TWI705495B - 基板載置台及基板處理裝置 - Google Patents

基板載置台及基板處理裝置 Download PDF

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Publication number
TWI705495B
TWI705495B TW105134301A TW105134301A TWI705495B TW I705495 B TWI705495 B TW I705495B TW 105134301 A TW105134301 A TW 105134301A TW 105134301 A TW105134301 A TW 105134301A TW I705495 B TWI705495 B TW I705495B
Authority
TW
Taiwan
Prior art keywords
substrate
mounting table
substrate mounting
elastomer sheet
processing
Prior art date
Application number
TW105134301A
Other languages
English (en)
Chinese (zh)
Other versions
TW201730960A (zh
Inventor
佐佐木芳彦
南雅人
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW201730960A publication Critical patent/TW201730960A/zh
Application granted granted Critical
Publication of TWI705495B publication Critical patent/TWI705495B/zh

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Classifications

    • H10P72/0432—
    • H10P50/242—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H10P14/6514—
    • H10P50/267—
    • H10P72/0431—
    • H10P72/0602—
    • H10P72/72—
    • H10P72/74—
    • H10P95/90—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2001—Maintaining constant desired temperature

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
TW105134301A 2015-11-04 2016-10-24 基板載置台及基板處理裝置 TWI705495B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015216551A JP6584289B2 (ja) 2015-11-04 2015-11-04 基板載置台および基板処理装置
JP2015-216551 2015-11-04

Publications (2)

Publication Number Publication Date
TW201730960A TW201730960A (zh) 2017-09-01
TWI705495B true TWI705495B (zh) 2020-09-21

Family

ID=58740285

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105134301A TWI705495B (zh) 2015-11-04 2016-10-24 基板載置台及基板處理裝置

Country Status (4)

Country Link
JP (1) JP6584289B2 (enExample)
KR (1) KR101928626B1 (enExample)
CN (1) CN107026102B (enExample)
TW (1) TWI705495B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7090465B2 (ja) * 2018-05-10 2022-06-24 東京エレクトロン株式会社 載置台及びプラズマ処理装置
JP7133992B2 (ja) * 2018-06-07 2022-09-09 東京エレクトロン株式会社 基板載置台及び基板処理装置
JP7079718B2 (ja) * 2018-11-27 2022-06-02 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
KR20220150894A (ko) * 2020-03-05 2022-11-11 미쓰비시 마테리알 가부시키가이샤 플라즈마 처리 장치용 부재와 그 제조 방법, 및 플라즈마 처리 장치
JP7301021B2 (ja) * 2020-05-01 2023-06-30 東京エレクトロン株式会社 基板処理装置、載置台及び温度制御方法
WO2024004039A1 (ja) * 2022-06-28 2024-01-04 日本碍子株式会社 ウエハ載置台
CN121127958A (zh) * 2023-05-08 2025-12-12 东京毅力科创株式会社 部件和部件的制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101223000A (zh) * 2005-07-19 2008-07-16 朗姆研究公司 保护在适于在等离子体处理系统中使用的基片支撑件中的粘结层的方法
JP2015106667A (ja) * 2013-11-29 2015-06-08 太平洋セメント株式会社 基板載置装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237222A (ja) * 2000-02-22 2001-08-31 Shibaura Mechatronics Corp 真空処理装置
US7232591B2 (en) * 2002-04-09 2007-06-19 Matsushita Electric Industrial Co., Ltd. Method of using an adhesive for temperature control during plasma processing
JP4082924B2 (ja) * 2002-04-16 2008-04-30 キヤノンアネルバ株式会社 静電吸着ホルダー及び基板処理装置
JP2007311613A (ja) * 2006-05-19 2007-11-29 Hitachi High-Technologies Corp 試料台及びそれを備えたプラズマ処理装置
CN101770971B (zh) * 2008-12-31 2012-06-20 中芯国际集成电路制造(上海)有限公司 晶圆承载装置
KR101219054B1 (ko) * 2009-05-27 2013-01-18 도쿄엘렉트론가부시키가이샤 정전 흡착 전극 및 그 제조 방법, 그리고 기판 처리 장치
US20120037068A1 (en) * 2010-08-11 2012-02-16 Applied Materials, Inc. Composite substrates for direct heating and increased temperature uniformity
JP6010433B2 (ja) * 2012-11-15 2016-10-19 東京エレクトロン株式会社 基板載置台および基板処理装置
JP2017001899A (ja) * 2015-06-05 2017-01-05 旭硝子株式会社 フロートガラス製造方法、及びフロートガラス製造装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101223000A (zh) * 2005-07-19 2008-07-16 朗姆研究公司 保护在适于在等离子体处理系统中使用的基片支撑件中的粘结层的方法
JP2015106667A (ja) * 2013-11-29 2015-06-08 太平洋セメント株式会社 基板載置装置

Also Published As

Publication number Publication date
JP2017092104A (ja) 2017-05-25
TW201730960A (zh) 2017-09-01
KR20170052492A (ko) 2017-05-12
JP6584289B2 (ja) 2019-10-02
CN107026102B (zh) 2020-03-31
KR101928626B1 (ko) 2018-12-12
CN107026102A (zh) 2017-08-08

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