TWI712103B - 頂銷單元的移動方法以及基板處理裝置 - Google Patents

頂銷單元的移動方法以及基板處理裝置 Download PDF

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Publication number
TWI712103B
TWI712103B TW107141127A TW107141127A TWI712103B TW I712103 B TWI712103 B TW I712103B TW 107141127 A TW107141127 A TW 107141127A TW 107141127 A TW107141127 A TW 107141127A TW I712103 B TWI712103 B TW I712103B
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TW
Taiwan
Prior art keywords
substrate
ejector pin
pin unit
supply part
unit
Prior art date
Application number
TW107141127A
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English (en)
Chinese (zh)
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TW201933531A (zh
Inventor
孫洪儁
Original Assignee
南韓商Ｔｅｓ股份有限公司
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Application filed by 南韓商Ｔｅｓ股份有限公司 filed Critical 南韓商Ｔｅｓ股份有限公司
Publication of TW201933531A publication Critical patent/TW201933531A/zh
Application granted granted Critical
Publication of TWI712103B publication Critical patent/TWI712103B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW107141127A 2017-11-29 2018-11-20 頂銷單元的移動方法以及基板處理裝置 TWI712103B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
??10-2017-0162250 2017-11-29
KR10-2017-0162250 2017-11-29
KR1020170162250A KR102053593B1 (ko) 2017-11-29 2017-11-29 리프트핀유닛의 이동방법 및 기판처리장치

Publications (2)

Publication Number Publication Date
TW201933531A TW201933531A (zh) 2019-08-16
TWI712103B true TWI712103B (zh) 2020-12-01

Family

ID=66850166

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107141127A TWI712103B (zh) 2017-11-29 2018-11-20 頂銷單元的移動方法以及基板處理裝置

Country Status (3)

Country Link
KR (1) KR102053593B1 (ko)
CN (1) CN109841544B (ko)
TW (1) TWI712103B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102288733B1 (ko) * 2019-09-25 2021-08-11 (주)에스티아이 기판처리장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020034883A1 (en) * 2000-07-27 2002-03-21 Klein Martin P. Substrate processing pallet and related substrate processing method and machine
US20030000775A1 (en) * 2001-06-29 2003-01-02 Applied Materials, Inc. Lift pin actuating mechanism for semiconductor processing chamber
US20110132873A1 (en) * 2009-12-04 2011-06-09 Tokyo Electron Limited Substrate processing apparatus, method for measuring distance between electrodes, and storage medium storing program
JP2012087336A (ja) * 2010-10-18 2012-05-10 Seiko Epson Corp 基板処理装置、基板処理室のクリーニング方法、および電気光学装置の製造方法
JP2014011166A (ja) * 2012-06-27 2014-01-20 Sharp Corp 基板処理装置

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JP3214505B2 (ja) * 1991-09-13 2001-10-02 株式会社デンソー 半導体装置の製造方法
US5879128A (en) * 1996-07-24 1999-03-09 Applied Materials, Inc. Lift pin and support pin apparatus for a processing chamber
JP3437104B2 (ja) * 1998-11-18 2003-08-18 東京エレクトロン株式会社 基板熱処理装置及び基板熱処理方法
JP4111703B2 (ja) * 2001-10-19 2008-07-02 アプライド マテリアルズ インコーポレイテッド ウエハリフト機構
TWI271813B (en) * 2002-05-08 2007-01-21 Jusung Eng Co Ltd Apparatus for manufacturing a semiconductor device
JP3929879B2 (ja) * 2002-11-21 2007-06-13 京セラ株式会社 ウェハ支持部材
CN100499059C (zh) * 2006-08-22 2009-06-10 资腾科技股份有限公司 水平手动式晶舟转换器防护装置
KR20080058568A (ko) * 2006-12-22 2008-06-26 세메스 주식회사 리프트 핀 및 이를 갖는 기판 처리 장치
TWM343237U (en) * 2007-02-01 2008-10-21 Applied Materials Inc Mask etch plasma reactor with cathode lift pin assembly
KR101362814B1 (ko) * 2007-04-13 2014-02-21 참엔지니어링(주) 플라즈마 처리 방법
JP2010238716A (ja) * 2009-03-30 2010-10-21 Mitsubishi Electric Corp 基板加熱処理方法、該基板加熱処理方法を用いた表示装置の製造方法、及び基板加熱処理装置
CN101964321B (zh) * 2009-07-22 2012-09-05 北京北方微电子基地设备工艺研究中心有限责任公司 一种基片处理设备及其顶针升降装置
KR100965143B1 (ko) * 2009-10-27 2010-06-25 (주)앤피에스 서셉터 유닛 및 이를 구비하는 기판 처리 장치
CN102064126B (zh) * 2010-11-04 2013-04-17 友达光电股份有限公司 基板运输处理方法
CN103668101B (zh) * 2012-09-21 2015-12-16 无锡华润华晶微电子有限公司 沉积成膜装置中所使用的晶圆固定装置
CN104269369A (zh) * 2014-08-29 2015-01-07 沈阳拓荆科技有限公司 一种通过真空装载腔为晶圆预热的装置及方法
CN105779960B (zh) * 2014-12-19 2018-09-18 北京北方华创微电子装备有限公司 沉积组件及半导体加工设备
CN204375711U (zh) * 2015-03-03 2015-06-03 王玉先 一种顶针推顶驱动装置
CN106486411B (zh) * 2015-09-01 2019-06-11 东京毅力科创株式会社 基板处理装置、升降销的位置检测、调节和异常检测方法
JP6653608B2 (ja) * 2016-03-29 2020-02-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020034883A1 (en) * 2000-07-27 2002-03-21 Klein Martin P. Substrate processing pallet and related substrate processing method and machine
US20030000775A1 (en) * 2001-06-29 2003-01-02 Applied Materials, Inc. Lift pin actuating mechanism for semiconductor processing chamber
US20110132873A1 (en) * 2009-12-04 2011-06-09 Tokyo Electron Limited Substrate processing apparatus, method for measuring distance between electrodes, and storage medium storing program
JP2012087336A (ja) * 2010-10-18 2012-05-10 Seiko Epson Corp 基板処理装置、基板処理室のクリーニング方法、および電気光学装置の製造方法
JP2014011166A (ja) * 2012-06-27 2014-01-20 Sharp Corp 基板処理装置

Also Published As

Publication number Publication date
CN109841544B (zh) 2023-05-09
KR20190063286A (ko) 2019-06-07
CN109841544A (zh) 2019-06-04
TW201933531A (zh) 2019-08-16
KR102053593B1 (ko) 2019-12-09

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