DE112017000561T5 - Auf Palladium basierende Legierungen - Google Patents
Auf Palladium basierende Legierungen Download PDFInfo
- Publication number
- DE112017000561T5 DE112017000561T5 DE112017000561.2T DE112017000561T DE112017000561T5 DE 112017000561 T5 DE112017000561 T5 DE 112017000561T5 DE 112017000561 T DE112017000561 T DE 112017000561T DE 112017000561 T5 DE112017000561 T5 DE 112017000561T5
- Authority
- DE
- Germany
- Prior art keywords
- weight
- alloy
- alloys
- palladium
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 170
- 239000000956 alloy Substances 0.000 title claims abstract description 170
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title claims abstract description 162
- 229910052763 palladium Inorganic materials 0.000 title claims abstract description 47
- 239000010949 copper Substances 0.000 claims abstract description 69
- 239000000523 sample Substances 0.000 claims abstract description 60
- 229910052702 rhenium Inorganic materials 0.000 claims abstract description 38
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910052802 copper Inorganic materials 0.000 claims abstract description 30
- 229910052709 silver Inorganic materials 0.000 claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000004332 silver Substances 0.000 claims abstract description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 20
- 239000011701 zinc Substances 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 12
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 11
- 239000010931 gold Substances 0.000 claims description 11
- 229910052725 zinc Inorganic materials 0.000 claims description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 10
- 239000011651 chromium Substances 0.000 claims description 8
- 229910052804 chromium Inorganic materials 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052796 boron Inorganic materials 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 5
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052733 gallium Inorganic materials 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- 229910052707 ruthenium Inorganic materials 0.000 claims description 5
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 4
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- 241000270295 Serpentes Species 0.000 claims description 3
- 230000003068 static effect Effects 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 22
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 17
- 239000000203 mixture Substances 0.000 description 17
- 238000007792 addition Methods 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 10
- 238000000137 annealing Methods 0.000 description 9
- 229910000510 noble metal Inorganic materials 0.000 description 8
- 229910001316 Ag alloy Inorganic materials 0.000 description 7
- 238000010587 phase diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 230000002829 reductive effect Effects 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- 229910000881 Cu alloy Inorganic materials 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 229910017770 Cu—Ag Inorganic materials 0.000 description 4
- 229910001252 Pd alloy Inorganic materials 0.000 description 4
- 229910002668 Pd-Cu Inorganic materials 0.000 description 4
