US20080202643A1 - Beryllium-copper conductor - Google Patents
Beryllium-copper conductor Download PDFInfo
- Publication number
- US20080202643A1 US20080202643A1 US12/069,287 US6928708A US2008202643A1 US 20080202643 A1 US20080202643 A1 US 20080202643A1 US 6928708 A US6928708 A US 6928708A US 2008202643 A1 US2008202643 A1 US 2008202643A1
- Authority
- US
- United States
- Prior art keywords
- wire
- beryllium
- nickel
- base alloy
- copper base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 33
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 title description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 68
- 239000000956 alloy Substances 0.000 claims abstract description 61
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 53
- 239000010949 copper Substances 0.000 claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910052802 copper Inorganic materials 0.000 claims abstract description 25
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 25
- 229910052790 beryllium Inorganic materials 0.000 claims abstract description 23
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 15
- 230000008569 process Effects 0.000 claims abstract description 14
- 238000005482 strain hardening Methods 0.000 claims abstract description 11
- 239000012535 impurity Substances 0.000 claims abstract description 9
- 238000003483 aging Methods 0.000 claims abstract description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 15
- 229910052709 silver Inorganic materials 0.000 claims description 15
- 239000004332 silver Substances 0.000 claims description 15
- 238000007747 plating Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 230000032683 aging Effects 0.000 description 8
- 230000009467 reduction Effects 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 229910000892 beryllide Inorganic materials 0.000 description 6
- 238000002845 discoloration Methods 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- 239000000126 substance Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000952 Be alloy Inorganic materials 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
Definitions
- the present invention relates to an, electrical conductor formed from a beryllium-copper alloy which can be formed into a single end or stranded wire.
- Alloy C17510 is a high conductivity Be—Cu alloy used both as an electronic connector and an electrical conductor.
- U.S. Pat. Nos. 4,594,116; 4,727,002; and 4,838,959 describe the process and the resultant properties obtained for an electrical conductor using this alloy. The aim is to obtain a product having 95 ksi tensile strength and 60% IACS electrical conductivity.
- the described process consists of deforming a solution annealed wire greater than 99% cross sectional area followed by over-aging. This process is different than what is normally utilized for this alloy where the material is aged directly after solution treatment (AT or TF00 temper) or after deforming 60% (HT or TH04 temper) to obtain maximum tensile strength.
- This aging treatment for a conductor is designed to provide a higher electrical conductivity at the cost of tensile strength.
- the main attributes of a conductor are its electrical conductivity and tensile strength. These two characteristics are often conflicting. Attempts to increase one result in reduction of the other. It is quite beneficial to conceive of methods to increase conductivity without sacrificing the strength of the conductor.
- Alloy C17510 in conductor applications is typically supplied with silver plating.
- the higher aging temperature required to age this wire at finish can result in a yellow discoloration.
- This discoloration is an unacceptable condition which requires great care to prevent and when ensued is cause for rejection of the conductor. It would be quite beneficial to conceive a method to avoid this discoloration.
- the present invention discloses a new alloy composition to improve electrical conductivity of C17510 and improve surface brightness of the silver plated product following final heat treatment.
- an age hardened wire for use as an electrical conductor.
- the wire is formed from a copper base alloy consisting of from 1.25 to 3.6 wt % nickel, from 0.25 to 0.45 beryllium, and the balance copper and impurities which do not affect the properties of said alloy.
- the nickel and beryllium are present in the copper base alloy in a ratio of nickel to beryllium from 5.0 to 8.0.
- the wire is in a cold worked and aged hardened condition so as to have an electrical conductivity of at least about 60% IACS.
- a process for forming an age hardened wire for use as an electrical conductor broadly comprises the steps of providing a copper base alloy material consisting of from 1.25 to 3.6 wt % nickel, from 0.25 to 0.45 beryllium, and the balance copper and impurities which do not affect the properties of said alloy, said nickel and beryllium being present in said copper base alloy in a ratio of nickel to beryllium from 5.0 to 8.0, cold working said material in a single step; and age hardening said cold worked material in a single step to form a wire in a cold worked and aged hardened condition having an electrical conductivity of at least about 60% IACS.
- FIG. 1 is a graph showing tensile strength versus electrical conductivity at 0.0320′′ diameter aged 725-975° F.
- FIG. 2 is a graph showing tensile strength versus electrical conductivity at 0.0177′′ diameter aged 725-975° F.;
- FIG. 3 is a graph showing tensile strength versus electrical conductivity at 0.004′′ diameter aged 725-975° F.
