TWI721219B - 複合樹脂組合物及該複合樹脂組合物成形的連接器 - Google Patents

複合樹脂組合物及該複合樹脂組合物成形的連接器 Download PDF

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Publication number
TWI721219B
TWI721219B TW106133901A TW106133901A TWI721219B TW I721219 B TWI721219 B TW I721219B TW 106133901 A TW106133901 A TW 106133901A TW 106133901 A TW106133901 A TW 106133901A TW I721219 B TWI721219 B TW I721219B
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TW
Taiwan
Prior art keywords
constituent unit
resin composition
composite resin
total
mol
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TW106133901A
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English (en)
Chinese (zh)
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TW201829618A (zh
Inventor
深津博樹
瀧智弘
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日商寶理塑料股份有限公司
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Publication of TW201829618A publication Critical patent/TW201829618A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/12—Polyester-amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/44—Polyester-amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/004—Additives being defined by their length

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Polyamides (AREA)
TW106133901A 2016-10-07 2017-09-30 複合樹脂組合物及該複合樹脂組合物成形的連接器 TWI721219B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-199062 2016-10-07
JP2016199062 2016-10-07

Publications (2)

Publication Number Publication Date
TW201829618A TW201829618A (zh) 2018-08-16
TWI721219B true TWI721219B (zh) 2021-03-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW106133901A TWI721219B (zh) 2016-10-07 2017-09-30 複合樹脂組合物及該複合樹脂組合物成形的連接器

Country Status (6)

Country Link
JP (1) JP6356938B1 (fr)
KR (1) KR102052662B1 (fr)
CN (1) CN109790378B (fr)
PH (1) PH12019500728A1 (fr)
TW (1) TWI721219B (fr)
WO (1) WO2018066417A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111417681B (zh) 2017-12-05 2023-08-22 提克纳有限责任公司 用于摄像模组的芳族聚合物组合物
JP7461959B2 (ja) 2019-03-20 2024-04-04 ティコナ・エルエルシー カメラモジュールのためのアクチュエータアセンブリ
JP2022524720A (ja) 2019-03-20 2022-05-10 ティコナ・エルエルシー カメラモジュールにおいて使用するためのポリマー組成物
KR102245200B1 (ko) 2019-07-09 2021-04-27 단국대학교 산학협력단 마이크로 커넥터용 조성물 및 이를 사용하는 마이크로 커넥터
JP2021105105A (ja) * 2019-12-26 2021-07-26 ポリプラスチックス株式会社 全芳香族ポリエステルアミド、ポリエステルアミド樹脂組成物、及び成形品
CN115551948B (zh) * 2020-05-13 2023-04-11 宝理塑料株式会社 表面安装继电器用液晶性树脂组合物及使用其的表面安装继电器
WO2022168706A1 (fr) * 2021-02-05 2022-08-11 ポリプラスチックス株式会社 Composition de résine à cristaux liquides pour turbine de ventilateur et turbine de ventilateur qui utilise celle-ci

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5798432A (en) * 1996-03-22 1998-08-25 Hoechst Celanese Corp. Method of making thermotropic liquid crystalline polymers containing hydroquinone
TW201431949A (zh) * 2012-09-26 2014-08-16 Polyplastics Co 電子元件用複合樹脂組合物以及由該複合樹脂組合物形成之電子元件
TW201634572A (zh) * 2014-12-05 2016-10-01 Polyplastics Co 複合樹脂組合物以及平面狀連結器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0919363A4 (fr) * 1997-06-13 2002-04-17 Nippon Petrochemicals Co Ltd Composite lie et composition adhesive pour ledit composite
JP4463637B2 (ja) 2004-07-30 2010-05-19 ポリプラスチックス株式会社 液晶性ポリエステル樹脂組成物
KR101413813B1 (ko) * 2011-04-01 2014-06-30 폴리플라스틱스 가부시키가이샤 전방향족 폴리에스터 및 폴리에스터 수지 조성물
US8932483B2 (en) * 2011-11-15 2015-01-13 Ticona Llc Low naphthenic liquid crystalline polymer composition
CN104080836B (zh) * 2012-01-31 2016-08-24 吉坤日矿日石能源株式会社 液晶聚酯酰胺、液晶聚酯酰胺树脂组合物及成型体
JP2016124947A (ja) * 2014-12-26 2016-07-11 ポリプラスチックス株式会社 成形品の製造方法及び複合樹脂組成物
JP6157779B1 (ja) * 2015-10-21 2017-07-05 ポリプラスチックス株式会社 全芳香族ポリエステルアミド及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5798432A (en) * 1996-03-22 1998-08-25 Hoechst Celanese Corp. Method of making thermotropic liquid crystalline polymers containing hydroquinone
TW201431949A (zh) * 2012-09-26 2014-08-16 Polyplastics Co 電子元件用複合樹脂組合物以及由該複合樹脂組合物形成之電子元件
TW201634572A (zh) * 2014-12-05 2016-10-01 Polyplastics Co 複合樹脂組合物以及平面狀連結器

Also Published As

Publication number Publication date
TW201829618A (zh) 2018-08-16
KR102052662B1 (ko) 2019-12-05
CN109790378A (zh) 2019-05-21
CN109790378B (zh) 2020-09-11
JPWO2018066417A1 (ja) 2018-10-04
JP6356938B1 (ja) 2018-07-11
PH12019500728A1 (en) 2019-11-11
KR20190028556A (ko) 2019-03-18
WO2018066417A1 (fr) 2018-04-12

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