- 238000005275 alloying Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 229910002056 binary alloy Inorganic materials 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 238000009864 tensile test Methods 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- RNAMYOYQYRYFQY-UHFFFAOYSA-N 2-(4,4-difluoropiperidin-1-yl)-6-methoxy-n-(1-propan-2-ylpiperidin-4-yl)-7-(3-pyrrolidin-1-ylpropoxy)quinazolin-4-amine Chemical compound N1=C(N2CCC(F)(F)CC2)N=C2C=C(OCCCN3CCCC3)C(OC)=CC2=C1NC1CCN(C(C)C)CC1 RNAMYOYQYRYFQY-UHFFFAOYSA-N 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910002708 Au–Cu Inorganic materials 0.000 description 1
- 229910002528 Cu-Pd Inorganic materials 0.000 description 1
- 229910000691 Re alloy Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910000905 alloy phase Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005058 metal casting Methods 0.000 description 1
- 238000005555 metalworking Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- 239000011573 trace mineral Substances 0.000 description 1
- 235000013619 trace mineral Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/04—Alloys based on a platinum group metal
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Conductive Materials (AREA)
- Measuring Leads Or Probes (AREA)
- Contacts (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/010,690 | 2016-01-29 | ||
| US15/010,690 US10385424B2 (en) | 2016-01-29 | 2016-01-29 | Palladium-based alloys |
| PCT/US2017/015327 WO2017132504A1 (en) | 2016-01-29 | 2017-01-27 | Palladium-based alloys |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE112017000561T5 true DE112017000561T5 (de) | 2018-10-31 |
Family
ID=59386435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE112017000561.2T Pending DE112017000561T5 (de) | 2016-01-29 | 2017-01-27 | Auf Palladium basierende Legierungen |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US10385424B2 (https=) |
| JP (1) | JP7084877B2 (https=) |
| KR (1) | KR102681572B1 (https=) |
| CN (2) | CN108699629B (https=) |
| DE (1) | DE112017000561T5 (https=) |
| TW (2) | TWI707051B (https=) |
| WO (1) | WO2017132504A1 (https=) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10385424B2 (en) * | 2016-01-29 | 2019-08-20 | Deringer-Ney, Inc. | Palladium-based alloys |
| JP6850365B2 (ja) * | 2017-12-27 | 2021-03-31 | 株式会社徳力本店 | 析出硬化型Ａｇ−Ｐｄ−Ｃｕ−Ｉｎ−Ｂ系合金 |
| JP7141098B2 (ja) * | 2018-10-02 | 2022-09-22 | 石福金属興業株式会社 | プローブピン用材料およびプローブピン |
| JP6734486B2 (ja) * | 2018-11-06 | 2020-08-05 | 株式会社徳力本店 | 電気・電子機器用のＰｄ合金、Ｐｄ合金材、プローブピン及び製造方法 |
| KR20210056542A (ko) | 2019-11-11 | 2021-05-20 | 주식회사 메가터치 | 전자 부품 제조용 금속 자재 제조 방법, 그 금속 자재 및 그 금속 자재를 이용하여 제조된 포고핀 |
| JP7260910B2 (ja) * | 2019-11-22 | 2023-04-19 | 石福金属興業株式会社 | プローブピン用材料およびプローブピン |
| CN110983147B (zh) * | 2019-12-20 | 2021-05-11 | 有研亿金新材料有限公司 | 一种高强度钯基弱电接触材料及其制备方法 |
| KR102235724B1 (ko) | 2020-04-10 | 2021-04-02 | 주식회사 메가터치 | 전자 부품 제조용 금속 자재 제조 방법, 그 금속 자재 및 그 금속 자재를 이용하여 제조된 포고핀 |
| CN112063879B (zh) * | 2020-08-28 | 2022-02-18 | 昆明贵研新材料科技有限公司 | 一种高导电高弹性钯基合金、热处理工艺及用途 |
| EP3960890A1 (de) | 2020-09-01 | 2022-03-02 | Heraeus Deutschland GmbH & Co. KG | Palladium-kupfer-silber-ruthenium-legierung |
| CN112239823A (zh) * | 2020-09-30 | 2021-01-19 | 武汉船用电力推进装置研究所（中国船舶重工集团公司第七一二研究所） | 一种氢气纯化用钯合金及其制备方法 |
| JP7429011B2 (ja) * | 2020-12-21 | 2024-02-07 | 石福金属興業株式会社 | プローブピン用材料およびプローブピン |
| CN117015625A (zh) * | 2021-03-26 | 2023-11-07 | 石福金属兴业株式会社 | 探测针用合金材料 |
| JP7072126B1 (ja) | 2022-02-10 | 2022-05-19 | 田中貴金属工業株式会社 | Ａｇ－Ｐｄ－Ｃｕ系合金からなるプローブピン用材料 |