- FIG. 4 is a graph showing tensile strength versus conductivity for improved C17510 aged 3 hours at 725-975° F.
- FIG. 5 is a graph showing tensile strength vs. electrical conductivity for Std. C17510 aged 3 hours at 725-975° F.
- the Copper Development Association (CDA) nominal composition of alloy C17510 is listed in Table 1. This is a broad range of chemistry and if utilized allows for a wide range of properties.
- the alloy is normally cast with a nominal composition of about 0.35% Be and 1.6% Ni or a Ni/Be ratio of 4.6.
- the alloy utilized in the above mentioned patents is similar to this chemistry having 0.38% Be and 1.66% Ni, a Ni/Be ratio of 4.4. If the broad range of chemistry listed for the alloy is utilized the Ni/Be range will vary from 2.3 to 11.
- High conductivity Be—Cu alloy C17510 contains a small amount of Be and a relatively larger amount of Ni. Ni readily reacts with Be forming beryllides. Ni beryllides mainly work as a grain refiner. Upon heat treatment (aging) of the normal chemistry of C17510, only a portion of the Be is combined with Ni to form beryllide leaving excess Be in elemental form. The free Be left in the copper matrix reduces electrical conductivity without substantially increasing strength of the alloy. Additionally, during the aging treatment the free Be can easily diffuse through silver plating to the surface of the wire causing a yellow discoloration. This discoloration is an unacceptable feature of the silver plated material.
- Ni/Be ratio in this alloy was found to increase the electrical conductivity of the alloy by reducing the remaining elemental beryllium.
- the improved alloy chemistry is defined by the ratio of Ni/Be to form nickel beryllide. Excess Ni beyond the amount needed to combine with Be will also reduce electrical conductivity of the alloy.
- Binary Ni—Be system shows two nickel beryllides, BeNi ( ⁇ ) and Be 25 Ni 5 ( ⁇ ). BeNi is the beryllide forming in C17510.
- Ni/Be weight ratio to form BeNi is 6.5.
- the range of Ni/Be with the permitted range of chemistry for C17510 is 2.3 to 11, with the typical ratio of 4.6.
- the Ni/Be weight ratio is close to 6.5, the stoichiometric ratio for NiBe.
- the Ni/Be weight ratio can be in the range of from 5.0 to 8.0, but is preferably from 5.5 to 7.5, and most preferably from 6.0 to 7.0.
- the Be content of the alloy may be from 0.25 to 0.45 percent by weight and the nickel of the alloy content may be from 1.25 to 3.6 percent by weight.
- the alloy may have intentional or unintentional impurities which do not adversely affect properties of the alloy in particular electrical conductivity, such as up to 0.10 wt % iron, up to 0.30 wt % cobalt, up to 0.20 wt % silicon, and up to 0.20 wt % aluminum.
- the alloy may be solution treated, cold worked and aged to provide electrical conductivity of at least 70% IACS with a tensile strength of at least 95 ksi.
- the alloy may also be solution treated, cold worked and aged to provide an electrical conductivity of at least 60% IACS and a tensile strength of at least 105 ksi.
- Typical solution treatment for the alloys is 1600° F. to 1750° F. for 15 minutes to 2 hours followed by the quench.
- the cold working may be performed in a single step using any suitable working device known in the art such as a drawing die.
- the cold working step should reduce the original dimension of the copper alloy material by an amount within the range of from at least 60% to 95%, preferably from 66% to 88%.
- the material may be age hardened at a temperature in the range of from 725° F. to 925° F. for a time period of up to 5.0 hours.
- the alloy can be silver plated using any suitable plating treatment known in the art.
- silver plating it is meant that the silver plating can be a plating of pure silver or a silver alloy.
- One of the advantages to the present invention is that the resulting material does not discolor upon final heat treatment.
- the two alloys shown in Tables 2 and 3 were plated with silver and drawn to 38 AWG (0.004′′ diameter).
- the silver plating thickness at 38 AWG was 40 micro-inches. This is the silver plating thickness required for most conductors.
- unilay stranded conductors consisting of 19 ends were made. This is a common conductor construction.
- the two conductors were heat treated to provide a minimum of 6% elongation as required by such conductors. Annealing was conducted in a typical box furnace under protective atmosphere of nitrogen. Following this heat treatment the conductor manufactured with the improved chemistry was bright with silver color. In contrast, the conductor with the standard chemistry was discolored showing an unacceptable yellow hue.
