TWI700350B - 黏著片、及光學構件 - Google Patents

黏著片、及光學構件 Download PDF

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Publication number
TWI700350B
TWI700350B TW104111859A TW104111859A TWI700350B TW I700350 B TWI700350 B TW I700350B TW 104111859 A TW104111859 A TW 104111859A TW 104111859 A TW104111859 A TW 104111859A TW I700350 B TWI700350 B TW I700350B
Authority
TW
Taiwan
Prior art keywords
meth
adhesive
acrylate
acid
mass
Prior art date
Application number
TW104111859A
Other languages
English (en)
Chinese (zh)
Other versions
TW201600578A (zh
Inventor
片岡賢一
天野立巳
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW201600578A publication Critical patent/TW201600578A/zh
Application granted granted Critical
Publication of TWI700350B publication Critical patent/TWI700350B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/14—Protective coatings, e.g. hard coatings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
TW104111859A 2014-04-16 2015-04-14 黏著片、及光學構件 TWI700350B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014085031 2014-04-16
JPJP2014-085031 2014-04-16
JPJP2015-058357 2015-03-20
JP2015058357A JP6594636B2 (ja) 2014-04-16 2015-03-20 粘着シート、及び、光学部材

Publications (2)

Publication Number Publication Date
TW201600578A TW201600578A (zh) 2016-01-01
TWI700350B true TWI700350B (zh) 2020-08-01

Family

ID=54323948

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104111859A TWI700350B (zh) 2014-04-16 2015-04-14 黏著片、及光學構件

Country Status (5)

Country Link
JP (1) JP6594636B2 (ja)
KR (1) KR102292378B1 (ja)
CN (1) CN106459687A (ja)
TW (1) TWI700350B (ja)
WO (1) WO2015159737A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6697876B2 (ja) * 2015-12-28 2020-05-27 日東電工株式会社 透明導電性フィルム用保護フィルム及び積層体
US10647858B2 (en) 2016-01-12 2020-05-12 Shin-Etsu Polymer Co., Ltd. Conductive polymer dispersion and method for preparing same, and method for manufacturing conductive film
JP6815740B2 (ja) * 2016-03-29 2021-01-20 日東電工株式会社 マスキングシート

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005097451A (ja) * 2003-09-26 2005-04-14 Nippon Carbide Ind Co Inc 光学部材表面保護フィルム用感圧接着剤組成物及び光学部材表面保護フィルム
JP2014043108A (ja) * 2013-11-01 2014-03-13 Nitto Denko Corp 透明フィルムおよび該フィルムを用いた表面保護フィルム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09165460A (ja) 1995-12-14 1997-06-24 Hitachi Chem Co Ltd 帯電防止処理方法
KR100744876B1 (ko) * 1998-06-22 2007-08-01 도요 보세키 가부시키가이샤 고대전방지성 적층체
JP4306024B2 (ja) * 1998-06-22 2009-07-29 東洋紡績株式会社 高制電性積層体およびそれを用いた成形品
JP3997270B2 (ja) * 2005-11-21 2007-10-24 綜研化学株式会社 光学フィルム用粘着剤組成物および粘着シート、ならびにこれを用いた光学部材
JP5452850B2 (ja) * 2007-07-13 2014-03-26 チェイル インダストリーズ インコーポレイテッド 光学部材用の表面保護シート
JP5577620B2 (ja) * 2009-05-11 2014-08-27 Ｄｉｃ株式会社 粘着剤、粘着フィルム、及び光学部材用表面保護フィルム
JP5500362B2 (ja) * 2010-05-19 2014-05-21 Ｄｉｃ株式会社 粘着剤、粘着フィルム、光学部材用表面保護フィルム及びそれが貼付された積層体
JP5723618B2 (ja) * 2011-02-04 2015-05-27 日東電工株式会社 粘着シートおよび表面保護フィルム
JP2014111705A (ja) * 2012-03-30 2014-06-19 Nitto Denko Corp 粘着シート

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005097451A (ja) * 2003-09-26 2005-04-14 Nippon Carbide Ind Co Inc 光学部材表面保護フィルム用感圧接着剤組成物及び光学部材表面保護フィルム
JP2014043108A (ja) * 2013-11-01 2014-03-13 Nitto Denko Corp 透明フィルムおよび該フィルムを用いた表面保護フィルム

Also Published As

Publication number Publication date
JP6594636B2 (ja) 2019-10-23
KR20160147819A (ko) 2016-12-23
CN106459687A (zh) 2017-02-22
KR102292378B1 (ko) 2021-08-24
TW201600578A (zh) 2016-01-01
JP2015212361A (ja) 2015-11-26
WO2015159737A1 (ja) 2015-10-22

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