TWI696233B - 輸送裝置、微影裝置及製造物品的方法 - Google Patents

輸送裝置、微影裝置及製造物品的方法 Download PDF

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Publication number
TWI696233B
TWI696233B TW106108768A TW106108768A TWI696233B TW I696233 B TWI696233 B TW I696233B TW 106108768 A TW106108768 A TW 106108768A TW 106108768 A TW106108768 A TW 106108768A TW I696233 B TWI696233 B TW I696233B
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TW
Taiwan
Prior art keywords
substrate
unit
transport
stage
conveying
Prior art date
Application number
TW106108768A
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English (en)
Chinese (zh)
Other versions
TW201737400A (zh
Inventor
松平泰尚
Original Assignee
日商佳能股份有限公司
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Publication date
Application filed by 日商佳能股份有限公司 filed Critical 日商佳能股份有限公司
Publication of TW201737400A publication Critical patent/TW201737400A/zh
Application granted granted Critical
Publication of TWI696233B publication Critical patent/TWI696233B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H10P72/3302—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • H10P72/0606—
    • H10P72/7618—
    • H10P76/2041—

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW106108768A 2016-03-31 2017-03-16 輸送裝置、微影裝置及製造物品的方法 TWI696233B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016073179A JP6357187B2 (ja) 2016-03-31 2016-03-31 搬送装置、リソグラフィ装置、および物品の製造方法
JP2016-073179 2016-03-31

Publications (2)

Publication Number Publication Date
TW201737400A TW201737400A (zh) 2017-10-16
TWI696233B true TWI696233B (zh) 2020-06-11

Family

ID=59958707

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106108768A TWI696233B (zh) 2016-03-31 2017-03-16 輸送裝置、微影裝置及製造物品的方法

Country Status (5)

Country Link
US (1) US10222712B2 (enExample)
JP (1) JP6357187B2 (enExample)
KR (1) KR102103891B1 (enExample)
CN (1) CN107272346B (enExample)
TW (1) TWI696233B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118081604A (zh) * 2018-07-09 2024-05-28 东京毅力科创株式会社 加工装置、加工方法以及计算机存储介质
JP7638662B2 (ja) * 2020-10-22 2025-03-04 キヤノン株式会社 無線伝送システム、制御方法、およびプログラム
JP2023132218A (ja) * 2022-03-10 2023-09-22 キオクシア株式会社 半導体製造装置及び半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201227868A (en) * 2010-02-05 2012-07-01 Tokyo Electron Ltd Substrate holder, substrate conveyance apparatus, and substrate processing apparatus
WO2014033856A1 (ja) * 2012-08-29 2014-03-06 富士機械製造株式会社 基板用作業機器の基板高さ補正方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5870488A (en) * 1996-05-07 1999-02-09 Fortrend Engineering Corporation Method and apparatus for prealigning wafers in a wafer sorting system
JP3741401B2 (ja) * 1998-02-27 2006-02-01 キヤノン株式会社 基板搬送装置、半導体製造装置および液晶プレート製造装置
JP2000114345A (ja) * 1998-09-30 2000-04-21 Ebara Corp 基板の位置決め装置
US6778258B2 (en) * 2001-10-19 2004-08-17 Asml Holding N.V. Wafer handling system for use in lithography patterning
JP2004151102A (ja) 2003-10-28 2004-05-27 Kyocera Corp ウエハー形状測定装置
JP2005260010A (ja) * 2004-03-11 2005-09-22 Nec Electronics Corp ウエハ搬送装置及びウエハ搬送方法
JP2005311113A (ja) * 2004-04-22 2005-11-04 Nikon Corp 位置合わせ装置と位置合わせ方法、搬送システムと搬送方法、及び露光システムと露光方法並びにデバイス製造方法
JP4695406B2 (ja) * 2005-02-10 2011-06-08 パナソニック株式会社 部品実装装置及び部品実装方法
JP4794882B2 (ja) * 2005-03-25 2011-10-19 キヤノン株式会社 走査型露光装置、走査型露光方法
JP5189759B2 (ja) * 2005-12-14 2013-04-24 富士通セミコンダクター株式会社 検査方法および検査装置
US20080145957A1 (en) * 2006-12-14 2008-06-19 Lee Young-Sun Wafer transferring robot in semiconductor device fabrication equipmentand method of detecting wafer warpage using the same
JP4740414B2 (ja) * 2007-04-24 2011-08-03 東京エレクトロン株式会社 基板搬送装置
US8225683B2 (en) * 2007-09-28 2012-07-24 Lam Research Corporation Wafer bow metrology arrangements and methods thereof
KR20100074345A (ko) * 2008-12-24 2010-07-02 주식회사 동부하이텍 웨이퍼 휨 변형 검지장치 및 그 방법
JP5665336B2 (ja) 2009-04-06 2015-02-04 キヤノン株式会社 基板保持装置、及びそれを用いたリソグラフィー装置
JP6122299B2 (ja) * 2013-01-15 2017-04-26 キヤノン株式会社 処理装置、処理方法、及びデバイスの製造方法
CN103972135B (zh) * 2013-01-25 2017-02-22 上海微电子装备有限公司 一种硅片精确定位传输装置及定位方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201227868A (en) * 2010-02-05 2012-07-01 Tokyo Electron Ltd Substrate holder, substrate conveyance apparatus, and substrate processing apparatus
WO2014033856A1 (ja) * 2012-08-29 2014-03-06 富士機械製造株式会社 基板用作業機器の基板高さ補正方法

Also Published As

Publication number Publication date
JP2017183669A (ja) 2017-10-05
KR20170113383A (ko) 2017-10-12
JP6357187B2 (ja) 2018-07-11
CN107272346B (zh) 2020-05-19
KR102103891B1 (ko) 2020-04-24
US10222712B2 (en) 2019-03-05
US20170285492A1 (en) 2017-10-05
TW201737400A (zh) 2017-10-16
CN107272346A (zh) 2017-10-20

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