- wires of example 1 having the chemistries shown in Tables 2 and 3 were drawn in three steps to 38 AWG (0.004′′ in diameter), a typical conductor diameter. As expected, both alloys showed good drawability and could be easily drawn to greater than 99% reduction in area. Properties of the as-drawn wires as a function of cold reduction are listed in Table 6.
- the standard chemistry shows a higher work hardening rate but at a lower electrical conductivity. At the highest cold reduction of 99.3% (38 AWG) tensile strength for the standard chemistry is about 10 ksi higher than that of improved C17510.
- the wires drawn to 0.0320′′, 0.0179′′ and 0.004′′ diameter were aged at various temperatures for three (3) hours to determine their aging response. Tensile strength, elongation and electrical conductivity of these wires are listed in Tables 7-9.
- tensile strength for each size wire is plotted versus electrical conductivity, FIGS. 1-3 .
- the alloy with superior combination of properties would lie to the top and right part of the graph.
- the most important property for a conductor is its electrical conductivity. A higher electrical conductivity at an equivalent tensile strength shows an improved product. Minimum electrical conductivity specified for this conductor is 60% IACS.
- FIGS. 1-3 show that in the region of interest, i.e., electrical conductivity greater than 60% IACS the improved chemistry has a greater electrical conductivity at equivalent tensile strength, or conversely has a higher tensile strength at the same electrical conductivity.
- the improved electrical conductivity is about 10% IACS, a substantial improvement. This clearly shows that the improved C17510 is a preferred chemistry in conductor applications. As FIGS. 1-3 show, in all cases above 60% IACS improved C17510 has a superior combination of properties indicating that improved C17510 is the preferred chemistry for this application.
- FIG. 4 shows that improved C17510 provides the required combination of properties with lower reductions (for example 60% reduction at 0.0320′′ and 88% reduction at 0.0177′′ diameters.)
- FIG. 5 shows tensile strength vs. electrical conductivity for Std. C17510 aged 3 hours at 725-975° F.
- the beryllium-copper conductor of the present invention provides an increased electrical conductivity and bright annealing with silver plating.
- the conductor of the present invention may take the form of a single end wire or a stranded wire.
Abstract
Description
- This application claims the priority of U.S. Provisional Patent Application No. 60/903,788, entitled Beryllium-Copper Conductor, filed on Feb. 27, 2007.
- (1) Field of the Invention
- The present invention relates to an, electrical conductor formed from a beryllium-copper alloy which can be formed into a single end or stranded wire.
- (2) Prior Art
- Alloy C17510 is a high conductivity Be—Cu alloy used both as an electronic connector and an electrical conductor. U.S. Pat. Nos. 4,594,116; 4,727,002; and 4,838,959 describe the process and the resultant properties obtained for an electrical conductor using this alloy. The aim is to obtain a product having 95 ksi tensile strength and 60% IACS electrical conductivity. The described process consists of deforming a solution annealed wire greater than 99% cross sectional area followed by over-aging. This process is different than what is normally utilized for this alloy where the material is aged directly after solution treatment (AT or TF00 temper) or after deforming 60% (HT or TH04 temper) to obtain maximum tensile strength. This aging treatment for a conductor is designed to provide a higher electrical conductivity at the cost of tensile strength.
- The main attributes of a conductor are its electrical conductivity and tensile strength. These two characteristics are often conflicting. Attempts to increase one result in reduction of the other. It is quite beneficial to conceive of methods to increase conductivity without sacrificing the strength of the conductor.
- Alloy C17510 in conductor applications is typically supplied with silver plating. The higher aging temperature required to age this wire at finish can result in a yellow discoloration. This discoloration is an unacceptable condition which requires great care to prevent and when ensued is cause for rejection of the conductor. It would be quite beneficial to conceive a method to avoid this discoloration.
- The present invention discloses a new alloy composition to improve electrical conductivity of C17510 and improve surface brightness of the silver plated product following final heat treatment.
- In accordance with the present invention, there is provided an age hardened wire for use as an electrical conductor. The wire is formed from a copper base alloy consisting of from 1.25 to 3.6 wt % nickel, from 0.25 to 0.45 beryllium, and the balance copper and impurities which do not affect the properties of said alloy. The nickel and beryllium are present in the copper base alloy in a ratio of nickel to beryllium from 5.0 to 8.0. The wire is in a cold worked and aged hardened condition so as to have an electrical conductivity of at least about 60% IACS.
