TWI701766B - 積體電路裝置及其形成方法 - Google Patents
積體電路裝置及其形成方法 Download PDFInfo
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- TWI701766B TWI701766B TW107115930A TW107115930A TWI701766B TW I701766 B TWI701766 B TW I701766B TW 107115930 A TW107115930 A TW 107115930A TW 107115930 A TW107115930 A TW 107115930A TW I701766 B TWI701766 B TW I701766B
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US15/813,742 US10770354B2 (en) | 2017-11-15 | 2017-11-15 | Method of forming integrated circuit with low-k sidewall spacers for gate stacks |
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US10770354B2 (en) | 2017-11-15 | 2020-09-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of forming integrated circuit with low-k sidewall spacers for gate stacks |
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US10700180B2 (en) * | 2018-07-27 | 2020-06-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor structure and manufacturing method thereof |
FR3088483B1 (fr) * | 2018-11-14 | 2022-01-14 | Commissariat Energie Atomique | Transistor a blocs de source et de drain siliciures proches du canal |
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US11355615B2 (en) * | 2020-01-17 | 2022-06-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | FinFET having fluorine-doped gate sidewall spacers |
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US11476347B2 (en) * | 2020-05-20 | 2022-10-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Processes for removing spikes from gates |
US11424187B2 (en) * | 2020-08-04 | 2022-08-23 | Nanya Technology Corporation | Semiconductor device with porous insulating layers and method for fabricating the same |
US11562910B2 (en) * | 2021-03-19 | 2023-01-24 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and method for forming thereof |
US12034054B2 (en) * | 2021-03-25 | 2024-07-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method for forming the same |
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2018
- 2018-01-03 DE DE102018100050.2A patent/DE102018100050B4/de active Active
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- 2018-04-26 CN CN201810384324.8A patent/CN109786332A/zh active Pending
- 2018-04-26 CN CN202310082869.4A patent/CN115966516A/zh active Pending
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2019
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2020
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Patent Citations (3)
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TW201701402A (zh) * | 2015-06-26 | 2017-01-01 | 台灣積體電路製造股份有限公司 | 半導體裝置及其製造方法 |
TW201712740A (zh) * | 2015-09-17 | 2017-04-01 | 台灣積體電路製造股份有限公司 | 半導體裝置結構及其形成方法 |
TWI582998B (zh) * | 2016-03-04 | 2017-05-11 | 台灣積體電路製造股份有限公司 | 半導體裝置及其製造方法 |
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US11699737B2 (en) | 2023-07-11 |
TW201923971A (zh) | 2019-06-16 |
US20190148501A1 (en) | 2019-05-16 |
KR102112641B1 (ko) | 2020-05-19 |
CN109786332A (zh) | 2019-05-21 |
US20200075420A1 (en) | 2020-03-05 |
US20230352554A1 (en) | 2023-11-02 |
US20210111265A1 (en) | 2021-04-15 |
DE102018100050B4 (de) | 2020-06-04 |
US10770354B2 (en) | 2020-09-08 |
CN115966516A (zh) | 2023-04-14 |
KR20190055680A (ko) | 2019-05-23 |
DE102018100050A1 (de) | 2019-05-16 |
US10854726B2 (en) | 2020-12-01 |
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