TWI271813B - Apparatus for manufacturing a semiconductor device - Google Patents

Abstract

An apparatus for manufacturing a semiconductor device according to the present invention includes a chamber having a gate valve and an outlet, a susceptor within the chamber to hold a wafer thereon, being movable upward and downward, and having a plurality of lift pin holes, wherein each lift pin hole has a hanging part at the upper end, and a plurality of lift pins passing through the plurality of lift pin holes, wherein each lift pin has a hung part at the upper end and a length of the lift pin being longer than that of the lift pin hole, and the upper diameter of the hung part is shorter than the upper diameter of the hanging part and is longer than the lower diameter of the hanging part.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing apparatus of a semiconductor device; and more particularly to an apparatus including a lifting needle portion for loading a substrate to be processed inside a chamber. Description The development of new materials has been actively carried out and a variety of large integrated circuits (LSIs) have been developed due to the rapid growth of new materials, such as ultra-wide snubber circuits (ULSI). That is, since a new material for forming a thin film (for example, an insulating layer, a semiconductor layer, and a conductor layer constituting a semiconductor device) has been widely developed in the field, there is currently a large integrated circuit (LSI). For example, a very large integrated body (ULSI) circuit. Semiconductor devices are typically fabricated by repeated deposition and patterning procedures. These procedures are performed under vacuum conditions in the manufacturing equipment of the semiconductor device. Manufacturing equipment for semiconductor devices is classified into many types according to the use. The straight apparatus generally includes: a processing chamber which is an airtight reaction vessel; a controller that controls the environment inside the chamber; and a gas supply system that stores the source gas and supplies the source gas. 1 and 2 show a manufacturing apparatus for a semiconductor device. The figure shows the state of loading or unloading the wafer, and Figure 2 shows the state of the program. In Figures 1 and 2, the apparatus includes a processing chamber, a table 8, and a gas entrant 6. The processing chamber 1 has a gate valve 2 and an outlet 4, and the top of the chamber 1 is hemispherical. The wafer to be processed enters and exits the processing chamber 1 via the gate valve 2, and the gate valve 2 is formed on the wall portion of the processing chamber 1. Inside the processing chamber

1271813 V. INSTRUCTIONS (2) =: Gas is discharged to the outside of the processing chamber i via the outlet 4. The gas injector 6, is connected to a gas supply system (not shown) other than the processing chamber i, and is disposed on the top of the inner surface of the processing chamber. The table portion 8 is also located inside the chamber 1 and the wafer 5 is placed on the table portion 8. The stage portion 8 includes a crystal holder 10, a crystal pad driving plate 17 and a lifting needle portion base and an if: needle driving plate 19. The crystal holder 10 is in the shape of a circular plate, and inside: a circle 50: ΐί1: which is used to supply heat to the wafer 50. Therefore, by heating 5 and speeding up and obtaining a stable result. Moreover, the crystal holder is connected to the crystal growth plate 17 by the first vertical column, which is driven by the motor to be driven by the motor "Μ", and the Tianren's day seat drive plate 17 A vertical cylinder 18a is moved up and down by the lift 2 to move the base 10. Below. The needle lowering base 15 is disposed on the base of the crystal holder i 〇 lifting needle, and the ancient and plural lifting pinholes 二 2 two liters of the plurality of lifting needles 13 through which the lifting needle driving plate is connected The /base substrate 15 is driven by a second vertical cylinder 18b cylinder "P". First, it is to treat the air outside the chamber 1 17 . Therefore, the plurality of lifting vertical cylinders 18b travel to the lift and lower movement of the wafer drive plate. "13 The vertical structure of the vertical floor portion 8 is generated by the air cylinder "P" to the bottom side of the chamber 1 of Fig. 1. "The member is not in Fig. 3. The line "A~a" in Fig. 3 is connected to the crystal holder 1 of 1 2 to pass through. As shown in FIG. 3, the first vertical cylinder j 8 "M" having a plurality of lifting pin holes, connected to the base driving plate 7 and the needle lowering base 15 is shown. Under the crystal holder 1 晶, the crystal driver board 17 is connected to the motor ----- Bu V lifting needle base 1 5 has a plurality of lifting needles