- Further in accordance with the present invention, there is provided a process for forming an age hardened wire for use as an electrical conductor. The process broadly comprises the steps of providing a copper base alloy material consisting of from 1.25 to 3.6 wt % nickel, from 0.25 to 0.45 beryllium, and the balance copper and impurities which do not affect the properties of said alloy, said nickel and beryllium being present in said copper base alloy in a ratio of nickel to beryllium from 5.0 to 8.0, cold working said material in a single step; and age hardening said cold worked material in a single step to form a wire in a cold worked and aged hardened condition having an electrical conductivity of at least about 60% IACS.
- Other details of the beryllium-copper conductor of the present invention, as well as other objects and advantages attendant thereto, are set forth in the following detailed description and the accompanying figures.
-
FIG. 1 is a graph showing tensile strength versus electrical conductivity at 0.0320″ diameter aged 725-975° F.; -
FIG. 2 is a graph showing tensile strength versus electrical conductivity at 0.0177″ diameter aged 725-975° F.; -
FIG. 3 is a graph showing tensile strength versus electrical conductivity at 0.004″ diameter aged 725-975° F.; -
FIG. 4 is a graph showing tensile strength versus conductivity for improved C17510 aged 3 hours at 725-975° F.; and -
FIG. 5 is a graph showing tensile strength vs. electrical conductivity for Std. C17510 aged 3 hours at 725-975° F. - The Copper Development Association (CDA) nominal composition of alloy C17510 is listed in Table 1. This is a broad range of chemistry and if utilized allows for a wide range of properties. The alloy, however, is normally cast with a nominal composition of about 0.35% Be and 1.6% Ni or a Ni/Be ratio of 4.6. The alloy utilized in the above mentioned patents is similar to this chemistry having 0.38% Be and 1.66% Ni, a Ni/Be ratio of 4.4. If the broad range of chemistry listed for the alloy is utilized the Ni/Be range will vary from 2.3 to 11.
-
TABLE 1 Composition Range for C17510 Be, % Ni, % Cu Impurities, % Max 0.20-0.60 1.4-2.2 Balance 0.10 Fe, 0.30 Co, 0.20 Si, 0.20 Al - High conductivity Be—Cu alloy C17510 contains a small amount of Be and a relatively larger amount of Ni. Ni readily reacts with Be forming beryllides. Ni beryllides mainly work as a grain refiner. Upon heat treatment (aging) of the normal chemistry of C17510, only a portion of the Be is combined with Ni to form beryllide leaving excess Be in elemental form. The free Be left in the copper matrix reduces electrical conductivity without substantially increasing strength of the alloy. Additionally, during the aging treatment the free Be can easily diffuse through silver plating to the surface of the wire causing a yellow discoloration. This discoloration is an unacceptable feature of the silver plated material.
- Increasing the Ni/Be ratio in this alloy was found to increase the electrical conductivity of the alloy by reducing the remaining elemental beryllium. The improved alloy chemistry is defined by the ratio of Ni/Be to form nickel beryllide. Excess Ni beyond the amount needed to combine with Be will also reduce electrical conductivity of the alloy. Binary Ni—Be system shows two nickel beryllides, BeNi (γ) and Be25Ni5 (δ). BeNi is the beryllide forming in C17510. Ni/Be weight ratio to form BeNi is 6.5. As stated previously, the range of Ni/Be with the permitted range of chemistry for C17510 is 2.3 to 11, with the typical ratio of 4.6.
- In accordance with the present invention, there is described a copper nickel beryllium alloy where the Ni/Be weight ratio is close to 6.5, the stoichiometric ratio for NiBe. As a practical measure, the Ni/Be weight ratio can be in the range of from 5.0 to 8.0, but is preferably from 5.5 to 7.5, and most preferably from 6.0 to 7.0. The Be content of the alloy may be from 0.25 to 0.45 percent by weight and the nickel of the alloy content may be from 1.25 to 3.6 percent by weight. The alloy may have intentional or unintentional impurities which do not adversely affect properties of the alloy in particular electrical conductivity, such as up to 0.10 wt % iron, up to 0.30 wt % cobalt, up to 0.20 wt % silicon, and up to 0.20 wt % aluminum.
