TWI705749B - 印刷電路板的雷射加工方法及其雷射加工機 - Google Patents

印刷電路板的雷射加工方法及其雷射加工機 Download PDF

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Publication number
TWI705749B
TWI705749B TW108147616A TW108147616A TWI705749B TW I705749 B TWI705749 B TW I705749B TW 108147616 A TW108147616 A TW 108147616A TW 108147616 A TW108147616 A TW 108147616A TW I705749 B TWI705749 B TW I705749B
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TW
Taiwan
Prior art keywords
laser
aperture
hole
diameter
processing
Prior art date
Application number
TW108147616A
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English (en)
Chinese (zh)
Other versions
TW202027578A (zh
Inventor
荒井邦男
金谷保彥
Original Assignee
達航科技股份有限公司
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Publication of TW202027578A publication Critical patent/TW202027578A/zh
Application granted granted Critical
Publication of TWI705749B publication Critical patent/TWI705749B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
TW108147616A 2019-01-01 2019-12-25 印刷電路板的雷射加工方法及其雷射加工機 TWI705749B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019008844 2019-01-01
JP2019-008844 2019-01-01

Publications (2)

Publication Number Publication Date
TW202027578A TW202027578A (zh) 2020-07-16
TWI705749B true TWI705749B (zh) 2020-09-21

Family

ID=71415006

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108147616A TWI705749B (zh) 2019-01-01 2019-12-25 印刷電路板的雷射加工方法及其雷射加工機

Country Status (4)

Country Link
JP (2) JP2020109820A (enExample)
KR (1) KR102410764B1 (enExample)
CN (1) CN111390380B (enExample)
TW (1) TWI705749B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022098586A (ja) * 2020-12-22 2022-07-04 大船企業日本株式会社 プリント基板レーザ加工装置に装着されるアパーチャにおける加工点パワーの調整方法と、該プリント基板レーザ加工装置に装着されるアパーチャにおける加工点パワーの調整方法を実施してなるプリント基板レーザ加工装置
JP2022105463A (ja) * 2021-01-02 2022-07-14 大船企業日本株式会社 プリント基板のレーザ加工方法およびプリント基板のレーザ加工機
JP7780063B2 (ja) * 2021-03-12 2025-12-04 大船企業日本株式会社 プリント基板のレーザ加工方法およびプリント基板のレーザ加工機
CN114273777A (zh) * 2021-12-14 2022-04-05 深圳市韵腾激光科技有限公司 一种提升电路板钻孔效率的激光加工系统
CN118829079B (zh) * 2023-10-24 2025-09-09 健鼎（无锡）电子有限公司 电路板加工方法及激光加工设备
TWI872784B (zh) * 2023-11-06 2025-02-11 健鼎科技股份有限公司 電路板加工方法及雷射加工設備

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW312082B (enExample) * 1995-08-07 1997-08-01 Mitsubishi Electric Corp
WO2014068274A1 (en) * 2012-11-02 2014-05-08 M-Solv Limited Method and apparatus for forming fine scale structures in dielectric substrate
TW201640965A (zh) * 2015-02-16 2016-11-16 日本美可多龍股份有限公司 可撓性印刷電路板之製造方法
WO2018110392A1 (ja) * 2016-12-12 2018-06-21 住友重機械工業株式会社 レーザパルス切出装置及びレーザ加工方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3126316B2 (ja) * 1996-11-20 2001-01-22 イビデン株式会社 多層プリント配線板の製造装置及び製造方法
JP3395141B2 (ja) * 1998-03-02 2003-04-07 住友重機械工業株式会社 レーザ加工装置
JP3883708B2 (ja) 1998-09-11 2007-02-21 日立ビアメカニクス株式会社 レーザ加工機におけるアパーチャ交換装置
JP4489899B2 (ja) 2000-03-08 2010-06-23 イビデン株式会社 多層プリント配線板用両面回路基板の製造方法
JP2003053560A (ja) 2001-08-09 2003-02-26 Ngk Spark Plug Co Ltd レーザ加工方法及びプリント配線基板の製造方法
DE10145184B4 (de) * 2001-09-13 2005-03-10 Siemens Ag Verfahren zum Laserbohren, insbesondere unter Verwendung einer Lochmaske
JP2003136267A (ja) 2001-11-01 2003-05-14 Hitachi Via Mechanics Ltd レーザ加工方法およびレーザ加工装置
JP2003204137A (ja) 2002-01-09 2003-07-18 Hitachi Via Mechanics Ltd レーザー穴あけ加工方法
CN101372071B (zh) * 2008-09-12 2011-06-08 上海美维科技有限公司 一种采用二氧化碳激光直接钻盲孔的方法
EP2377375B1 (en) * 2008-12-13 2016-01-27 M-Solv Limited Method and apparatus for laser machining relatively narrow and relatively wide structures
CN105025669B (zh) * 2015-07-28 2018-08-10 维嘉数控科技（苏州）有限公司 Uv激光钻孔的方法及具有盲孔的印刷电路板
JP6743287B2 (ja) * 2017-03-30 2020-08-19 太陽誘電株式会社 配線基板及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW312082B (enExample) * 1995-08-07 1997-08-01 Mitsubishi Electric Corp
WO2014068274A1 (en) * 2012-11-02 2014-05-08 M-Solv Limited Method and apparatus for forming fine scale structures in dielectric substrate
TW201640965A (zh) * 2015-02-16 2016-11-16 日本美可多龍股份有限公司 可撓性印刷電路板之製造方法
WO2018110392A1 (ja) * 2016-12-12 2018-06-21 住友重機械工業株式会社 レーザパルス切出装置及びレーザ加工方法

Also Published As

Publication number Publication date
JP2020108904A (ja) 2020-07-16
TW202027578A (zh) 2020-07-16
JP7098093B2 (ja) 2022-07-11
KR102410764B1 (ko) 2022-06-21
CN111390380A (zh) 2020-07-10
JP2020109820A (ja) 2020-07-16
KR20200084299A (ko) 2020-07-10
CN111390380B (zh) 2022-06-28

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