1^^ I2?1813 V. Invention Description (3) Lifting pin ί 3 : lH f18b is connected to the "f σ卩 driver board 19 below the crystal driver board 1 7. The lifting needle driver board 19 is connected to *", Therefore, the lifting needle driving plate 19 is moved by s. The plurality of lifting needles U pass through a plurality of lifting pinholes to "P" and to move the air I* ΐ ΐ the upper portion of the chamber 1 is hemispherical, which is capable of maximizing the dispersion of the source = processing chamber! == 曰 round 5°. Thereby, the area close to the valve closing 2 is sensitive; Γ, θί - square ^ Γ ί temperature and の force # conditions can be easily changed. In addition, the first region 2Ga inside the valley chamber 1 is disposed on the gate 2, and has a second region 2 than the first region 2〇& It is desirable to deposit and pattern the film in the first region to load and unload to the inter-section 2, while the ί 上 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ The crystal sling moves toward the first area... Moreover, deposition or patterning is done in the first region 20a. The flywheel ίο t 右 right is to move the crystal driver board 17 by the motor "M", and if the air cylinder "Ρ" moves the lifting needle driving plate 19, the needle lowering base 15 is The lifting needle portion 13 is simultaneously moved'. Meanwhile, in FIGS. 1 and 2, the first folding box 21 and the second folding portion are formed, and 5 r: the impurity is penetrated into the processing chamber 1, and the first folding box 21 is disposed at The bottom of the case 1 is between the base plate driving plate 17, and the second folding box 22 is located between the base pad driving plate 17 and the lifting pin driving plate 19. First, in the device of Figure 1, the crystal holder is 丨0 and crystal 1271813 by the motor "Μ"

V. INSTRUCTION OF THE INVENTION (4) 3: The reverse 17 is placed in the second region 2〇b, and the plurality of lifting needle portions 13 of the lowering needle ίί 15 ί are raised by the air round stomach "p". Therefore, the plurality of 曰# dogs are out of the plurality of lifting pinholes 12 above the pedestal 1 。. Moreover, the round circle 50 is placed on the complex 弁p^m π Γρ you 々L lift needle #13. After that, by the air cylinder. t) The lifting needle portion 13 is lowered, and the wafer 50 is loaded on the crystal holder 1 〇 ^ r 图 图 图 图 图 图 图 图 图 图 图 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达 马达1 The source gas of the medium-rolling body injector 6 is not λ, and the wide T-hepatic film is deposited on the wafer 50 in the center of the region, and thus will be thinned so that the wafer 50 is on the === Film patterning. It

Domain coffee. The Λ廿1 of the plurality of lifting needles t3 is lowered, and placed in the second zone "λ 丄 J upwards and raised by the pedestal 10 曰 HI 50. From the (four) 2, the wafer 50 is taken out from the processing chamber ten. The Japanese solid-state needle base 15 is driven by the conventional handling of the Acer air cylinder "p", which includes the control chamber = the needle portion 13' so that the size of the chamber 1 is increased. The reliability of the placement is reduced. The dish/loading force of the second is difficult, and therefore, the lifting needle portion 13^the second chamber 1 + ' is liable to generate impurities. Since the motor "M" and the air Ύρ must be completely detached from the table portion 8, the cost of the device becomes high. SUMMARY OF THE INVENTION Therefore, the present invention substantially eliminates many problems due to the manufacturing equipment of the conventional semiconductor devices. One or more of the limitations and disadvantages of the technology, or an advantage of the invention (5) j: M ^ ^, is to provide a manufacturing apparatus of a semiconductor device having an early structure and a small size. BRIEF DESCRIPTION OF THE DRAWINGS Other characteristics and advantages of the present invention will be apparent from the point of view and the scope of the invention. The second aspect of the present invention can be realized and achieved by the appendage of the stomach and the structure proposed by the patented target. To achieve these and other advantages, a manufacturing device having a gate valve and an outlet for use in a semiconductor application includes: using/holding a wafer thereon, And a crystal holder of the H 2 portion, the J-number lifting pinhole, wherein each lifting pinhole is at two:: and has 4, and the plurality of lifting needles pass through the plurality of lifting and lowering and have a hanging support portion The top end has a suspension support portion and is raised and lowered. Each of the lifting pins lifts a length of the pinhole, and the upper length of the suspension support portion is too larger than the upper diameter of the support portion and smaller than the diameter of the suspension support portion. Suspension ^ We should be aware of the general description above and the lower diameter below. The detailed description of the present invention is intended to be illustrative and illustrative. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a semiconductor device of the present invention will be described in detail with reference to the accompanying drawings. FIG. 4 shows a semiconductor device according to the present invention. This is the same manufacturing device as the conventional device of Figs. 1 and 2. Expressed in the same symbol. In Fig. 4, the apparatus includes a phase injector 6' and a motor "M" used in the process. Handling chamber 丨^ room 丨, 台台8, gas