- The alloy may be solution treated, cold worked and aged to provide electrical conductivity of at least 70% IACS with a tensile strength of at least 95 ksi. The alloy may also be solution treated, cold worked and aged to provide an electrical conductivity of at least 60% IACS and a tensile strength of at least 105 ksi. Typical solution treatment for the alloys is 1600° F. to 1750° F. for 15 minutes to 2 hours followed by the quench. The cold working may be performed in a single step using any suitable working device known in the art such as a drawing die. The cold working step should reduce the original dimension of the copper alloy material by an amount within the range of from at least 60% to 95%, preferably from 66% to 88%. Following cold working, the material may be age hardened at a temperature in the range of from 725° F. to 925° F. for a time period of up to 5.0 hours.
- The alloy can be silver plated using any suitable plating treatment known in the art. By silver plating, it is meant that the silver plating can be a plating of pure silver or a silver alloy. One of the advantages to the present invention is that the resulting material does not discolor upon final heat treatment.
- The following examples demonstrate advantages of the new improved chemistry.
- A sample of alloy C17510 was obtained with the Ni/Be weight ratio of 6.0. Chemistry of this alloy is listed in Table 2.
-
TABLE 2 Chemical composition for Improved C17510 Be, % Ni, % Cu 0.32 1.93 Balance - Performance of this alloy was compared with C17510 having “standard” or typical chemistry for this alloy. Chemical composition of material used for comparison is listed in Table 3. Ni/Be ratio for the standard chemistry sample is 4.4.
-
TABLE 3 Chemical composition for standard C17510 Be, % Ni, % Cu 0.36 1.57 Balance - Both the standard and improved wires were obtained in the solutionized condition at 0.0508″ diameter following identical processing. Mechanical properties and electrical conductivity of the as received wires are listed in Table 4. Both versions of the alloy have the same tensile strength and elongation while improved C17510 shows higher electrical conductivity.
-
TABLE 4 Mechanical properties and electrical conductivity of the solution annealed 0.0508″ wire Tensile Elongation, Conductivity, Material Strength, ksi % in 10″ % IACS Standard C17510 55.8 27.5 35.9 Improved C17510 55.2 26.2 40.5 - The two alloys shown in Tables 2 and 3 were plated with silver and drawn to 38 AWG (0.004″ diameter). The silver plating thickness at 38 AWG was 40 micro-inches. This is the silver plating thickness required for most conductors. Using these single end wires, unilay stranded conductors consisting of 19 ends were made. This is a common conductor construction. The two conductors were heat treated to provide a minimum of 6% elongation as required by such conductors. Annealing was conducted in a typical box furnace under protective atmosphere of nitrogen. Following this heat treatment the conductor manufactured with the improved chemistry was bright with silver color. In contrast, the conductor with the standard chemistry was discolored showing an unacceptable yellow hue.
- Additionally the properties of the improved chemistry were superior to those of the standard chemistry. The properties obtained following heat treatment of the two conductors are listed in Table 5. Electrical conductivity of the improved alloy is 10% greater than that of the standard alloy. The improved alloy also has a greater tensile strength and elongation.
-
TABLE 5 Tensile strength and electrical conductivity of 19/38 Unilay C17510 Conductor Property Improved Alloy Standard Alloy Tensile Strength, ksi 100.2 96.2 Elongation, % 12.4 11.4 Conductivity, % IACS 72.6 62.2 - The wires of example 1 having the chemistries shown in Tables 2 and 3 were drawn in three steps to 38 AWG (0.004″ in diameter), a typical conductor diameter. As expected, both alloys showed good drawability and could be easily drawn to greater than 99% reduction in area. Properties of the as-drawn wires as a function of cold reduction are listed in Table 6.
-
TABLE 6 Mechanical properties and electrical conductivity of as-drawn C17510 Improved Alloy Standard Alloy % Cold Tensile Conductivity, Tensile Conductivity, Work Strength, ksi % IACS Strength, ksi % IACS 0.0 55.2 40.5 55.8 35.9 20.8 74.3 40.5 74.0 36.3 35.5 77.6 39.5 79.0 34.9 49.5 78.8 40.7 82.9 35.3 60.8 80.5 40.8 85.5 36.0 87.8 94.6 38.3 99.8 35.5 99.3 117.2 39.4 126.9 33.6 - The standard chemistry shows a higher work hardening rate but at a lower electrical conductivity. At the highest cold reduction of 99.3% (38 AWG) tensile strength for the standard chemistry is about 10 ksi higher than that of improved C17510.
- The wires drawn to 0.0320″, 0.0179″ and 0.004″ diameter were aged at various temperatures for three (3) hours to determine their aging response. Tensile strength, elongation and electrical conductivity of these wires are listed in Tables 7-9.
