-11-06 2023-07-01 日商互應化學工業股份有限公司 印刷線路板及印刷線路板的製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260808A (ja) * 1996-03-19 1997-10-03 Fujitsu Ltd 光触媒反応による金属配線の形成方法及び基材
JP2000313963A (ja) * 1999-04-28 2000-11-14 Sumitomo Metal Ind Ltd 樹脂のめっき方法
JP2006351646A (ja) * 2005-06-14 2006-12-28 Tokai Rubber Ind Ltd 回路基板およびその製造方法
CN102443136A (zh) * 2010-09-14 2012-05-09 太阳控股株式会社 感光性树脂、固化性树脂组合物、干膜以及印刷电路板
CN103969947A (zh) * 2013-01-31 2014-08-06 太阳油墨（苏州）有限公司 碱显影型感光性树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板
JP2017129687A (ja) * 2016-01-19 2017-07-27 互応化学工業株式会社 感光性樹脂組成物、ドライフィルム、プリント配線板、及び感光性樹脂組成物の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11242330A (ja) 1998-02-24 1999-09-07 Nippon Steel Chem Co Ltd 感光性樹脂組成物、それを用いた多層プリント配線板とその製造方法
JP2000313693A (ja) * 1999-04-26 2000-11-14 Komatsu Electronic Metals Co Ltd 半導体単結晶製造用熱伝導型種結晶及び該熱伝導型種結晶による単結晶の成長方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260808A (ja) * 1996-03-19 1997-10-03 Fujitsu Ltd 光触媒反応による金属配線の形成方法及び基材
JP2000313963A (ja) * 1999-04-28 2000-11-14 Sumitomo Metal Ind Ltd 樹脂のめっき方法
JP2006351646A (ja) * 2005-06-14 2006-12-28 Tokai Rubber Ind Ltd 回路基板およびその製造方法
CN102443136A (zh) * 2010-09-14 2012-05-09 太阳控股株式会社 感光性树脂、固化性树脂组合物、干膜以及印刷电路板
CN103969947A (zh) * 2013-01-31 2014-08-06 太阳油墨（苏州）有限公司 碱显影型感光性树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板
JP2017129687A (ja) * 2016-01-19 2017-07-27 互応化学工業株式会社 感光性樹脂組成物、ドライフィルム、プリント配線板、及び感光性樹脂組成物の製造方法

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WO2019031322A1 (ja) 2019-02-14
JP6705084B2 (ja) 2020-06-03
KR20200035008A (ko) 2020-04-01
TW201910137A (zh) 2019-03-16
CN110999554A (zh) 2020-04-10
JPWO2019031322A1 (ja) 2019-11-07
KR102189000B1 (ko) 2020-12-09
TWI722308B (zh) 2021-03-21

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