| EP4234733A1 (de) * | 2022-02-28 | 2023-08-30 | Heraeus Deutschland GmbH & Co. KG | Palladium-kupfer-silber-legeriung |
| TWI797023B (zh) * | 2022-06-14 | 2023-03-21 | 大亞電線電纜股份有限公司 | 鈀銀銅合金線材及其製法 |
| CN117448716B (zh) * | 2022-07-18 | 2026-04-24 | 中国石油化工股份有限公司 | 钯合金及其制备方法 |
| CN117448618A (zh) * | 2022-07-18 | 2024-01-26 | 中国石油化工股份有限公司 | 钯基合金材料及其制备方法和应用 |
| EP4325227B1 (de) | 2022-08-16 | 2025-10-01 | Heraeus Precious Metals GmbH & Co. KG | Bandförmiger verbundwerkstoff für prüfnadeln |
| CN115679144A (zh) * | 2022-10-26 | 2023-02-03 | 北京工业大学 | 一种氢气分离提纯用钯基多元合金 |
| CN117385209A (zh) * | 2023-06-25 | 2024-01-12 | 江苏苏青电子材料股份有限公司 | 一种钯基六元合金的制备工艺及其应用 |
| CN117026055B (zh) * | 2023-10-09 | 2024-01-12 | 浙江金连接科技股份有限公司 | 一种半导体芯片测试探针用钯合金及其制备方法 |
| CN121737554A (zh) * | 2026-02-26 | 2026-03-27 | 浙江金连接科技股份有限公司 | 高硬度低电阻钯合金线及其制造方法和芯片测试用探针 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5833774A (en) | 1997-04-10 | 1998-11-10 | The J. M. Ney Company | High strength silver palladium alloy |
| US6210636B1 (en) | 1999-04-30 | 2001-04-03 | The J. M. Ney Company | Cu-Ni-Zn-Pd alloys |
| US7354488B2 (en) | 2004-05-10 | 2008-04-08 | Deringer-Ney, Inc. | Palladium alloy |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1913423A (en) * | 1929-01-28 | 1933-06-13 | Int Nickel Co | Precious metal alloy |
| ZA733409B (en) * | 1972-05-31 | 1974-05-29 | Commw Scient Ind Res Org | A process of manufacturing ion-exchange resins |
| JPS5247516Y2 (https=) | 1972-11-27 | 1977-10-28 | ||
| JPS5247516A (en) | 1975-10-14 | 1977-04-15 | Nippon Telegr & Teleph Corp <Ntt> | Process for producing material for contact compound spring material |
| US4539177A (en) | 1982-07-21 | 1985-09-03 | Jeneric Industries, Inc. | Dental alloys for porcelain-fused-to-metal restorations |
| US5484569A (en) | 1994-08-12 | 1996-01-16 | The J. M. Ney Company | Silver palladium alloy |
| DE60016292T2 (de) * | 1999-02-02 | 2005-12-01 | Japan As Represented By Director General Of National Research Institute For Meta, Tsukuba | Superlegierung mit hoher Schmelztemperatur und Verfahren zu ihrer Herstellung |
| JP5657881B2 (ja) | 2009-12-09 | 2015-01-21 | 株式会社徳力本店 | プローブピン用材料 |
| JP4878401B1 (ja) | 2011-05-17 | 2012-02-15 | 石福金属興業株式会社 | プローブピン用材料、プローブピン及びその製造方法 |
| WO2013099682A1 (ja) | 2011-12-27 | 2013-07-04 | 株式会社徳力本店 | 電気・電子機器用のＰｄ合金 |
| WO2014049874A1 (ja) | 2012-09-28 | 2014-04-03 | 株式会社徳力本店 | 電気・電子機器用途のＡｇ‐Ｐｄ‐Ｃｕ‐Ｃｏ合金 |
| US10385424B2 (en) | 2016-01-29 | 2019-08-20 | Deringer-Ney, Inc. | Palladium-based alloys |
-
2016
- 2016-01-29 US US15/010,690 patent/US10385424B2/en active Active
-
2017
- 2017-01-05 TW TW106100264A patent/TWI707051B/zh active
- 2017-01-05 TW TW109127881A patent/TWI743947B/zh active
- 2017-01-27 WO PCT/US2017/015327 patent/WO2017132504A1/en not_active Ceased
- 2017-01-27 CN CN201780008849.5A patent/CN108699629B/zh active Active
- 2017-01-27 JP JP2018559160A patent/JP7084877B2/ja active Active
- 2017-01-27 DE DE112017000561.2T patent/DE112017000561T5/de active Pending
- 2017-01-27 CN CN202110438876.4A patent/CN113249608A/zh active Pending
- 2017-01-27 KR KR1020187021763A patent/KR102681572B1/ko active Active
-
2019
- 2019-07-11 US US16/509,136 patent/US11041228B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5833774A (en) | 1997-04-10 | 1998-11-10 | The J. M. Ney Company | High strength silver palladium alloy |