-
TABLE 7 C17510 Properties drawn 60% to 0.0320″ diameter and aged Standard C17510 Improved C17510 Tensile Aging Tensile Elongation, Conductivity, Strength, Elongation, Conductivity, Temperature, ° F. Strength, ksi % in 10″ % IACS ksi % in 10″ % IACS As Cold Worked 80.5 1.2 40.8 85.5 1.2 36.0 725 127.4 11.3 50.0 141.8 11.3 46.9 775 136.6 11.1 55.9 144.2 11.4 49.4 825 136.5 10.3 59.8 143.7 11.5 52.7 875 128.7 8.7 64.3 136.2 10.2 56.0 925 113.7 8.5 69.8 125.2 9.2 58.0 -
TABLE 8 C17510 Properties drawn 88% to 0.0179″ diameter and aged Improved C17510 Standard C17510 Tensile Tensile Aging Strength, Elongation, Conductivity, Strength, Elongation, Conductivity, Temperature, ° F. ksi % in 10″ % IACS ksi % in 10″ % IACS As Cold Worked 94.6 1.2 38.3 99.8 1.3 35.5 725 130.9 8.9 49.2 146.5 10.0 46.4 775 142.2 8.9 56.3 148.6 10.0 51.4 825 133.0 7.6 63.3 143.5 9.0 53.9 875 116.7 6.4 68.2 136.2 8.3 56.4 925 81.0 7.5 77.1 117.3 7.0 59.8 -
TABLE 9 C17510 Properties drawn 99.3% to 0.004″ diameter and aged Standard C17510 Improved C17510 Tensile Aging Temperature, Tensile Elongation, Conductivity, Strength, Elongation, Conductivity, ° F. Strength, ksi % in 10″ % IACS ksi % in 10″ % IACS As Cold Worked 117.2 1.7 39.4 126.9 1.6 33.6 725 121.2 1.1 52.9 141.5 1.2 48.6 775 113.0 3.2 63.3 128.9 1.5 55.6 825 93.5 4.5 73.5 117.1 5.3 58.9 875 76.0 8.0 78.6 104.5 5.3 61.2 925 70.1 13.8 80.4 87.5 7.7 63.8 - In order to be able to compare combination of properties for these samples, tensile strength for each size wire is plotted versus electrical conductivity,
FIGS. 1-3 . The alloy with superior combination of properties would lie to the top and right part of the graph. The most important property for a conductor is its electrical conductivity. A higher electrical conductivity at an equivalent tensile strength shows an improved product. Minimum electrical conductivity specified for this conductor is 60% IACS. -
FIGS. 1-3 show that in the region of interest, i.e., electrical conductivity greater than 60% IACS the improved chemistry has a greater electrical conductivity at equivalent tensile strength, or conversely has a higher tensile strength at the same electrical conductivity. The improved electrical conductivity is about 10% IACS, a substantial improvement. This clearly shows that the improved C17510 is a preferred chemistry in conductor applications. AsFIGS. 1-3 show, in all cases above 60% IACS improved C17510 has a superior combination of properties indicating that improved C17510 is the preferred chemistry for this application. - The above mentioned patents (U.S. Pat. Nos. 4,594,116, 4,727,002 and 4,838,959) for an ultra high strength conductor are based on a minimum of 99% reduction as an essential step to obtain the required properties.
FIG. 4 shows that improved C17510 provides the required combination of properties with lower reductions (for example 60% reduction at 0.0320″ and 88% reduction at 0.0177″ diameters.)FIG. 5 shows tensile strength vs. electrical conductivity for Std. C17510 aged 3 hours at 725-975° F. - The beryllium-copper conductor of the present invention provides an increased electrical conductivity and bright annealing with silver plating. The conductor of the present invention may take the form of a single end wire or a stranded wire.
- It is apparent that there has been provided in accordance with the present invention a beryllium-copper conductor which fully satisfies the objects, means, and advantages set forth hereinbefore. While the present invention has been described in the context of specific embodiments thereof, other unforeseeable alternatives, modifications, and variations may become apparent to those skilled in the art having read the foregoing detailed description. Accordingly, it is intended to embrace those alternatives, modifications, and variations as fall within the broad scope of the appended claims.
