CN107272346B - 输送装置、光刻装置及物品的制造方法 - Google Patents

输送装置、光刻装置及物品的制造方法 Download PDF

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Publication number
CN107272346B
CN107272346B CN201710207667.2A CN201710207667A CN107272346B CN 107272346 B CN107272346 B CN 107272346B CN 201710207667 A CN201710207667 A CN 201710207667A CN 107272346 B CN107272346 B CN 107272346B
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China
Prior art keywords
substrate
stage
unit
conveying
distribution
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CN201710207667.2A
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English (en)
Chinese (zh)
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CN107272346A (zh
Inventor
松平泰尚
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Canon Inc
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Canon Inc
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Publication of CN107272346A publication Critical patent/CN107272346A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201710207667.2A 2016-03-31 2017-03-31 输送装置、光刻装置及物品的制造方法 Active CN107272346B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-073179 2016-03-31
JP2016073179A JP6357187B2 (ja) 2016-03-31 2016-03-31 搬送装置、リソグラフィ装置、および物品の製造方法

Publications (2)

Publication Number Publication Date
CN107272346A CN107272346A (zh) 2017-10-20
CN107272346B true CN107272346B (zh) 2020-05-19

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ID=59958707

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CN201710207667.2A Active CN107272346B (zh) 2016-03-31 2017-03-31 输送装置、光刻装置及物品的制造方法

Country Status (5)

Country Link
US (1) US10222712B2 (enExample)
JP (1) JP6357187B2 (enExample)
KR (1) KR102103891B1 (enExample)
CN (1) CN107272346B (enExample)
TW (1) TWI696233B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210362290A1 (en) * 2018-07-09 2021-11-25 Tokyo Electron Limited Processing apparatus, processing method and computer- readable recording medium
JP7638662B2 (ja) * 2020-10-22 2025-03-04 キヤノン株式会社 無線伝送システム、制御方法、およびプログラム
JP2023132218A (ja) * 2022-03-10 2023-09-22 キオクシア株式会社 半導体製造装置及び半導体装置の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6236904B1 (en) * 1998-02-27 2001-05-22 Canon Kabushiki Kaisha Substrate conveying system
JP2005311113A (ja) * 2004-04-22 2005-11-04 Nikon Corp 位置合わせ装置と位置合わせ方法、搬送システムと搬送方法、及び露光システムと露光方法並びにデバイス製造方法
JP2007189211A (ja) * 2005-12-14 2007-07-26 Fujitsu Ltd 検査方法および検査装置
CN101124670A (zh) * 2005-02-10 2008-02-13 松下电器产业株式会社 部件安装装置及基板输送方法
CN103972135A (zh) * 2013-01-25 2014-08-06 上海微电子装备有限公司 一种硅片精确定位传输装置及定位方法

Family Cites Families (14)

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US5870488A (en) * 1996-05-07 1999-02-09 Fortrend Engineering Corporation Method and apparatus for prealigning wafers in a wafer sorting system
JP2000114345A (ja) * 1998-09-30 2000-04-21 Ebara Corp 基板の位置決め装置
US6778258B2 (en) * 2001-10-19 2004-08-17 Asml Holding N.V. Wafer handling system for use in lithography patterning
JP2004151102A (ja) 2003-10-28 2004-05-27 Kyocera Corp ウエハー形状測定装置
JP2005260010A (ja) * 2004-03-11 2005-09-22 Nec Electronics Corp ウエハ搬送装置及びウエハ搬送方法
JP4794882B2 (ja) * 2005-03-25 2011-10-19 キヤノン株式会社 走査型露光装置、走査型露光方法
US20080145957A1 (en) * 2006-12-14 2008-06-19 Lee Young-Sun Wafer transferring robot in semiconductor device fabrication equipmentand method of detecting wafer warpage using the same
JP4740414B2 (ja) * 2007-04-24 2011-08-03 東京エレクトロン株式会社 基板搬送装置
US8225683B2 (en) * 2007-09-28 2012-07-24 Lam Research Corporation Wafer bow metrology arrangements and methods thereof
KR20100074345A (ko) * 2008-12-24 2010-07-02 주식회사 동부하이텍 웨이퍼 휨 변형 검지장치 및 그 방법
JP5665336B2 (ja) 2009-04-06 2015-02-04 キヤノン株式会社 基板保持装置、及びそれを用いたリソグラフィー装置
CN102741995A (zh) * 2010-02-05 2012-10-17 东京毅力科创株式会社 基板保持用具、基板输送装置及基板处理装置
JP6124900B2 (ja) * 2012-08-29 2017-05-10 富士機械製造株式会社 基板用作業機器の基板高さ補正方法
JP6122299B2 (ja) * 2013-01-15 2017-04-26 キヤノン株式会社 処理装置、処理方法、及びデバイスの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6236904B1 (en) * 1998-02-27 2001-05-22 Canon Kabushiki Kaisha Substrate conveying system
JP2005311113A (ja) * 2004-04-22 2005-11-04 Nikon Corp 位置合わせ装置と位置合わせ方法、搬送システムと搬送方法、及び露光システムと露光方法並びにデバイス製造方法
CN101124670A (zh) * 2005-02-10 2008-02-13 松下电器产业株式会社 部件安装装置及基板输送方法
JP2007189211A (ja) * 2005-12-14 2007-07-26 Fujitsu Ltd 検査方法および検査装置
CN103972135A (zh) * 2013-01-25 2014-08-06 上海微电子装备有限公司 一种硅片精确定位传输装置及定位方法

Also Published As

Publication number Publication date
US10222712B2 (en) 2019-03-05
US20170285492A1 (en) 2017-10-05
TWI696233B (zh) 2020-06-11
JP6357187B2 (ja) 2018-07-11
JP2017183669A (ja) 2017-10-05
KR20170113383A (ko) 2017-10-12
KR102103891B1 (ko) 2020-04-24
TW201737400A (zh) 2017-10-16
CN107272346A (zh) 2017-10-20

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