TWI707444B - 半導體封裝體配置裝置、製造裝置、半導體封裝體的配置方法以及電子零件的製造方法 - Google Patents
半導體封裝體配置裝置、製造裝置、半導體封裝體的配置方法以及電子零件的製造方法 Download PDFInfo
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- TWI707444B TWI707444B TW107108686A TW107108686A TWI707444B TW I707444 B TWI707444 B TW I707444B TW 107108686 A TW107108686 A TW 107108686A TW 107108686 A TW107108686 A TW 107108686A TW I707444 B TWI707444 B TW I707444B
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- semiconductor package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017-051101 | 2017-03-16 | ||
JP2017051101A JP6626027B2 (ja) | 2017-03-16 | 2017-03-16 | 製造装置および電子部品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201843799A TW201843799A (zh) | 2018-12-16 |
TWI707444B true TWI707444B (zh) | 2020-10-11 |
Family
ID=63706247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107108686A TWI707444B (zh) | 2017-03-16 | 2018-03-14 | 半導體封裝體配置裝置、製造裝置、半導體封裝體的配置方法以及電子零件的製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6626027B2 (ko) |
KR (1) | KR102089097B1 (ko) |
CN (1) | CN108630579B (ko) |
TW (1) | TWI707444B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI785885B (zh) * | 2021-01-18 | 2022-12-01 | 日商Towa股份有限公司 | 搬送機構、切斷裝置及切斷品的製造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102143715B1 (ko) * | 2019-01-31 | 2020-08-11 | 한미반도체 주식회사 | 테이핑 시스템 및 테이핑 방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200402828A (en) * | 2002-07-17 | 2004-02-16 | Matsushita Electric Ind Co Ltd | Method and apparatus for picking up semiconductor chip and suction and exfoliation tool used therefor |
JP2010135574A (ja) * | 2008-12-05 | 2010-06-17 | Alpha- Design Kk | 移載装置 |
TW201616566A (zh) * | 2014-09-04 | 2016-05-01 | Towa Corp | 切斷裝置、吸附機構及具備吸附機構之裝置 |
TW201635420A (zh) * | 2015-03-16 | 2016-10-01 | 韓華泰科股份有限公司 | 貼合裝置以及貼合方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6412637A (en) * | 1987-07-06 | 1989-01-17 | Yamatake Honeywell Co Ltd | Automatic restoration system of loopback type |
JP2770817B2 (ja) * | 1996-06-19 | 1998-07-02 | 日本電気株式会社 | チップマウント装置及び方法 |
KR100434832B1 (ko) * | 2001-05-29 | 2004-06-07 | 주식회사 탑 엔지니어링 | 플립칩본더장치 및 그 작동방법 |
JP2007281503A (ja) * | 2007-06-01 | 2007-10-25 | Renesas Technology Corp | チップ移載装置、およびチップ移載方法 |
KR101360007B1 (ko) * | 2012-09-27 | 2014-02-07 | 한미반도체 주식회사 | 플립칩 본딩장치 |
JP6000902B2 (ja) * | 2013-06-24 | 2016-10-05 | Towa株式会社 | 電子部品用の収容治具、その製造方法及び個片化装置 |
JP6017382B2 (ja) | 2013-07-29 | 2016-11-02 | Towa株式会社 | 個片化された電子部品の搬送装置及び搬送方法 |
WO2015145530A1 (ja) * | 2014-03-24 | 2015-10-01 | 富士機械製造株式会社 | ダイ実装システム及びダイ実装方法 |
US20160111375A1 (en) * | 2014-10-17 | 2016-04-21 | Tango Systems, Inc. | Temporary bonding of packages to carrier for depositing metal layer for shielding |
JP5845546B1 (ja) | 2014-10-31 | 2016-01-20 | アキム株式会社 | 搬送装置、組立装置および組立方法 |
JP6320323B2 (ja) * | 2015-03-04 | 2018-05-09 | Towa株式会社 | 製造装置、搬送方法、搬送プログラム、および搬送プログラムを格納した記録媒体 |
KR101590593B1 (ko) * | 2015-12-03 | 2016-02-02 | 제너셈(주) | 반도체패키지의 스퍼터링 방법 |
-
2017
- 2017-03-16 JP JP2017051101A patent/JP6626027B2/ja active Active
-
2018
- 2018-02-28 KR KR1020180024115A patent/KR102089097B1/ko active IP Right Grant
- 2018-03-14 TW TW107108686A patent/TWI707444B/zh active
- 2018-03-14 CN CN201810208327.6A patent/CN108630579B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200402828A (en) * | 2002-07-17 | 2004-02-16 | Matsushita Electric Ind Co Ltd | Method and apparatus for picking up semiconductor chip and suction and exfoliation tool used therefor |
JP2010135574A (ja) * | 2008-12-05 | 2010-06-17 | Alpha- Design Kk | 移載装置 |
TW201616566A (zh) * | 2014-09-04 | 2016-05-01 | Towa Corp | 切斷裝置、吸附機構及具備吸附機構之裝置 |
TW201635420A (zh) * | 2015-03-16 | 2016-10-01 | 韓華泰科股份有限公司 | 貼合裝置以及貼合方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI785885B (zh) * | 2021-01-18 | 2022-12-01 | 日商Towa股份有限公司 | 搬送機構、切斷裝置及切斷品的製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201843799A (zh) | 2018-12-16 |
CN108630579A (zh) | 2018-10-09 |
KR20180106876A (ko) | 2018-10-01 |
JP2018157010A (ja) | 2018-10-04 |
CN108630579B (zh) | 2022-05-10 |
JP6626027B2 (ja) | 2019-12-25 |
KR102089097B1 (ko) | 2020-03-13 |
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