TWI707051B - 以鈀為主的合金 - Google Patents

以鈀為主的合金 Download PDF

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Publication number
TWI707051B
TWI707051B TW106100264A TW106100264A TWI707051B TW I707051 B TWI707051 B TW I707051B TW 106100264 A TW106100264 A TW 106100264A TW 106100264 A TW106100264 A TW 106100264A TW I707051 B TWI707051 B TW I707051B
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TW
Taiwan
Prior art keywords
alloy
palladium
probe
rhenium
ratio
Prior art date
Application number
TW106100264A
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English (en)
Chinese (zh)
Other versions
TW201726929A (zh
Inventor
亞瑟 S. 克蘭
愛德華 F. 史密斯三世
史里那斯 維斯瓦那森
Original Assignee
美商德林傑奈股份有限公司
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Publication date
Application filed by 美商德林傑奈股份有限公司 filed Critical 美商德林傑奈股份有限公司
Publication of TW201726929A publication Critical patent/TW201726929A/zh
Application granted granted Critical
Publication of TWI707051B publication Critical patent/TWI707051B/zh

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/04—Alloys based on a platinum group metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Conductive Materials (AREA)
  • Measuring Leads Or Probes (AREA)
  • Contacts (AREA)
TW106100264A 2016-01-29 2017-01-05 以鈀為主的合金 TWI707051B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/010,690 2016-01-29
US15/010,690 US10385424B2 (en) 2016-01-29 2016-01-29 Palladium-based alloys

Publications (2)

Publication Number Publication Date
TW201726929A TW201726929A (zh) 2017-08-01
TWI707051B true TWI707051B (zh) 2020-10-11

Family

ID=59386435

Family Applications (2)

Application Number Title Priority Date Filing Date
TW106100264A TWI707051B (zh) 2016-01-29 2017-01-05 以鈀為主的合金
TW109127881A TWI743947B (zh) 2016-01-29 2017-01-05 以鈀為主的合金

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW109127881A TWI743947B (zh) 2016-01-29 2017-01-05 以鈀為主的合金

Country Status (7)

Country Link
US (2) US10385424B2 (https=)
JP (1) JP7084877B2 (https=)
KR (1) KR102681572B1 (https=)
CN (2) CN108699629B (https=)
DE (1) DE112017000561T5 (https=)
TW (2) TWI707051B (https=)
WO (1) WO2017132504A1 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10385424B2 (en) * 2016-01-29 2019-08-20 Deringer-Ney, Inc. Palladium-based alloys
JP6850365B2 (ja) * 2017-12-27 2021-03-31 株式会社徳力本店 析出硬化型Ａｇ−Ｐｄ−Ｃｕ−Ｉｎ−Ｂ系合金
JP7141098B2 (ja) * 2018-10-02 2022-09-22 石福金属興業株式会社 プローブピン用材料およびプローブピン
JP6734486B2 (ja) * 2018-11-06 2020-08-05 株式会社徳力本店 電気・電子機器用のＰｄ合金、Ｐｄ合金材、プローブピン及び製造方法
KR20210056542A (ko) 2019-11-11 2021-05-20 주식회사 메가터치 전자 부품 제조용 금속 자재 제조 방법, 그 금속 자재 및 그 금속 자재를 이용하여 제조된 포고핀
JP7260910B2 (ja) * 2019-11-22 2023-04-19 石福金属興業株式会社 プローブピン用材料およびプローブピン
CN110983147B (zh) * 2019-12-20 2021-05-11 有研亿金新材料有限公司 一种高强度钯基弱电接触材料及其制备方法
KR102235724B1 (ko) 2020-04-10 2021-04-02 주식회사 메가터치 전자 부품 제조용 금속 자재 제조 방법, 그 금속 자재 및 그 금속 자재를 이용하여 제조된 포고핀
CN112063879B (zh) * 2020-08-28 2022-02-18 昆明贵研新材料科技有限公司 一种高导电高弹性钯基合金、热处理工艺及用途
EP3960890A1 (de) 2020-09-01 2022-03-02 Heraeus Deutschland GmbH & Co. KG Palladium-kupfer-silber-ruthenium-legierung
CN112239823A (zh) * 2020-09-30 2021-01-19 武汉船用电力推进装置研究所（中国船舶重工集团公司第七一二研究所） 一种氢气纯化用钯合金及其制备方法
JP7429011B2 (ja) * 2020-12-21 2024-02-07 石福金属興業株式会社 プローブピン用材料およびプローブピン
CN117015625A (zh) * 2021-03-26 2023-11-07 石福金属兴业株式会社 探测针用合金材料
JP7072126B1 (ja) 2022-02-10 2022-05-19 田中貴金属工業株式会社 Ａｇ－Ｐｄ－Ｃｕ系合金からなるプローブピン用材料
EP4234733A1 (de) * 2022-02-28 2023-08-30 Heraeus Deutschland GmbH & Co. KG Palladium-kupfer-silber-legeriung
TWI797023B (zh) * 2022-06-14 2023-03-21 大亞電線電纜股份有限公司 鈀銀銅合金線材及其製法
CN117448716B (zh) * 2022-07-18 2026-04-24 中国石油化工股份有限公司 钯合金及其制备方法
CN117448618A (zh) * 2022-07-18 2024-01-26 中国石油化工股份有限公司 钯基合金材料及其制备方法和应用
EP4325227B1 (de) 2022-08-16 2025-10-01 Heraeus Precious Metals GmbH & Co. KG Bandförmiger verbundwerkstoff für prüfnadeln
CN115679144A (zh) * 2022-10-26 2023-02-03 北京工业大学 一种氢气分离提纯用钯基多元合金
CN117385209A (zh) * 2023-06-25 2024-01-12 江苏苏青电子材料股份有限公司 一种钯基六元合金的制备工艺及其应用
CN117026055B (zh) * 2023-10-09 2024-01-12 浙江金连接科技股份有限公司 一种半导体芯片测试探针用钯合金及其制备方法
CN121737554A (zh) * 2026-02-26 2026-03-27 浙江金连接科技股份有限公司 高硬度低电阻钯合金线及其制造方法和芯片测试用探针

