CN109790378B - 复合树脂组合物、及由该复合树脂组合物成形而成的连接器 - Google Patents

复合树脂组合物、及由该复合树脂组合物成形而成的连接器 Download PDF

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CN109790378B
CN109790378B CN201780058271.4A CN201780058271A CN109790378B CN 109790378 B CN109790378 B CN 109790378B CN 201780058271 A CN201780058271 A CN 201780058271A CN 109790378 B CN109790378 B CN 109790378B
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resin composition
mol
composite resin
constituent unit
total
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CN109790378A (zh
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深津博树
泷智弘
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Polyplastics Co Ltd
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Polyplastics Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/12—Polyester-amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/44—Polyester-amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/004—Additives being defined by their length

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyamides (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
CN201780058271.4A 2016-10-07 2017-09-26 复合树脂组合物、及由该复合树脂组合物成形而成的连接器 Active CN109790378B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016-199062 2016-10-07
JP2016199062 2016-10-07
PCT/JP2017/034795 WO2018066417A1 (fr) 2016-10-07 2017-09-26 Composition de résine composite, et raccord fabriqué à partir de ladite composition de résine composite

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CN109790378A CN109790378A (zh) 2019-05-21
CN109790378B true CN109790378B (zh) 2020-09-11

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CN201780058271.4A Active CN109790378B (zh) 2016-10-07 2017-09-26 复合树脂组合物、及由该复合树脂组合物成形而成的连接器

Country Status (6)

Country Link
JP (1) JP6356938B1 (fr)
KR (1) KR102052662B1 (fr)
CN (1) CN109790378B (fr)
PH (1) PH12019500728A1 (fr)
TW (1) TWI721219B (fr)
WO (1) WO2018066417A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019112847A1 (fr) 2017-12-05 2019-06-13 Ticona Llc Composition polymère aromatique destinée à être utilisée dans un module de caméra
US11086200B2 (en) 2019-03-20 2021-08-10 Ticona Llc Polymer composition for use in a camera module
JP7461959B2 (ja) 2019-03-20 2024-04-04 ティコナ・エルエルシー カメラモジュールのためのアクチュエータアセンブリ
KR102245200B1 (ko) 2019-07-09 2021-04-27 단국대학교 산학협력단 마이크로 커넥터용 조성물 및 이를 사용하는 마이크로 커넥터
JP2021105105A (ja) * 2019-12-26 2021-07-26 ポリプラスチックス株式会社 全芳香族ポリエステルアミド、ポリエステルアミド樹脂組成物、及び成形品
WO2021229931A1 (fr) * 2020-05-13 2021-11-18 ポリプラスチックス株式会社 Composition de résine cristalline liquide pour des relais montés en surface, et relais monté en surface l'utilisant
KR20230142763A (ko) 2021-02-04 2023-10-11 티코나 엘엘씨 전기 회로 보호 장치용 중합체 조성물
CN116806239A (zh) * 2021-02-05 2023-09-26 宝理塑料株式会社 风扇叶轮用液晶性树脂组合物及使用其的风扇叶轮

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5798432A (en) * 1996-03-22 1998-08-25 Hoechst Celanese Corp. Method of making thermotropic liquid crystalline polymers containing hydroquinone
CN103459459A (zh) * 2011-04-01 2013-12-18 宝理塑料株式会社 全芳香族聚酯及聚酯树脂组合物
CN104704049A (zh) * 2012-09-26 2015-06-10 宝理塑料株式会社 电子部件用复合树脂组合物、以及由该复合树脂组合物成型而成的电子部件
JP2016124947A (ja) * 2014-12-26 2016-07-11 ポリプラスチックス株式会社 成形品の製造方法及び複合樹脂組成物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0919363A4 (fr) * 1997-06-13 2002-04-17 Nippon Petrochemicals Co Ltd Composite lie et composition adhesive pour ledit composite
JP4463637B2 (ja) 2004-07-30 2010-05-19 ポリプラスチックス株式会社 液晶性ポリエステル樹脂組成物
WO2013074476A1 (fr) * 2011-11-15 2013-05-23 Ticona Llc Composition polymère cristal liquide à faible teneur en napthéniques
JP5909508B2 (ja) * 2012-01-31 2016-04-26 Ｊｘエネルギー株式会社 液晶ポリエステルアミド、液晶ポリエステルアミド樹脂組成物及び成形体
WO2016088714A1 (fr) * 2014-12-05 2016-06-09 ポリプラスチックス株式会社 Composition de résine composite et connecteur plan
CN108026269A (zh) * 2015-10-21 2018-05-11 宝理塑料株式会社 全芳香族聚酯酰胺和其制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5798432A (en) * 1996-03-22 1998-08-25 Hoechst Celanese Corp. Method of making thermotropic liquid crystalline polymers containing hydroquinone
CN103459459A (zh) * 2011-04-01 2013-12-18 宝理塑料株式会社 全芳香族聚酯及聚酯树脂组合物
CN104704049A (zh) * 2012-09-26 2015-06-10 宝理塑料株式会社 电子部件用复合树脂组合物、以及由该复合树脂组合物成型而成的电子部件
JP2016124947A (ja) * 2014-12-26 2016-07-11 ポリプラスチックス株式会社 成形品の製造方法及び複合樹脂組成物

Also Published As

Publication number Publication date
TW201829618A (zh) 2018-08-16
KR20190028556A (ko) 2019-03-18
PH12019500728A1 (en) 2019-11-11
JP6356938B1 (ja) 2018-07-11
WO2018066417A1 (fr) 2018-04-12
KR102052662B1 (ko) 2019-12-05
TWI721219B (zh) 2021-03-11
CN109790378A (zh) 2019-05-21
JPWO2018066417A1 (ja) 2018-10-04

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