Claims (14)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/069,287 US20080202643A1 (en) | 2007-02-27 | 2008-02-08 | Beryllium-copper conductor |
EP08151504A EP1967597A3 (en) | 2007-02-27 | 2008-02-15 | Beryllium-Copper conductor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US90378807P | 2007-02-27 | 2007-02-27 | |
US12/069,287 US20080202643A1 (en) | 2007-02-27 | 2008-02-08 | Beryllium-copper conductor |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080202643A1 true US20080202643A1 (en) | 2008-08-28 |
Family
ID=41078094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/069,287 Abandoned US20080202643A1 (en) | 2007-02-27 | 2008-02-08 | Beryllium-copper conductor |
Country Status (2)
Country | Link |
---|---|
US (1) | US20080202643A1 (en) |
EP (1) | EP1967597A3 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2881344A1 (en) | 2013-12-03 | 2015-06-10 | Veyance Technologies, Inc. | Conveyor belt rip detection system with microwire sensor |
CN110629140A (en) * | 2019-10-14 | 2019-12-31 | 江苏泰祥电线电缆有限公司 | High strength alloy copper conductor annealing device |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4533412A (en) * | 1982-09-30 | 1985-08-06 | Fdx Patents Holding Company, N.V. | Thermal-mechanical treatment for copper alloys |
US4551187A (en) * | 1984-06-08 | 1985-11-05 | Brush Wellman Inc. | Copper alloy |
US4594116A (en) * | 1984-07-30 | 1986-06-10 | Hudson Wire Company | Method for manufacturing high strength copper alloy wire |
US4657601A (en) * | 1983-11-10 | 1987-04-14 | Brush Wellman Inc. | Thermomechanical processing of beryllium-copper alloys |
US6049041A (en) * | 1995-11-10 | 2000-04-11 | Ngk Insulators, Ltd. | Flexible metal-clad dielectrics, having beryllium copper foil |
US20070056661A1 (en) * | 2005-09-09 | 2007-03-15 | Ngk Insulators, Ltd. | Beryllium copper alloy and method of manufacturing beryllium copper alloy |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2289593A (en) * | 1940-08-03 | 1942-07-14 | Charles B Sawyer | Alloy |
US4179314A (en) * | 1978-12-11 | 1979-12-18 | Kawecki Berylco Industries, Inc. | Treatment of beryllium-copper alloy and articles made therefrom |
US4727002A (en) | 1984-07-30 | 1988-02-23 | Hudson Wire Company | High strength copper alloy wire |
US4838959A (en) * | 1984-07-30 | 1989-06-13 | Hudson International Conductors | Method for manufacturing high strength copper alloy wire |
US4692192A (en) * | 1984-10-30 | 1987-09-08 | Ngk Insulators, Ltd. | Electroconductive spring material |
JPS62199743A (en) * | 1986-02-27 | 1987-09-03 | Ngk Insulators Ltd | High strength copper alloy and its manufacture |
DE3773470D1 (en) * | 1986-11-13 | 1991-11-07 | Ngk Insulators Ltd | PRODUCTION OF COPPER-BERYLLIUM ALLOYS. |
JPH01165736A (en) * | 1987-12-21 | 1989-06-29 | Dowa Mining Co Ltd | Copper alloy for terminal of wire harness and its manufacture |
JPH083141B2 (en) * | 1989-10-27 | 1996-01-17 | 日本碍子株式会社 | Beryllium copper alloy member manufacturing method |
US6059905A (en) * | 1993-08-26 | 2000-05-09 | Ngk Metals Corporation | Process for treating a copper-beryllium alloy |
JPH10296398A (en) * | 1997-04-24 | 1998-11-10 | Ngk Insulators Ltd | Wire for coil and production thereof |
-
2008
- 2008-02-08 US US12/069,287 patent/US20080202643A1/en not_active Abandoned
- 2008-02-15 EP EP08151504A patent/EP1967597A3/en not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4533412A (en) * | 1982-09-30 | 1985-08-06 | Fdx Patents Holding Company, N.V. | Thermal-mechanical treatment for copper alloys |
US4657601A (en) * | 1983-11-10 | 1987-04-14 | Brush Wellman Inc. | Thermomechanical processing of beryllium-copper alloys |
US4551187A (en) * | 1984-06-08 | 1985-11-05 | Brush Wellman Inc. | Copper alloy |
US4594116A (en) * | 1984-07-30 | 1986-06-10 | Hudson Wire Company | Method for manufacturing high strength copper alloy wire |
US6049041A (en) * | 1995-11-10 | 2000-04-11 | Ngk Insulators, Ltd. | Flexible metal-clad dielectrics, having beryllium copper foil |