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011122194A (ja) * 2009-12-09 2011-06-23 Tokuriki Honten Co Ltd 電機・電子機器用Ｐｄ合金
JP2012242184A (ja) * 2011-05-17 2012-12-10 Ishifuku Metal Ind Co Ltd プローブピン用材料、プローブピン及びその製造方法

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US1913423A (en) * 1929-01-28 1933-06-13 Int Nickel Co Precious metal alloy
ZA733409B (en) * 1972-05-31 1974-05-29 Commw Scient Ind Res Org A process of manufacturing ion-exchange resins
JPS5247516Y2 (https=) 1972-11-27 1977-10-28
JPS5247516A (en) 1975-10-14 1977-04-15 Nippon Telegr & Teleph Corp <Ntt> Process for producing material for contact compound spring material
US4539177A (en) 1982-07-21 1985-09-03 Jeneric Industries, Inc. Dental alloys for porcelain-fused-to-metal restorations
US5484569A (en) 1994-08-12 1996-01-16 The J. M. Ney Company Silver palladium alloy
US5833774A (en) 1997-04-10 1998-11-10 The J. M. Ney Company High strength silver palladium alloy
DE60016292T2 (de) * 1999-02-02 2005-12-01 Japan As Represented By Director General Of National Research Institute For Meta, Tsukuba Superlegierung mit hoher Schmelztemperatur und Verfahren zu ihrer Herstellung
US6210636B1 (en) 1999-04-30 2001-04-03 The J. M. Ney Company Cu-Ni-Zn-Pd alloys
WO2005113846A2 (en) 2004-05-10 2005-12-01 Deringer-Ney, Inc. Palladium alloy
WO2013099682A1 (ja) 2011-12-27 2013-07-04 株式会社徳力本店 電気・電子機器用のＰｄ合金
WO2014049874A1 (ja) 2012-09-28 2014-04-03 株式会社徳力本店 電気・電子機器用途のＡｇ‐Ｐｄ‐Ｃｕ‐Ｃｏ合金
US10385424B2 (en) 2016-01-29 2019-08-20 Deringer-Ney, Inc. Palladium-based alloys

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011122194A (ja) * 2009-12-09 2011-06-23 Tokuriki Honten Co Ltd 電機・電子機器用Ｐｄ合金
JP2012242184A (ja) * 2011-05-17 2012-12-10 Ishifuku Metal Ind Co Ltd プローブピン用材料、プローブピン及びその製造方法

Also Published As

Publication number Publication date
CN108699629A (zh) 2018-10-23
US10385424B2 (en) 2019-08-20
US11041228B2 (en) 2021-06-22
KR20190010527A (ko) 2019-01-30
US20190330713A1 (en) 2019-10-31
DE112017000561T5 (de) 2018-10-31
TW202111133A (zh) 2021-03-16
TW201726929A (zh) 2017-08-01
CN113249608A (zh) 2021-08-13
JP2019508592A (ja) 2019-03-28
TWI743947B (zh) 2021-10-21
WO2017132504A1 (en) 2017-08-03
CN108699629B (zh) 2021-06-01
JP7084877B2 (ja) 2022-06-15
US20170218481A1 (en) 2017-08-03
KR102681572B1 (ko) 2024-07-03

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