匕 闸 gate valve 2 and output Q Page 10 1271813 V. Description of invention (6) 4 The top of the preparation to 1 is hemispherical. The gate valve 2 is formed in the wall of the processing chamber 1. The wafer to be processed enters and exits the port 4 through the channel from the gate valve 2 and is connected to the pumping port. Each of the slaves/丄® is in the south (not shown). The internal pressure of the working chamber 1 and the temple processing chamber 1 inside the processing chamber 1 is discharged. The gas injectors 6, 1 are connected to an external gas supply system (not shown), and are disposed on the inner surface of the processing chamber.卩上. The stage 8 includes a base 1 and a base drive plate 17. The crystal holder 10 is positioned inside the process interior and carries the wafer 5Q thereon. The crystal holder 1 〇 cl is adjacent to the heater 11 having a heat supply to the wafer 5, and has a plurality of lifting pins and a phantom pin. On the other hand, the crystal holder 1 is connected to the crystal driver board 7 controlled by the motor, which is placed in the processing chamber, so that the crystal holder 10 is up and down by the motor "M". mobile. The folding box 21 makes the processing valley 1 airtight and is positioned between the driving plates 17. ^ As described above, the process of wafer 5 is performed in the first region of the processing chamber 2 20 a, the gate valve 2, the 66 μ plus plant, the # s 4 + & The loading and unloading of the wafer 50 is completed in the second region 20b inside the processing chamber 1 and in the lower region of the first region 20a. - The apparatus of the present invention will be described in detail below with reference to Figs. 5A and 5B. 5A and (10) show the construction of the crystal holder and the lifting needle portion according to the present invention. In (4) and (4), the line "A-A" indicates the bottom of the processing capacity of Fig. 4. As described above, the crystal holder 10 has a plurality of lifting pinholes 62. Each of the lifting pinholes 62 has a hanging support portion 62a at the top end of the lifting pinhole 62. Each of the lifting and lowering needle portions 60 passing through the respective lifting pinholes has a hanging portion 60a at the distal end of the lifting needle portion 6A. The upper diameter of the hanging portion is shorter than the upper diameter of the hanging support portion 62a and longer than the hanging support portion.

1271813

The lower diameter of 62a, the 俾 can be placed on the crystal seat 1〇 in the first two of the figure, the suspension portion 60a is suspended on the t-hanging support portion - the length of the J-degree system is longer than the length of the lifting pinhole 62, When the crystal seat strip 10 is shown, the lower part of the area 20b is lifted and the needle portion 6 is lifted. Can stand out to = ^. The lower portion of the lifting needle portion 60 travels to the suspension support portion 62a and the lower portion of the needle hole 62, and thus the suspension portion 6 is when the crystal holder 1 is positioned in the first region 2二a of the figure. 〇a is suspended on the suspension support. The suspension portion 62a and the suspension portion 6Ga are funnel-shaped as shown in Fig. 5A or cylindrical as shown in Fig. 5 (not shown). Here, it is desirable that the suspension support portion 62a has a southerness than the suspension portion a so that the suspension portion 6〇& is placed on the suspension branch portion 62a when the procedure is performed. Therefore, in this case, the wafer 5 of FIG. 4 is only located on the crystal plaque. On the other hand, the support portion 61 can be coupled to the lower end of the lifting needle portion 6A. The branch portion 61 prevents the base portion 60 from rising when the crystal holder tether is located in the second region 2〇]3 of FIG. 4, and the portion 60 is at the bottom of the lower portion of the lifting needle portion 6 and the bottom of the processing chamber of FIG. 2 "AA" contact damage caused. The support portion 6 can be coupled by the lower end of the screw assembly. At this time, the lower end of the elevating needle portion 6A may be an in-situ screw member', and the support portion 61 may be an internally threaded member. Large Due to the simple construction of this device, the size of the device can be reduced. This can be used to carefully control the conditions inside the processing chamber, and the degree of defective products is reduced. The cost of equipment has also dropped. Figure 6A and 6B show the drivers for the device in accordance with the present invention. First, as shown in :6 A, the crystal holder 1 〇 is brought down to the bottom "A-A" of the processing chamber 1 by the motor "Μ" of Fig. 4. Then, through the lifting pinhole 62 in the base 1

