TWI697948B - 基板處理方法以及基板處理裝置 - Google Patents

基板處理方法以及基板處理裝置 Download PDF

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Publication number
TWI697948B
TWI697948B TW107136001A TW107136001A TWI697948B TW I697948 B TWI697948 B TW I697948B TW 107136001 A TW107136001 A TW 107136001A TW 107136001 A TW107136001 A TW 107136001A TW I697948 B TWI697948 B TW I697948B
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TW
Taiwan
Prior art keywords
liquid
substrate
nozzle
cleaning
droplet
Prior art date
Application number
TW107136001A
Other languages
English (en)
Chinese (zh)
Other versions
TW201923876A (zh
Inventor
西田崇之
石井淳一
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW201923876A publication Critical patent/TW201923876A/zh
Application granted granted Critical
Publication of TWI697948B publication Critical patent/TWI697948B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

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  • Cleaning Or Drying Semiconductors (AREA)
TW107136001A 2017-10-12 2018-10-12 基板處理方法以及基板處理裝置 TWI697948B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017198618A JP6966917B2 (ja) 2017-10-12 2017-10-12 基板処理方法および基板処理装置
JP2017-198618 2017-10-12

Publications (2)

Publication Number Publication Date
TW201923876A TW201923876A (zh) 2019-06-16
TWI697948B true TWI697948B (zh) 2020-07-01

Family

ID=66100772

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107136001A TWI697948B (zh) 2017-10-12 2018-10-12 基板處理方法以及基板處理裝置

Country Status (5)

Country Link
JP (1) JP6966917B2 (https=)
KR (1) KR102346493B1 (https=)
CN (1) CN111095494B (https=)
TW (1) TWI697948B (https=)
WO (1) WO2019073905A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7285166B2 (ja) * 2019-08-20 2023-06-01 株式会社荏原製作所 基板洗浄方法および基板洗浄装置
CN116153775B (zh) 2020-03-05 2025-11-18 东京毅力科创株式会社 基片处理方法和基片处理装置
KR102682854B1 (ko) * 2020-06-02 2024-07-10 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
KR102683710B1 (ko) * 2021-12-03 2024-07-09 세메스 주식회사 홈 포트와 이를 이용한 기판 처리 장치 및 홈 포트 세정방법
CN114888722B (zh) * 2022-05-17 2024-11-22 华海清科股份有限公司 一种化学机械抛光方法
US12138745B2 (en) * 2023-03-22 2024-11-12 Yield Engineering Systems, Inc. Apparatus and method for coating removal

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030079764A1 (en) * 2001-11-01 2003-05-01 Keizo Hirose Substrate processing apparatus and substrate processing method
US20070003278A1 (en) * 2005-07-01 2007-01-04 Koji Kaneyama Substrate drying apparatus, substrate cleaning apparatus and substrate processing system

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3834542B2 (ja) * 2001-11-01 2006-10-18 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法
JP2007012998A (ja) * 2005-07-01 2007-01-18 Dainippon Screen Mfg Co Ltd 基板洗浄装置およびそれを備えた基板処理システム
JP2008130643A (ja) * 2006-11-17 2008-06-05 Dainippon Screen Mfg Co Ltd ノズル、基板処理装置および基板処理方法
JP5151629B2 (ja) * 2008-04-03 2013-02-27 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置、現像方法、現像装置及び記憶媒体
JP5512424B2 (ja) * 2010-07-06 2014-06-04 東京エレクトロン株式会社 基板洗浄装置および基板洗浄方法
JP6709555B2 (ja) * 2015-03-05 2020-06-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6508721B2 (ja) 2015-09-28 2019-05-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030079764A1 (en) * 2001-11-01 2003-05-01 Keizo Hirose Substrate processing apparatus and substrate processing method
US20070003278A1 (en) * 2005-07-01 2007-01-04 Koji Kaneyama Substrate drying apparatus, substrate cleaning apparatus and substrate processing system

Also Published As

Publication number Publication date
CN111095494A (zh) 2020-05-01
WO2019073905A1 (ja) 2019-04-18
JP6966917B2 (ja) 2021-11-17
KR20200041990A (ko) 2020-04-22
CN111095494B (zh) 2024-11-26
TW201923876A (zh) 2019-06-16
KR102346493B1 (ko) 2021-12-31
JP2019075413A (ja) 2019-05-16

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