US20070056661A1 (en) * | 2005-09-09 | 2007-03-15 | Ngk Insulators, Ltd. | Beryllium copper alloy and method of manufacturing beryllium copper alloy |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2881344A1 (en) | 2013-12-03 | 2015-06-10 | Veyance Technologies, Inc. | Conveyor belt rip detection system with microwire sensor |
JP2015107878A (en) * | 2013-12-03 | 2015-06-11 | ヴェーヤンス テクノロジーズ、 インコーポレイテッドVeyance Technologies, Inc. | Conveyor belt rip detection system with microwire sensor |
US9452892B2 (en) | 2013-12-03 | 2016-09-27 | Veyance Technologies, Inc | Conveyor belt rip detection system with microwire sensor |
CN110629140A (en) * | 2019-10-14 | 2019-12-31 | 江苏泰祥电线电缆有限公司 | High strength alloy copper conductor annealing device |
Also Published As
Publication number | Publication date |
---|---|
EP1967597A3 (en) | 2012-04-11 |
EP1967597A2 (en) | 2008-09-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1323188C (en) | Copper alloy containing cobalt, nickel and silicon | |
JP3803981B2 (en) | Method for producing copper alloy having high strength and high conductivity | |
CN101828240B (en) | Aluminum electric wire for automobiles and process for producing the aluminum electric wire | |
US7648601B2 (en) | High-strength, high-conductivity copper alloy wire excellent in resistance to stress relaxation | |
KR101521408B1 (en) | Electrical wire conductor for wiring, method for producing electrical wire conductor for wiring, electrical wire for wiring, and copper alloy wire | |
US20100294534A1 (en) | Conductor wire for electronic apparatus and electrical wire for wiring using the same | |
JP3699701B2 (en) | Easy-to-process high-strength, high-conductivity copper alloy | |
HU227988B1 (en) | Silver containing copper alloy | |
JPH08503022A (en) | Copper alloy having high strength and electrical conductivity and method for producing the same | |
US20090183803A1 (en) | Copper-nickel-silicon alloys | |
US6053994A (en) | Copper alloy wire and cable and method for preparing same | |
CN106029930A (en) | Copper alloy twisted wire, manufacturing method therefor, and electrical wire for automobile | |
JP3896793B2 (en) | Manufacturing method of high strength and high conductivity copper alloy material | |
JPH11222641A (en) | Copper alloy for elctrically conductive spring and its production | |
JP2000256814A (en) | Manufacture of copper-based alloy bar for terminal | |
KR20010113909A (en) | Copper alloy with improved resistance to cracking | |
US4594116A (en) | Method for manufacturing high strength copper alloy wire | |
US20080202643A1 (en) | Beryllium-copper conductor | |
TW201632634A (en) | Copper alloy bars and electronic parts with large current and electronic parts for heat dissipation | |
JPWO2009154239A1 (en) | Wire conductor for wiring, wire for wiring, and method for manufacturing wire conductor for wiring | |
JP2017057423A (en) | Manufacturing method of aluminum alloy conductive wire, aluminum alloy conductive wire and wire and wire harness using the same | |
JPH09143597A (en) | Copper alloy for lead frame and its production | |
US7291232B2 (en) | Process for high strength, high conductivity copper alloy of Cu-Ni-Si group | |
JP2020059921A (en) | Manufacturing method of aluminum alloy conductive wire, aluminum alloy conductive wire and wire and wire harness using the same | |
JPS6393837A (en) | Copper alloy for electronic equipment and its production |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: FISK ALLOY WIRE, INC., NEW JERSEY Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SALEH, JOSEPH;REEL/FRAME:020546/0568 Effective date: 20080201 Owner name: FISK ALLOY WIRE, INC.,NEW JERSEY Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SALEH, JOSEPH;REEL/FRAME:020546/0568 Effective date: 20080201 |
|
AS | Assignment |
Owner name: MANUFACTURER'S AND TRADERS TRUST COMPANY, NEW YORK Free format text: SECURITY AGREEMENT;ASSIGNOR:FISK ALLOY WIRE INCORPORATED;REEL/FRAME:023708/0742 Effective date: 20091229 Owner name: MANUFACTURER'S AND TRADERS TRUST COMPANY,NEW YORK Free format text: SECURITY AGREEMENT;ASSIGNOR:FISK ALLOY WIRE INCORPORATED;REEL/FRAME:023708/0742 Effective date: 20091229 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |