TWI707776B - 氣浮式薄膜貼合設備及其氣浮滾輪 - Google Patents

氣浮式薄膜貼合設備及其氣浮滾輪 Download PDF

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TWI707776B
TWI707776B TW108148289A TW108148289A TWI707776B TW I707776 B TWI707776 B TW I707776B TW 108148289 A TW108148289 A TW 108148289A TW 108148289 A TW108148289 A TW 108148289A TW I707776 B TWI707776 B TW I707776B
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air
roller
film
floating
laminating
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TW108148289A
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TW202124169A (zh
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楊思枬
王清和
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輝能科技股份有限公司
英屬開曼群島商輝能控股股份有限公司
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Priority to TW108148289A priority Critical patent/TWI707776B/zh
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Publication of TWI707776B publication Critical patent/TWI707776B/zh
Priority to US16/952,791 priority patent/US11046055B1/en
Priority to CN202011327047.0A priority patent/CN113120296B/zh
Priority to EP20209942.0A priority patent/EP3845381B1/en
Priority to ES20209942T priority patent/ES2948886T3/es
Priority to HUE20209942A priority patent/HUE061893T2/hu
Priority to PL20209942.0T priority patent/PL3845381T3/pl
Priority to KR1020200171119A priority patent/KR102219165B1/ko
Priority to JP2020204926A priority patent/JP6827145B1/ja
Priority to BR102020026096-0A priority patent/BR102020026096B1/pt
Publication of TW202124169A publication Critical patent/TW202124169A/zh

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  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
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  • Lining Or Joining Of Plastics Or The Like (AREA)
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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
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Abstract

一種氣浮式薄膜貼合設備及其氣浮滾輪，係藉由特定角度能吹出氣流的氣浮滾輪所構成，而能適用於具有立體障礙之基膜，藉由氣流提供的正壓來填補因立體障礙所產生的空間缺陷，使其能夠與貼合膜緊密貼合，克服因立體障礙所產生的皺折、缺陷以及所衍生無法將膜面貼合平整的缺失。