| US6210636B1 (en) | 1999-04-30 | 2001-04-03 | The J. M. Ney Company | Cu-Ni-Zn-Pd alloys |
| US7354488B2 (en) | 2004-05-10 | 2008-04-08 | Deringer-Ney, Inc. | Palladium alloy |
Non-Patent Citations (1)
| Title |
|---|
| Raub und Worwag, Z. Metallkd., 1955, 46, 52-57 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108699629A (zh) | 2018-10-23 |
| US10385424B2 (en) | 2019-08-20 |
| US11041228B2 (en) | 2021-06-22 |
| KR20190010527A (ko) | 2019-01-30 |
| US20190330713A1 (en) | 2019-10-31 |
| TW202111133A (zh) | 2021-03-16 |
| TWI707051B (zh) | 2020-10-11 |
| TW201726929A (zh) | 2017-08-01 |
| CN113249608A (zh) | 2021-08-13 |
| JP2019508592A (ja) | 2019-03-28 |
| TWI743947B (zh) | 2021-10-21 |
| WO2017132504A1 (en) | 2017-08-03 |
| CN108699629B (zh) | 2021-06-01 |
| JP7084877B2 (ja) | 2022-06-15 |
| US20170218481A1 (en) | 2017-08-03 |
| KR102681572B1 (ko) | 2024-07-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE112017000561T5 (de) | Auf Palladium basierende Legierungen | |
| DE10125586B4 (de) | Kupferlegierung zur Verwendung in elektrischen und elektronischen Teilen | |
| DE3689777T2 (de) | Mehrzweck-Kupferlegierungen mittelhoher Leitfähigkeit und hoher Festigkeit und Verfahren zu ihrer Herstellung. | |
| DE3520407C2 (de) | Verfahren zur thermomechanischen Behandlung von kobalthaltigen Kupfer-Beryllium-Legierungen | |
| EP3529389B1 (de) | Kupfer-zink-legierung | |
| DE102017003011A1 (de) | Kupferlegierungsblechwerkstoff und herstellungsverfahren für einen kupferlegierungsblechwerkstoff | |
| DE102013004117A1 (de) | Kupferlegierungsblech für elektrische und elektronische Bauteile mit hervorragender Biegebearbeitbarkeit und Spannungsrelaxationsbeständigkeit | |
| DE60001762T2 (de) | Kupfer-Legierung mit verbesserter Bruchfestigkeit | |
| WO2016045770A1 (de) | Elektrisches verbindungselement | |
| DE69517173T2 (de) | Silber-palladium-legierung | |
| CH669211A5 (de) | Kupfer-chrom-titan-silizium-legierung und ihre verwendung. | |
| DE69814657T2 (de) | Legierung auf kupferbasis, gekennzeichnet durch ausscheidungshärtung und durch härtung im festen zustand | |
| DE102018118207A1 (de) | Samariumhaltige weichmagnetische Legierungen | |
| DE112018007004T5 (de) | Kupferbeschichteter Stahldraht und geneigte Spiralfeder | |
| DE112005000312B4 (de) | Kupferlegierung | |
| DE2948916C2 (de) | Kupfer-Zinn-Legierung, Verfahren zu ihrer Herstellung sowie ihre Verwendung | |
| EP3878986A1 (de) | Draht und band mit bornitrid-nanoröhren für elektrische kontaktierungen | |
| DE112020001366T5 (de) | Kupferlegierungsplatte und verfahren zur herstellung derselben | |
| DE691061C (de) | nduesen | |
| DE112023000992T5 (de) | Kupferlegierungsmaterial sowie Widerstandsmaterial für einen Widerstand unter Verwendung des Kupferlegierungsmaterials und Widerstand | |
| DE102013000057B4 (de) | Legierungsdraht und verfahren zur herstellung desselben | |
| EP4411009B1 (de) | Kupferlegierung, halbzeug und elektrisches verbindungselement aus einer kupferlegierung | |
| DE2243731B2 (de) | Aushärtbare Kupferlegierung | |
| DE112005001271T5 (de) | Kupferlegierung für elektrische und elektronische Geräte | |
| DE2420072C2 (de) | Verschleißfeste rostfreie Stahllegierung, Verfahren zum Wärmebehandeln derselben und deren Verwendung |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R012 | Request for examination validly filed |