1271813 V. INSTRUCTIONS (8) The needle drop (10) contacts the processing chamber "the bottom of the spoon ^ ^ ^ ' and the lifting needle DU 4 吏 庙 η 空 ψ , ^ , , , , , , , , , , , , , , , , , , , , , , , , , , , , 50 is placed on the protruding lifting needle 6 。. Moving.: ί Ϊ * As shown in Fig. 6β, the crystal holder 10 is moved up by the motor "M" to be placed at: 4 ^ or etching procedure. On the 1st floor of the sundial, and after 70% of the deposition, as shown in Fig. 6a, the slabs of the slabs and the slabs on the slabs are lowered by 1", and the "M" is placed so that the wafers 5 are attached to the "A-A". At this time, the lifting 6 is close to the bottom of the processing chamber 1 Γ Λ A Ten P60 is in contact with the processing of the Xuan 1 ΛΑ ΛΑ Α Α , , , , , , , , , , , , , , , , , , , The bottom 邛 circle 50 rises, and from the gate of Fig. 4, the crystal is lifted by the lifting needle portion 60. The above is only used for 2; the wafer 50 is taken out from the processing chamber 1. For example, the invention is not limited to the preferred embodiment of the invention. The scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 and FIG. 2 are cross-sectional views showing a manufacturing apparatus of a conventional semiconductor device; FIG. 3 is a schematic exploded view of a conventional stage including a crystal holder; FIG. 4 is a cross section of a manufacturing apparatus of a semiconductor device according to the present invention. 5A and 5B are cross-sectional views showing the construction of a crystal holder and a lifting needle according to the present invention; and Figs. 6A and 6B show the driving procedure of the apparatus according to the present invention. [Description of symbols] 1 chamber 10 crystal seat 11 heater 12 lifting pinhole 13 lifting needle portion 15 lifting needle base 17 crystal holder driving plate 18a first vertical cylinder 18b second vertical cylinder 19 lifting needle driving plate 2 Gate valve 20a first region 20b second region 21 first bellows 22 second bellows

Page 14 1271813 Simple description of the model 4 Output 50 Wafer 6 Gas injector 60 Lifting needle 6 0a Suspension 62 Lifting pinhole 62a Suspension support 8 Countertop

1·· Page 15

Claims (1)

1271813 VI. Patent application scope 1 · A semiconductor-capacity chamber, a crystal seat, the crystal holder system can have a pinhole at the top end with a plurality of pinholes at the top end with a pinhole length, diameter, and length 2 The hanging part has 3 · According to the patent application, a support part is required, and the patent department is requested to apply for the patent. 4. According to the application, 5. Lifting parts according to the application. 6. According to the application of the suspension 7. The suspension of the suspension device 8. According to the manufacturing equipment of the suspension device, comprising: a gate valve and an outlet; inside the chamber, for holding a wafer And moving downwardly and having a plurality of lifting pinholes, each lifting has a hanging support portion; and the needle portion 'passing the plurality of lifting pin holes, each lifting needle portion hanging portion' and the lifting needle portion The length of the suspension is longer than the lower diameter of the suspension support on the upper diameter of the suspension support. The manufacturing apparatus of the semiconductor device of the first aspect is at the height of the suspension support. The manufacturing equipment of the semiconductor device of the member; the lower end of the needle portion is combined. The manufacturing device of the semiconductor device of the first component is the fourth device, and the lower end of the lifting pin portion is a manufacturing device of the semiconductor device of the external device, and the member is supported. Among them, there are still some of them, such as the patented support section, the patent department, the patented support section, the first β-system, the funnel-shaped semiconductor device, and the manufacturing range. 6:® & The manufacturing range of the semiconductor device is the first item > and the semiconductor device is provided with 僙 /, and has a cylindrical shape. Among them Page 16 T271iU3_____ VI. Scope of Application Patent 9. The manufacturing apparatus of a semiconductor device according to claim 8 of the patent application, wherein the suspension portion has a cylindrical shape. The manufacturing apparatus of the semiconductor device according to the first aspect of the invention, wherein the top of the chamber is hemispherical. 11. A manufacturing apparatus for a semiconductor device according to claim 10 of the patent application, further comprising a gas injector 'located on top of the inner surface of the chamber. 1 2. A manufacturing apparatus for a semiconductor device according to the first aspect of the patent application, which further comprises a crystal driver board attached to the crystal holder, the crystal panel being moved by a motor. Page 17