Description

氣浮式薄膜貼合設備及其氣浮滾輪
本發明係有關於一種薄膜貼合設備特別是一種藉由氣浮滾輪的氣流來填補待貼合薄膜上的缺陷空間，克服因立體障礙所產生的皺折、缺陷以及所衍生無法將膜面貼合平整的缺失之氣浮式薄膜貼合設備及其氣浮滾輪。
近年來，各種電子產品朝向輕薄、微小化發展，使得各種薄膜貼合技術的應用層面更為廣泛最常見的薄膜貼合技術為滾輪捲繞(roll to roll)的方式，其為一種高效能、連續性的生產方式，專門處理可撓性質的薄膜貼合加工，利用待貼合的筒狀原料與欲貼合的薄膜筒狀原料，以滾輪帶動壓合的方式來進行連續性的貼合，貼合完成後可再捲成圓筒狀或進行裁切，以作為半成品供後續加工使用。
薄膜貼合的主要關鍵在於如何使薄膜貼合後不產生皺折，使貼合後的積層體能夠平整，前案譬如為WO2011093427A1號專利，主要利用絕緣性薄膜、金屬箔、間隔薄膜、金屬箔、以及絕緣性薄膜重疊並進行熱壓合，再從間隔薄膜剝離而獲得兩個單面積層體，使其能夠貼合平整。
然而，於待貼合薄膜的背面具有塗層的情況下，塗層會形成立體障礙，立體障礙之間會產生空間缺陷，再加上薄膜的厚度較薄，無法 提供足夠的挺性，貼合時就會產生皺折、缺陷的情況，使其貼膜非常不平整；然現在技術上，儘管提出許多改善貼合平整的技術，但卻並未考量具有立體障礙的情況。
有鑑於此，本發明提出一種嶄新的氣浮式薄膜貼合設備及其氣浮滾輪，以解決上述具有立體障礙的貼膜所面臨的問題。
本發明的主要目的在於提供一種氣浮式薄膜貼合設備及其氣浮滾輪，可解決上述習知技術之缺失，係可利用氣浮滾輪於滾動壓合的過程中持續提供正壓的氣流，來填補待貼合薄膜之立體障礙間的空間缺陷，以達到貼合的平整性。
為達到上述目的，本發明提供一種氣浮式薄膜貼合設備及其氣浮滾輪，其包含有至少二進料滾輪、貼合滾輪以及氣浮滾輪，進料滾輪藉以導引基膜與貼合膜來進行貼合，其中基膜具有第一表面以及對應之第二表面，且第二表面上具有至少二元件，於該些元件間形成缺陷空間，貼合滾輪可接受進料滾輪所導引之貼合膜，配合氣浮滾輪可接受進料滾輪所導引之基膜，且氣浮滾輪設置並緊鄰於貼合滾輪之對應位置，而可藉由貼合滾輪之壓合，將貼合膜貼合至基膜之第一表面；於貼合過程中，氣浮滾輪可持續提供正壓的氣流至基膜的第二表面，藉以填補於缺陷空間，增加基膜的挺性而能使其與貼合膜平整地貼合。
另一方面，氣浮滾輪包含有外滾輪、內輪與一進氣源，外滾輪可相對內輪轉動，且其外表面具有複數個吹氣孔，內輪係為固定不轉動 且設置於外滾輪內，其外表面於預定角度範圍具有具有複數個通孔，可接收進氣源的氣流，通過內輪之通孔與外滾輪之吹氣孔，而可於貼合過程中將氣流填補於基膜之缺陷空間，且其中預定角度範圍係約為20-90度；如此一來，即可克服因立體障礙所產生的皺折、缺陷以及所衍生無法將膜面貼合平整的缺失。
底下藉由具體實施例詳加說明，當更容易瞭解本發明之目的、技術內容、特點及其所達成之功效。
10‧‧‧氣浮滾輪
11‧‧‧外滾輪
111‧‧‧吹氣孔
12‧‧‧內輪
121‧‧‧通孔
21‧‧‧貼合滾輪
31‧‧‧第一進料滾輪
32‧‧‧第二進料滾輪
33‧‧‧自由輪
34‧‧‧收料滾輪
40‧‧‧基膜
401‧‧‧第一表面
402‧‧‧第二表面
41‧‧‧元件
50‧‧‧貼合膜
L‧‧‧中心線
θ‧‧‧預定角度
第1A圖為本發明之實施例所提供之氣浮滾輪之示意圖。
第1B圖為本發明之實施例所提供之氣浮滾輪之分解示意圖。
第2A、2B圖為本發明之實施例所提供之氣浮滾輪之使用狀態示意圖。
第3圖為本發明之實施例所提供之氣浮式薄膜貼合設備示意圖。
第4圖為本發明之實施例所提供之氣浮式薄膜貼合設備之壓和剖面示意圖。
本發明所揭露之一種氣浮滾輪其係可於貼合過程中持續提供正壓的氣流，來填補待貼合薄膜上的缺陷空間，使其不產生皺折、缺陷而能確實平整地貼合；請參閱第1A、1B圖，氣浮滾輪10包含有外滾輪11與內輪12，外滾輪11係可相對轉動以配合帶動待貼合薄膜來進行壓合，因此，外滾輪11概略為中空圓筒狀，其外表面具有複數個吹氣孔111，因外滾輪11 係直接接觸於待貼合薄膜，因此吹氣孔111的部份尺寸不宜太大，此部份容後詳述。而內輪12係為固定不轉動且設置於外滾輪11內，其外表面於預定角度範圍具有具有複數個通孔121，因為內輪12無需配合待貼合薄膜或貼合過程中來轉動，僅需能導引進氣源來通過通孔121，因此，內輪12可為部份實心或空心皆可，僅需能將氣流導引至通孔121即可，而相較於前述的外滾輪11之吹氣孔111，通孔121的尺寸可以較大，來提供足夠的氣流。
為了說明其氣流導引與通孔121配置的角度，請接續參閱第2A、2B圖，氣浮滾輪10可配合貼合滾輪21來針對待貼合的基膜40與貼合膜50來進行壓合貼合，基膜40具有相對的第一表面401以及第二表面402，貼合膜50係貼合於基膜40的第一表面401，而基膜40的第二表面402上具有複數個元件41，因此，基膜40上的元件41因具有一定的厚度則會形成立體障礙，而立體障礙之間則會形成空間缺陷，因此，當進行貼合時，基膜40之第二表面402上的空間缺陷則會影響基膜40與貼合膜50之間的貼合度。
而本發明之氣浮滾輪10可提供正壓的氣流，概略來說，其壓力可為0.1-0.3kg/cm2，並配合氣浮滾輪10之內輪12與外滾輪11的設計，而可於貼合過程中持續提供氣流來填補於基膜40之第二表面402上的空間缺陷，增加基膜40的挺性，使其能於平整狀態下與貼合膜50來進行貼合，因此，提供氣流的預定角度θ，其範圍概略為20-90度，其計算基準為概略由氣浮滾輪10之中心軸至基膜40與貼合膜50接觸點為中心線L，沿著此中心線L兩側計算的角度，原則上，兩側的角度可大致上相同，舉例來說，當預定角度θ為90度時，則可配置中心線L兩側各為45度角的範圍；當然，根據不同的貼合狀況，此配置也可為兩側不相等的狀況，譬如考量空間缺陷較難填 補(譬如範圍較大或是形狀較複雜等)，則可設計貼合前的吹氣角度(圖中左側)較大、或是當基膜40與貼合膜50較難貼合(譬如材質問題)，則可則可設計貼合後的吹氣角度(圖中右側)較大。
接著請同時配合第1A-2B圖，因此，為了達到前述吹氣效果，氣浮滾輪10的外滾輪11的外表面可為滿佈吹氣孔111，以確保外滾輪11於貼合過程中不論轉動到任何角度，氣流皆可導引出來，如前所述，吹氣孔111的尺寸不宜過大，以確保外滾輪11與基膜40的貼合度；而內輪12的部份，則為預定角度θ的範圍分佈有通孔121，原則上通孔121的尺寸也不宜過大，以確保氣流導引的均勻性，但整體而言，通孔121的尺寸可大於吹氣孔111。
請參閱第3圖，為本發明之實施例所提供之氣浮式薄膜貼合設備示意圖，氣浮式薄膜貼合設備包含有至少兩個進料滾輪、貼合滾輪21與氣浮滾輪10，進料滾輪的數量可根據貼合薄膜的數量而定，如圖中所繪示，包含有第一進料滾輪31與第二進料滾輪32，第一進料滾輪31用以導引貼合膜50，而第二進料滾輪32用以導引基膜40，當然，如為更多膜層相互貼合，則會設置對應數量的進料滾輪，此處說明僅為配合圖式說明，並非用以限制其數量與位置。
以下舉一實際實施態樣來做說明，貼合膜50可為PET(聚對苯二甲酸乙二酯)或其他塑膠薄膜，而基膜40可為譬如銅、鋁等金屬薄膜，其厚度概略為0.006-0.02毫米(mm)，而其上具有特殊圖樣的塗層(元件41)，厚度可為0.1-0.3毫米，分別藉由第一進料31與第二進料滾輪32的導引，來分別藉由貼合滾輪21與氣浮滾輪10所接收，而氣浮滾輪10設置緊鄰於貼合滾輪21，來使貼合膜50與基膜40相互貼合；同時更可配合自由輪33的設置來 調整基膜40的進料角度。
貼合滾輪21的硬度可控制為40-90度(蕭氏硬度)，來避免硬度過高或過低所產生薄膜積層不易貼合或是破裂的情況；而於貼合過程中，請參閱第4圖，氣浮滾輪10之內輪12接收進氣源的氣流，並導引使其通過內輪12之通孔121與外滾輪11之吹氣孔111，來填補於基膜40之元件41之間的空間缺陷，增加基膜40的挺性，使其能平整地與貼合膜50貼合，而不產生皺折、缺陷。貼合完成後，再藉由收料滾輪34予以將貼合後的薄膜積層捲繞收納；當然，亦可配合其他設備或裝置，直接進行連續加工。
唯以上所述者，僅為本發明之較佳實施例而已，並非用來限定本發明實施之範圍。故即凡依本發明申請範圍所述之特徵及精神所為之均等變化或修飾，均應包括於本發明之申請專利範圍內。
10‧‧‧氣浮滾輪
11‧‧‧外滾輪
111‧‧‧吹氣孔
12‧‧‧內輪
121‧‧‧通孔

Claims (10)

  1. 一種氣浮式薄膜貼合設備，係包含有：至少二進料滾輪，藉以導引一基膜與一貼合膜來進行貼合，其中該基膜具有一第一表面以及對應之一第二表面，且該第二表面上具有至少二元件，該些元件間形成一缺陷空間；一貼合滾輪，接受該進料滾輪所導引之該貼合膜；以及一氣浮滾輪，接受另一該進料滾輪所導引之該基膜，且設置並緊鄰於該貼合滾輪之對應位置，而可藉由該貼合滾輪之壓合，將該貼合膜貼合至該基膜之該第一表面，其中該氣浮滾輪包含有：一外滾輪，其外表面具有複數個吹氣孔，並可相對轉動；一內輪，係設置於該外滾輪內，其外表面於一預定角度範圍具有複數個通孔；以及一進氣源，係連接該內輪，以注入一氣流至該內輪，通過該內輪之該通孔與該外滾輪之該吹氣孔，而於該預定角度範圍內將該氣流填補於該基膜之該第二表面的該缺陷空間；其中該預定角度範圍係為20-90度。
  2. 根據申請專利範圍第1項之氣浮式薄膜貼合設備，其中該基膜係為一金屬薄膜。
  3. 根據申請專利範圍第2項之氣浮式薄膜貼合設備，其中該金屬薄膜之厚度為0.006-0.02毫米。
  4. 根據申請專利範圍第1項之氣浮式薄膜貼合設備，其中該進氣源之該氣流的壓力係為0.1-0.3kg/cm2。
  5. 根據申請專利範圍第1項之氣浮式薄膜貼合設備，其中該基膜之該元件的厚度係為0.1-0.3毫米。
  6. 根據申請專利範圍第5項之氣浮式薄膜貼合設備，其中該貼合滾輪之表面硬度係為40-90度(蕭氏硬度)。
  7. 根據申請專利範圍第1項之氣浮式薄膜貼合設備，其中該通孔的尺寸大於該吹氣孔。
  8. 一種氣浮滾輪，係藉以配合一貼合滾輪而將一基膜與一貼合膜來進行貼合，其中該基膜具有一第一表面以及對應之一第二表面，且該第二表面上具有至少二元件，該些元件間形成一缺陷空間，該氣浮滾輪係包含有：一外滾輪，其外表面具有複數個吹氣孔，並可相對轉動；一內輪，係設置於該外滾輪內，其外表面於一預定角度範圍具有具有複數個通孔；以及一進氣源，係連接該內輪，以注入一氣流至該內輪，通過該內輪之該通孔與該外滾輪之該吹氣孔，而於該預定角度範圍內將該氣流填補於該基膜之該第二表面的該缺陷空間；其中該預定角度範圍係為20-90度。
  9. 根據申請專利範圍第8項之氣浮滾輪，其中該進氣源之該氣流的壓力係為0.1-0.3kg/cm2。
  10. 根據申請專利範圍第8項之氣浮滾輪，其中該通孔的尺寸大於該吹氣孔。
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